CN101108446A - Laser device for cutting and method thereof - Google Patents
Laser device for cutting and method thereof Download PDFInfo
- Publication number
- CN101108446A CN101108446A CNA2006100617558A CN200610061755A CN101108446A CN 101108446 A CN101108446 A CN 101108446A CN A2006100617558 A CNA2006100617558 A CN A2006100617558A CN 200610061755 A CN200610061755 A CN 200610061755A CN 101108446 A CN101108446 A CN 101108446A
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- China
- Prior art keywords
- laser cutting
- brittle substrate
- laser
- brittle
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a laser cutting machine for cutting brittle base plate along any preset direction. The laser cutting machine comprises a bearing device for bearing the brittle base plate, a parting tool for forming a pre-cut line along the preset direction on the brittle base plate, a laser generator for producing laser beam to heat the brittle base plate along the pre-cut line, a cooling device for providing cooling liquid to cool the heated brittle base plate and make the brittle base plate craze along the pre-cut line, a clamp device comprising at least one pair of clamp components to clamp the brittle base plate from the two opposite sides of the preset direction. The invention also provides a method for using the laser cutting machine to cut brittle base plate.
Description
Technical field
The present invention relates to a kind of laser cutting device and method, relate in particular to a kind of cutter sweep and method of utilizing laser beam cutting brittle material substrate.
Background technology
Continuous development along with Display Technique, Thin Film Transistor-LCD (Thin Film TransistorLiquid Crystal Display, TFT-LCD) etc. liquid crystal indicator has been widely used in consumer field, it is expected to replace conventional cathode ray tube (Cathode Ray Tube, CRT) display unit.
Liquid crystal indicators such as TFT-LCD are usually by two glass substrates, and the liquid crystal material and the some circuit that are contained between these two glass substrates are formed.This liquid crystal material can change the Presentation Function that arrangement mode is finished TFT-LCD under electric field action.Usually, in order to form the display panels of different size, need cut larger-size substrate, to meet the different needs.
Laser cutting device generally includes carrier, break bar, laser instrument, and cooler.When adopting this kind laser cutting device glass-cutting substrate, often utilize the vacuum suction method that glass substrate is fixed on the carrier, produce precut line with break bar at glass baseplate surface then, should precut line with laser beam heats immediately, provide cooling fluid cooled glass substrate surface via cooler again.This glass substrate can produce STRESS VARIATION because of the temperature difference that sharply produces, and this STRESS VARIATION formerly produces the crackle of growing up by break bar downwards at the precut line position that glass baseplate surface forms, and then makes whole glass substrate cracking.
But; in the process that adopts above-mentioned laser cutting device glass-cutting substrate; the both sides of regular meeting's precut line on glass substrate outwards produce certain displacement energy along basic direction of vertically being somebody's turn to do precut line; this displacement energy easily causes crackle to grow up and is offset out permissible cut coverage, causes the cutting failure.
In view of this, be necessary to provide a kind of laser cutting device and method, so that preferable cut quality to be provided.
Summary of the invention
To a kind of laser cutting device and method be described with specific embodiment below, it can provide preferable cut quality.
A kind of laser cutting device is used for along predetermined direction cutting brittle material substrate, and this laser cutting device comprises: a bogey is used to carry described brittle substrate; One cracking utensil is used for forming precut line at the described predetermined direction in described brittle substrate upper edge; One laser generator is used to produce laser beam and heats described brittle substrate along described precut line; One cooling device is used to provide cooling fluid to cool off described heated brittle substrate, so that this brittle substrate is along described precut line cracking; And a clamping device, it comprises at least one pair of clamping part, in order to state brittle substrate from the relative sandwich of described predetermined direction residence.
And a kind of laser cutting method is used for along predetermined direction cutting brittle material substrate, and this laser cutting method comprises: a brittle substrate is provided, and it is carried by a bogey; One clamping device that comprises at least one pair of clamping part is provided, states brittle substrate from the relative sandwich residence of described predetermined direction via this at least one pair of clamping part; Described predetermined direction forms precut line in described brittle substrate upper edge; Utilize laser beam to heat described brittle substrate along described precut line; Cool off described heated brittle substrate so that described brittle substrate ftractures along described precut line.
Compared with prior art, described laser cutting device comprises a clamping device, and this clamping device comprises at least one pair of clamping part; When using this laser cutting device cutting brittle material substrate, utilize the clamping part of described clamping device to state brittle substrate from the relative sandwich of described predetermined direction residence.In the cutting process, the clamping part of this clamping device can produce a chucking power to brittle substrate, in order to the phenomenon that suppresses to grow up and expand outwardly at the crackle at predetermined cuts line place in the cutting process, and then makes the cutting quality get a promotion.
Description of drawings
Fig. 1 is the working state schematic representation of the laser cutting device that provides of first embodiment of the invention.
Fig. 2 is the working state schematic representation of the laser cutting device that provides of second embodiment of the invention.
The specific embodiment
Below in conjunction with accompanying drawing the embodiment of the invention is described in further detail.
See also Fig. 1, the laser cutting device 100 that first embodiment of the invention provided comprises bogey 110, cracking utensil 120, laser generator 130, cooling device 140, and clamping device 150.
Described bogey 110 is used to carry brittle substrate to be cut 200.The material of this brittle substrate 200 can be fragile materials such as pottery, glass or quartz.
Described cracking utensil 120 is used for forming precut line 210 at described brittle substrate 200 upper edge predetermined direction A.This cracking utensil can be diamond cutter or break bar.
Described laser generator 130 comprises a lasing light emitter 132, be used to produce a laser beam 138 irradiations and heat described brittle substrate 200, the wavelength of this lasing light emitter 132 is relevant with the material of brittle substrate 200, when this brittle substrate 200 was materials such as pottery, glass, quartz, it was 10.6 microns that the wavelength of this lasing light emitter 132 is generally.Preferably, this laser generator 130 also comprises a beam deflector 134, is used to change the direction of the laser beam 138 that lasing light emitter produces, and to reduce the volume of laser generator 130, makes its compact conformation.This beam deflector 134 can be speculum or prism.Preferred, this laser generator 130 also comprises a light beam localizing device 136, is used for that described beam deflector 134 is transmitted the laser beam 138 that comes and is focused to described brittle substrate 200, and it can improve the efficiency of heating surface.
Described cooling device 140 is used to provide cooling fluid to cool off the brittle substrate 200 that the described laser beam 138 that is produced by laser generator 130 heats, so that this brittle substrate 200 cracks growth along described precut line 210, and then make brittle substrate 200 along precut line 210 crackings.Described cooling fluid can be gas, liquid or gas and mixtures of liquids.Described gas can be gaseous nitrogen, gaseous helium or its mixture etc. of low temperature (being generally below 0 ℃).Described liquid can be cooling water, cold oil, liquid nitrogen or liquid helium etc.
Described clamping device 150 comprises at least one pair of clamping part 152.The precut directional correlation of the quantity of described clamping part 152 and setting and brittle substrate 200, when precut direction is single identical or opposite direction, this clamping device 150 can be provided with a pair of clamping part 152, and this states brittle substrate 200 to clamping part 152 in order to the relative sandwich residence from described precut direction; When precut direction was a plurality of different direction, this clamping device 150 can be provided with many to clamping part 152, this many to clamping part 152 in order to state brittle substrate 200 from the relative sandwich residence of described different precut direction respectively.The shape of the clamping part 152 of described clamping device 150 usually is complementary with the profile of brittle substrate 200 to be cut, so that it is can be with described brittle substrate 200 inconsistent and this brittle substrate 200 clamped.In the present embodiment, this clamping device 150 is for being fixed on the roughly rectangular framework on the described bogey 110, and it has a pair of clamping part 152.This is conflicted from the relative both sides of described precut direction A to clamping part 152 and clamps described brittle substrate 200.The mode that this clamping device 150 is fixed on the described bogey 110 can be welding manner or screw fixed form.As shown in Figure 1, this clamping device 150 is fixed on the described bogey 110 by a plurality of screws 154.
Referring to Fig. 2, the structure of laser cutting device 300 that second embodiment of the invention provided and the laser cutting device 100 of first embodiment is basic identical, and it also comprises bogey 110, cracking utensil 120, laser generator 130, cooling device 140.This laser cutting device 300 is with 100 differences of described laser cutting device, distance between the paired clamping part 352 of the clamping device 350 of this laser cutting device 300 is adjustable, and this kind setting can make this clamping part 352 can realize the brittle substrate 200 of different size is carried out clamping.Concrete, this clamping device 350 comprises a pair of clamping part 352, exciting bank 354, and transmission arm 356.Described clamping part 352 is in order to conflict from the relative both sides of predetermined direction A and to clamp brittle substrate 200 to be cut.Described exciting bank 354 is fixed on the described bogey 110, its can encourage the transmission arm 356 described clamping parts 352 of effect so that this to clamping part 352 mutually near or away from.This also can regulate its chucking power each other via the incentive action of exciting bank 354 to clamping part 352.
To describe a kind of method of using described laser cutting device 300 along predetermined direction A cutting brittle material substrate below in detail, it roughly may further comprise the steps:
(1) provide a brittle substrate 200, it is carried by a bogey 110.The material of described brittle substrate is fragile materials such as pottery, glass or quartz, is glass substrate in the present embodiment.
(2) state glass substrate 200 via a pair of clamping part 352 of described clamping device 350 from the relative sandwich residence of described predetermined direction A.Concrete steps can be: utilize the described transmission arm 356 of exciting bank 354 excitations that two clamping parts 352 are drawn back certain distance earlier, then glass substrate 200 is placed on the bogey 110 between two clamping parts 352, conflicts from the relative both sides of described predetermined direction A by exciting bank 354 excitation transmission arms 356 effect clamping parts 352 again and clamp described glass substrate 200.
Certainly, be understandable that, also can adopt the clamping device 150 of first embodiment in this step.Concrete steps can be: elder generation conflicts from the relative both sides of described predetermined direction A with clamping part 152 and clamps described glass substrate 200, utilizes screw 154 that clamping device 150 is fixed on the bogey 110 again.Certainly, also can be with screw 154 clamping device 150 to be fixed on the bogey 110 earlier, again described glass substrate 200 is embedded described clamping device 150, and a pair of clamping part 152 of this clamping device 150 is conflicted from the relative both sides of described predetermined direction A and clamp described glass substrate 200.
(3) utilize cracking utensil 120 to form precut line 210 at the described predetermined direction A in described glass substrate 200 upper edges.
(4) utilize laser generator 130 to produce a laser beam 138, along the described glass substrate 200 of described precut line 210 heating.Concrete steps can be: produce laser beams 138 by lasing light emitter 132, via described beam deflector 134 deflections and be passed to described light beam localizing device 136, and be focused to described glass substrate 200 via this light beam localizing device 136.Certainly, be understandable that, can produce a laser beam 138,, and need not adopt light beam localizing device 136 via direct irradiation after beam deflector 134 deflections and along the described glass substrate 200 of described precut line 210 heating by lasing light emitter 132; Further, also can produce a laser beam 138 direct irradiations and heat described glass substrate 200, and need not adopt beam deflector 134 by lasing light emitter 132 along described precut line 210.
(5) utilize cooling device 140 described by 138 heated glass substrates 200 of laser beam, so that described glass substrate 200 cracks growth and ftractures at described precut line 210 places along precut line 210 injection cooling fluid coolings.
Certainly, be understandable that, can utilize vacuum adsorption method that described glass substrate 200 further is fixed on the described bogey 110 afterwards in step (1) or step (2).
Laser cutting device 100,300 and cutting method that the embodiment of the invention provided, it utilizes the clamping part 152,352 of described clamping device 150,350 to conflict from the relative both sides of described predetermined direction A and clamps described brittle substrate 200.The clamping part 152,352 of described clamping device 150,350 can produce a chucking power to brittle substrate 200, in order to the phenomenon that suppresses to grow up and expand outwardly at the crackle at predetermined cuts line place in the cutting process, and then makes the cutting quality get a promotion.
In addition, those skilled in the art also can do other and change in spirit of the present invention, as the shape of suitable change clamping device or method of clamping etc., as long as it does not depart from technique effect of the present invention and all can.The variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (16)
1. a laser cutting device is used for along predetermined direction cutting brittle material substrate, and this laser cutting device comprises: a bogey is used to carry described brittle substrate; One cracking utensil is used for forming precut line at the described predetermined direction in described brittle substrate upper edge; One laser generator is used to produce laser beam and heats described brittle substrate along described precut line; And a cooling device, be used to provide cooling fluid to cool off described heated brittle substrate, so that this brittle substrate is along described precut line cracking; It is characterized in that described laser cutting device also comprises a clamping device, this clamping device comprises at least one pair of clamping part, states brittle substrate in order to the relative sandwich residence from described predetermined direction.
2. laser cutting device as claimed in claim 1 is characterized in that, described cracking utensil is diamond cutter or break bar.
3. laser cutting device as claimed in claim 1 is characterized in that described laser generator comprises a lasing light emitter, is used to produce a laser beam to heat described brittle substrate.
4. laser cutting device as claimed in claim 3 is characterized in that described laser generator also comprises a beam deflector, is used to transmit laser beam that described lasing light emitter produces to described brittle substrate.
5. laser cutting device as claimed in claim 4 is characterized in that the laser generator of restrainting also comprises a light beam localizing device, is used to assemble the laser beam that transmits via described beam deflector to described brittle substrate.
6. laser cutting device as claimed in claim 4 is characterized in that, described beam deflector is speculum or prism.
7. laser cutting device as claimed in claim 1 is characterized in that, described clamping device is a framework, and it is fixed on the described bogey.
8. laser cutting device as claimed in claim 7 is characterized in that described clamping device is fixed on the described bogey via welding manner or screw fixation method.
9. laser cutting device as claimed in claim 1 is characterized in that described clamping device also comprises exciting bank, and this exciting bank is fixed on the described bogey, in order to encourage clamping part paired in described at least one pair of clamping part mutually near or away from.
10. a laser cutting method is used for along predetermined direction cutting brittle material substrate, and this laser cutting method comprises:
One brittle substrate is provided, and it is carried by a bogey;
One clamping device that comprises at least one pair of clamping part is provided, states brittle substrate from the relative sandwich residence of described predetermined direction via this at least one pair of clamping part;
Described predetermined direction forms precut line in described brittle substrate upper edge;
Utilize laser beam to heat described brittle substrate along described precut line;
Cool off described heated brittle substrate, so that described brittle substrate is along described precut line cracking.
11. laser cutting method as claimed in claim 10 is characterized in that, described laser cutting method also comprises and utilizes vacuum suction that described brittle substrate is fixed on the described bogey.
12. laser cutting method as claimed in claim 10 is characterized in that, described heated brittle substrate cools off via a cooling fluid.
13. laser cutting method as claimed in claim 12 is characterized in that, described cooling fluid is gas, liquid or gas and mixtures of liquids.
14. laser cutting method as claimed in claim 13 is characterized in that, described gas is gaseous nitrogen, gaseous helium or its mixture.
15. laser cutting method as claimed in claim 13 is characterized in that, described liquid is cooling water, cold oil, liquid nitrogen or liquid helium.
16. laser cutting method as claimed in claim 10 is characterized in that, the material of described brittle substrate is pottery, glass or quartz.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100617558A CN101108446A (en) | 2006-07-21 | 2006-07-21 | Laser device for cutting and method thereof |
| KR1020070070189A KR100932347B1 (en) | 2006-07-21 | 2007-07-12 | Laser cutting apparatus and laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100617558A CN101108446A (en) | 2006-07-21 | 2006-07-21 | Laser device for cutting and method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101108446A true CN101108446A (en) | 2008-01-23 |
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ID=39040815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100617558A Pending CN101108446A (en) | 2006-07-21 | 2006-07-21 | Laser device for cutting and method thereof |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100932347B1 (en) |
| CN (1) | CN101108446A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101530965B (en) * | 2008-03-11 | 2010-12-08 | 富士迈半导体精密工业（上海）有限公司 | Device and method for cutting substrate |
| CN101591137B (en) * | 2008-05-30 | 2011-08-10 | 富士迈半导体精密工业（上海）有限公司 | Laser cutting device and laser cutting method |
| CN102217056A (en) * | 2008-11-19 | 2011-10-12 | 应用材料股份有限公司 | Laser-scribing tool architecture |
| CN101530951B (en) * | 2008-03-13 | 2012-03-14 | 富士迈半导体精密工业（上海）有限公司 | Brittle substrate and laser cutting method therefor |
| CN101574759B (en) * | 2008-05-05 | 2012-07-04 | 元太科技工业股份有限公司 | Bearing device and manufacture method of flexible display panel |
| CN102627396A (en) * | 2011-06-14 | 2012-08-08 | 胡伟 | Glass/ceramic deep processing molding method and molding equipment |
| CN106141446A (en) * | 2015-04-24 | 2016-11-23 | 昆山纳诺新材料科技有限公司 | Fragility object shearing device and cutting-off method thereof |
| CN107160174A (en) * | 2017-06-30 | 2017-09-15 | 惠州市柯帝士科技有限公司 | It is cut by laser mechanism |
| CN107813061A (en) * | 2017-09-25 | 2018-03-20 | 武汉华星光电技术有限公司 | Laser cutting device and laser cutting method |
| CN108247220A (en) * | 2018-01-31 | 2018-07-06 | 中国电子科技集团公司第三十八研究所 | A kind of laser of microwave components tears lid method open |
| CN111085784A (en) * | 2018-10-08 | 2020-05-01 | 英属开曼群岛商纳诺股份有限公司 | Immersion type laser processing method and system thereof |
| CN112264720A (en) * | 2020-10-28 | 2021-01-26 | 安徽瑞迪微电子有限公司 | DBC substrate splitting method |
| CN113857653A (en) * | 2021-12-03 | 2021-12-31 | 太原理工大学 | Surface modification device of ultrasonic-assisted laser |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004042423A (en) * | 2002-07-11 | 2004-02-12 | Mitsuboshi Diamond Industrial Co Ltd | Scribing apparatus |
| JP2004186635A (en) * | 2002-12-06 | 2004-07-02 | Sharp Corp | Cutting device for semiconductor substrate and cutting method |
-
2006
- 2006-07-21 CN CNA2006100617558A patent/CN101108446A/en active Pending
-
2007
- 2007-07-12 KR KR1020070070189A patent/KR100932347B1/en not_active IP Right Cessation
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101530965B (en) * | 2008-03-11 | 2010-12-08 | 富士迈半导体精密工业（上海）有限公司 | Device and method for cutting substrate |
| CN101530951B (en) * | 2008-03-13 | 2012-03-14 | 富士迈半导体精密工业（上海）有限公司 | Brittle substrate and laser cutting method therefor |
| CN101574759B (en) * | 2008-05-05 | 2012-07-04 | 元太科技工业股份有限公司 | Bearing device and manufacture method of flexible display panel |
| CN101591137B (en) * | 2008-05-30 | 2011-08-10 | 富士迈半导体精密工业（上海）有限公司 | Laser cutting device and laser cutting method |
| CN102217056A (en) * | 2008-11-19 | 2011-10-12 | 应用材料股份有限公司 | Laser-scribing tool architecture |
| CN102627396A (en) * | 2011-06-14 | 2012-08-08 | 胡伟 | Glass/ceramic deep processing molding method and molding equipment |
| CN106141446B (en) * | 2015-04-24 | 2020-09-25 | 英属开曼群岛商纳诺股份有限公司 | Brittle object cutting device and cutting method thereof |
| CN106141446A (en) * | 2015-04-24 | 2016-11-23 | 昆山纳诺新材料科技有限公司 | Fragility object shearing device and cutting-off method thereof |
| CN107160174A (en) * | 2017-06-30 | 2017-09-15 | 惠州市柯帝士科技有限公司 | It is cut by laser mechanism |
| CN107160174B (en) * | 2017-06-30 | 2019-04-02 | 大展智能装备(广东)有限责任公司 | Laser cutting mechanism |
| CN107813061A (en) * | 2017-09-25 | 2018-03-20 | 武汉华星光电技术有限公司 | Laser cutting device and laser cutting method |
| CN108247220A (en) * | 2018-01-31 | 2018-07-06 | 中国电子科技集团公司第三十八研究所 | A kind of laser of microwave components tears lid method open |
| CN111085784A (en) * | 2018-10-08 | 2020-05-01 | 英属开曼群岛商纳诺股份有限公司 | Immersion type laser processing method and system thereof |
| CN111085784B (en) * | 2018-10-08 | 2022-04-29 | 英属开曼群岛商纳诺股份有限公司 | Immersion type laser processing method and system thereof |
| CN112264720A (en) * | 2020-10-28 | 2021-01-26 | 安徽瑞迪微电子有限公司 | DBC substrate splitting method |
| CN113857653A (en) * | 2021-12-03 | 2021-12-31 | 太原理工大学 | Surface modification device of ultrasonic-assisted laser |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080008965A (en) | 2008-01-24 |
| KR100932347B1 (en) | 2009-12-16 |
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Open date: 20080123 |