CN114734153B - Splitting method and system for processing brittle material by laser - Google Patents
Splitting method and system for processing brittle material by laser Download PDFInfo
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- CN114734153B CN114734153B CN202210345068.8A CN202210345068A CN114734153B CN 114734153 B CN114734153 B CN 114734153B CN 202210345068 A CN202210345068 A CN 202210345068A CN 114734153 B CN114734153 B CN 114734153B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P25/00—Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The invention relates to a method and a system for splitting a brittle material processed by a laser, wherein the system comprises a system control module, a laser processing system, a workpiece transmission table and a vortex tube, the laser processing system is used for carrying out laser processing on the processed material to obtain a required processing pattern, namely a laser scanning line, on the processed material, and the system control module is used for controlling the vortex tube or/and the workpiece transmission table to move according to a preset program, so that hot air flow and cold air flow generated by the vortex tube respectively heat and refrigerate the laser scanning line of the processed material which is processed by laser on the workpiece transmission table or the materials at two sides of the laser scanning line, and a processed part of the processed material is separated from a substrate part in a breaking way to finish splitting. The invention reduces the integral installation difficulty of the system, improves the yield, reduces the maintenance period of the equipment and reduces the production cost of the equipment.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a splitting method and a splitting system for processing a brittle material by a laser.
Background
Transparent materials such as glass, sapphire, and the like are widely used in various fields. The traditional processing modes such as CNC processing, glass scribing, casting and the like always have the problems of low processing precision, difficult consistency guarantee, easy edge breakage (crack) and the like. In recent years, the above problems can be effectively solved by processing a brittle material, particularly a glass-based material, with an ultrafast laser. However, the glass processing also has some problems such as low efficiency, high one-time investment cost, difficult maintenance, high debugging requirement and the like.
At present, the precision processing process of the applicant for the transparent materials such as glass and the like by utilizing the ultrafast laser is mainly divided into two steps: firstly, scanning and scribing a glass surface by pulse laser (ultrafast laser), wherein a series of lines are formed on the glass surface by light pulse with a certain frequency, due to the processing speed and the non-uniformity of glass materials, some parts among pulse points are not completely separated, and the middle parts are still connected together; and secondly, carrying out secondary scanning on the scribing area by using a continuous carbon dioxide laser, wherein the scanning area absorbs laser and is broken by heating. The splinter approach currently used by the applicant has several disadvantages: firstly, the light beam of carbon dioxide laser instrument is more concentrated, and the effective area is less relatively, need carry out accurate calibration to the scanning area of two lasers in the course of the work, if there is the deviation in carbon dioxide laser scanning area and the marking off region can lead to partial lobe of a leaf incomplete, the system integral erection degree of difficulty is big, and needs regular calibration maintenance. Secondly, carbon dioxide laser lobe of a leaf increases laser scattering, needs to carry out strict laser safety design to the light installation design of equipment, has increased the equipment design degree of difficulty. Meanwhile, the system control coordination is complex and the cost is high.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a method and a system for splitting a brittle material processed by a laser.
The technical scheme of the invention is realized as follows: the invention discloses a splitting method for processing a brittle material by a laser, which comprises the following steps:
scanning and scribing the processing material through laser;
heating and refrigerating the laser scanning line on the processing material respectively, and forming thermal stress at the laser scanning line of the processing material so as to break and separate the processing part and the substrate part of the processing material.
Further, the laser scanning line on the processing material is heated and refrigerated through hot air flow and cold air flow, and the method specifically comprises the following steps: the system control module controls the workpiece transmission platform to move the processing material processed by the laser to a position below a hot air flow outlet of the vortex tube, the hot air flow outlet of the vortex tube is aligned with a laser scanning line of the processing material, and the vortex tube or the workpiece transmission platform is controlled to move, so that the hot air flow from the hot air flow outlet of the vortex tube can walk along the laser scanning line of the processing material at least once, and the laser scanning line of the processing material is fully heated; and then the workpiece transmission platform is controlled by the system control module to move the heated processing material to a position below a cold air flow outlet of the vortex tube, the cold air flow outlet of the vortex tube is aligned with the laser scanning line of the processing material, the vortex tube or the workpiece transmission platform is controlled to move, the cold air flow from the cold air flow outlet of the vortex tube is enabled to walk along the laser scanning line of the processing material at least once, and the laser scanning line of the processing material is enabled to be rapidly cooled.
The invention discloses a splinter method for processing a brittle material by a laser, which comprises the following steps:
scanning and scribing the processing material through laser;
the materials at the two sides of the laser scanning line on the processing material are respectively heated and cooled, so that the processing part and the substrate part at the two sides of the laser scanning line of the processing material are reversely contracted and expanded, and the processing material is broken at the laser scanning position.
Further, the material on both sides of the laser scanning line on the processing material is heated and refrigerated through hot air flow and cold air flow, and the method specifically comprises the following steps: the system control module controls the workpiece transmission platform to move the laser-processed processing material to a set position below the vortex tube, so that hot air flow and cold air flow of the vortex tube respectively heat and refrigerate the material on two sides of a laser scanning line on the processing material.
Further, scanning and scribing the processing material by laser specifically comprises: the laser is controlled to emit laser beams, the laser beams enter a beam scanning and focusing system through a beam transformation module and are focused on a processing material on a workpiece moving platform, and a system control module controls laser light emitting parameters, the beam scanning and focusing system and moving parameters of a workpiece transmission platform to obtain a required processing pattern, namely a laser scanning line, on the processing material.
Further, compressed gas is utilized to form cold and hot gas flows through the vortex tube respectively; the temperature of hot air flow and cold air flow is controlled by adjusting the pressure of compressed gas, so that the method is suitable for the splinters of different processing materials and different processing patterns.
The invention discloses a splitting system for processing brittle materials by a laser, which comprises a system control module, a laser processing system, a workpiece transmission table and a vortex tube, wherein the laser processing system is used for carrying out laser processing on processed materials to obtain required processing patterns, namely laser scanning lines, on the processed materials, and the system control module is used for controlling the vortex tube or/and the workpiece transmission table to move according to a preset program so that hot air flow and cold air flow generated by the vortex tube respectively heat and refrigerate the set positions of the processed materials which are processed by the laser on the workpiece transmission table.
Further, the system control module is used for controlling the vortex tube or/and the workpiece transmission table to move according to a preset program, so that hot air flow and cold air flow generated by the vortex tube respectively heat and refrigerate the laser scanning line of the processing material which is processed by laser on the workpiece transmission table, thermal stress is formed at the laser scanning line, and the processing part of the processing material is separated from the substrate part in a fracture mode.
Further, the system control module is used for controlling the vortex tube or/and the workpiece transmission table to move according to a preset program, so that hot air flow and cold air flow generated by the vortex tube respectively heat and refrigerate materials on two sides of a laser scanning line of the processed material which is processed by laser on the workpiece transmission table, and processed parts on two sides of the laser scanning line of the processed material and the substrate part are reversely contracted and expanded, so that the processed material is broken at a laser scanning position.
Furthermore, the laser processing system comprises a laser, a light beam conversion module and a light beam scanning and focusing system, wherein the laser and the light beam scanning and focusing system are respectively electrically connected with the system control module, a laser beam emitted by the laser enters the light beam scanning and focusing system through the light beam conversion module and is focused on a processing material on the workpiece moving table, and the system control module is used for controlling light emitting parameters of the laser and moving parameters of the light beam scanning and focusing system and the workpiece transmission table to obtain a required processing pattern on the processing material.
The invention has at least the following beneficial effects: the method specifically comprises the steps of scanning and scribing the surface of the glass by pulse laser (picosecond or femtosecond laser); cold and hot air flows are formed by normal-temperature high-pressure gas passing through the vortex tube, the vortex tube and the air flows are controlled by the motor to refrigerate and heat a machined workpiece and a brittle base material respectively, a machining area is separated from the substrate, and a precise and controllable machining element is formed.
According to the invention, the vortex tube principle is used for splitting the processed workpiece, and compared with the traditional carbon dioxide laser scanning mode, a larger thermal stress area and a larger thermal stress ratio can be obtained, so that the reverse shrinkage expansion of the processing area and the substrate area is realized; the method can effectively improve the success rate of splitting. Meanwhile, the device can ensure that the device is not in direct contact with a processed workpiece, and the surface of the processed workpiece is not damaged by external processing parts such as diamond. Through the vortex tubes with different types of designs and reasonable air inlet pressure, the temperature of cold and hot air flow can be effectively controlled to adapt to the splinters of different types of processing materials, and the application field of equipment is effectively enhanced. Meanwhile, by using the method, the adjustment of a precise optical path is reduced, the installation and debugging difficulty of the cutting system is effectively reduced, and the maintenance period of the equipment is prolonged. On the premise that the number of integral devices is relatively small, the integral working efficiency is improved, the production difficulty is easily reduced, the production is easy, the equipment maintenance period is prolonged, the production cost is reduced, and the enterprise benefit is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a breaking system for laser processing a brittle material according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a laser processed work material according to one embodiment of the present invention;
fig. 3 is a schematic structural diagram of a breaking system for laser processing a brittle material according to another embodiment of the present invention.
In the attached drawing, 1 is a laser, 2 is a beam shaping module, 3 is a beam scanning focusing system, 4 is a processing material, 5 is a workpiece transmission table, 6 is a vortex tube, 7 is compressed gas, 8 is a laser scanning line, 9 is hot air flow, 10 is cold air flow, and 11 is a laser beam.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Example one
Referring to fig. 1 and 2, an embodiment of the present invention provides a sheet splitting system for processing a brittle material by a laser, including a laser processing system, a workpiece transmission stage, a vortex tube, and a system control module for controlling a laser light emission signal, a scanning signal, and the workpiece transmission stage, where the laser processing system is configured to perform laser processing on a processing material to obtain a desired processing pattern, i.e., a laser scanning line, on the processing material, and the system control module is configured to control the vortex tube or/and the workpiece transmission stage to move according to a preset program, so that a hot air flow and a cold air flow generated by the vortex tube respectively heat and refrigerate materials on both sides of the laser scanning line of the processing material, which have been subjected to laser processing, on the workpiece transmission stage, and a workpiece portion and a substrate portion on both sides of the laser scanning line of the processing material are respectively subjected to reverse contraction and expansion, so as to be broken at a laser scanning position.
As shown in fig. 2, when the laser scanning line is annular, the hot air flow generated by the vortex tube can be controlled to heat the outer material portion (such as the substrate portion) of the laser scanning line, and the cold air flow generated by the vortex tube is controlled to refrigerate the inner material portion (such as the workpiece portion) of the laser scanning line, so that the workpiece to be machined is contracted, the outer substrate is expanded, and the workpiece is fractured at the laser scanning position 8, thereby achieving the workpiece fracturing effect.
Further, the laser processing system comprises a laser 1, a light beam conversion module 2 and a light beam scanning and focusing system 3, wherein the laser and the light beam scanning and focusing system are respectively electrically connected with a system control module, a laser beam emitted by the laser enters the light beam scanning and focusing system through the light beam conversion module and is focused on a processing material 4 on a workpiece moving table 5, and the system control module is used for controlling light emitting parameters of the laser and moving parameters of the light beam scanning and focusing system and the workpiece transmission table 5 to obtain a required processing pattern on the processing material.
Further, the laser 1 of the present embodiment adopts an ultrafast laser, which may be a solid state or fiber ultrafast laser, or other solid state laser such as nanosecond laser, MOPA fiber laser light source, or the like.
Further, the beam shaping module 2 may be, but is not limited to, an optical device such as a beam expander, a limiting aperture, etc. that can change the size, divergence angle, and energy distribution of the light beam.
Further, the beam scanning focusing system 3 comprises a beam scanning component and a beam focusing mirror assembly.
Further, the processing material 4 may be, but is not limited to, a brittle material such as glass, ceramic, sapphire, or the like.
Further, the workpiece drive stage 5 may be, but is not limited to, a drive stage using a linear motor, a servo motor, or a stepping motor.
Further, the material on both sides of the laser scanning line on the processing material is heated and refrigerated through hot air flow and cold air flow, and the method specifically comprises the following steps: the system control module controls the workpiece transmission platform to move the processing material processed by the laser to a set position below the vortex tube, and controls the workpiece transmission platform 5 and the vortex tube 6 according to the shape of the processing workpiece, so that the cold airflow 10 and the hot airflow 9 output by the vortex tube respectively heat and refrigerate (cool) the materials at two sides of a scanning line 8 on the processing material 4; due to the action of cold shrinkage and thermal expansion stress on two sides of the scanning line 8 on the processing material 4, laser scanning areas (two sides of the scanning line) are completely broken, and splitting is completed.
Further, the vortex tube 6 of the present invention may be, but is not limited to, a single flow vortex tube, a counter flow vortex tube, or a conical vortex tube.
Further, the compressed gas 7 of the present invention may be, but is not limited to, compressed air, nitrogen, argon, etc.
Furthermore, the invention can control the temperature of hot air flow and cold air flow by adjusting the pressure of the compressed gas 7, and is suitable for the splinters of different processing materials and different processing patterns.
Further, the invention can utilize the vortex tube to heat and cool different areas of the processing material at the same time by changing the processing sequence, and can also heat or cool the same area or different areas of the processing material by steps (when heating or cooling the same area or different areas of the processing material by steps, the heating and cooling can be carried out firstly, and the cooling and heating can be carried out firstly).
The structure of the vortex tube can be correspondingly adjusted according to the needs, such as the shape of a laser scanning line and the processing flow, when the vortex tube is used for heating and cooling different regions of a processing material simultaneously, and when the laser scanning line is annular, the vortex tube structure shown in figure 1 can be adopted, but not limited to the vortex tube structure shown in figure 1, the vortex tube comprises a vortex tube body, the vortex tube body is provided with a compressed gas inlet, a cold airflow outlet and a hot airflow outlet, the compressed gas inlet of the vortex tube is connected with a compressed gas source, the gas outlet of the vortex tube body is provided with a flow guide device, the flow guide device is provided with a flow guide hole penetrating through the flow guide device to form the cold airflow outlet, and the flow guide device is provided with a hot airflow outlet between the outer wall of the flow guide device and the inner wall of the vortex tube body outlet. The outer wall of the flow guide device is in a conical shape with a small top and a big bottom, and a cold air outlet and a hot air outlet of the vortex tube are arranged downwards.
Of course, if the same region or different regions of the processing material are heated and cooled respectively through two steps, a vortex tube structure as shown in fig. 3 can be adopted, but not limited to the vortex tube structure shown in fig. 3, and the cold airflow outlet and the hot airflow outlet of the vortex tube are respectively located at different positions of the vortex tube, such as at two ends of the vortex tube.
Example two
Referring to fig. 1 and 2, an embodiment of the present invention provides a method for laser processing a brittle material, including the following steps:
scanning and scribing the processing material through laser;
the materials at the two sides of the laser scanning line on the processing material are respectively heated and cooled, so that the processing part and the substrate part at the two sides of the laser scanning line of the processing material are reversely contracted and expanded, and the processing material is broken at the laser scanning position.
Further, the material on both sides of the laser scanning line on the processing material is heated and refrigerated through hot air flow and cold air flow, and the method specifically comprises the following steps: the system control module controls the workpiece transmission platform to move the laser-processed processing material to the lower part of the vortex tube, and controls the vortex tube or the workpiece transmission platform to move, so that hot air flow and cold air flow of the vortex tube respectively heat and refrigerate the material on two sides of a laser scanning line on the processing material.
Further, scanning and scribing the processing material by laser specifically comprises: the laser is controlled to emit laser beams, the laser beams enter a beam scanning and focusing system through a beam transformation module and are focused on a processing material on a workpiece moving platform, and a system control module controls laser light emitting parameters, the beam scanning and focusing system and moving parameters of a workpiece transmission platform to obtain a required processing pattern, namely a laser scanning line, on the processing material.
Further, compressed gas is utilized to respectively form a cold air flow and a hot air flow through a vortex tube; the temperature of hot air flow and cold air flow is controlled by adjusting the pressure of compressed gas, so that the method is suitable for the splinters of different processing materials and different processing patterns.
The above process is described in detail below by specific examples.
Referring to fig. 1, an infrared laser beam 11 emitted by a picosecond ultrafast laser 1 enters a beam scanning focusing system 3 through a beam transformation module 2 and is focused on a processing material 4 on a workpiece moving table 5. The system control module controls laser light-emitting parameters, the scanning module 3 and the workpiece transmission table 5 to move parameters, and required processing patterns are obtained on the processing materials 4. The workpiece transmission platform 5 moves the processing material 4 processed by the laser to the lower part of the single-flow vortex tube 6, the system controls the single-flow vortex tube 6 and the workpiece moving platform 5 to move according to the shape and the size of a processed part, and the cold air flow 10 and the hot air flow 9 output by the single-flow vortex tube respectively heat and refrigerate the materials at two sides of the laser scanning line 8 on the processing material 4, so that the processed part is contracted and the external substrate is expanded as shown in figure 2, thereby the processed part is broken at the laser scanning position 8, and the processed part is broken.
EXAMPLE III
Referring to fig. 2 and 3, an embodiment of the present invention provides a splinter system for processing a brittle material with a laser, including a system control module, a laser processing system, a workpiece transmission table, and a vortex tube, where the laser processing system is configured to perform laser processing on a processed material to obtain a required processing pattern, that is, a laser scanning line, and the system control module is configured to control the vortex tube or/and the workpiece transmission table to move according to a preset program, so that a hot airflow and a cold airflow generated by the vortex tube respectively heat and refrigerate the laser scanning line of the processed material on the workpiece transmission table, and form a thermal stress at the laser scanning line, so that a processed part of the processed material is separated from a substrate part by fracture.
The laser processing system of the present embodiment has the same structure as the laser processing system of the first embodiment.
Further, the laser scanning line on the processing material is heated and refrigerated through hot air flow and cold air flow, and the method specifically comprises the following steps: the system control module controls the workpiece transmission platform to move the processing material processed by the laser to a position below a hot air flow outlet of the vortex tube, the hot air flow outlet of the vortex tube is aligned with a laser scanning line of the processing material, and the vortex tube or the workpiece transmission platform is controlled to move, so that the hot air flow flowing out of a hot air flow outlet of the vortex tube can walk at least once along the laser scanning line of the processing material (the walking times along the laser scanning line of the processing material are set as required), and the laser scanning line of the processing material is fully heated; and then the workpiece transmission platform is controlled by the system control module to move the heated processing material to a position below a cold air flow outlet of the vortex tube, the cold air flow outlet of the vortex tube is aligned with the laser scanning line of the processing material, the vortex tube or the workpiece transmission platform is controlled to move, and the cold air flow from the cold air flow outlet of the vortex tube is enabled to walk at least once along the laser scanning line of the processing material (the walking times along the laser scanning line of the processing material are set according to requirements), so that the laser scanning line of the processing material is rapidly cooled.
Example four
Referring to fig. 2 and 3, an embodiment of the invention discloses a method for splitting a brittle material by a laser, which comprises the following steps:
scanning and scribing the processing material through laser;
heating and refrigerating the laser scanning line on the processing material respectively, and forming thermal stress at the laser scanning line of the processing material so as to break and separate the processing part and the substrate part of the processing material.
Further, the laser scanning line on the processing material is heated and refrigerated through hot air flow and cold air flow, and the method specifically comprises the following steps: the system control module controls the workpiece transmission platform to move the processing material processed by the laser to a position below a hot air flow outlet of the vortex tube, the hot air flow outlet of the vortex tube is aligned with a laser scanning line of the processing material, and the vortex tube or the workpiece transmission platform is controlled to move, so that the hot air flow from the hot air flow outlet of the vortex tube can walk along the laser scanning line of the processing material at least once, and the laser scanning line of the processing material is fully heated; and then controlling the workpiece transmission table to move the heated processing material to a position below a cold air flow outlet of the vortex tube through the system control module, aligning the cold air flow outlet of the vortex tube with a laser scanning line of the processing material, controlling the vortex tube or the workpiece transmission table to move, enabling the cold air flow from the cold air flow outlet of the vortex tube to walk along the laser scanning line of the processing material at least once, and rapidly cooling the laser scanning line of the processing material.
Further, scanning and scribing the processing material by laser specifically comprises: the laser is controlled to emit laser beams, the laser beams enter the beam scanning and focusing system through the beam transformation module and are focused on a processing material on the workpiece moving platform, and the system control module controls laser light emitting parameters, the beam scanning and focusing system and moving parameters of the workpiece transmission platform to obtain a required processing pattern, namely a laser scanning line, on the processing material.
Further, compressed gas is utilized to form cold and hot gas flows through the vortex tube respectively; the temperature of hot air flow and cold air flow is controlled by adjusting the pressure of compressed gas, so that the method is suitable for the splinters of different processing materials and different processing patterns.
The above process is described in detail below by specific examples.
Referring to fig. 3, an infrared laser beam 11 emitted from the picosecond ultrafast laser 1 enters the beam scanning focusing system 3 through the beam transformation module 2 and is focused on the processing material 4 on the workpiece moving table 5. The system control module controls laser light emitting parameters, the scanning module 3 and the workpiece transmission table 5 to move parameters, and required processing patterns are obtained on the processing materials 4. The workpiece drive table 5 moves the laser-treated working material 4 under the counter-current vortex tube 6. Then the system control module controls the processing material 4 to move to the position below the hot air flow 9 outlet and walk along the laser scanning line 8 for a plurality of times, so that the laser scanning line 8 is fully heated; then rapidly moving the laser scanning line to the position below the outlet of the cold airflow 10 and walking along the laser scanning line 8 for a plurality of times to rapidly cool the laser scanning line 8; thereby forming a strong thermal stress at the laser scanning line 8 to fracture and separate the workpiece from the processing material.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A splitting method for processing a brittle material by a laser is characterized in that: the method comprises the following steps:
scanning and scribing the processing material through laser;
the compressed gas is utilized to form hot air flow and cold air flow through the vortex tube respectively, the laser scanning lines on the processing material are heated and refrigerated respectively, thermal stress is formed at the laser scanning lines of the processing material, and the processing part and the substrate part of the processing material are separated by fracture.
2. A breaking method for laser processing a brittle material as claimed in claim 1, characterized in that:
the laser scanning line on the processing material is respectively heated and refrigerated through hot air flow and cold air flow, and the method specifically comprises the following steps: the system control module controls the workpiece transmission platform to move the processing material processed by the laser to a position below a hot air flow outlet of the vortex tube, the hot air flow outlet of the vortex tube is aligned with a laser scanning line of the processing material, and the vortex tube or the workpiece transmission platform is controlled to move, so that the hot air flow from the hot air flow outlet of the vortex tube can walk along the laser scanning line of the processing material at least once, and the laser scanning line of the processing material is fully heated; and then the workpiece transmission platform is controlled by the system control module to move the heated processing material to a position below a cold air flow outlet of the vortex tube, the cold air flow outlet of the vortex tube is aligned with the laser scanning line of the processing material, the vortex tube or the workpiece transmission platform is controlled to move, the cold air flow from the cold air flow outlet of the vortex tube is enabled to walk along the laser scanning line of the processing material at least once, and the laser scanning line of the processing material is enabled to be rapidly cooled.
3. A splitting method for processing brittle materials by a laser is characterized by comprising the following steps:
scanning and scribing the processing material through laser;
the compressed gas is utilized to respectively form hot airflow and cold airflow through the vortex tube, the materials at two sides of the laser scanning line on the processing material are respectively heated and refrigerated, and the parts of the processed parts at two sides of the laser scanning line of the processing material and the substrate part are reversely contracted and expanded, so that the processed parts are broken at the laser scanning position of the processing material.
4. A breaking method for laser processing a brittle material as claimed in claim 3, characterized in that:
the material of laser scanning line both sides on the processing material is heated, is refrigerated through hot gas flow, cold air current respectively, specifically includes: the system control module controls the workpiece transmission platform to move the laser-processed processing material to a set position below the vortex tube, so that hot air flow and cold air flow of the vortex tube respectively heat and refrigerate the material on two sides of a laser scanning line on the processing material.
5. A breaking method for laser processing a brittle material as claimed in claim 1 or 3, characterized in that: scanning and scribing a processing material through laser, and the method specifically comprises the following steps: the laser is controlled to emit laser beams, the laser beams enter a beam scanning and focusing system through a beam transformation module and are focused on a processing material on a workpiece moving platform, and a system control module controls laser light emitting parameters, the beam scanning and focusing system and moving parameters of a workpiece transmission platform to obtain a required processing pattern, namely a laser scanning line, on the processing material.
6. A breaking method for laser processing a brittle material as claimed in claim 1 or 3, characterized in that: the temperature of hot air flow and cold air flow is controlled by adjusting the pressure of compressed gas, so that the method is suitable for the splinters of different processing materials and different processing patterns.
7. A breaking system for laser processing of brittle materials, characterized by: the laser processing system is used for carrying out laser processing on a processing material to obtain a required processing pattern, namely a laser scanning line, on the processing material, and the system control module is used for controlling the vortex tube or/and the workpiece transmission table to move according to a preset program so that hot air flow and cold air flow generated by the vortex tube respectively heat and refrigerate the set position of the processing material which is subjected to laser processing on the workpiece transmission table.
8. A breaking system for laser machining a brittle material as claimed in claim 7, characterized in that: the system control module is used for controlling the vortex tube or/and the workpiece transmission table to move according to a preset program, so that hot air flow and cold air flow generated by the vortex tube respectively heat and refrigerate the laser scanning line of the processing material which is processed by laser on the workpiece transmission table, thermal stress is formed at the laser scanning line, and the processing part of the processing material is separated from the substrate part in a fracture mode.
9. A breaking system for laser machining a brittle material as claimed in claim 7, characterized in that: the system control module is used for controlling the vortex tube or/and the workpiece transmission platform to move according to a preset program, so that hot air flow and cold air flow generated by the vortex tube respectively heat and refrigerate materials on two sides of a laser scanning line of the processed material which is processed by laser on the workpiece transmission platform, and processed parts on two sides of the laser scanning line of the processed material and a substrate part are reversely contracted and expanded, so that the processed material is broken at a laser scanning position.
10. A breaking system for laser machining a brittle material as claimed in claim 7, characterized in that: the laser processing system comprises a laser, a light beam conversion module and a light beam scanning and focusing system, wherein the laser and the light beam scanning and focusing system are respectively electrically connected with a system control module, a laser beam emitted by the laser enters the light beam scanning and focusing system through the light beam conversion module to be focused on a processing material on a workpiece moving table, and the system control module is used for controlling light emitting parameters of the laser and moving parameters of the light beam scanning and focusing system and a workpiece transmission table to obtain a required processing pattern on the processing material.
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