CN1939637A - Laser cutting method - Google Patents
Laser cutting method Download PDFInfo
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- CN1939637A CN1939637A CN200510094681.3A CN200510094681A CN1939637A CN 1939637 A CN1939637 A CN 1939637A CN 200510094681 A CN200510094681 A CN 200510094681A CN 1939637 A CN1939637 A CN 1939637A
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Abstract
A laser cutting method with high productivity includes such steps as cutting the original plate at the first speed to divide it into two plates, cutting the resultant plate at the second speed higher than the first speed to divide it into two plates, cutting the resultant plate at the third speed higher than the second speed to divide it into two plates, and so on.
Description
[technical field]
The present invention has disclosed a kind of laser cutting method, especially refers to a kind of cutting brittle material such as liquid crystal indicator (TFT-LCD) (Thin Film Transistor, abbreviation TFT of being used for; Liquid CrystalDisplay is called for short LCD) cutting method of face glass.
[background technology]
Along with the continuous development of technology, liquid crystal indicator (TFT-LCD) is owing to the characteristic of himself is widely used in the consumer field.It is regarded as in order to replace the strong rival of traditional cathode-ray tube (Cathode Ray Tube, be called for short CRT) display unit.
Liquid crystal indicator usually by two glass substrates, be contained in two liquid crystal and some circuit in the glass substrate and form.Liquid crystal can change arrangement mode and finish display action under electric field effects.In order to form the display panels of different size, need cut bigger display panels usually to meet the different needs.
The mode of traditional cutting display panels all is as the groove instrument with physical means such as break bars, break bar imposes the quantitative stress of glass to face glass, cause stable vertical slight crack (Median Crack) at glass surface, then with the upset of the cut surface of face glass, utilize the compressing tablet made from resin that adds that the cut surface opposing backside surface of face glass is applied compressive load to form stress and then face glass is separated fully on face glass.
Yet break bar glass-cutting panel need pass through the multiple tracks processing procedure as cutting (Scribe), sliver (Break), edging (Grinding) etc., and is more time-consuming; And break bar glass-cutting surface can cause physical property to destroy to glass, and the line of cut annex usually exists some irregular hallrcuts (MicroCrack) or burr, and these defectives are to product strength and produce yield and exert an influence.
Along with the frivolous development trend of consumption electronic products, glass substrate also thinner to thickness, density of material is lower, the strength of materials strengthens and the lower trend development of thermal coefficient of expansion, in this case, the traditional utilization on quality that physical means such as break bar cut and the production efficiency do not satisfied demand.Thereby a kind of mode of utilizing laser to carry out the glass-cutting panel has produced.
The break bar cutting of comparing traditional, laser cutting be difficult for producing particle contamination, cut surface smooth, can significantly shorten the production time-histories, and the hallrcuts that is produced because of the cutting of no conventional knives wheel behind the laser glass-cutting panel is so the intensity of face glass is traditional 2-3 times.
As shown in Figure 1, the laser cutting apparatus of a kind of glass-cutting panel 1 that generally adopts at present comprises laser system 2, groove instrument 3 and cooling system 4.Laser cutting apparatus is shown in the arrow A with respect to the cut direction of glass substrate.Along cut direction A, groove instrument 3 is prior to forming a small indentation on the face glass 1, laser system 2 emission thunder laser beams heat along indentation subsequently, cooling system cools off the thermal treatment zone thereupon, and the temperature difference of utilizing heating and cooling to produce is cut the stress that face glass produces.
As shown in Figure 2, when existing laser cutting brittle material such as glass substrate 1, be to cut to another edge by the edge of glass substrate 1 to the center in regular turn always.That is, during cutting, the side along fixing cut direction A from glass substrate is cutting first line of cut 5 earlier, returns a side of the initial cut of glass substrate then and and then cuts second line of cut 6, cuts to another edge to the center so in regular turn always.Generally the yield and the uniformity of cutting speed in order to keep cutting understood the cutting that finish same cut direction A with identical cutting speed V1 usually in the process of cutting.
Pass and destroy theory of mechanics as can be known by heat, during cutting the heat transfer effect of material and the destruction factor can be with the size of material change different with cutting position, further influence the optimum Cutting speed of each position.Cutting speed must be lower when the substrate that cuts is big.Yet, the substrate of cutting hour, cutting speed can improve.
So therefrom as can be seen, existing cutting method cuts to another edge from the edge of glass substrate 1 to the center always.Glass substrate is bigger during initial cut, can only cut with lower speed V1, yet repeatedly still uses speed V1 to cut after the cutting.Because the variation of cutting position, in the time of the speed that can improve, also be still and adopt speed V1 to cut.Obviously like this will need more clipping time, delay production efficiency.
So need a kind of novel laser cutting method of design to take place to overcome above-mentioned disadvantageous situation.
[summary of the invention]
The object of the present invention is to provide a kind of laser cutting method, it can finish cutting fast.
The objective of the invention is to be achieved through the following technical solutions: a kind of laser cutting method, it comprises: the first step, cut original substrate with first cutting speed and become two; Second goes on foot, and the substrate after with second cutting speed first step being cut cuts, and second cutting speed is greater than first cutting speed; The 3rd step, with the 3rd cutting speed second substrate that goes on foot after cutting to be cut, the 3rd cutting speed is greater than second cutting speed; When carrying out repeatedly more next step cutting, all cut with the substrate after greater than the cutting speed of previous step previous step being cut.
Compared with prior art, laser cutting method of the present invention adopts at different cutting positions and uses different cutting speeds, and the size of cutting substrate is more little, and speed is big more, so just can save man-hour, accelerates the cutting flow process, enhances productivity.
[description of drawings]
Fig. 1 is a kind of existing laser cutting apparatus schematic diagram.
Fig. 2 is the cutting schematic flow sheet of the existing laser cutting method shown in Fig. 1.
Fig. 3 is the employed laser cutting apparatus schematic diagram of laser cutting method of the present invention.
Fig. 4 is a kind of cutting flow process intention of laser cutting method of the present invention.
Fig. 5 is the another kind cutting schematic flow sheet of laser cutting method of the present invention.
[specific embodiment]
Compare with existing laser cutting technique, what laser cutting of the present invention related to is that utilization difference of cutting position on glass substrate changes cutting speed and reaches the method for saving man-hour.It does not relate to self structure, the generation of laser system, groove instrument and cooling system or forms principle.So laser cutting method of the present invention is for employed laser system, the self structure of groove instrument and cooling system, generation or form principle and do not describe in detail.
Referring to shown in Figure 3, the employed laser cutting apparatus of laser cutting method that the present invention is used for the glass-cutting substrate comprises laser system 10, groove instrument 11 and cooling system 12.
In laser cutting apparatus of the present invention, groove instrument 11 can be any means that thunder laser beam, diamond cutter, break bar etc. can produce predetermined crackle at glass baseplate surface.Cooling system 12 can be mixture or more than one gas and the mixtures of liquids etc. that single liquid, pure gas add single liquid, as pure water, cold oil, liquid nitrogen or liquid helium etc.
Referring to shown in Figure 3, laser glass-cutting panel forms pre-groove with groove instrument 11 earlier on glass substrate 13, thunder laser beam sprays in laser system 10 such as the CO2 Lasers light beam heats the face glass surface, face glass itself is heated because of the laser energy, the temperature of glass is controlled under its melting temperature, face glass inside produces tensile stress because of the material expanded by heating, immediately with cooling system 12 cooled glass panels.Face glass is because of being cooled off the influence of system cools, internal contraction and produce compression.Face glass heats the influence of cooling off rapidly with cooling system rapidly because of laser, and internal stress distribution produces fast and changes, and then cracks at face glass, and crackle is grown up at cut surface and made face glass separate fully.
Cause the factor of face glass splitting to have: row, can be represented by following formula the stress that glass inside is produced as the effect owing to laser and cooling:
σ～0.5αEΔT (1)
ΔT＝T1-T2 (2)
Wherein, σ is the stress intensity that face glass inside is produced, and α is the thermal coefficient of expansion of face glass inside, and E is the face glass young's modulus, and T1 is the temperature of face glass behind the laser heating glass panel, and T2 is the temperature of cooling back face glass.
Shown in formula (1) and (2), the stress intensity of panel inside is directly proportional with the temperature difference that laser and cooling system produce on face glass with material coefficient of thermal expansion coefficient, young's modulus.And the maximum of T1 can not be greater than the gasification temperature of face glass.
When laser and cooling system to stress that face glass caused during greater than the rupture strength of material, glass surface will crack, crackle can be along with the difference of process conditions, present different growth at glass surface, as form a groove (Scribe) or the separation fully of face glass (Full Body Cut is called for short FBC).
Referring to shown in Figure 4, when the glass substrate 13 of cutting is when can equal portions cutting apart, the present invention's laser cutting method is: the first step, carry out first line of cut 7, and glass substrate 13 is cut into its 1/2 two, cutting speed is V1; Second step to carrying out the equal portions cutting of second, third line of cut 8,9 on two glass substrates of above-mentioned 1/2 respectively, cut into 1/4 four of glass substrate 13, and cutting speed is V2; The 3rd step, carry out the 4th, the 5th, the 6th and the 7th line of cut 14,15,16,17, above-mentioned second step is cut into 1/4 four carry out equal portions more respectively and cut into 1/8 eight of glass substrate 13, cutting speed is V3; Cutting speed V1＜V2＜V3.According to the cutting demand of reality, can continue on the basis that previous step is cut, to carry out next step equal portions cutting, next step cutting speed is greater than the cutting speed of previous step.
This shows, when cutting as shown in Figure 4, glass substrate is cut into 1/ (2 in regular turn
n), n=1,2,3 ... n (n is a natural number) if. cutting speed V1 for the first time, cutting speed V2 for the second time, the n time cutting speed is Vn, because along with the carrying out of cutting, the size of glass substrate is more and more littler, and then cutting speed can increase gradually, i.e. V1＜V2＜V3 ...＜Vn.Like this, because the increase of cutting speed, then the time of glass-cutting substrate will be saved a lot.
Referring to shown in Figure 5, can not equal portions during cutting when the glass substrate of cutting, the present invention's laser cutting method is: the first step, carry out line of cut 20, glass substrate is cut into less two, cutting speed V1; Second step, carry out the second or the 3rd line of cut 21,22, two of previous step cutting are further cut respectively, this moment cutting speed V2, the 3rd step was carried out the 4th line of cut 23, the substrate after second step was cut cuts cutting speed V3 again; Cutting speed V1＜V2＜V3.By that analogy, repeatedly cut according to actual needs.Diverse location according to cutting changes corresponding cutting speed, and the glass substrate of cutting is more little, and cutting speed is fast more, like this, just can significantly save clipping time, enhances productivity.
Claims (5)
1. laser cutting method, it comprises:
The first step is cut original substrate with first cutting speed and is become two;
Second goes on foot, and the substrate after with second cutting speed first step being cut cuts, and second cutting speed is greater than first cutting speed;
The 3rd step, with the 3rd cutting speed second substrate that goes on foot after cutting to be cut again, the 3rd cutting speed is greater than second cutting speed;
When carrying out repeatedly more next step cutting, all cut with the substrate after greater than the cutting speed of previous step previous step being cut.
2. laser cutting method as claimed in claim 1 is characterized in that: above-mentioned second step is that two substrates after with second cutting speed first step being cut cut respectively.
3. laser cutting method as claimed in claim 1 is characterized in that: the above-mentioned first step is cut above-mentioned original substrate with first cutting speed and is become 1/2 two of this original substrate.
4. laser cutting method as claimed in claim 3 is characterized in that: in above-mentioned second step, two substrates after the first step cutting are cut into 1/4 four of above-mentioned original substrate respectively with second cutting speed.
5. laser cutting method as claimed in claim 1 is characterized in that: during cutting, next step cutting is the substrate after the last time cutting to be carried out equal portions more respectively cut into 1/ (2 of above-mentioned original substrate
n), n=1,2,3,4,5...n.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100946813A CN100445013C (en) | 2005-09-30 | 2005-09-30 | Laser cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100946813A CN100445013C (en) | 2005-09-30 | 2005-09-30 | Laser cutting method |
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| Publication Number | Publication Date |
|---|---|
| CN1939637A true CN1939637A (en) | 2007-04-04 |
| CN100445013C CN100445013C (en) | 2008-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100946813A Expired - Fee Related CN100445013C (en) | 2005-09-30 | 2005-09-30 | Laser cutting method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101279403B (en) * | 2007-04-06 | 2012-03-14 | 富士迈半导体精密工业（上海）有限公司 | Laser processing method |
| CN106256519A (en) * | 2015-06-19 | 2016-12-28 | 上海和辉光电有限公司 | A kind of method of cutting substrate |
| CN110355482A (en) * | 2019-07-01 | 2019-10-22 | 王慧珍 | New pattern laser cutting equipment and cutting method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5776220A (en) * | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| JP2001259874A (en) * | 2000-01-11 | 2001-09-25 | Hitachi Cable Ltd | Cutting method |
| WO2001085387A1 (en) * | 2000-05-11 | 2001-11-15 | Ptg Precision Technology Center Limited Llc | System for cutting brittle materials |
| CN1284737C (en) * | 2000-12-01 | 2006-11-15 | Lg电子株式会社 | Glass cutting method and apparatus |
| KR100701013B1 (en) * | 2001-05-21 | 2007-03-29 | 삼성전자주식회사 | Method and Apparatus for cutting non-metal substrate using a laser beam |
| KR100794284B1 (en) * | 2001-09-29 | 2008-01-11 | 삼성전자주식회사 | Method for cutting non-metal substrate |
-
2005
- 2005-09-30 CN CNB2005100946813A patent/CN100445013C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101279403B (en) * | 2007-04-06 | 2012-03-14 | 富士迈半导体精密工业（上海）有限公司 | Laser processing method |
| CN106256519A (en) * | 2015-06-19 | 2016-12-28 | 上海和辉光电有限公司 | A kind of method of cutting substrate |
| CN106256519B (en) * | 2015-06-19 | 2019-09-24 | 上海和辉光电有限公司 | A kind of method of cutting substrate |
| CN110355482A (en) * | 2019-07-01 | 2019-10-22 | 王慧珍 | New pattern laser cutting equipment and cutting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100445013C (en) | 2008-12-24 |
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Address after: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
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Address after: 201600 Shanghai City Industrial Zone of Songjiang science and Technology Park Wen Ji Road No. 500 Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
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Granted publication date: 20081224 Termination date: 20210930 |
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