200827081 九、發明說明： 【發明所屬之技術領域】 β 本發明涉及一種雷射切割系統及切割方法，特別係一種 用於切割脆性材料如液晶顯示裝置（TFT_LCD，Thin Film200827081 IX. Description of the invention: [Technical field to which the invention pertains] β The present invention relates to a laser cutting system and a cutting method, in particular to a method for cutting a brittle material such as a liquid crystal display device (TFT_LCD, Thin Film)
Transistor Liquid Crystal Display )用玻璃基板之雷射切割系統 及切割方法。 【先前技術】 _ 隨著技術之不斷發展，液晶顯示裝置（TFT丄CD)由於 其自身特性已廣泛應用於消費領域。液晶顯示裝置通常由兩 塊玻璃基板、設置於兩塊玻璃基板之間的液晶及若干電路組 成。液晶可以於電場影響下改變排列方式來完成顯示動作。 為了形成不同尺寸之液晶顯示面板，通常需要對較大的液晶 顯示面板用玻璃基板進行切割以滿足不同的需求。 如圖1所示，一種切割脆性材料，如玻璃基板1〇之雷射 切軎彳糸統，其包括劃線工具20、雷射產生裝置3〇及冷卻裝置 φ 40。雷射切割系統對玻璃基板1〇之切割方向為箭頭a所示。 沿著切割方向A，劃線工具20先行在玻璃基板1〇之表面產 生預切割線，隨即以雷射產生裝置30產生的雷射光束沿著預 切割線進行加熱，再以冷卻裝置40噴出的冷卻液冷卻加熱 區。玻璃基板10會因急劇產生的溫度差而產生應力的變化， 使先前產生的預切割線產生裂紋並向下成長，進而貫穿整個 玻璃基板10斷面使其完全開裂。 如圖2所示，採用雷射切割玻璃基板1〇的過程中，通常 200827081 先對玻璃基板ίο的一面進行切割，依序由玻璃基板1〇的一 ，邊緣向中心切割直到另一邊緣。如沿切割方向A進行切割， •先從玻璃基板10的一邊緣向中心切割直到另一邊緣以完成第 一切割線50,然後返回玻璃基板10之初始切割邊緣再完成第 一切副線60。這樣就使得在切割過程中無效行程過多，導致 切割時間過長，切割速度較慢。 【發明内容】 _ 有鑑於此，提供一種切割速度快之雷射切割系統及切割 方法實為必要。 以下將以實施例說明一種用於切割脆性材料基板之雷射 切割系統及利用該雷射切割系統切割脆性材料基板之切割方 法。 " 一種雷射切割系統，其包括：用於承載脆性材料基板之 一個第一承載平台及一個第二承載平台，一個雷射產生裝 置，一個第一冷卻裝置，一個第二冷卻裝置，一個第一劃線 工具及一個第二劃線工具。該第一承載平台與第二承載平台 均可在一第一方向上及與該第一方向垂直之第二方向上作往 復移動。該雷射產生裝置設置於該第一承載平台與該第二承 載平台之間，用以產生雷射光束。該第一冷卻裝置與第二冷 部裝置沿該第一方向分別設置於該雷射產生裝置相對的兩 側，用以喷射冷卻流體。該第一劃線工具在該第一方向上設 置於該第二冷卻裝置的與雷射產生裝置相對的一側。該第二 劃線工具在該第一方向上設置於該第一冷卻裝置的與雷射產 8 200827081 生裝置相對的—側。 ，—種细f射切割系統切賴性材料基板之切割方法， 射切割系統包括—個第—承載平台，—個與該第一承載 、、相對《置的第二承載平台，—個雷射產生褒置，一個第 外:部衣置’-個第二冷卻裝置’―個第—劃線工具及一個 二具’該第一冷卻裝置與第二冷卻袭置分別設置於 ::八對的兩側，該第一劃線工具與該第二劃線 命、刀別狄置_第二冷卻裝置的與雷射產生裝 一 :=冷卻褒置的與雷射產生裝置相對的-側，該切割 於第一 :::::::::動第-承載平台移動以帶動裝載 利用第一咖料基板沿一第-方向移動； 脆性材^板m射=裝置及第—冷卻裝置對該第一 動第一承载平台移動以以形成切割線；驅 =基=:舆該第一方向垂直之第二方向移動，再沿 二=:移動;利用第二劃線工具，雷射產 1射—T部裝置對該第1性材料基板之第-表面進 =ΓΓ_線;待第—跪性材料基板之第-表面 。疋畢第一脆性材料基板進行翻面摔作.鶴第 承載平台移動以帶動裝載於第 翻面域，㈣第一 基板沿第一方向移動;利用第1=上:第-脆性材料 第一冷卻裝置對鮮-雜 ” β射產生裝置及 枓基板的—與該第一方向相對 9 200827081 的第二表面進行雷射切割以形成切割 ‘移:以帶動輪第-承載平台上之第-脆性材料21: 方向垂直之第二方向移動，再沿與該第-方向相 成切割線Γ 1性材料基板之第二表面進行雷射切割以形 工具及-個第二書: Γ冷卻裝置，-個第-劃線 分別設置於該雷射產=置冷卻裝置與第二冷卻裝置 該第二劃線工具分別設置於劃線工具與 置相對的-側與㈣切衣置的與雷射產生裝 側，該切割方法順次紐“=與置相對的一 以帶動裝载於該第—承載平台弟—承载平台移動 -方向上移動；利 脆性材料基板在-第 生褒置，第一Α 線工具’第二劃缸具，雷射產 料基板的—第二==第二，卻㈣成對該第-脆性材 帶動裝载於該第二承載“ 驅動第二承载平台移動以 方向上移動；利用第一 ^工/r脆性材料基板在該第一 基板的 裝置，第—冷卻裝置及第二冷d::: ’雷射產生 第—表面的雷射切割，對，二脆性材料 亚將該第—脆性材料基板翻 200827081 面，驅動第一承载平A 俄 -方向上移動;利二:::第;=板，第 生裝置，第-冷卿 弟—⑽卫具’雷射產 性材料基板的雷射切判，並完成對翻面之第-脆 動第二是恭亚a 亚將該弟二脆性材料基板翻面丨驅 上移動；利用第°二動以帶動第Γ跪性材料基板在該第一方向 第-A鮮罢—4線工具，第二劃線工具，雷射產生裝置， 板;及第二冷卻裝置完朗細之第二脆性材料基 與先’技術她’所述雷射蝴纽在對舰材料基板 二=面進行切割時’完成切割線之軌跡係依序由該脆性 上土板的-邊緣向中心切割直到另—邊緣，再由結束切判 向中心切割翻初始切割—邊緣，重複此蝴執跡完 日k、面上之切n這樣便有利於有效的減少無效行程， 提升切舰度。並且’所述雷射域系闕可以·上述第 -承载平台與第二承載平台完成對裝餅其上之脆性材料基 板進行交替_，對—個脆性材料基板的切割可以與翻轉或 卸載另一個脆性材料基板同時進行，從而進一步提升了切割 速度。由此可見，上述雷射切割系統及利用該雷射切割系統 切副脆性材料基板之切割方法可提高切割速度。 【實施方式】 下面結合附圖對本發明作進一步的詳細說明。 睛參考圖3’本發明實施例提供的用於切割脆性材料基板 之雷射切割系統100包括:一個第一線性導軌61〇，一個第二 11 200827081 線性導軌620，一個第三線性導軌500，一個第一承載平二 ，710，一個第二承載平台72〇，一個雷射產生裝置3〇〇，第一 •冷卻裝置410,第二冷卻裝置420,第一劃線工具21〇,第二 劃線工具220。 該第一線性導執610與第二線性導執620相互平行，且 均與該第二轨道5〇〇相垂直，該第一線性導執與第二線 F生‘轨620均設置於該第三線性導執5〇〇上且分別位於該第 φ 二線性導轨500的兩端。該第三線性導執500沿X轴方向延 伸，該X軸方向包括一 XI方向及與該X1方向相反的χ2方 向。該第一線性導執610與第二線性導執62〇沿γ軸方向延 伸，該γ軸方向包括一 Y1方向及與該Y1方向相反的¥2方 向。該第一線性導軌610與第二線性導執62〇均可於第三線 性導轨500上沿所述X軸方向作往復移動。 該第一承載平台710設置於該第一線性導轨61()上，且 可於該第一線性導執610上沿所述Y軸方向作往復移動。該 •第一承載平台用於承載一脆性材料基板1〇1。 該第二承載平台720設置於該第二線性導執62〇上，且 :於該第二線性導執62〇上沿所述γ軸方向作往復移動。該 第二承載平台720用於承載一脆性材料基板1〇2。 該每射產生裝置3⑽設置於該第一承載平台710與該第 一承载平台720之間，在本實施例中，該雷射產生裝置3〇〇 又置於第—線性導轨5〇〇上方。該雷射產生裝置包括氣 體田射器，例如一氧化碳雷射器、一氧化碳雷射器、氮分子 12 200827081 田射口： N性氣體雷射器等。該雷射產生裝置獅可產生雷 •射光束，其波長的選擇與脆性材料基板101，102的材質相關； 、田脆〖生材料基板1〇1，搬的材質為玻璃時，則選用雷射光束 之波長約為10.6微米的雷射產生裝置。 該第冷卻裝置410與第二冷卻裝置42〇沿所述χ軸方 向分別設^與該雷誠生裝置3⑻相__，在本實施 例中該第一冷郃裝置410與第二冷卻裝置42〇均設置於第 藝三線性導轨500上方。該第一冷卻裝置與第二冷卻襄置 420用以喷射出冷卻流體以冷卻待加工脆性材料基板1〇1， 搬如玻璃基板。該冷卻流體可以係氣體、液體或其混合物。 所述氣體可為空氣、氦氣、氮氣、二氧化碳或其混合物。所 述液體可為純水、酒精、賴、異㈣、液態氣、液態氮、 冷卻油或其混合物。 該第-劃缸具21G沿X軸方向設置於該第二冷卻裝置 420的與铪射產生裝置300相對的一側。該二書工且220 φ沿X轴方向設置於該第-冷卻裝置_的與雷射產生裝置3〇〇 相對的-侧。該第-劃線工具210與該第二劃線工具22〇用 於在待加工脆性材料基板101，搬上形成預切割線。該第一 劃線工具210與該第二劃線工具22〇可為可產生雷射光束之 雷射產生裝置、刀輪等可在玻璃基板表面產生預_線的任 意工具。 所述雷射產生裝置300，第一冷卻裝置41〇，第二冷卻裝 置420，第一劃線工具210及第二劃線工具22〇在所述χ轴 13 200827081 方向成線性排布，且其下方被定義為雷射切割工作區。 請參考圖4、圖5及圖6,本發明實施例提供的利用上述 雷射切割系統100用於切割脆性材料基板1〇1，1〇2之切割方 法，其可包括以下步驟： (1) 提供脆性材料基板101及1〇2，並將該脆性材料基板 101及102分別裝載於該第一承載平台71〇與該第二承载平台 720 上。 ° 該脆性材料基板1〇1及1〇2可以係玻璃基板、陶瓷基板、 石英基板、矽晶片（SiliC0I1 Wafer)等。 (2) 驅動第一線性導執61〇於第三線性導執5〇〇上移動， 從而帶動第一承載平台71〇沿χι方向移動，使脆性材料基板 101移動到所定義之雷射切割工作區。 驅動第一承載平台710沿所述Y1或Y2方向移動，使 脆性材料基板1(U上所要形成第一切割線1〇4的位置位於第 一劃線工具210下方。 (4) 驅動該第一線性導執610沿XI方向移動，利用第一 劃線工具21()自該脆性材料基板101的一起始邊緣沿X2方向 向該第一脆性材料基板101中心進行切割直到一結束邊緣， 從而在該脆性材料基板的一第一表面形成第一條預切割 線1〇3(請參考圖5)。 (5) 雷射產生裝置300產生雷射光束，如二氧化碳雷射光 束對第一條預切割線103進行加熱，使該脆性材料基板101 文熱膨脹而於其内部產生壓應力（請參考圖5)。 200827081 (6)第一冷卻裝置41〇將冷卻流體（圖未示）沿著被加熱 •之第一條預切割線103延伸方向急速以霧狀喷於該脆性材料 基板101上(請參考圖5)。 所述冷卻流體使該脆性材料基板101表面的溫度急速下 降’脆性材料基板1〇1内部因溫度急劇變化發生收縮而產生 張應力。此時，該脆性材料基板1〇1因在短時間内局部發生 急劇應力變化，而使得該脆性材料基板1〇1會沿著預切割線 _ 103產生裂紋，裂紋在切割面成長從而形成第一條切割線 104。所形成的第一條切割線104沿所述X軸方向延伸。 由於雷射與冷卻的作用，對該脆性材料基板1〇1内部所 產生之應力，可由下列公式表示： σ 〜0·5αΕΔΤ ⑴ △_Τ2 (2) 其中’ σ為該脆性材料基板1〇1内部所產生之應力大小， α為該脆性材料基板1〇1内部之熱膨脹係數，Ε為該脆性材料 籲基板101之揚氏係數，T1為被雷射光束加熱後的該脆性材料 基板101之溫度，T2為被冷卻後的該脆性材料基板皿之溫 度。 由公式(1)與(2)所示，該脆性材料基板101内部之應力大 J與脆〖生材料之熱膨脹係數、揚氏係數及雷射產生裝置 與第冷卻裴置410於脆性材料基板1〇1上產生之溫度差成 正比而且Tl之最大值不得大於該脆性材料基板101之氣化 溫度。 15 200827081 當加熱與冷卻過程對該脆性材料基板衞所造成的應力 .大於驗㈣之破㈣鱗，麵性㈣基板皿表面將產 生裂紋成長。 ⑺待上述第—切割線_形成後，驅動第_承載平台71〇 沿Y1方向移動，進而使得脆性材料基板1〇1上所要形成的第 二條切割線104的位置位於第二劃線工具22G下方。 _⑻驅動該第一線性導軌61〇於第三線性導軌上移動 •使第、承載平纟71〇、沿χ2方向移動，以帶動脆性材料基板 101沿Χ2方向移動，第二劃線工具22〇自形成上述第一條預 切雜1〇3的結束邊緣沿χι方向向該脆性材料基板肌中心 進行切割直到上述第一條預切割線的起始邊緣，從而在Transistor Liquid Crystal Display) Laser cutting system and cutting method using glass substrate. [Prior Art] _ With the continuous development of technology, liquid crystal display devices (TFT丄CD) have been widely used in the consumer field due to their own characteristics. The liquid crystal display device usually consists of two glass substrates, a liquid crystal disposed between the two glass substrates, and a plurality of circuits. The liquid crystal can change the arrangement under the influence of the electric field to complete the display action. In order to form liquid crystal display panels of different sizes, it is generally required to cut a large glass substrate for a liquid crystal display panel to meet different needs. As shown in Fig. 1, a cutting brittle material, such as a laser substrate of a glass substrate, includes a scribing tool 20, a laser generating device 3, and a cooling device φ40. The cutting direction of the glass substrate 1 by the laser cutting system is indicated by an arrow a. Along the cutting direction A, the scribing tool 20 first produces a pre-cut line on the surface of the glass substrate 1 , and then the laser beam generated by the laser generating device 30 is heated along the pre-cut line and then ejected by the cooling device 40. The coolant cools the heating zone. The glass substrate 10 undergoes a change in stress due to a sharp temperature difference, causes the previously generated pre-cut line to crack and grows downward, and further penetrates the entire glass substrate 10 to completely crack it. As shown in Fig. 2, in the process of laser cutting a glass substrate, generally, the surface of the glass substrate ίο is cut first, and the edge of the glass substrate 1 is cut toward the center to the other edge. For example, cutting is performed in the cutting direction A. • First cutting from one edge of the glass substrate 10 toward the center to the other edge to complete the first cutting line 50, and then returning to the initial cutting edge of the glass substrate 10 to complete the first sub-line 60. This results in too many invalid strokes during the cutting process, resulting in a long cutting time and a slow cutting speed. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a laser cutting system and a cutting method with a fast cutting speed. A laser cutting system for cutting a substrate of a brittle material and a cutting method for cutting the substrate of the brittle material using the laser cutting system will be described below by way of examples. " A laser cutting system comprising: a first carrying platform for carrying a substrate of brittle material and a second carrying platform, a laser generating device, a first cooling device, a second cooling device, a first A scribing tool and a second scribing tool. The first carrier platform and the second carrier platform are reciprocally movable in a first direction and a second direction perpendicular to the first direction. The laser generating device is disposed between the first carrying platform and the second loading platform for generating a laser beam. The first cooling device and the second cooling device are respectively disposed on opposite sides of the laser generating device in the first direction for injecting a cooling fluid. The first scribing tool is disposed in a first direction on a side of the second cooling device opposite the laser generating device. The second scribing tool is disposed in the first direction on a side of the first cooling device opposite to the laser device 8 200827081. , a cutting method for a substrate of a thin-cutting cutting system, the cutting and cutting system comprises a first-bearing platform, a first bearing, and a second carrying platform, a laser褒 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , On both sides, the first scribing tool and the second scribing tool, the second cooling device and the laser generating device: the side of the cooling device opposite to the laser generating device, Cutting in the first::::::::: moving the first carrier platform to drive the loading to move in a first direction using the first coffee substrate; the brittle material is the device and the first cooling device The first moving first carrying platform moves to form a cutting line; the driving = base =: 舆 the first direction is perpendicular to the second direction, and then the second =: moving; using the second scribing tool, the laser produces 1 shot The T-part device enters the first surface of the substrate of the first material material as the first surface of the substrate of the first material substrate. The first brittle material substrate is turned over and thrown. The crane first carrying platform moves to drive the loading surface, and (4) the first substrate moves in the first direction; using the first = upper: first-brittle material first cooling The device performs laser cutting on the second surface of the fresh-hetero” β-ray generating device and the germanium substrate opposite to the first direction 9 200827081 to form a cutting shift: to drive the first-brittle material on the wheel-bearing platform 21: The direction is perpendicular to the second direction, and then along the first direction of the cutting line Γ the second surface of the material substrate is laser cut to form a tool and a second book: Γ cooling device, The first-dash line is respectively disposed on the laser product=the cooling device and the second cooling device. The second scribing tool is respectively disposed on the opposite side of the scribing tool and the (four) cutting device and the laser generating device side. The cutting method is sequentially slid "" to move relative to the opposite one to drive the loading on the first-loading platform--bearing platform movement-direction; the brittle material substrate is in the -first generation, the first 工具 line tool' Second row cylinder, laser production substrate - the first == second, but (d) to drive the first brittle material to be loaded on the second carrier "drive the second carrier platform to move in the direction of movement; using the first / r brittle material substrate on the first substrate The device, the first cooling device and the second cold d::: 'the laser produces the first surface of the laser cutting, and the second brittle material sub-turns the first brittle material substrate to the 200827081 surface, driving the first bearing flat A - moving in the direction; Li 2::: the first; = board, the first device, the first - cold Qingdi - (10) the defender 'laser production material substrate laser cut, and complete the first - crisp The second is that Kyoko Aya drives the two brittle material substrates to move over the surface; the second movement is used to drive the third material in the first direction. a second scribing tool, a laser generating device, a plate; and a second brittle device, the second brittle material base and the first 'technical her' laser butterfly are cut on the opposite side of the ship material substrate 'The trajectory of the finished cutting line is sequentially cut from the edge of the brittle upper soil plate to the center to the other edge, and then Ending the cut and cutting to the center to cut the initial cut-edge, repeating the cut-off day k, the face cut n is beneficial to effectively reduce the invalid stroke, improve the cutting degree. And 'the laser domain system阙The above-mentioned first-bearing platform and the second carrying platform may be used to alternate the brittle material substrate on the loading cake, and the cutting of the brittle material substrate may be performed simultaneously with flipping or unloading another brittle material substrate, thereby further improving The cutting speed can be seen. The laser cutting system and the cutting method for cutting the substrate of the brittle material by the laser cutting system can improve the cutting speed. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. Referring to FIG. 3, a laser cutting system 100 for cutting a substrate of a brittle material provided by an embodiment of the present invention includes: a first linear guide 61 〇, a second 11 200827081 linear guide 620, and a third linear guide 500, one a first load plane 2, 710, a second load bearing platform 72A, a laser generating device 3A, a first cooling device 410, The second cooling device 420 is a first scribing tool 21A and a second scribing tool 220. The first linear guide 610 and the second linear guide 620 are parallel to each other and are perpendicular to the second track 5 ,. The first linear guide and the second line F are both disposed on the track 620. The third linear guides 5 are located at two ends of the φ second linear guide 500, respectively. The third linear guide 500 extends in the X-axis direction including an XI direction and a χ2 direction opposite to the X1 direction. The first linear guide 610 and the second linear guide 62A extend in the γ-axis direction, and the γ-axis direction includes a Y1 direction and a ¥2 direction opposite to the Y1 direction. The first linear guide 610 and the second linear guide 62A are reciprocally movable on the third linear guide 500 in the X-axis direction. The first carrying platform 710 is disposed on the first linear guide 61 () and reciprocable along the Y-axis direction on the first linear guide 610. The first carrier platform is used to carry a brittle material substrate 1〇1. The second bearing platform 720 is disposed on the second linear guide 62〇, and reciprocates along the γ-axis direction on the second linear guide 62〇. The second carrying platform 720 is configured to carry a brittle material substrate 1〇2. The shot generating device 3 (10) is disposed between the first carrying platform 710 and the first carrying platform 720. In the embodiment, the laser generating device 3 is placed above the first linear guide 5 . The laser generating apparatus includes a gas field emitter such as a carbon monoxide laser, a carbon monoxide laser, and a nitrogen molecule 12 200827081, a field emitter: an N-type gas laser, and the like. The laser generating device lion can generate a lightning beam, and the wavelength is selected according to the material of the brittle material substrate 101, 102; the field material is 1 〇1 of the raw material substrate, and the material is glass, the laser is selected. A laser generating device having a beam wavelength of about 10.6 microns. The first cooling device 410 and the second cooling device 42 are respectively disposed along the axis of the x-axis with the Rayson device 3 (8). In the embodiment, the first cooling device 410 and the second cooling device 42 The crucibles are disposed above the first linear linear guide 500. The first cooling device and the second cooling device 420 are configured to eject a cooling fluid to cool the substrate 1 to 1 to be processed, such as a glass substrate. The cooling fluid can be a gas, a liquid, or a mixture thereof. The gas can be air, helium, nitrogen, carbon dioxide or a mixture thereof. The liquid may be pure water, alcohol, lye, iso (iv), liquid gas, liquid nitrogen, cooling oil or a mixture thereof. The first stroke cylinder 21G is disposed on the side of the second cooling device 420 opposite to the radiation generation device 300 in the X-axis direction. The two knives and 220 φ are disposed on the side of the first cooling device _ opposite to the laser generating device 3 沿 in the X-axis direction. The first scribing tool 210 and the second scribing tool 22 are used to form a pre-cut line on the brittle material substrate 101 to be processed. The first scribing tool 210 and the second scribing tool 22 can be any tool that can generate a pre-line on the surface of the glass substrate, such as a laser generating device that can generate a laser beam. The laser generating device 300, the first cooling device 41, the second cooling device 420, the first scribing tool 210 and the second scribing tool 22 are linearly arranged in the direction of the reel 13 200827081, and The lower part is defined as the laser cutting work area. Referring to FIG. 4, FIG. 5 and FIG. 6, a cutting method for cutting a brittle material substrate 1〇1, 1〇2 by using the above laser cutting system 100 according to an embodiment of the present invention may include the following steps: (1) The brittle material substrates 101 and 1 are provided, and the brittle material substrates 101 and 102 are respectively mounted on the first carrier platform 71 and the second carrier platform 720. The brittle material substrates 1〇1 and 1〇2 may be a glass substrate, a ceramic substrate, a quartz substrate, a germanium wafer, or the like. (2) driving the first linear guide 61 to move on the third linear guide 5〇〇, thereby driving the first carrying platform 71〇 to move along the χι direction, moving the brittle material substrate 101 to the defined laser cutting Work area. Driving the first bearing platform 710 to move in the Y1 or Y2 direction to make the brittle material substrate 1 (the position on the U where the first cutting line 1〇4 is to be formed is located below the first scribing tool 210. (4) Driving the first The linear guide 610 is moved in the XI direction, and is cut from a starting edge of the brittle material substrate 101 in the X2 direction toward the center of the first brittle material substrate 101 by using the first scribing tool 21 () until an end edge, thereby A first surface of the brittle material substrate forms a first pre-cut line 1〇3 (please refer to FIG. 5). (5) The laser generating device 300 generates a laser beam, such as a carbon dioxide laser beam, pre-cutting the first strip. The wire 103 is heated to thermally expand the brittle material substrate 101 to generate compressive stress therein (refer to Fig. 5). 200827081 (6) The first cooling device 41 〇 heats the cooling fluid (not shown) along the heating device. The first pre-cut line 103 is rapidly sprayed on the brittle material substrate 101 in a mist direction (please refer to FIG. 5). The cooling fluid rapidly drops the temperature of the surface of the brittle material substrate 101. The brittle material substrate 1〇 1 internal due to temperature sharp The change occurs and the tensile stress is generated. At this time, the brittle material substrate 1〇1 causes a sharp stress change locally in a short time, so that the brittle material substrate 1〇1 generates cracks along the pre-cut line _103, and the crack occurs. The cutting surface is grown to form a first cutting line 104. The formed first cutting line 104 extends in the X-axis direction. Due to the action of laser and cooling, the interior of the brittle material substrate 1〇1 is generated. The stress can be expressed by the following formula: σ 〜0·5αΕΔΤ (1) Δ_Τ2 (2) where 'σ is the magnitude of the stress generated inside the brittle material substrate 1〇1, and α is the thermal expansion coefficient inside the brittle material substrate 1〇1, Ε is the brittle material appealing to the Young's modulus of the substrate 101, T1 is the temperature of the brittle material substrate 101 heated by the laser beam, and T2 is the temperature of the brittle material substrate after being cooled. Formula (1) and (2) shows a stress J inside the brittle material substrate 101, a thermal expansion coefficient of the brittle material, a Young's modulus, and a temperature generated by the laser generating device and the cooling device 410 on the brittle material substrate 1〇1. The difference is proportional and the maximum value of Tl is not greater than the vaporization temperature of the brittle material substrate 101. 15 200827081 The stress caused by the heating and cooling process on the brittle material substrate is greater than the damage of the test (4) scale (four) scale, surface (four) substrate The surface of the dish will be cracked. (7) After the first cutting line_ is formed, the driving stage 71 is moved in the Y1 direction, thereby making the position of the second cutting line 104 to be formed on the brittle material substrate 1〇1. It is located under the second scribing tool 22G. _(8) drives the first linear guide 61 to move on the third linear guide, and moves the first, carrying flat 71纟 in the χ2 direction to drive the brittle material substrate 101 along the Χ2 direction. Moving, the second scribing tool 22 is cut from the end edge of the first pre-cut 1 〇 3 to the muscle center of the brittle material substrate in the χι direction until the beginning edge of the first pre-cut line, thereby in
該脆性材料基板101第一表面形成第二條預切割線 考圖6)。 V (9)田射產生裝置3〇〇產生雷射光束，如二氧化碳雷射光 束對該第—條肋麟1(>3位置進行加熱，使脆性材料基板 • 101受熱膨脹而於其内部產生麗應力（請參考圖6)。 — (10)第二冷卻裝置420將冷卻流體（圖未示）沿著被加熱 的第二條預切割線103延伸方向急速以霧狀喷於該脆性材料 基板101上(請參考圖6)。 所述冷卻流體使該脆性材料基板101表面溫度急速下 降，該脆性材料基板1〇1内部因溫度急劇變化發生收縮而產 生張應力，而使得該脆性材料基板101會沿著該第二條預切 J線103產生裂紋，裂紋在切割面成長從而形成第二條切割 16 200827081 線104。所形成的第二條切割線1〇4沿所述χ軸方向延伸。 重複步驟(3)至(10)，以於該脆性材料基板1〇1之第一表面 上形成在所述X轴方向上延伸之切割線1〇4，直到第一表面 切割完畢。 可以理解的是，根據實際需要，完成該脆性材料基板1〇1 第一表面上在所述X軸方向上延伸的切割線1〇4後，可將該 第-承載平§ 710旋轉90度，重複上述步驟(2)至⑽，完成 該脆性材料基板101第-表面上在γ轴方向延伸的切割線 104。從而，完成該脆性材料基板皿第—表面上之切割線 104。完成該脆性材料基板1〇lg 一表面上之切割線綱後， 可將該脆性材·板1G1翻面，重複上述步驟⑺至⑽，以對 該脆性材料基板皿的與第—表面相對的第二表面進行切割 用以於該第二表面上形成切割線。 —(11)驅動第-線性導執㈣於第三線性導轨上移動使 第一承載平台710沿X2方向移動，帶動脆性材料基板皿沿 乂2方向移動’以將該第-承載平台別移出所定義的 割工作區。 ㈣驅動第二線性導執62叫第三線性導執上移動使 =載平台720沿X2方向移動’帶動脆性材料基板搬沿 =工Γ區向錢，㈣該承載平台72G移動騎定義的雷射 (13)於該脆性材料基板搬一第 工。一剛基請第一表面上形成切二二 17 200827081 驟與上述於該脆性材料基板搬的第一表面上形成切割線1〇4 的步驟基本相同，在此不再贅述。 • (14)於該脆性材料基板102之第一表面上形成切割線104 的同時，將已完成第一表面切割之脆性材料基板1〇1翻面。 (15)完成對該脆性材料基板1〇2第一表面的切割後，驅動 第二線性導執620於第三線性導轨5〇〇上移動使第二承載平 台720沿XI方向移動，帶動脆性材料基板1〇2沿χι方向移 _動，以使該第二承載平台720移出所定義的雷射切割工作區。 驅動第一線性導轨620於第三線性導執5〇〇上移動使第一承 載平台710沿XI方向移動，帶動脆性材料基板1〇1沿方 向移動，以使該第一承載平台710移動到所定義的雷射切割 工作區。完成對該脆性材料基板1〇1未切割的表面即與其第 一表面相對的第二表面進行雷射切割。對脆性材料基板1〇1 之第二表面進行切割的步驟與上述對該脆性材料基板1〇1之 第一表面進行切割的步驟基本相同，在此不再贅述。 • (16)於對該脆性材料基板101第二表面進行切割的同 時，將已完成第一表面切割的脆性材料基板102翻面。 (17)完成對該脆性材料基板101之第二表面的切割後，驅 動第一線性導執610於第三線性導軌500上移動使第一承载 平台710沿X2方向移動，使脆性材料基板1〇1沿χ2方向移 動，以使該第一承載平台710移出所定義的雷射切割工作區。 驅動第二線性導轨620於第三線性導執5〇〇上移動使第二承 载平台720沿Χ2方向移動，以帶動脆性材料基板1〇2移動到 18 200827081 所定義的雷射切割工作區。完成對該脆性材料基板102之第 二表面的切割；對該脆性材料基板102之第二表面進行切割 的步驟與上述對該脆性材料基板1〇1之第一表面進行切割的 步驟基本相同，在此不再贅述。 (18)在該脆性材料基板1〇2之第二表面進行切割的同 時，將切割完畢之該脆性材料基板1〇1從該第一承載平台71〇 上取下，然後將下一個待切割的脆性材料基板裝載於該第一 _ 承載平台710上。 另外，根據實際需要，如果不需要對該脆性材料基板1〇1 之第二表面進行切割時，例如完成該脆性材料基板1〇1第一 表面的切副就可以使其完全分離(Full B〇dy ，簡稱fbc)， 則可將切割完畢的該脆性材料基板1〇1從該第一承載平台71〇 上取下，然後將下一個待切割的脆性材料基板設置於該第一 承載平台710上。 重複上述步驟，可以對該第一承載平台710與第二承載 馨平口 720上之脆性材料基板1〇1，1〇2進行交替切割，對其中一 個脆性材料基板進行_時基本不會影響對另-個脆性材料 基板進行翻面或卸載的操作，從而提高了切割效率。 鉍上所述，所述雷射切割系統1〇〇在對上述脆性材料基 板101，102的-個表面進行切割時，完成切割線之軌跡係依序 由該脆性材料基板101，搬的一邊緣向中心切割直到另一邊 緣二再由結束切割-邊緣向中心切割朗初始切割一邊緣， 重複此切難跡完賴表面上之蝴線；這樣便有利於有效 19 200827081 的UtRg ’提升切割速度。並且，所述雷射切割系統 •還可以利用上述第-承載平台灿與第二承載平台，完成 ，對衣載於其上之脆性材料基板進行交替切割，對—個脆性材 料基板的_可以與翻轉或卸載另—個脆性材料基板同時進 行’從而進—步提升了切割速度。由此可見，上述雷射切割 ^統100及利用該雷射切割系統1〇〇切割脆性材料基板之切 剎方法可提高切割速度。 • 本發明確已符合發明專利要件，爰依法提出專利申請。 准以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技 i之人士，於援依本案發明精神所作之等效修飾或變化，皆 應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係先前技術中一種雷射切割系統示意圖。 圖2係圖1所示雷射切割系統的一切割狀態示意圖。 _ 圖3係本發明實施例雷射切割系統之示意圖。 圖4係圖3所示雷射切割系統的一切割狀態示意圖。 圖5係圖4中對第一脆性材料基板切割第一條切割線的一 切割狀態示意圖。 圖6係圖4中對第一脆性材料基板切割第二條切割線的一 切割狀態示意圖。 ' 【主要元件符號說明】 20 200827081 玻璃基板 雷射產生裝置 ’第一切割線 -雷射切割系統 第二線性導執 第一承載平台 雷射產生裝置 第二冷卻裝置 春 第二劃線工具 預切割線 劃線工具 20 冷卻裝置 40 弟—切割線 60 第一線性導執 610 第三線性導軌 500 第二承載平台 720 第一冷卻裝置 410 第一劃線工具 210 脆性材料基板 101,102 切割線 104 21The first surface of the brittle material substrate 101 forms a second pre-cut line (Fig. 6). The V (9) field generating device 3 generates a laser beam, such as a carbon dioxide laser beam, which heats the position of the first strip 1 (> 3 to thermally expand the brittle material substrate 101). Li stress (please refer to Fig. 6) - (10) The second cooling device 420 sprays a cooling fluid (not shown) along the direction of extension of the heated second pre-cut line 103 to spray the brittle material substrate in a mist form. 101 (refer to FIG. 6) The cooling fluid causes the surface temperature of the brittle material substrate 101 to rapidly drop, and the inside of the brittle material substrate 1〇1 shrinks due to a sudden change in temperature to generate tensile stress, so that the brittle material substrate 101 is caused. A crack is generated along the second pre-cut J line 103, and the crack grows on the cut surface to form a second cut 16 200827081 line 104. The formed second cut line 1 〇 4 extends in the z-axis direction. Steps (3) to (10) are repeated to form a cutting line 1〇4 extending in the X-axis direction on the first surface of the brittle material substrate 1〇1 until the first surface is cut. Yes, according to actual needs, complete the After the cutting line 1〇4 of the first surface on the first surface extending in the X-axis direction, the first carrier layer 710 can be rotated by 90 degrees, and the above steps (2) to (10) are repeated to complete the a cutting line 104 extending on the first surface of the brittle material substrate 101 in the γ-axis direction. Thus, the cutting line 104 on the first surface of the brittle material substrate is completed. The cutting line on the surface of the brittle material substrate 1 〇 lg is completed. Thereafter, the brittle material plate 1G1 can be turned over, and the above steps (7) to (10) are repeated to cut the second surface of the brittle material substrate opposite the first surface to form a cutting line on the second surface. - (11) driving the first linear guide (4) moving on the third linear guide to move the first bearing platform 710 in the X2 direction, driving the brittle material substrate to move in the direction of 乂 2 to the first carrier platform Move out the defined cutting work area. (4) Drive the second linear guide 62 to move the third linear guide to move = the platform 720 moves in the X2 direction to drive the brittle material substrate to move along the = work area to the money, (4) the load Platform 72G mobile ride defined laser (13) The brittle material substrate is moved. The first surface is formed on the first surface. The step of forming the cutting line 1〇4 on the first surface of the brittle material substrate is substantially the same. (14) While forming the cutting line 104 on the first surface of the brittle material substrate 102, the first surface-cut brittle material substrate 1〇1 is turned over. (15) Completion of the brittle material After the cutting of the first surface of the substrate 1 2 , the second linear guide 620 is driven to move on the third linear guide 5 使 to move the second bearing platform 720 in the XI direction, and the brittle material substrate 1 〇 2 is driven along the χ 1 direction. Shifting to move the second carrier platform 720 out of the defined laser cutting work area. Driving the first linear guide 620 to move on the third linear guide 5 使 to move the first bearing platform 710 in the XI direction, and driving the brittle material substrate 1 〇 1 to move in the direction to move the first bearing platform 710 Go to the defined laser cutting work area. The surface which is not cut by the brittle material substrate 1〇1, that is, the second surface opposite to the first surface thereof, is subjected to laser cutting. The step of cutting the second surface of the brittle material substrate 1〇1 is substantially the same as the step of cutting the first surface of the brittle material substrate 1〇1, and will not be described herein. (16) While the second surface of the brittle material substrate 101 is being cut, the brittle material substrate 102 on which the first surface has been cut is turned over. (17) After the cutting of the second surface of the brittle material substrate 101 is completed, driving the first linear guide 610 to move on the third linear guide 500 to move the first bearing platform 710 in the X2 direction to make the brittle material substrate 1 The crucible 1 is moved in the direction of the crucible 2 to move the first carrier platform 710 out of the defined laser cutting work area. Driving the second linear guide 620 to move on the third linear guide 5 使 moves the second loading platform 720 in the Χ 2 direction to drive the brittle material substrate 1 〇 2 to move to the laser cutting work area defined in 18 200827081. The cutting of the second surface of the brittle material substrate 102 is completed; the step of cutting the second surface of the brittle material substrate 102 is substantially the same as the step of cutting the first surface of the brittle material substrate 1〇1, This will not be repeated here. (18) while cutting the second surface of the brittle material substrate 1〇2, removing the cut brittle material substrate 1〇1 from the first carrying platform 71〇, and then placing the next to be cut A substrate of brittle material is loaded on the first carrier platform 710. In addition, according to actual needs, if it is not necessary to cut the second surface of the brittle material substrate 1〇1, for example, the cutting pair of the first surface of the brittle material substrate 1〇1 can be completely separated (Full B〇) Dy (abbreviated as fbc), the cut brittle material substrate 1〇1 can be removed from the first carrying platform 71, and then the next brittle material substrate to be cut is disposed on the first carrying platform 710. . Repeating the above steps, the brittle material substrates 1〇1, 1〇2 on the first bearing platform 710 and the second bearing slab 720 can be alternately cut, and the siding of one of the brittle material substrates does not substantially affect the other - A brittle material substrate is flipped or unloaded to increase cutting efficiency. As described above, when the laser cutting system 1 is dicing the surfaces of the brittle material substrates 101, 102, the trajectory of the cutting line is sequentially passed from the brittle material substrate 101, and an edge is moved. Cutting to the center until the other edge is cut by the end of the cutting - edge to the center to cut the edge of the initial cut, repeating the cut to the end of the butterfly line on the surface; this is beneficial to the UtRg 'lifting cutting speed of 19 200827081. Moreover, the laser cutting system can also be completed by using the above-mentioned first-bearing platform and the second carrying platform, and alternately cutting the brittle material substrate on which the clothes are mounted, and the _ a brittle material substrate can be Flipping or unloading another brittle material substrate simultaneously 'and thus increasing the cutting speed. It can be seen that the above-described laser cutting system 100 and the cutting method using the laser cutting system 1 to cut the substrate of the brittle material can improve the cutting speed. • The invention has indeed met the requirements of the invention patent and has filed a patent application in accordance with the law. The above-mentioned embodiments are only the preferred embodiments of the present invention, and those skilled in the art will be able to include the equivalent modifications or variations of the invention in the spirit of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a laser cutting system in the prior art. 2 is a schematic view showing a cutting state of the laser cutting system shown in FIG. 1. Figure 3 is a schematic illustration of a laser cutting system in accordance with an embodiment of the present invention. Figure 4 is a schematic view showing a cutting state of the laser cutting system shown in Figure 3. Figure 5 is a schematic view showing a cutting state of the first cutting line of the first brittle material substrate in Figure 4; Figure 6 is a schematic view showing a cutting state of the second cutting line of the first brittle material substrate in Figure 4; ' [Main component symbol description] 20 200827081 Glass substrate laser generating device 'first cutting line - laser cutting system second linear guide first bearing platform laser generating device second cooling device spring second scribing tool pre-cutting Line scribing tool 20 Cooling device 40 - Cutting line 60 First linear guide 610 Third linear guide 500 Second carrying platform 720 First cooling device 410 First scribing tool 210 Brittle material substrate 101, 102 Cutting line 104 21