CN101530965B - Device and method for cutting substrate - Google Patents
Device and method for cutting substrate Download PDFInfo
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- CN101530965B CN101530965B CN2008103005143A CN200810300514A CN101530965B CN 101530965 B CN101530965 B CN 101530965B CN 2008103005143 A CN2008103005143 A CN 2008103005143A CN 200810300514 A CN200810300514 A CN 200810300514A CN 101530965 B CN101530965 B CN 101530965B
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Abstract
The invention relates to a device and a method for cutting a substrate used in the manufacturing field of flat panel displays. The device is used for cutting the substrate which is provided with a positioning mark and a plurality of precut lines. The device for cutting the substrate comprises a positioning platform, an image positioning device, a knife flywheel cutting module and a laser cutting module, wherein the knife flywheel cutting module and the laser cutting module are arranged on both opposite sides of the image positioning device respectively; the positioning platform is used for supporting the substrate and ensuring that the substrate moves along a first direction and a second direction which is different from the first direction; the image positioning device is used for positioning the substrate according to the positioning mark; and the knife flywheel cutting module and the laser cutting module are respectively used for cutting the substrate along the precut lines.
Description
Technical field
The present invention relates to a kind of cutter for substrate and method for dividing substrate, particularly be used for the cutter for substrate and the method for dividing substrate of manufacturing field of flat panel.
Background technology
In the manufacture process of panel display apparatus, need utilize cutter sweep that the substrate cut of a large-size is become undersized substrate usually.
See also Fig. 1, a kind of cutter sweep 10 comprises a locating platform 11 that is used for bearing substrate 101, a break bar cutting module 12 that is arranged on locating platform 11 tops, one is arranged on locating platform 11 tops and the laser cutting module 13 adjacent with break bar cutting module 12, and image locator (Charge Coupled Device, CCD) 14 that are arranged on laser cutting module 13 away from break bar cutting module 12 1 sides.Locating platform 11 can move along X-direction and Y direction, and break bar cutting module 12, laser cutting module 13 and image locator 14 are on the same straight line.Substrate 101 is provided with telltale mark 102 and the latticed precut line 103 that a plurality of linearities are arranged.Telltale mark 102 is arranged on along an end of the precut line 103 of X-direction extension.
See also Fig. 2, cutter sweep 10 forms on substrate 101 along the cutting process of the line of cut of X-direction extension and is summarized as follows: collinear correction is done at the center to the cutting of the break bar shown in Fig. 1 module 12, laser cutting module 13 and image locator 14, the datum line of proofreading and correct is positioned at the central authorities of locating platform 11, and promptly datum line overlaps with the precut line in the centre of substrate 101; Along Y direction mobile position platform 11, make sensing region 141 precision positionings to a telltale mark 102 of image locator 14; Along X-direction mobile position platform 11, the cutting zone 121 that makes break bar cut module 12 is positioned at the initial cut place with this telltale mark 102 corresponding precut lines; Along X-direction mobile position platform 11 12 pairs of substrates 101 of break bar cutting module are cut; When the line of cut that is formed by break bar cutting module 12 arrived the cutting zone 131 of laser cutting module 13,13 pairs of substrates 101 of laser cutting module cut up to the cutting of finishing this line of cut; Along Y direction and X-direction mobile position platform 11, make the cutting zone 121 of break bar cutting module 12 be positioned at the initial cut place of the precut line of next bar, and then finish the cutting action of second line of cut by break bar cutting module 12 and laser cutting module 13; Repeat above-mentioned steps up to the cutting action of finishing on the substrate 101 all lines of cut that extend along X-direction.Yet, in this cutting process, because locating platform 11 itself has linearity precision (Yaw) error, thus angle that can the formation certain angle between the line of cut that causes formation and the precut line.Therefore, under the situation that the quantity that forms line of cut along Y direction increases progressively, can cause at line of cut that forms on the substrate 101 and the side-play amount between the corresponding precut line to increase gradually, and then might damage small size substrate 104.
Please be simultaneously referring to Fig. 3, the spacing of two precut lines 103 of adjacent X-direction is H, promptly locating platform 11 each distances that move along Y direction are H; Spacing along X-direction between the center of the center of cutting zone 121 and sensing region 141 is L; It is d that locating platform 11 moves the mean error that causes in X-direction along Y direction, the angle that forms between line of cut 105 that is caused by mean error d and the precut line 103 is α, break bar cutting module 12 and image locator 14 apart from each others, the center of then causing the center of cutting zone 121 and sensing region 141 is D along the side-play amount of Y direction.For example: if H=50mm, d=1.5 μ m, L=250mm, then can get according to formula d: H=D: L, D=7.5 μ m, even to move the mean error that causes in X-direction along Y direction be 1.5 μ m to locating platform 11, and then the center of the center of cutting zone 121 and sensing region 141 side-play amount of 7.5 μ m promptly can occur along Y direction, therefore also bigger departure can occur by break bar cutting module 12 and laser cutting module 13 between line of cut 105 that forms on the substrate 101 and precut line 103.This shows, because locating platform 11 has mean error d and image locator 14 is relative far away with the distance that break bar cuts between the module 12 in X-direction when moving, so earlier by behind image locator 14 location, cut between the line of cut 105 that forms and the precut line 103 by break bar cutting module 12 and laser cutting module 13 again and on Y direction, have bigger side-play amount, thereby when 10 pairs of substrates 101 of cutter sweep cut, might damage preformed small size substrate 104 (as shown in Figure 1), cause the yield of gained small size substrate 104 lower.
Summary of the invention
To a kind of cutter for substrate and a kind of method for dividing substrate be described with embodiment below, it helps reducing the error range in the substrate cut process, improves the yield of substrate cut.
A kind of cutter for substrate, it is used for cutting substrate, this substrate is provided with telltale mark and many precut lines, this cutter for substrate comprises: a locating platform, an image locator, a break bar cutting module and a laser cutting module, this break bar cutting module and this laser cutting module are separately positioned on the relative both sides of this image locator, the center of the cutting zone of this break bar cutting module, the center of the cutting zone of the center of the sensing region of this image locator and this laser cutting module is on same straight line, this locating platform is used to carry this substrate and this substrate is moved along the second direction that a first direction and is different from this first direction, this image locator is used for according to this telltale mark this substrate being positioned, and this break bar cutting module and this laser cutting module are respectively applied for along this precut line this substrate is cut.
A kind of method for dividing substrate, it is used for cutting substrate, this substrate is provided with telltale mark and many precut lines, the cutter for substrate that this method for dividing substrate adopted comprises a locating platform, an image locator, break bar cutting module and a laser cutting module, this break bar cutting module and this laser cutting module are separately positioned on the relative both sides of this image locator, and this method for dividing substrate may further comprise the steps:
Proofread and correct at center to the cutting zone of the center of the sensing region of the center of the cutting zone of this break bar cutting module, this image locator and this laser cutting module, and the three is located along the same line;
Utilize this locating platform to drive carrying substrate thereon and move, make the sensing region of this image locator navigate to telltale mark on this substrate along a first direction;
Utilize this locating platform to drive this substrate and move along a second direction that is different from this first direction, the cutting zone that makes this break bar cut module is positioned at the initial cut place of a precut line on this substrate;
Utilize this locating platform to drive this substrate and move, so that this break bar cutting module cuts this substrate along this precut line along the opposite direction of this second direction; And
When the line of cut that is formed by this break bar cutting module arrives the cutting zone of this laser cutting module, utilize this laser cutting module that this substrate is cut.
With respect to prior art, included break bar cutting module and laser cutting module are separately positioned on the both sides of image locator in described cutter for substrate and the method for dividing substrate.Therefore, after this image locator positions this substrate, locating platform moves than short distance and can make break bar cutting module be positioned at the initial cut place of the precut line of substrate, thereby can reduce line of cut that forms that the linearity trueness error by locating platform caused and the angle between the precut line, thereby reduced the departure between break bar cutting module and the precut line, improved the cutting yield of substrate.
Description of drawings
Fig. 1 is the structural representation that a kind of existing cutter sweep is used for cutting substrate.
Fig. 2 is the schematic top plan view that cutter sweep shown in Fig. 1 is used for cutting substrate.
Fig. 3 is the deviation quantitative analysis schematic diagram between a line of cut that forms on the substrate and corresponding precut line of cutter sweep shown in Fig. 2.
Fig. 4 is the structural representation that the first embodiment of the invention cutter for substrate is used for cutting substrate.
Fig. 5 is the schematic top plan view that cutter for substrate shown in Fig. 4 is used for cutting substrate.
Fig. 6 is the deviation quantitative analysis schematic diagram between a line of cut that forms on the substrate and corresponding precut line of cutter for substrate shown in Fig. 4.
The specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
See also Fig. 4, the cutter for substrate that is used for cutting substrate 101 20 that first embodiment of the invention provides.
Cutter for substrate 20 comprises: a locating platform 21 that is used for bearing substrate 101, a break bar cutting module 22 that is arranged on locating platform 21 tops, an image locator 23 that is arranged on locating platform 21 tops and contiguous break bar cutting module 22, and a laser cutting module 24 that is arranged on image locator 23 away from break bar cutting module 22 1 sides.
Locating platform 21 can move along X-direction and Y direction, makes that many precut lines 103 on this substrate 101 can move to the below that break bar cuts module 22, image locator 23 and laser cutting module 24 respectively.
Break bar cutting module 22 and laser cutting module 24 are arranged at the both sides of image locator 23 respectively, and center, the center of this image locator 23 and the center three of this laser cutting module 24 of break bar cutting module 22 are on the same straight line.Image locator 23 can independently be provided with, and also can be installed on the break bar cutting module 22, and in the present embodiment, image locator 23 is installed on the break bar cutting module 22.Air line distance L1 between image locator 23 and the break bar cutting module 22 is less than or equal to the air line distance L2 between image locator 23 and the laser cutting module 24.In the present embodiment, air line distance L1 between image locator 23 and the break bar cutting module 22 equals the air line distance L2 between image locator 23 and the laser cutting module 24, after so 23 pairs of substrates 101 of image locator position, locating platform 21 moves than short distance and can make break bar cutting module 22 be positioned at the initial cut place of precut line 103, thereby can reduce line of cut that forms that the linearity trueness error by locating platform 21 caused and the angle between the precut line 103, thereby reduce the departure between break bar cutting module 22 and the precut line 103.Under the situation that the quantity along X-direction or Y direction formation line of cut increases progressively, also can reduce by a relatively large margin at line of cut that forms on the substrate 101 and the side-play amount between the corresponding precut line, and then reduce the possibility of damage small size substrate 104.In addition, image locator 23 also can measure the line of cut of formation and the side-play amount between the corresponding precut line, and can adjust, thereby improve cutter for substrate 20 forms many lines of cut at substrate 101 reliability according to the parameter of the product confrontation cutter for substrate 20 of detecting the line of cut that forms.
Be understandable that many precut lines 103 also can be arranged with other forms, for example: along the precut line of X-direction extension and along the angle between the precut line of Y direction extension is acute angle.
Please be simultaneously referring to Fig. 5, the cutting method of utilizing cutter for substrate 20 cutting substrates 101 that second embodiment of the invention provides may further comprise the steps:
Proofread and correct at the center of the center of the center of the cutting zone 221 of tool setting wheel cutting module 22, the sensing region 231 of image locator 23 and the cutting zone 241 of laser cutting module 24, the three is located along the same line, the datum line of proofreading and correct is positioned at the central authorities of substrate 101, and promptly the residing straight line in center of the center of the center of cutting zone 221, sensing region 231 and cutting zone 241 overlaps (side-play amount is zero) with the precut line 103 of substrate 101 central authorities;
Utilize locating platform 21 to drive carrying substrate 101 thereon and move, make the sensing region 231 of image locator 23 navigate to a telltale mark 102 along Y direction;
Utilize locating platform 21 to drive substrate 101 and move, make the cutting zone 221 of break bar cutting module 22 be positioned at initial cut place with the corresponding precut line 103 that extends along X-direction of this telltale mark 102 along X-direction;
Utilize locating platform 21 to drive substrate 101 and move so that 22 pairs of substrates 101 of break bar cutting module cut along X-direction, the line of cut 105 that is formed by break bar cutting module 22 will move to the cutting zone 241 of this laser cutting module 24;
During the cutting zone 241 of the line of cut 105 arrival laser cutting modules 24 that form by break bar cutting module 22, utilize 24 pairs of substrates 101 of laser cutting module to cut up to the cutting of finishing this line of cut 105;
Utilize locating platform 21 to drive substrate 101 and move, make the cutting zone 221 of break bar cutting module 22 be positioned at the initial cut place of next bar along the precut line 103 of X-direction extension along Y direction and X-direction;
Utilize locating platform 21 to drive substrate 101 and move, finish second line of cut 105 by break bar cutting module 22, laser cutting module 24 along X-direction;
Repeat above-mentioned steps up to the cutting action of finishing on the substrate 101 all lines of cut 105 that extend along X-direction.
Be understandable that, utilize locating platform 21 can drive substrate 101 and revolve and turn 90 degrees, repeat above-mentioned steps and on substrate 101, forms all lines of cut 105 along the Y direction extension by break bar cutting module 22, laser cutting module 24.
In the cutting method that present embodiment provided, has short air line distance L1 between image locator 23 and the break bar cutting module 22, be after 23 pairs of substrates 101 of image locator position, locating platform 21 moves than short distance L1 and can make the cutting zone 221 of break bar cutting module 22 be positioned at the initial cut place of precut line 103, thereby caused the line of cut 105 that forms and the angle between the precut line 103 to reduce accordingly by the linearity trueness error of locating platform 21, then the cutting zone 221 of break bar cutting module 22 and the departure between the precut line 103 also can diminish accordingly.Under the situation that the quantity along X-direction or Y direction formation line of cut 105 increases progressively, also can reduce greatly at line of cut 105 that forms on the substrate 101 and the side-play amount between the corresponding precut line 103, and then reduce the possibility of damage small size substrate 104.
Please be simultaneously referring to Fig. 6, the spacing of two adjacent precut lines 103 that extend along X-direction is H, promptly the distances that at every turn move along Y direction of locating platform 21 are H; Spacing along X-direction between the center of the center of cutting zone 221 and sensing region 231 is L1, and the spacing along X-direction between the center of the center of cutting zone 241 and sensing region 231 is L2, at this, and L1=L2=L0; It is d that locating platform 21 moves the mean error that causes in X-direction along Y direction, the angle that forms between line of cut 105 that is caused by mean error d and the precut line 103 is β, along the side-play amount of Y direction, and the side-play amount along Y direction is T between the center of cutting zone 241 and the precut line 103 between the center of cutting zone 221 and the precut line 103.For example: if H=50mm, d=1.5 μ m, L1=L2=L0=80mm, then can get according to formula d: H=T: L0, T=2.4 μ m, even to move the mean error that causes in X-direction along Y direction be 1.5 μ m to locating platform 21, then promptly can occur the side-play amount of 2.4 μ m between line of cut 105 that is formed by break bar cutting module 22 and laser cutting module 24 and the precut line 103.This shows, has short air line distance between sensing region 231 and the cutting zone 221, then locating platform 21 moves than short distance and can make the cutting zone 221 of break bar cutting module 22 be positioned at the initial cut place of precut line 103, thereby line of cut that forms 105 that the linearity trueness error by locating platform 21 caused and the angle β between the precut line 103 have been reduced, thereby having reduced the cutting zone 221 of break bar cutting module 22 and the departure between the precut line 103 reduces, reduce the probability of the small size substrate 104 (as shown in Figure 4) that damage will form when 20 pairs of substrates 101 of cutter for substrate cut effectively, improved the fine ratio of product of small size substrate 104.
In addition, those skilled in the art also can do other variation in spirit of the present invention, if its do not depart from technique effect of the present invention all can, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (7)
1. cutter for substrate, it is used for cutting substrate, this substrate is provided with telltale mark and many precut lines, this cutter for substrate comprises: a locating platform, an image locator, a break bar cutting module and a laser cutting module, this break bar cutting module and this laser cutting module are separately positioned on the relative both sides of this image locator, the center of the cutting zone of this break bar cutting module, the center of the cutting zone of the center of the sensing region of this image locator and this laser cutting module is on same straight line, this locating platform is used to carry this substrate and this substrate is moved along the second direction that a first direction and is different from this first direction, this image locator is used for according to this telltale mark this substrate being positioned, and this break bar cutting module and this laser cutting module are respectively applied for along this precut line this substrate is cut.
2. cutter for substrate as claimed in claim 1 is characterized in that: this image locator is installed on this break bar cutting module.
3. cutter for substrate as claimed in claim 1 is characterized in that: this first direction is vertical with this second direction.
4. cutter for substrate as claimed in claim 3 is characterized in that: the distance between the center of the cutting zone of the center of the sensing region of this image locator and this break bar cutting module is less than or equal to the distance between the center of cutting zone of the center of sensing region of this image locator and this laser cutting module.
5. method for dividing substrate, it is used for cutting substrate, this substrate is provided with telltale mark and many precut lines, the cutter for substrate that this method for dividing substrate adopted comprises a locating platform, an image locator, break bar cutting module and a laser cutting module, this break bar cutting module and this laser cutting module are separately positioned on the relative both sides of this image locator, and this method for dividing substrate may further comprise the steps:
Proofread and correct at center to the cutting zone of the center of the sensing region of the center of the cutting zone of this break bar cutting module, this image locator and this laser cutting module, and the three is located along the same line
Utilize this locating platform to drive carrying substrate thereon and move, make the sensing region of this image locator navigate to telltale mark on this substrate along a first direction;
Utilize this locating platform to drive this substrate and move along a second direction that is different from this first direction, the cutting zone that makes this break bar cut module is positioned at the initial cut place of a precut line on this substrate;
Utilize this locating platform to drive this substrate and move, so that this break bar cutting module cuts this substrate along this precut line along the opposite direction of this second direction; And
When the line of cut that is formed by this break bar cutting module arrives the cutting zone of this laser cutting module, utilize this laser cutting module that this substrate is cut.
6. method for dividing substrate as claimed in claim 5 is characterized in that: this first direction is vertical with this second direction.
7. method for dividing substrate as claimed in claim 5 is characterized in that: the residing straight line of center three of the center of the center of the cutting zone of this break bar cutting module, the sensing region of this image locator and the cutting zone of this laser cutting module overlaps with the precut line of this substrate center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103005143A CN101530965B (en) | 2008-03-11 | 2008-03-11 | Device and method for cutting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103005143A CN101530965B (en) | 2008-03-11 | 2008-03-11 | Device and method for cutting substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101530965A CN101530965A (en) | 2009-09-16 |
| CN101530965B true CN101530965B (en) | 2010-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008103005143A Expired - Fee Related CN101530965B (en) | 2008-03-11 | 2008-03-11 | Device and method for cutting substrate |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6218686B2 (en) * | 2014-07-17 | 2017-10-25 | Ｔｏｗａ株式会社 | Substrate cutting apparatus and substrate cutting method |
| CN105630221A (en) * | 2014-11-06 | 2016-06-01 | 深圳莱宝高科技股份有限公司 | Panel structure, panel unit and manufacturing methods of panel structure and panel unit |
| CN105573541A (en) * | 2014-11-06 | 2016-05-11 | 深圳莱宝高科技股份有限公司 | Panel structure, structure unit and fabrication methods therefor |
| CN106031961B (en) * | 2015-03-20 | 2019-02-05 | 元壤实业（上海）有限公司 | A method of processing conducting foam wire casing |
| CN105652484A (en) * | 2016-03-29 | 2016-06-08 | 深圳市华星光电技术有限公司 | Method for cutting liquid crystal display panel |
| JP6744626B2 (en) * | 2016-07-25 | 2020-08-19 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing device |
| CN107160174B (en) * | 2017-06-30 | 2019-04-02 | 大展智能装备(广东)有限责任公司 | Laser cutting mechanism |
| CN110039189B (en) * | 2019-03-18 | 2021-03-16 | 武汉华星光电半导体显示技术有限公司 | Cutting apparatus, cutting method, and manufacturing method of display panel |
| DE102019206274A1 (en) * | 2019-05-02 | 2020-11-05 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for separating cutting a plurality of workpiece parts |
| CN112264720A (en) * | 2020-10-28 | 2021-01-26 | 安徽瑞迪微电子有限公司 | DBC substrate splitting method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001293586A (en) * | 2000-04-12 | 2001-10-23 | Takatori Corp | Method of cutting glass |
| CN101108446A (en) * | 2006-07-21 | 2008-01-23 | 富士迈半导体精密工业（上海）有限公司 | Laser device for cutting and method thereof |
-
2008
- 2008-03-11 CN CN2008103005143A patent/CN101530965B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001293586A (en) * | 2000-04-12 | 2001-10-23 | Takatori Corp | Method of cutting glass |
| CN101108446A (en) * | 2006-07-21 | 2008-01-23 | 富士迈半导体精密工业（上海）有限公司 | Laser device for cutting and method thereof |
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| CN101530965A (en) | 2009-09-16 |
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