CN106425087A - Laser processing device for aluminum nitride ceramic and method thereof - Google Patents
Laser processing device for aluminum nitride ceramic and method thereof Download PDFInfo
- Publication number
- CN106425087A CN106425087A CN201610965241.9A CN201610965241A CN106425087A CN 106425087 A CN106425087 A CN 106425087A CN 201610965241 A CN201610965241 A CN 201610965241A CN 106425087 A CN106425087 A CN 106425087A
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- laser
- aluminium nitride
- nitride ceramics
- processing device
- motion platform
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser processing device for aluminum nitride ceramic and a method thereof. A light path output end of a quasi-continuous laser is in transmission connection with a laser head through an optical fiber provided with a protective layer. A collimating mirror and a focusing mirror are sequentially arranged on an output light path of the laser head. A light path output end of the focusing mirror directly faces an X-Y motion platform installed on glassware through a lifting mechanism. The glassware is arranged in a constant-temperature ultrasonic cleaning device. Through optical collation, adoption of an optimized laser light path and an optical module, and combination of advantages of fiber lasers in the field of scribing and perforating of the aluminum nitride ceramic, scribing, cutting and micropore machining are achieved; since the optical fiber provided with the protective layer is adopted for replacing a conventional flying optical circuit, damage of dust to equipment including lasers and the like is reduced, and the airtightness of an optical cavity is improved; and it is guaranteed that the aluminum nitride ceramic is processed fast and well, and impurities on the surfaces of processed materials are cleared away.
Description
Technical field
The present invention relates to a kind of laser processing device of aluminium nitride ceramics and its method, belong to laser process equipment technology neck
Domain.
Background technology
Aluminium nitride is a kind of new ceramic material of high comprehensive performance, has excellent heat conductivity, reliably electricity is absolutely
A series of good characteristics such as edge, low dielectric constant and dielectric loss, hot expansion system that is nontoxic and matching with silicon, quilt
It is considered the ideal material of highly intergrated semiconductor substrate of new generation and electron device package, cause the wide of domestic and international researcher
General concern, developing rapidly with modern science and technology, the performance of material therefor is put forward higher requirement.Aluminium nitride ceramics
Also more will be widely applied in many fields.Although passing through the unremitting effort of many researchers for many years, in powder
Preparation, shaping, the research of the aspect such as sintering all makes significant progress.Aluminium nitride hardness is high, exceedes conventional aluminium oxide, is new
The wear-resistant ceramic material of type, but because cost is high, it is only used for the position of serious wear. invaded using the resistance to melt of ALN ceramic heat resistant
Erosion and thermal shock resistance, can make GaAs crystal crucible, Al evaporating dish, hydromagnetic generating device and high-temperature turbine machine corrosion-resistant member, profit
Infrared ray window can be made with its optical property.Aluminium nitride film can be made into high-frequency piezoelectric element, super large-scale integration substrate
Deng.Aluminium nitride is heat-resisting, the erosion of molten-metal-resistant, stable to acid, but is easily etched in alkaline solution.AIN fresh surface is sudden and violent
It is exposed at can react in humid air and generate very thin oxide-film.Using this characteristic, can be used as the earthenware of the Metal Meltings such as aluminium, copper, silver, lead
Crucible and burning casting mould material.Preferably, the quick porcelain of alternative virose oxidation is wide in the electronics industry for the metallization performance of ALN pottery
General application.
Content of the invention
The purpose of the present invention is to overcome the shortcomings of that prior art exists, and provides a kind of laser processing device of aluminium nitride ceramics
And its method.
The purpose of the present invention is achieved through the following technical solutions：
The laser processing device of aluminium nitride ceramics, feature is：Comprise quasi-continuous laser, the optical fiber with protective layer, glass
Glass vessel and thermostatic ultrasonic cleaning device, the lens combination light path output of described quasi-continuous laser by have the optical fiber of protective layer with
Laser head conduction connects, and the output light path of laser head has been sequentially arranged collimating mirror and focus lamp, the lens combination light path output of focus lamp
It is right against X-Y motion platform, described X-Y motion platform is installed on glassware by elevating mechanism, and glassware is placed in
In thermostatic ultrasonic cleaning device.
Further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, the top cloth of described X-Y motion platform
It is equipped with image system.
Further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, described focus lamp is provided with spray
Mouth, nozzle is right against X-Y motion platform, and nozzle connects auxiliary inflatable device.
Further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, described quasi-continuous laser is
1064nm optical fiber quasi-continuous laser.
Further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, the protective layer of described optical fiber is by rubber
Or aluminum laminated films are wound.
Further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, is contained with molten in described glassware
Liquid, solution is hydrochloric acid solution or acetone soln.
Further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, described image system is high-resolution
Auxiliary positioning image system.
Yet further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, control system and X-Y motion platform
Control and connect.
Yet further, the laser processing device of above-mentioned aluminium nitride ceramics, wherein, above described X-Y motion platform
Side is disposed with vacuum absorption device.
The laser processing of aluminium nitride ceramics of the present invention, aluminium nitride ceramics to be processed is fixed on X-Y motion platform,
Laser that quasi-continuous laser sends arrives laser head through the fiber optic conduction with protective layer, and the light path of laser head exports and dissipates
Natural light is adjusted to directional light by collimating mirror by light, and directional light is converged by focus lamp, coordinates with image system, and then controls
Laser machining site processed, laser is fed back on X-Y motion platform according to graphics processing in the way of coordinate system, based on position of platform
Trigger, is exported laser, focuses on aluminium nitride ceramics surface to be processed, be processed with moment melted material, to be processed
The aluminium nitride ceramics completing is inserted in the glassware holding solution, by thermostatic ultrasonic cleaning device carry out heat with ultrasonic, go
Impurity except generation in process.
The present invention compared with prior art has significant advantage and beneficial effect, embodies in the following areas：
1. adopt long pulsewidth laser instrument (quasi-continuous laser), produce the pulse of ms magnitude, enable to pulsed light and have
Ratio more than high ten times of peak power of continuous light, cutting, boring and the line to material preferably, the light path output of selection dissipates
Light, needs laser head is connected to the entrance point of cutting head, that is, collimate port, diverging light is adjusted to directional light, then by cutting
Cut a built-in focus lamp, zero diopter is pooled a strongest point of energy, auxiliary is blown, and allows and is exported by the light path of cutting head
Rectify for X-Y motion platform, using high definition image, material is positioned, determines specific Working position, laser according to plus
Work figure is fed back on uniform motion platform in the way of coordinate system, is realized isoparametric to energy of lasers by control system
Control, and the control of movement velocity is it is ensured that fluency in process, the uniformity of energy processing；
2. conducted using the optical fiber with protective layer, replaced the flight light path of traditional sense, decreased dust to sharp
The equipment such as light device injure, and increased the sealing of optical cavity；
3. arranged in pairs or groups by optics, using the application of the laser optical path through optimizing and optical module, comprehensive optical-fiber laser exists
The line of aluminium oxide ceramics aspect and the advantage in punching field, and improve traditional processing mode, realize line, cutting and micropore and add
Work, comparing other light sources processing mode has faster process velocity and crudy, is more suitable for chip package, LED illumination
In row field；This invention ensures that the faster and better processing of aluminium nitride ceramics and machine the clear of rear material surface impurity
Wash.
4. the processing such as carry out ruling, cut for the aluminium nitride ceramics good to heat dispersion, suitable chip package, LED
Illumination etc. industry, realize line, cutting and capillary processing, compared to traditional laser equipment hole knockout, process velocity faster,
Crudy is more preferable.
Brief description
Fig. 1：The structural representation of the present invention.
Specific embodiment
In order to be more clearly understood to the technical characteristic of the present invention, purpose and effect, now comparison accompanying drawing describes in detail
Specific embodiments.
As shown in figure 1, the laser processing device of aluminium nitride ceramics, comprise quasi-continuous laser 1, there is the optical fiber of protective layer
2nd, glassware 11 and thermostatic ultrasonic cleaning device 12, the lens combination light path output of quasi-continuous laser 1 is by having protective layer
Optical fiber 2 is connected with laser head 3 conduction, and the output light path of laser head 3 has been sequentially arranged collimating mirror 4 and focus lamp 6, focus lamp 6
Lens combination light path output be right against X-Y motion platform 9, X-Y motion platform 9 is installed on glassware 11 by elevating mechanism,
Glassware 11 is placed in thermostatic ultrasonic cleaning device 12.The top of X-Y motion platform 9 is disposed with image system 5, focus lamp 6
On nozzle 7 is installed, nozzle 7 is right against X-Y motion platform 9, and nozzle 7 connects auxiliary inflatable device 8.Above X-Y motion platform 9
Side be disposed with vacuum absorption device.Control system 10 is connected with X-Y motion platform 9 control.
Between quasi-continuous laser 1 and laser head 3, light path is conducted using the optical fiber with protective layer, replaces tradition meaning
The flight light path of justice, decreases dust and the equipment such as laser instrument is injured, increased the sealing of optical cavity.The protective layer of optical fiber 2 by
Rubber or aluminum laminated films, to being wound, prevent optical fiber from fractureing or are polluted by extraneous impurity.
Quasi-continuous laser 1 is 1064nm optical fiber quasi-continuous laser.There is QCW and go out optical mode, enable to pulsed light
There is the peak power than more than high ten times of continuous light, cutting, boring and the line to material preferably.
The random natural light of laser head 3 output is adjusted to orderly collimated light beam by collimating mirror 4.
Collimted laser beam enters focus lamp 6, realizes laser and converges, and coordinates with image system 5 and then control laser to add
Station is put, and laser is fed back on uniform motion platform according to graphics processing in the way of coordinate system, triggers letter based on position of platform
Number, export laser, focus on workpiece to be processed surface, be processed with moment melted material.
Image system 5 is high-resolution auxiliary positioning image system, it is possible to achieve the preparation to material positions and automatically catches
Catch function.
X-Y motion platform 9 arranges the kinematic parameters such as speed, acceleration by control system 10, operates simple and convenient.
It is contained with solution, solution is hydrochloric acid solution or acetone soln, and two kinds of solution can not mix to be made in glassware 11
With.But can by aluminium nitride ceramics first after dilute hydrochloric acid solution soaks 2～4 hours, then continue to soak 2 hours in acetone soln
?.
Using long pulsewidth laser instrument (being also quasi-continuous laser), produce the pulse of ms magnitude, enable to pulsed light tool
There are the peak power than more than high ten times of continuous light, cutting, boring and the line to material preferably, the light path output of selection is sent out
Astigmatism, needs laser head is connected to the entrance point of cutting head, that is, collimate port, diverging light is adjusted to directional light, then passes through
The built-in focus lamp of cutting head, zero diopter is pooled a strongest point of energy, and auxiliary is blown, and allows defeated by the light path of cutting head
Go out and rectify for X-Y motion platform, using high definition image, material is positioned, determine specific Working position, laser according to
Graphics processing is fed back on uniform motion platform in the way of coordinate system, is realized to parameters such as energy of lasers by control system
Control, and the control of movement velocity is it is ensured that fluency in process, the uniformity of energy processing.
The laser processing of aluminium nitride ceramics of the present invention, aluminium nitride ceramics to be processed is fixed on X-Y motion platform 9
On, the laser that quasi-continuous laser 1 sends is transmitted to laser head 3 through the optical fiber 2 with protective layer, and the light path of laser head 3 is defeated
Go out diverging light, natural light is adjusted to by directional light by collimating mirror 4, directional light is converged by focus lamp 6, joins with image system
Close, and then control laser machining site, laser is fed back on X-Y motion platform 9 according to graphics processing in the way of coordinate system, base
In position of platform trigger, export laser, focus on aluminium nitride ceramics surface to be processed, carry out adding with moment melted material
Work, the aluminium nitride ceramics being completely processed is inserted in the glassware 11 holding solution, is carried out by thermostatic ultrasonic cleaning device 12
Heating and impurity that is ultrasonic, producing in removal process.
Focal position is located at nozzle below 7, increases auxiliary blowing function 8 and reduces the heat producing in process, light path
Output is right against X-Y motion platform 9, and the top of X-Y motion platform 9 is disposed with image system 5, kinematic parameter and laser parameter
Stability it is ensured that processing is controlled by control system 10.
X-Y motion platform 9 is the grating scale of 0.1um using high accuracy, high-resolution, read head, linear electric motors, equipment group
Install and compensated by laser interferometer, make device location precision controlling within 5um.
The material surface machining and the back side retain some slags, need the flow process of cleaning, dilute from 10% concentration
Salt acid soak, proper amount of acetone solution holds respectively in glassware 11, and glass container is placed on the ultrasonic wave containing water to clean
In instrument, temperature is maintained at 60 ° about, and it is miscellaneous that such way can speed up that solution produces to laser action to aluminium nitride ceramics
Matter.
Arranged in pairs or groups by optics, using the application of the laser optical path through optimizing and optical module, comprehensive optical-fiber laser is in oxygen
Change aluminium pottery aspect line and the advantage in punching field, and improve traditional processing mode, realize line, cutting and micropore and add
Work, comparing other light sources processing mode has faster process velocity and crudy, is more suitable for chip package, LED illumination
In row field.This invention ensures that the faster and better processing of aluminium nitride ceramics and machine the clear of rear material surface impurity
Wash.
The present invention processing such as is carried out ruling, cuts for the aluminium nitride ceramics good to heat dispersion, suitable chip package,
The industries such as LED illumination, realize line, cutting and capillary processing, compared to traditional laser equipment hole knockout, process velocity is more
Hurry up, crudy is more preferable.
It should be noted that：The foregoing is only the preferred embodiment of the present invention, be not limited to the power of the present invention
Sharp scope；Simultaneously above description, the special personage for correlative technology field should understand and implement, therefore other without departing from
The equivalent change being completed under disclosed spirit or modification, should be included in claim.
Claims (10)
1. aluminium nitride ceramics laser processing device it is characterised in that：Comprise quasi-continuous laser (1), there is the light of protective layer
Fine (2), glassware (11) and thermostatic ultrasonic cleaning device (12), the lens combination light path output of described quasi-continuous laser (1) is led to
Cross and there is the optical fiber (2) of protective layer be connected with laser head (3) conduction, the output light path of laser head (3) has been sequentially arranged collimation
Mirror (4) and focus lamp (6), the lens combination light path output of focus lamp (6) is right against X-Y motion platform (9), described X-Y motion platform (9)
It is installed on glassware (11) by elevating mechanism, glassware (11) is placed in thermostatic ultrasonic cleaning device (12).
2. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：Described X-Y motion platform
(9) top is disposed with image system (5).
3. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：On described focus lamp (6)
Nozzle (7) is installed, nozzle (7) is right against X-Y motion platform (9), nozzle (7) connects auxiliary inflatable device (8).
4. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：Described quasi-continuous laser
(1) it is 1064nm optical fiber quasi-continuous laser.
5. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：The guarantor of described optical fiber (2)
Sheath is wound by rubber or aluminum laminated films.
6. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：Described glassware (11)
In be contained with solution, solution be hydrochloric acid solution or acetone soln.
7. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：Described image system (5)
For high-resolution auxiliary positioning image system.
8. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：Control system (10) and X-
Y motion platform (9) controls connection.
9. aluminium nitride ceramics according to claim 1 laser processing device it is characterised in that：Described X-Y motion platform
(9) side above is disposed with vacuum absorption device.
10. using claim 1 described device realize aluminium nitride ceramics laser processing it is characterised in that：To be processed
Aluminium nitride ceramics is fixed on X-Y motion platform (9), and the laser that quasi-continuous laser (1) sends is through having the light of protective layer
Fine (2) are transmitted to laser head (3), the light path output diverging light of laser head (3), by collimating mirror (4), natural light are adjusted to flat
Row light, directional light passes through focus lamp (6) and converges, and coordinates with image system, and then controls laser machining site, and laser is according to processing
Figure is fed back on X-Y motion platform (9) in the way of coordinate system, based on position of platform trigger, exports laser, focuses on
Aluminium nitride ceramics surface to be processed, is processed with moment melted material, and the aluminium nitride ceramics being completely processed is inserted and held
In the glassware (11) of solution, carry out heating and ultrasonic, generation in removal process by thermostatic ultrasonic cleaning device (12)
Impurity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610965241.9A CN106425087A (en) | 2016-11-04 | 2016-11-04 | Laser processing device for aluminum nitride ceramic and method thereof |
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| CN201610965241.9A CN106425087A (en) | 2016-11-04 | 2016-11-04 | Laser processing device for aluminum nitride ceramic and method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109366014A (en) * | 2018-12-21 | 2019-02-22 | 武汉欧双光电科技股份有限公司 | A kind of raw ceramic laser cutting equipment |
| CN110000466A (en) * | 2019-04-03 | 2019-07-12 | 中国科学院西安光学精密机械研究所 | A kind of self-loopa Blowing adsorption device and laser processing |
| CN110508952A (en) * | 2019-09-06 | 2019-11-29 | 岗春激光科技（江苏）有限公司 | Laser cutting head cooling system and laser cutting head |
| CN114911004A (en) * | 2022-04-22 | 2022-08-16 | 宁波大学 | Special glass optical fiber coating layer stripping device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101208773A (en) * | 2005-06-30 | 2008-06-25 | 飞科公司 | Method and device for cleaning electronic components processed with a laser beam |
| CN104384727A (en) * | 2014-11-19 | 2015-03-04 | 苏州德龙激光股份有限公司 | Device for processing aluminum oxide ceramic by fiber laser and method thereof |
| CN204185383U (en) * | 2014-11-20 | 2015-03-04 | 苏州德龙激光股份有限公司 | The processing unit (plant) of infrared laser cutting sapphire glass |
| CN104607808A (en) * | 2014-12-11 | 2015-05-13 | 西北工业大学 | Method for machining micro holes in ceramic matrix composite through femtosecond lasers |
| CN104668785A (en) * | 2015-03-10 | 2015-06-03 | 苏州德龙激光股份有限公司 | Laser rapid drilling device and laser rapid drilling method |
| WO2015137004A1 (en) * | 2014-03-14 | 2015-09-17 | 株式会社東京精密 | Laser dicing device and dicing method |
| CN105499790A (en) * | 2015-12-30 | 2016-04-20 | 武汉嘉铭激光有限公司 | Laser processing head |
| CN206230149U (en) * | 2016-11-04 | 2017-06-09 | 苏州德龙激光股份有限公司 | The laser processing device of aluminium nitride ceramics |
-
2016
- 2016-11-04 CN CN201610965241.9A patent/CN106425087A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101208773A (en) * | 2005-06-30 | 2008-06-25 | 飞科公司 | Method and device for cleaning electronic components processed with a laser beam |
| WO2015137004A1 (en) * | 2014-03-14 | 2015-09-17 | 株式会社東京精密 | Laser dicing device and dicing method |
| CN104384727A (en) * | 2014-11-19 | 2015-03-04 | 苏州德龙激光股份有限公司 | Device for processing aluminum oxide ceramic by fiber laser and method thereof |
| CN204185383U (en) * | 2014-11-20 | 2015-03-04 | 苏州德龙激光股份有限公司 | The processing unit (plant) of infrared laser cutting sapphire glass |
| CN104607808A (en) * | 2014-12-11 | 2015-05-13 | 西北工业大学 | Method for machining micro holes in ceramic matrix composite through femtosecond lasers |
| CN104668785A (en) * | 2015-03-10 | 2015-06-03 | 苏州德龙激光股份有限公司 | Laser rapid drilling device and laser rapid drilling method |
| CN105499790A (en) * | 2015-12-30 | 2016-04-20 | 武汉嘉铭激光有限公司 | Laser processing head |
| CN206230149U (en) * | 2016-11-04 | 2017-06-09 | 苏州德龙激光股份有限公司 | The laser processing device of aluminium nitride ceramics |
Non-Patent Citations (1)
| Title |
|---|
| TONY HOULT: "准连续激光器在焊接中应用", 《金属加工》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109366014A (en) * | 2018-12-21 | 2019-02-22 | 武汉欧双光电科技股份有限公司 | A kind of raw ceramic laser cutting equipment |
| CN110000466A (en) * | 2019-04-03 | 2019-07-12 | 中国科学院西安光学精密机械研究所 | A kind of self-loopa Blowing adsorption device and laser processing |
| CN110508952A (en) * | 2019-09-06 | 2019-11-29 | 岗春激光科技（江苏）有限公司 | Laser cutting head cooling system and laser cutting head |
| CN114911004A (en) * | 2022-04-22 | 2022-08-16 | 宁波大学 | Special glass optical fiber coating layer stripping device |
| CN114911004B (en) * | 2022-04-22 | 2023-08-08 | 宁波大学 | Stripping device for special glass optical fiber coating layer |
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Application publication date: 20170222 |
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