CN106141446B - Brittle object cutting device and cutting method thereof - Google Patents
Brittle object cutting device and cutting method thereof Download PDFInfo
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- CN106141446B CN106141446B CN201510201011.0A CN201510201011A CN106141446B CN 106141446 B CN106141446 B CN 106141446B CN 201510201011 A CN201510201011 A CN 201510201011A CN 106141446 B CN106141446 B CN 106141446B
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Abstract
The invention provides a brittle object cutting device and a cutting method thereof, wherein the brittle object cutting device comprises a first heating laser unit, a second heating laser unit, a notch laser unit, a cooling unit and a processing module. On the surface of the brittle object, the heating beams of the two heating laser units are respectively positioned on two sides of the cutting beam of the cutting laser unit, and the cooling liquid of the cooling unit follows the heating beams. In one moving process of the brittle object, the processing module controls the cutting beam to cut, and controls one of the heating beam and the cooling liquid of the cooling unit to heat and cool the brittle object. The invention can save the operation time for cutting the brittle object.
Description
Technical Field
The present invention relates to a cutting device and a cutting method thereof, and more particularly, to a brittle object cutting device and a cutting method thereof, which use a laser to generate a thermally-induced mechanical stress (change) to cut a brittle object.
Background
It is known to create a cut along a boundary line and fracture stress along the cut creates a mechanical force to cause a complete separation cut of a brittle flat material, such as glass, sapphire, silicon, gallium arsenide, or ceramic.
In this manner, in order to cut the brittle flat sheet material, the depth of the cut must be at least one-third of the thickness of the brittle flat sheet material. The indentations may be produced mechanically or by laser means. In particular for substrates (chips), laser cutting methods by burning into the material to create an incision are increasingly used. The cuts are typically only a few microns (mum) wide and have a depth of 1/3 which approximates the thickness of the brittle flat sheet material. The cut depth is generated in proportion to the total thickness of the brittle flat plate material according to the brittleness of the brittle flat plate material. The laser process is critical for the aspect ratio between the width of the kerf and the depth of the kerf, which requires complex equipment and relatively slow creation of the kerf. Thus, deep grooves require more and more processing time for thick wafers.
Such a method is disclosed in US patent US 20050153525 or US 20040228004. After the notch is produced, the chip is completely severed by applying mechanical (impulse) energy or force, such as a pulling force (stretching of the film), a bending force (breaking beyond the ridge), or a combination thereof.
The mechanical application of the breaking force is relatively imprecise in positioning. A fracture defect therefore occurs when the fracture line is not perpendicular to the thickness of the material or when two fracture lines do not intersect each other at a point at a predetermined angle. In particular in chip production, for example, fracture defects lead to a reduction in yield and must therefore be avoided. In addition, if the material particles separate, they can cause contamination on the surface of the brittle flat material.
In addition to severing the brittle flat material by material removal, for example in the form of a cut, it is known to create a mechanical force to initiate a crack, followed by thermal induced mechanical stress to propagate in the brittle flat material. Such a process (thermal laser separation-TLS) is described in patent No. WO 90/20015. It is not preferred, especially when a brittle flat material to be separated into a plurality of parallel strips is to be cut in a second direction, e.g. perpendicular to the first separation direction, e.g. into individual rectangles during singulation of the chips into individual chips. Since new initial cracks have to be formed separately at the start of each division row in the first separation direction, the method is very time consuming and gives the machine high losses.
For example, in US 8,212,180, a method for cutting a brittle flat material is disclosed, and the process of generating a cut and the process of applying thermo-mechanical stress are divided into two strokes, so that the two processes may cause a problem of displacement of the point of action on the brittle flat material, thereby causing a problem that the fracture line does not run perpendicular to the thickness of the material.
In view of the foregoing, the present inventors have devised and designed a brittle object cutting apparatus and a brittle object cutting method to overcome the drawbacks of the prior art and to improve industrial implementation.
Disclosure of Invention
The present invention is directed to a brittle object cutting apparatus and a cutting method thereof, which are intended to solve the above problems of the prior art.
In order to achieve the above object, the present invention provides a brittle object cutting device, which is applied to a brittle object, and comprises a notch laser unit, a first heating laser unit, a second heating laser unit, two cooling units and a processing module. The incision laser unit emits an incision beam to act on the brittle object. The first heating laser unit emits a first heating beam. The second heating laser unit emits a second heating light beam, and when the first heating light beam, the second heating light beam and the incision light beam act on the brittle object, the first heating light beam and the second heating light beam are respectively positioned at two sides of the incision light beam. The cooling unit provides cooling liquid to cool the brittle object; wherein a cooling unit is located on one side of the first heating beam and opposite to the cutting beam to cool the brittle object after the first heating beam; another cooling unit is located on a side of the second heating beam and opposite the incision beam to cool the brittle article after the second heating beam. The processing module is configured to: selectively controlling the cutting laser unit, the first heating laser unit and the cooling unit so as to enable the cutting beam and the first heating beam to sequentially cut along one of a plurality of separation lines of the brittle object in one processing stroke, and simultaneously operating the first heating beam and the cooling liquid; or selectively controlling the cutting laser unit, the second heating laser unit and the cooling unit to carry out processing operation, so that the cutting beam, the second heating beam and the cooling liquid sequentially carry out cutting processing along one of a plurality of separation lines of the brittle object in one processing stroke, and the second heating beam and the cooling liquid simultaneously carry out operation.
Preferably, the machining direction of the notching beam, the first heating beam and the cooling liquid is opposite to the machining direction of the notching beam, the second heating beam and the cooling liquid.
Preferably, the incision beam acts on the brittle object for a predetermined distance from the edge of the brittle object to the first axial separation line; the incision beam acts entirely on the brittle article along the second axial separation line or acts a predetermined distance in the second axial direction at each intersection of the separation lines.
In order to achieve the above object, the present invention further provides a brittle object cutting device, which is applied to a brittle object and includes a notch laser unit, a heating laser unit, a first optical path guiding unit, a second optical path guiding unit, two cooling units and a processing module. The cutting laser unit emits a cutting beam to act on the brittle object on a cutting optical path. The heating laser unit emits a heating beam. The first light path guiding unit is configured to guide the heating light beam to or through the first heating light path, or configured to guide a part of the heating light beam to and through the first heating light path. The second light path guiding unit guides the heating light beam passing through the first light path guiding unit, the brittle object is heated on the second heating light path, and when the first heating light path, the second heating light path and the cut light path act on the brittle object, the first heating light path and the second heating light path are respectively positioned on two sides of the cut light path. The cooling unit provides cooling liquid to cool the brittle object; the cooling unit is positioned on one side of the first heating light path and is opposite to the cut light path and used for cooling the fragile object after the first heating light path; another cooling unit is located on one side of the second heating light path and opposite the cut-out light path for cooling the brittle object after the second heating light path. The processing module controls the notch laser unit, the heating laser unit, the first light path guiding unit and the cooling unit to perform processing operation, so that the notch light beam on the notch light path, the heating light beam and the cooling liquid on the first heating light path or the notch light beam on the notch light path, the heating light beam and the cooling liquid on the second heating light path are sequentially cut along one of a plurality of separation lines of the brittle object in one processing stroke, the first heating light beam and the cooling liquid operate simultaneously, and the second heating light beam and the cooling liquid operate simultaneously.
Preferably, the machining directions of the slit beam on the slit optical path, the heating beam on the first heating optical path, and the cooling liquid are opposite to the machining directions of the slit beam on the slit optical path, the heating beam on the second heating optical path, and the cooling liquid.
Preferably, the incision beam acts on the brittle object for a predetermined distance from the edge of the brittle object to the first axial separation line; the incision beam acts completely on the brittle article along the second axial separation line or acts a predetermined distance in the second axial direction at each intersection of the separation lines.
To achieve the above object, the present invention further provides a method for cutting a brittle object, which is applied to a brittle object having a plurality of separation lines, the method comprising the steps of: setting a notching laser unit to emit a notching beam; configuring a first heating laser unit to emit a first heating beam; configuring a second heating laser unit to emit a second heating beam; processing the brittle object by acting the cutting beam on the brittle object along one of the parting lines; and selectively heating the brittle object along one of the separation lines by using the first heating light beam or the second heating light beam, and simultaneously providing cooling liquid through a cooling unit so as to cool the brittle object along one of the separation lines after the first heating light beam or the second heating light beam. The first heating light beam and the cooling liquid or the second heating light beam and the cooling liquid heat and cool the brittle object, and the brittle object and the cutting light beam are processed in the same moving stroke of the brittle object.
Preferably, the cutting method further comprises the steps of: the action positions of the first heating light beam and the second heating light beam on the brittle object are respectively arranged at two sides of the action position of the incision light beam on the brittle object.
Preferably, the cutting method further comprises the steps of: the processing directions of the notching beam, the first heating beam and the cooling liquid are opposite to the processing directions of the notching beam, the second heating beam and the cooling liquid.
Preferably, the cutting method comprises the following steps: and controlling the incision light beam to act on the brittle object along each separation line in the first axial direction for a predetermined distance, wherein the predetermined distance is started from the edge of the brittle object.
Preferably, the cutting method further comprises the steps of: and controlling the incision light beam to act on the brittle object completely along each of the plurality of separation lines in the second axial direction, or acting a preset distance at the intersection point of the plurality of separation lines in the first axial direction and the plurality of separation lines in the second axial direction.
In view of the above, the brittle object cutting apparatus and the cutting method according to the present invention may have one or more of the following advantages:
(1) the invention relates to a brittle object cutting device and a cutting method thereof, which can improve the edge quality of a brittle object by simultaneously performing the processes of cutting, heating and cooling in the same process.
(2) The invention relates to a brittle object cutting device and a cutting method thereof, which can lead heating beams to be behind a cutting beam in the reciprocating processing process by arranging the heating beams at two sides of the cutting beam, thereby saving the reset displacement time of the processing process and improving the efficiency.
(3) The brittle object cutting device and the cutting method thereof form the first heating light beam or the second heating light beam through the arrangement of the first light path guide unit and the second light path guide unit, thereby reducing the number of heating laser units and saving the cost.
Drawings
The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:
fig. 1 is a schematic structural view of a brittle object cutting apparatus according to a first embodiment of the present invention.
FIG. 2 is a first application diagram of a first embodiment of the brittle object cutting device of the present invention.
FIG. 3 is a schematic view of a second application of the first embodiment of the apparatus for cutting a brittle object according to the present invention.
FIG. 4 is a first application diagram of a second embodiment of the brittle member cutting apparatus according to the present invention.
FIG. 5 is a schematic view of a second application of the second embodiment of the apparatus for cutting a brittle object according to the present invention.
FIG. 6 is a first application diagram of a third embodiment of the apparatus for severing a brittle object according to the present invention.
FIG. 7 is a schematic view of a second application of a third embodiment of the apparatus for cutting a brittle object according to the present invention.
Fig. 8 is a step diagram of the method for cutting a brittle object according to the present invention.
Fig. 9 is a schematic view of the application of the cutting method of the brittle object of the present invention.
[ notation ] to show
11: first heating laser unit 111: first heating light beam
12: second heating laser unit 121: second heating light beam
13: the slit laser unit 131: notched light beam
132: cut optical path 14A: cooling unit
14B: the other cooling unit 15: processing module
21: heating laser unit 22: first light path guide unit
221: first heating light path 23: second light path guide unit
231: second heating light path 24: blocking unit
9: a brittle object D: a predetermined distance
S81-S85: step (ii) of
Detailed Description
To facilitate understanding of the technical features, contents, and advantages of the present invention and the effects achieved thereby, the present invention will be described in detail with reference to the accompanying drawings in the form of embodiments, and it should be noted that the drawings are used for illustration and assistance in the specification, and are not necessarily true to scale and precise arrangement after the implementation of the present invention, and therefore, the scope of the right of the present invention in actual implementation should not be read and limited by the scale and arrangement of the drawings.
Hereinafter, embodiments of a brittle object cutting apparatus and a cutting method thereof according to the present invention will be described with reference to the accompanying drawings, and for the sake of understanding, the same components in the following embodiments will be described with the same reference numerals. In addition, the direction indicated by the arrow in the drawing is the moving direction of the brittle object.
Hereinafter, the brittle object of the present invention is exemplified by a WAFER (WAFER), such as a sapphire WAFER, but it can be applied to other brittle objects, and therefore, should not be limited thereto.
The plurality of separation lines on the brittle object can be formed by a plurality of first axial separation lines and a plurality of second axial separation lines. Wherein the first axial direction may be perpendicular to the second axial direction. The cutting device for the brittle object of the invention processes the separation lines in the first axial direction in the forward direction and the reverse direction one by one, and processes the separation lines in the second axial direction in the forward direction and the reverse direction one by one to cut the brittle object.
Referring to fig. 1, there is shown a schematic structural view of a brittle object cutting apparatus according to a first embodiment of the present invention. As shown in fig. 1, the brittle object cutting apparatus includes a first heating laser unit 11, a second heating laser unit 12, a notch laser unit 13, two cooling units 14A, 14B, and a processing module 15. The first heating laser unit 11 and the second heating laser unit 12 may be CO2A laser; wherein the first heating laser unit 11 emits a first heating beam 111, and the second heating laser unit 12 emits a second heating beam 121. The laser unit 13 may be a UV laser, the laser unit 13 emits a cutting beam 131 to act on the brittle object 9, and the first heating beam 111, the second heating beam 121 and the cutting beam 131 act on the brittle object 9 when the first heating beam 111, the second heating beam 121 and the cutting beam 131 act on the brittle object 9The beam 111 and the second heating beam 121 are located on either side of the slit beam 131. That is, when machining in the forward direction, the first heating beam 111 follows the slit beam 131, and when machining in the reverse direction, the second heating beam 121 follows the slit beam 131. The cooling unit 14 provides a cooling liquid to cool the brittle object 9; wherein the cooling unit 14A is located at a side of the first heating beam 111 and opposite to the cutting beam 131 to cool the brittle article 9 after the first heating beam 111; another cooling unit 14B is located on one side of the second heating beam 121 and opposite to the incision beam 131 to cool the brittle object 9 after the second heating beam 121. The Processing module 15 may be a Central Processing Unit (CPU) or a Microcontroller Unit (MCU), and the Processing module 15 selectively controls the kerf laser Unit 13, the first heating laser Unit 11 and the cooling Unit 14A to perform a Processing operation; alternatively, the notch laser unit 13, the second heating laser unit 12, and the other cooling unit 14B are controlled to perform the machining operation. Therefore, in one processing stroke (for example, processing along a separation line in a first axial direction), the cutting beam 131, the first heating beam 111 and the cooling liquid can be sequentially cut along one of the separation lines of the brittle object 9; alternatively, the cutting beam 131, the second heating beam 121 and the cooling liquid may be sequentially cut along one of a plurality of parting lines of the brittle object 9. In particular, the first heating laser unit 11 and the cooling unit 14A perform heating and cooling operations simultaneously, and the second heating laser unit 12 and the other cooling unit 14B perform heating and cooling operations simultaneously.
Of course, the brittle object cutting device may further include a guiding component for guiding the light beam, a lens, a carrying stage or a driving component for carrying the brittle object 9 to move, and the like, which are well known to those skilled in the art and will not be described herein again. Wherein, the bearing table or the driving assembly for bearing the movement of the brittle object 9 is also controlled by the processing module 15 to make the brittle object 9 move in the first axial direction or the second axial direction or rotate along a rotating axial direction. In addition, the focusing lens can also be controlled by the processing module 15 to focus the light beam on the surface of the fragile object 9. The first axial direction, the second axial direction and the rotating axial direction are integrated, and the other third axial direction is separated from the three axial directions.
In a preferred embodiment, the axial directions may be an X-axis direction, a Y-axis direction, a C-axis direction, and a Z-axis direction. The X axis and the Y axis are used for moving the fragile object 9, the C axis is used for adjusting or rotating the fragile object 9 according to the separation line, and the Z axis is used for moving the lens so that the light beam can be focused on the surface of the fragile object 9 to replace the movement of the fragile object 9 relative to the lens along the Z axis. That is, the Z-axis may maintain or change focus, e.g., maintain or change the working distance between the fragile object 9 and the lens. The rotation axis direction is perpendicular to the plane formed by the X axis direction and the Y axis direction, and the vacuum chuck is naturally rotated together with the rotation axis direction by turning the brittle object 9 by 90 degrees after the end of the first direction processing (for example, after the end of the forward direction cutting) while aligning the parting line.
Referring to fig. 2 and 3, there are shown a first application diagram and a second application diagram of a brittle object cutting device according to a first embodiment of the present invention. For example, when the brittle object cutting device cuts the brittle object 9 in a positive direction along the separation line of the first axial direction, the processing module 15 may control the cutting laser unit 13 to perform the cutting operation, and then control the first heating laser unit 11 and the cooling unit 14A to perform the heating and cooling operations. Then, when the brittle object cutting device cuts the brittle object 9 along the separation line of the first axial direction in a reverse direction opposite to the positive direction, the processing module 15 can control the notching laser unit 13 to perform the notching operation, and then control the second heating laser unit 12 and the other cooling unit 14B to perform the heating and cooling operations. The brittle member cutting device performs a processing operation along a second axial separation line, which will be further described below. Therefore, the brittle object cutting apparatus can directly perform the processing by the notch laser unit 13, the second heating laser unit 12 and the other cooling unit 14B after the process in the forward direction is completed by the notch laser unit 13, the first heating laser unit 11 and the cooling unit 14A, and the processing time can be saved.
In addition, in the processing stroke in which the brittle object 9 is moved by the brittle object cutting device to complete one first axial separation line in the forward direction, the notch laser unit 13 and the first heating laser unit 11 are simultaneously operated, and the cooling unit 14A is simultaneously cooled after the first heating laser unit 11. Similarly, in the processing stroke in which the brittle object 9 is moved by the brittle object cutting device to complete one separation line in the first axial direction in the reverse direction, the notch laser unit 13 and the second heating laser unit 12 are simultaneously operated, and the other cooling unit 14B is simultaneously cooled after the second heating laser unit 12. Therefore, the brittle object cutting device of the invention can solve the problem of poor edge quality or accuracy possibly caused by error problems in the prior art.
Referring to fig. 4 and 5, there are shown a first application diagram and a second application diagram of a second embodiment of the brittle object cutting device according to the present invention. In the present embodiment, the brittle object cutting apparatus includes a heating laser unit 21, a first optical path guiding unit 22, a second optical path guiding unit 23, a notch laser unit 13, two cooling units 14A and 14B, and a processing module 15. The heating laser unit 21 emits a heating beam. The first light path guiding unit 22 may be a movable reflecting mirror or a beam splitter, wherein the first light path guiding unit 22 is an implementation example of the beam splitter, which will be further described in the following embodiments. The first light path guiding unit 22 guides the heating light beam to heat the brittle object 9 on the first heating light path 221, or passes the heating light beam through the first light path guiding unit 22. The second light path guiding unit 23 guides the heating light beam that originally passed through the first light path guiding unit 22 after the first light path guiding unit 22 is removed, and heats the brittle object 9 on the second heating light path 231. The heating light beam guided by the second light path guiding unit 23 is a heating light beam that heats the laser unit 21. The notching laser unit 13 emits a notching beam to act on the brittle object 9 on the notching optical path 132, and when the first heating optical path 221, the second heating optical path 231 and the notching optical path 132 act on the brittle object 9, the first heating optical path 221 and the second heating optical path 231 are respectively located at two sides of the notching optical path 132. The two cooling units 14A, 14B are configured to provide a cooling fluid to cool the brittle object 9, similar to the previous embodiment, and will not be described again. That is, when machining in the forward direction, the first heating optical path 221 is after the notch optical path 132, and the coolant is after the first heating optical path 221; when working in the reverse direction, the second heating light path 231 is behind the cut light path 132, and the cooling liquid is behind the second heating light path 231. The processing module 15 controls the heating laser unit 21, the first optical path guiding unit 22, the notch laser unit 13, and the two cooling units 14A and 14B to perform processing operations. Wherein, in one processing stroke, the processing module 15 controls to make the cutting beam on the cutting light path 132, the heating beam on the first heating light path 221 and the cooling liquid sequentially cut the processing parting line along one of the parting lines (for example, the parting line in the first axial direction) of the brittle object 9; alternatively, the cutting processing separation line is controlled so that the cutting beam on the cutting optical path 132, the heating beam on the second heating optical path 231, and the cooling liquid are sequentially cut along one of the plurality of separation lines (for example, the second axial separation line) of the brittle object 9. Similarly, the heating light beam on the first heating light path 221 heats and cools simultaneously with the cooling liquid, and the heating light beam on the second heating light path 231 heats and cools simultaneously with the cooling liquid.
For example, when the brittle object 9 is cut along the positive direction along the separation line in the first axial direction of the brittle object cutting device, the processing module 15 may control the first light path guiding unit 22 to change the original light path of the heating laser unit 21 (i.e., the first light path guiding unit 22 is stationary), and act on the brittle object 9 on the first heating light path 221. At this time, the brittle object cutting apparatus can perform the cutting operation by using the cutting beam on the cutting path 132 in sequence, and then perform the heating and cooling operations by controlling the heating beam and the cooling liquid on the first heating path 221. Then, when the brittle object 9 is cut along the reverse direction along the separation line in the first axial direction of the brittle object cutting device, the processing module 15 may control the first optical path guiding unit 22 to move away without changing the original optical path of the heating laser unit 21, so that the heating beam of the heating laser unit 21 may be received by the second optical path guiding unit 23. Therefore, the second light path guiding unit 23 can change the original light path of the heating laser unit 21 to act on the brittle object 9 on the second heating light path 231. At this time, the brittle object cutting apparatus can perform the cutting operation by the cutting beam on the cutting path 132, and perform the heating and cooling operation by the heating beam and the cooling liquid on the second heating path 231 in sequence.
As can be seen from the above, after the forward direction process is completed, the brittle object cutting apparatus can directly use the heating light beam on the second heating light path 231 and the cooling liquid of the other cooling unit 14B to perform heating and cooling, so as to save the processing time, and further, only one heating laser unit can be used to achieve the purpose.
Referring to fig. 6 and 7, a first application diagram and a second application diagram of a third embodiment of a brittle cutting target cutting apparatus according to the present invention are shown, respectively. In the present embodiment, the first optical path guiding unit 22 is exemplified by a beam splitter. Preferably, the transmittance and reflectance of the beam splitter are 50% each, but not limited thereto, and may be varied according to the actual application or the configuration of the designer, such as 40% and 60% or 30% and 70%.
In the present embodiment, the configuration of each component is similar to that of the previous embodiment, and thus, the description thereof is omitted. It should be noted that the blocking units 24 are disposed on the first heating light path 221 and the second heating light path 231 respectively. The two blocking units 24 selectively block the heating light beam of the first heating light path 221 or the heating light beam on the second heating light path 231 through the control of the processing module 15.
For example, when the brittle object 9 is cut along the positive direction on the separation line of the first axial direction of the brittle object cutting device, the processing module 15 may control the blocking unit 24 on the second heating light path 231 to move so as to block the heating light beam on the second heating light path 231, so that only the heating light beam on the first heating light path 221 acts on the brittle object 9. At this time, the brittle object cutting apparatus can perform the cutting operation by the cutting beam on the cutting path 132 and the heating and cooling operation by the heating beam and the cooling liquid on the first heating path 221 in sequence. Next, when the separation line in the first axial direction of the brittle object cutting device cuts the brittle object 9 in the reverse direction, the processing module 15 may control the blocking unit 24 on the first heating light path 221 to move to block the heating light beam on the first heating light path 221, so that only the heating light beam on the second heating light path 231 acts on the brittle object 9. At this time, the brittle object cutting apparatus can perform the cutting operation by the cutting beam on the cutting path 132 and the heating and cooling operation by the heating beam and the cooling liquid on the second heating path 231 in sequence.
Referring to fig. 8, there are shown steps of the method for cutting a brittle object according to the present invention. The method for cutting a brittle object according to the present invention is preferably applied to the apparatus for cutting a brittle object according to the first embodiment, and may be applied to the second and third embodiments without departing from the spirit and scope of the present invention. The cutting method of the brittle object of the invention comprises the following steps:
(S81) setting a notching laser unit to emit a notching beam.
(S82) configuring the first heating laser unit to emit a first heating light beam.
(S83) configuring a second heating laser unit to emit a second heating beam.
(S84) applying the incision beam to the brittle object along the separation line to process the brittle object.
(S85) heating the brittle article along the separation line using selectively the first heating beam or the second heating beam, and simultaneously passing through the cooling unit to provide a cooling liquid to cool the brittle article along the separation line. The first heating light beam and the cooling liquid or the second heating light beam and the cooling liquid heat and cool the brittle object, and the first heating light beam and the second heating light beam and the cutting light beam process the brittle object in the same moving stroke of the brittle object.
Referring to fig. 9, an application of the method for cutting a brittle object according to the present invention is illustrated. In the above embodiments, the kerf generated by the kerf laser unit 13 preferably has a width of 2 μm to 10 μm and a depth of 1/10 which is less than the thickness of the brittle object 9, for example, a depth of 3 μm to 15 μm for a WAFER (WAFER) thickness of 90 μm to 130 μm. The cutting speed may be 100mm/s to 300mm/s or faster. However, the above description is only an exemplary description of the operating parameters of the brittle object cutting device of the present invention, and should not be construed as limiting.
It is worth mentioning in particular that, on the first axial separation line, the incision laser unit 13 acts only a predetermined distance D on the brittle object 9, and the predetermined distance D is initiated by an edge of the brittle object 9, and preferably the predetermined distance D is 30 μm to 1000 μm. On the separation line in the second axial direction, the incision laser unit 13 may have two implementation examples. As shown in fig. 9 (a), in one of the embodiments, the notch laser unit 13 acts on the brittle object 9 entirely and entirely along the second axial separation line. In another embodiment, as shown in fig. 9 (b), the notch laser unit 13 may act on the brittle article 9 at the intersection of the plurality of separation lines along the second axial separation line by a predetermined distance, and the predetermined distance may be centered on the intersection of the plurality of separation lines in the first axial direction and the plurality of separation lines in the second axial direction.
In the cutting device and the cutting method for the brittle object, all separation lines in the first axial direction are cut first, and then all separation lines in the second axial direction are cut. In addition, the cutting apparatus and the cutting method for the brittle object according to the present invention can be performed in such a manner that the brittle object 9 is cut in a forward direction along a separation line in a first axial direction or a second axial direction of the brittle object 9, and then the brittle object 9 is cut in a reverse direction; alternatively, the cutting of the brittle object 9 in the reverse direction may be performed, followed by the cutting of the brittle object 9 in the forward direction. Further, the brittle object cutting apparatus and the cutting method thereof of the present invention sequentially or randomly cut the respective separation lines in the first axial direction. After all the separation lines in the first axial direction are cut, the brittle member 9 is rotated (for example, by 90 degrees) and the separation lines in the second axial direction are cut sequentially or randomly. In the drawings, the first axial separation line and the second axial separation line are sequentially cut, but the present invention is not limited thereto.
The detailed description and embodiments of the method for cutting a brittle object according to the present invention have been described above with reference to the apparatus for cutting a brittle object according to the present invention, and will not be described here for the sake of brevity.
The foregoing is by way of example only, and not limiting. Any equivalent modifications or variations without departing from the spirit and scope of the present invention should be included in the claims of the present application.
Claims (7)
1. A brittle object cutting device, which is applied to cut a brittle object, comprises:
a notch laser unit configured to emit a notch beam to act on the brittle object on a notch optical path, wherein the notch beam acts on the brittle object a predetermined distance from a first axial separation line, and the predetermined distance is initiated by an edge of the brittle object;
a heating laser unit configured to emit a heating beam;
a first light path guiding unit configured to guide a part of the heating light beam onto a first heating light path and to guide a part of the heating light beam through the first light path guiding unit;
a second light path guiding unit configured to guide a part of the heating light beam passing through the first light path guiding unit, heat the brittle object on a second heating light path, and the first heating light path and the second heating light path are respectively located at both sides of the cut light path when the first heating light path, the second heating light path and the cut light path act on the brittle object;
the two blocking units are respectively arranged on the first heating light path and the second heating light path;
two cooling units configured to provide a cooling fluid to cool the brittle object, wherein one cooling unit is located on one side of the first heating light path and opposite the incision light path to cool the brittle object after the first heating light path, and the other cooling unit is located on one side of the second heating light path and opposite the incision light path to cool the brittle object after the second heating light path;
a processing module configured to: controlling the one notching laser unit, the heating laser unit, the first optical path guiding unit, and the cooling unit to perform a machining operation such that the notching beam on the notching optical path, the heating beam on the first heating optical path, and the cooling liquid are sequentially subjected to a cutting process along one of a plurality of parting lines of the brittle object in one machining stroke, and the notching optical path, the heating beam on the first heating optical path, and the cooling liquid are simultaneously operated; or the cutting light beam on the cutting light path, the heating light beam on the second heating light path and the cooling liquid are sequentially cut along one of a plurality of parting lines of the brittle object, and the cutting light path, the heating light beam on the second heating light path and the cooling liquid are operated simultaneously;
wherein the two blocking units selectively block the heating light beam on the first heating light path or the heating light beam on the second heating light path through the control of the processing module.
2. The brittle object cutting apparatus according to claim 1, wherein a processing direction of the cutting beam on the cutting optical path, the heating beam on the first heating optical path and the cooling liquid is opposite to a processing direction of the cutting beam on the cutting optical path, the heating beam on the second heating optical path and the cooling liquid.
3. The brittle article cutting apparatus according to claim 1, wherein the cutting beam acts on the brittle article entirely on the separation line in the second axial direction or acts on each intersection of the separation lines along the second axial direction by the predetermined distance.
4. A cutting method of a brittle object, which is applied to the brittle object and is provided with a plurality of separation lines, the cutting method comprises the following steps:
setting a notching laser unit to emit a notching beam;
configuring a heating laser unit to emit a heating beam;
configuring a first light path guiding unit to guide a portion of the heating light beam onto a first heating light path and to guide a portion of the heating light beam through the first light path guiding unit;
configuring a second light path guiding unit to guide the heating light beam passing through the first light path guiding unit to heat the brittle object on a second heating light path, wherein when the first heating light path, the second heating light path and the light path of the notch light beam act on the brittle object, the first heating light path and the second heating light path are respectively located on two sides of the light path of the notch light beam;
two blocking units are configured and respectively arranged on the first heating light path and the second heating light path;
applying the incision beam to a brittle object along one of a plurality of separation lines to process the brittle object; and
selectively blocking the heating light beam of the first heating light path or the heating light beam on the second heating light path by the two blocking units, heating the brittle article along the one of the plurality of separation lines with the heating beam of the first heating light path or the heating beam of the second heating light path selectively, and simultaneously passing through a cooling unit to provide a cooling liquid, to cool the brittle article along the one of the plurality of separation lines after the heating beam, the heating light beam and the cooling liquid of the first heating light path or the heating light beam and the cooling liquid of the second heating light path heat and cool the brittle object, and processing the brittle object in the same moving stroke of the brittle object simultaneously with the notch beam.
5. The method of cutting a brittle object as claimed in claim 4, wherein a processing direction of the cutting beam, the heating beam of the first heating optical path and the cooling liquid is opposite to a processing direction of the cutting beam, the heating beam of the second heating optical path and the cooling liquid.
6. The method of cutting a brittle object according to claim 5, wherein the cutting method comprises the steps of:
controlling the incision beam to act on the brittle article a predetermined distance along each of the plurality of separation lines in a first axial direction, and the predetermined distance is initiated by an edge of the brittle article.
7. The method of cutting a brittle article according to claim 6, wherein the cutting method further comprises the steps of:
controlling the incision beam to act on the brittle article entirely along each of the plurality of separation lines in the second axial direction, or at an intersection of the plurality of separation lines in the first axial direction and the plurality of separation lines in the second axial direction by the predetermined distance.
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