CN1939636A - Laser cutting method and apparatus - Google Patents
Laser cutting method and apparatus Download PDFInfo
- Publication number
- CN1939636A CN1939636A CN200510094679.6A CN200510094679A CN1939636A CN 1939636 A CN1939636 A CN 1939636A CN 200510094679 A CN200510094679 A CN 200510094679A CN 1939636 A CN1939636 A CN 1939636A
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- laser
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200510094679.6A CN100482398C (en) | 2005-09-30 | 2005-09-30 | Laser cutting method and apparatus |
Applications Claiming Priority (1)
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CN200510094679.6A CN100482398C (en) | 2005-09-30 | 2005-09-30 | Laser cutting method and apparatus |
Publications (2)
Publication Number | Publication Date |
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CN1939636A true CN1939636A (en) | 2007-04-04 |
CN100482398C CN100482398C (en) | 2009-04-29 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN200510094679.6A Expired - Fee Related CN100482398C (en) | 2005-09-30 | 2005-09-30 | Laser cutting method and apparatus |
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CN (1) | CN100482398C (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101844865A (en) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | Cutter for substrate and the method for utilizing this cutter for substrate cutting substrate |
CN101530951B (en) * | 2008-03-13 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | Brittle substrate and laser cutting method therefor |
CN101279403B (en) * | 2007-04-06 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | Laser processing method |
CN102574244A (en) * | 2009-10-08 | 2012-07-11 | 特摩劳吉克公司 | Controlling rules and variables for cutting |
CN102643017A (en) * | 2011-03-14 | 2012-08-22 | 京东方科技集团股份有限公司 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
CN101462822B (en) * | 2007-12-21 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | Friable non-metal workpiece with through hole and method of processing the same |
CN103608145A (en) * | 2011-04-07 | 2014-02-26 | 特摩劳吉克公司 | Method of, system and computer program for machine cutting several parts of a piece of material using controlling rules and variables for cutting |
CN105798470A (en) * | 2016-05-27 | 2016-07-27 | 京东方科技集团股份有限公司 | Laser cutter and cutting method thereof |
CN106141446A (en) * | 2015-04-24 | 2016-11-23 | 昆山纳诺新材料科技有限公司 | Fragility object shearing device and cutting-off method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6218642B1 (en) * | 1999-07-12 | 2001-04-17 | J. F. Helmold & Bro., Inc. | Laser hardened steel cutting rule |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
KR100673073B1 (en) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | Method and Apparatus for cutting non-metal substrate using a laser beam |
KR100794284B1 (en) * | 2001-09-29 | 2008-01-11 | 삼성전자주식회사 | Method for cutting non-metal substrate |
DE10257544A1 (en) * | 2002-12-10 | 2004-07-08 | Schott Glas | Reduction of a laser-scored glass panel to a required rectangular shape involves removing surplus material first by breaking off surplus material along a second laser-scored line, and secondly from a first laser-scored line |
KR100497820B1 (en) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | Glass-plate cutting machine |
-
2005
- 2005-09-30 CN CN200510094679.6A patent/CN100482398C/en not_active Expired - Fee Related
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101279403B (en) * | 2007-04-06 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | Laser processing method |
US8518280B2 (en) | 2007-12-21 | 2013-08-27 | Hon Hai Precision Industry Co., Ltd. | Brittle non-metallic workpiece with through hole and method for making same |
CN101462822B (en) * | 2007-12-21 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | Friable non-metal workpiece with through hole and method of processing the same |
CN101530951B (en) * | 2008-03-13 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | Brittle substrate and laser cutting method therefor |
CN101844865B (en) * | 2009-03-25 | 2013-06-05 | 三星显示有限公司 | Substrate cutting apparatus and method of cutting substrate using the same |
CN101844865A (en) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | Cutter for substrate and the method for utilizing this cutter for substrate cutting substrate |
CN102574244A (en) * | 2009-10-08 | 2012-07-11 | 特摩劳吉克公司 | Controlling rules and variables for cutting |
CN102574244B (en) * | 2009-10-08 | 2014-10-22 | 特摩劳吉克公司 | Controlling rules and variables for cutting |
CN102643017A (en) * | 2011-03-14 | 2012-08-22 | 京东方科技集团股份有限公司 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
CN103608145A (en) * | 2011-04-07 | 2014-02-26 | 特摩劳吉克公司 | Method of, system and computer program for machine cutting several parts of a piece of material using controlling rules and variables for cutting |
CN106141446A (en) * | 2015-04-24 | 2016-11-23 | 昆山纳诺新材料科技有限公司 | Fragility object shearing device and cutting-off method thereof |
CN106141446B (en) * | 2015-04-24 | 2020-09-25 | 英属开曼群岛商纳诺股份有限公司 | Brittle object cutting device and cutting method thereof |
CN105798470A (en) * | 2016-05-27 | 2016-07-27 | 京东方科技集团股份有限公司 | Laser cutter and cutting method thereof |
CN105798470B (en) * | 2016-05-27 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of laser cutting machine and its cutting method |
Also Published As
Publication number | Publication date |
---|---|
CN100482398C (en) | 2009-04-29 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
|
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 201600 Shanghai City Industrial Zone of Songjiang science and Technology Park Wen Ji Road No. 500 Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 Termination date: 20210930 |
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CF01 | Termination of patent right due to non-payment of annual fee |