TWI375664B - - Google Patents

Description

1375664 IX. Description of the Invention: [Technical Field] The present invention relates to a method for forming a crack on a substrate of a brittle material by laser scribing, and more particularly, after forming a first crack, A second crack intersecting the first crack is formed to the intersection with the first crack. Here, "laser scribing processing" refers to irradiating a laser beam onto a substrate to form a beam spot, and moving the beam point relative to the substrate, heating the substrate locally below a soft > point, and then heating the substrate. The path through which the beam spot passes is processed by the thermal stress generated by cooling the substrate to form a crack. - Further, "crack" refers to a linear crack formed in advance on a predetermined position on the substrate before performing a cracking process in which the substrate is completely broken. The crack is formed by a crack that does not reach the back surface of the substrate, and by performing a cutting process in which the bending force is applied to the thickness direction along the crack, the crack progresses in the thickness direction of the substrate, and reaches the back side at the front end of the crack. The phase becomes a disconnected line that is completely disconnected. > In addition to the glass substrate, the "brittle material" also includes materials such as ceramics, single crystal, semiconductor wafers, and sapphire. [Prior Art] A brittle material substrate such as a glass substrate is used in various products by being cut into an appropriate size or shape. In the method of breaking the brittle material substrate, a laser scnbe' processing by laser heating and immediate cooling after heating to form a crack, and a crack application formed by laser scribing processing are performed. The method of breaking the bending force distance 5 1375664 and breaking it, has been put into practical use. By performing the laser scribing process and the breaking process, a disconnected surface of excellent quality can be obtained. Laser scribing processing sometimes uses a plurality of linear cracks that are placed on each other on the substrate (referred to as cross-line h, for example, when cutting a large-sized square substrate which is a product from a large substrate) Although it is performed to cut the substrate into vertical and horizontal intersections and cut, in this case, the laser marking process is performed and cross-lined. Generally speaking, 'laser marking processing, in order to reduce the processing width and improve the heating efficiency, The shape of the beam spot is formed into an elliptical shape, an oblong shape or the like having a long axis shape, and the long axis direction is directed toward the scanning direction. Further, the cooling region (referred to as a cooling point) for cooling immediately after heating follows the beam spot movement. (Refer to Patent Document 1) Further, a laser scribing process (see Patent Document 2) is disclosed, and when a refrigerant is sprayed immediately after heating to perform cooling, a liquid refrigerant is used without using a gas refrigerant, thereby lifting the substrate. Therefore, it is preferable to use water (pure water) as the liquid refrigerant in the substrate which is rapidly heated, and it is also disclosed that ethanol, ethylene glycol, methanol, acetone, and The liquid refrigerant in which any of the surfactants is mixed with water can be cut at a faster cutting speed than when a refrigerant having gas physical properties is used. Further, it is also revealed that if a gas is used, When the squeegee of the physical property of the refrigerant (the specific heat is smaller than the fluorine gas), the cutting speed is lowered and it is not suitable as a refrigerant. On the other hand, the processing of cutting the glass substrate along the closed curve is also performed. Method for processing a substrate (refer to Patent Document 3), the example of which is 375,664. In the process of manufacturing a circular solar cell device, a plurality of circular cracked outer peripheral lines are formed on a rectangular large substrate at intervals. A circular solar cell device is formed on the inner side of the crack outer circumference, and a linear crack is formed between the outer circumference of the adjacent circular crack and between the outer periphery of the large substrate and the outer circumference of the circular crack, thereby performing a circle According to this, a circular crack outer circumference is formed by using a c〇2 laser. Then, on the circular substrate (solar battery device), the beam point of the c〇2 laser is blocked while being blocked. C 2 The laser is scanned in a straight line to form a linear crack from the outer periphery of the large substrate to the outer peripheral line of the crack, and a linear crack is formed between the adjacent outer peripheral lines of the crack. # By the above steps,圆形 文献 圆形 圆形 圆形 圆形 圆形 Η Η Η Η Η Η Η Η Η Η Η Η Η Η Η Η Η 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明Contents] Fig. 1 is a schematic view showing the processing order of the fine τ, is γ*· ϋ , and dust when the circular member 10 is taken from the square glass substrate G by laser scribing. ) is shown to form a plurality of linear cracks (X - i, χ - 2, γ _, circular cracks (R - D, and form γ - 2) outside the circular member 1 。. It is called "abandoning the cutting", Λ 7 you, and the number of the peasant π. The circular member 10 is easily separated and formed at this time, as shown in Fig. Ub, Φ ·, mm. The processing sequence shown by the number of the circle, the initial formation of a circular crack is also the result of the eight-way return) Shape cracks (d father's position, respectively, forming a straight crack (χ-ΐ γ—ι χ—2 7 1375664 — 2) (second crack)” At this time, the crack is in the heating zone (beam spot) and the cooling zone ( The vicinity of the boundary of the cooling point) forms a subtle change in the position of the crack due to the delicate balance between the heating zone and the cooling zone. Further, depending on the internal state of the substrate, the position of the crack changes due to the subtle change in the stress distribution. It is very difficult to make the straight cracks at the intersection with the circular cracks and stop the system correctly. As a result, as shown in Fig. 1(c), sometimes the stop position of the cracks will shift, resulting in linear cracks (X-1, Υ—卜χ—2) crossing the intersection with the circular crack” or the linear crack (Υ-1) does not reach the circular crack. In order to prevent such a defect, as described in the above Patent Document 3, Can be considered on the circular member 10 The beam spot is blocked, and when a straight crack is formed, even if one of the beam points crosses the intersection to reach the circular member 10, the circular member 10 itself is not directly heated. However, if this method is used, the lightning must be preliminarily The film for blocking the film is formed on the circular member 10, or the mask member is attached to the circular member 10 while positioning the circular crack. In the former case, it is necessary to form a straight crack. The step of removing the film. In the latter case, there must be a positioning step, but in any case, the step is increased and time-consuming and labor-intensive. Moreover, even in the case of forming or covering the member by the film When the circular member 10 itself is not directly heated, the tensile stress generated in the cooling region (cooling point) at the rear is sometimes transmitted to the front, and the straight crack is before the straight crack and the circular crack. The phenomenon of the intersection travels (details will be described later), and the linear crack cannot be stopped. The same problem occurs when linear straight line scribing is performed. Not cut by a laser scribing of a plurality of typically 11 bar-shaped member from the glass substrate G processing cis

^ ^ Can't bear the picture. When the size of the glass substrate G is larger than the strip member 11 and the relationship between the 丨M ^ h forms the end portion 12, the other end is intended to effectively utilize the end portion 2 as shown in Fig. 2(a). As shown, the glass substrate G is formed along the first Α Λ, and the first direction is formed by a linear first crack (Χ-υ and along the second side orthogonal to the first direction to form a plurality of second cracks (Υ 1 ~ Υ - 5). At this point, the processing sequence shown by the circle in Figure 2(b) is initially formed as a first-crack (X-υ, then to the position of the first-crack (Η) 'Forming a second crack (Υ-1~γ- at this time) It is very difficult to stop the front end at the intersection with the first crack (Χ-1) at the end of the second crack (丫?~丫5). As shown in Fig. 2(4), the stop position of the second crack (γ-Νγ)) is shifted to cause the crossing of the intersection with the first crack (XD), or the second crack (γ_5) does not reach the first crack ( The intersection of X-1). Therefore, (4) of the present invention provides a method for forming a crack of a brittle material substrate, which is processed by laser scribing. When the first crack is formed and then the second crack is formed at the intersection with the first crack in the direction intersecting the first crack, the second crack can be stopped at the intersection and the point. The crack forming method of the invention is formed by the first-laser scribing process, and the friction coefficient reducing agent for reducing the friction coefficient is attached to the crack of the first crack, and the third laser is drawn.丨 线 加 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线 线In the crack of the first crack, the surface on both sides of the crack in the first crack becomes slidable. When the second laser scribing is performed in this state, when the second crack reaches the intersection with the first crack At the time of the point, the crack of the second crack on the square side before the intersection will travel to the point of intersection, but when the intersection is intersected with the crack of the first crack, the crack of the second crack is caused by the tensile stress. The direction of expansion 'because of the system and the first The direction of the cracked surface of the crack is the same. Therefore, the travel of the crack of the second crack is interrupted by the sliding action. As a result, the travel of the crack of the first crack stops at the intersection point. After that, at the intersection point In the former case, even if it is slightly heated or cooled, the second crack does not travel to the front as long as the initial crack is not formed in the portion. According to the present invention, the friction coefficient reducing agent which reduces the friction coefficient is attached to In the crack of the first crack, the surface on both sides of the crack in the crack is slidable, and as a result, the travel of the crack of the second crack stops at the intersection with the first crack and the second crack can be made. Exactly stop. (Other means and effects to solve the problem) The friction coefficient reducing agent is more important than the one containing the lubricating oil. In particular, the cracking agent is included in the crack, so that the turtle can be used as a friction, for example, as a friction. However, it is considered that the water-soluble (as long as the coefficient of friction is reduced as long as the friction coefficient of both sides of the first crack is reduced, the agent can be used. It is preferred to use an oil repellency reducing agent if it is appropriately contained. Here, even if it is oyster sauce, there are many types of 10 1375664 = water for refrigerant - when it is sprayed), permeability (easy to penetrate into the crack, and easy to reduce the coefficient of friction), and it is easier to choose. A material that enters a crack and is easy to feed low (four) numbers. Among the Shi Xi oils, it is preferred to improve the lubricity of the oyster sauce. In addition to the lubricating oil such as eucalyptus oil, it is also possible to use, for example, a material having an alkyl group, specifically, a solution of a decyl alcohol, a hydrazine, and a fatty acid to be converted into a solution by adding ethanol. The material (4) acts as a friction coefficient reducing agent. its

The material of the "county" is preferably an alkyl alcohol, an alkyl ether or a fatty acid alkyl vinegar having a linear or branched alkyl group having a carbon number of 3 (), and is preferably excellent as a friction coefficient reducing agent. Further, the friction coefficient reducing agent may be sprayed together with the refrigerant when the substrate is cooled by the first laser scribing process. In the laser scribing process, the large tensile stress acts on the crack during the cooling and immediately after cooling, so that the crack can be spread by cooling the substrate. It is true that the friction coefficient reducing agent adheres to the crack and can be attached to the refrigerant while being attached thereto. Therefore, it is not necessary to add another step. The refrigerant can also use water containing eucalyptus oil. Conventionally, in the case of a coolant, a refrigerant such as water (steam) or ethanol which is sprayed together with nitrogen or compressed air alone does not have a function as a friction coefficient reducing agent. By using such a liquid to contain eucalyptus oil, it can be utilized as a friction coefficient reducing agent which can be sprayed. The coefficient of friction reducing agent may also be applied or sprayed immediately adjacent to the intersection after the substrate has been cooled by the first laser scribing process. 1375664

By separately coating the coolant with the coolant immediately after cooling, the friction coefficient reducing agent is only attached to the vicinity in the first crack. Thereby, the use of the friction coefficient reducing agent can be reduced, and the friction coefficient reducing agent can be attached to an unnecessary portion. [Embodiment] First, a crack formed by laser scribing processing will be described. Hereinafter, an embodiment of the present invention will be described based on the drawings. For convenience of explanation, Fig. 3 is a view showing a state of the glass substrate G in the laser scribing process, Fig. 3(a) is a perspective view, and Fig. 3(b) is a plan view showing an enlarged portion of the surface of the substrate. Fig. 3(c) shows the positions of the respective sections of Fig. 4. Moreover, Fig. 4 is a cross-sectional view showing a state in which cracks are generated at the position shown in Fig. 3(c). The predetermined line L 断开 is set on the glass substrate G, and the laser beam is irradiated to form an elliptical beam spot BS, and the long axis direction is scanned toward the line to be cut L 〇. Further, a nozzle (e.g., compressed air containing water) is ejected from a nozzle (not shown) toward the back of the beam spot BS, whereby a cooling point cs is formed and scanned so as to follow the beam spot BS. Specifically, the position of the laser beam forming the beam spot BS and the nozzle forming the cold spot CS is fixed in advance, and the substrate G is relatively moved in the front direction (the direction of the arrow in the middle direction) along the line to cut L, thereby making the beam The point BS and the cooling point CS are scanned from the initial crack tr in the direction of the line to cut L. Fig. 3(b) shows the compressive stress and tensile stress generated in the vicinity of the surface of the substrate at this time. In the figure, the magnitude of the compressive stress is indicated by a dotted arrow, and the magnitude of the tensile stress is indicated by a solid arrow. 12 1375664 As the beam spot BS passes, the compressive stress gradually becomes stronger. Then, when the cooling point CS follows the beam, the point BS is rearward, and the compressive stress is changed from a compressive stress to a tensile stress. Thereafter, the tensile stress is gradually relaxed and the internal heat is transferred to the surface and then converted into a weaker compressive force to terminate the crack. Fig. 4(a) is a view showing a section a-a immediately after the beam spot BS has passed (see Fig. 3(c). The cross sections are also the same as described below). Since (4) stress acts, no cracks are generated. Fig. 4 (8) is a view showing a section B-B' in which the cooling point cs is converted into a tensile stress. The coarse crack is caused by the strong tensile stress, and the crack is about to expand due to the large tensile stress. Figure 4 (e) shows that the tensile stress gradually weakens after the cooling point passes. A map of the section cross section CC. The width of the residual crack due to the weak tensile stress: the fine crack L2 of the coarse crack U. Fig. 4(4) shows the time-lapse: a graph of wearing two: D when the tensile stress disappears after thinning and is again converted into a weaker compressive stress. In this area, due to weak compressive stress, it is traced). The HMW regards the unrecognizable crack L3 (referred to as blind cracking, and the crack forming method of the present invention is described. In the seventh step of the crack forming method of the invention, the first crack forming step and the rubbing operation are performed: Each step of the formation of the first crack, but: the formation of the adhesion with the friction reducer. 仃 first - crack adhesion: j (a) indicates the first crack formation step and the friction coefficient decreased sword: step. The forming step (and the rubbing: the step of reducing the agent) is performed by the laser scribing process described in the attaching steps of the descending agent of Fig. 3 and Fig. 4. However, 13 丄]0064 is only in the six 7 medium. The point of containing a trace amount of eucalyptus as a friction coefficient reducing agent is different. That is, 'the laser beam LB is irradiated onto the substrate G to form an elliptical beam spot BS. Further, the refrigerant is ejected from the cooling nozzle CN to form a cooling point CS. Fixing the position of the beam spot BS and the cooling point CS, driving the platform (not shown) on which the substrate G is loaded, moving the substrate G' along the predetermined line L of the direction of the X direction, and making the beam spot BS and the cooling point CS from the initial turtle Split TR across substrate G Scanning is performed in such a manner that a first crack (X-1) is formed. In the refrigerant, water (the original coolant) is contained in advance as a friction coefficient reducing agent in an amount of 1% or less, for example, 0.4%, and is formed in advance. The compressed air is sprayed together from the nozzle. Since the concentration of the eucalyptus oil is increased, it cannot be ejected from the nozzle, so the concentration is adjusted to be relatively light. In this way, the friction coefficient reducing agent is sprayed together with the refrigerant. Immediately forming a coarser crack L1» as illustrated in Fig. 4(b), the crack is spread by the larger tensile stress in the coarser crack L1, so that the eucalyptus oil easily adheres to the crack. After that, over time In the past, although the crack L3 (blind crack) was visually unrecognizable through the fine crack L2, the friction coefficient in the crack was reduced by the attached eucalyptus oil. Then the second crack forming step was performed. Fig. 5(b) A diagram showing a second crack forming step. The second crack forming step is such that the scanning direction of the substrate G faces the Y direction to perform laser scribing processing as illustrated in FIG. 4(b). The friction coefficient reducing agent is used, so that only the refrigerant of water and compressed air can be used, but as long as it does not cause a bad reaction due to the simmering oil (friction coefficient reducing agent), 1375664 can be used directly in the first crack forming step. The refrigerant used (and the adhesion step of the friction coefficient reducing agent). In the second crack forming step, the cooling point CS reaches the intersection F with the first crack (X-1), and further continues scanning until the first crack is exceeded. Fig. 6 is a perspective view showing a state in which the front end of the cooling point CS reaches the first crack (χ-丨), Fig. 6(a) is a perspective view, and Fig. 6(b) is a plan view. Further, Fig. 6(c) to Fig. 6 (d) is an enlarged view of different states of the region s of Fig. 6(b), respectively. 6(c) shows the state of the region s before the cooling point CS reaches the region 5, and FIG. 6(d) shows that the eucalyptus oil adheres to the first crack (the region S of FIG. 6(b) when χ_υ, and FIG. 6 ( e) As a comparative example, the region s of Fig. 6(b) when the eucalyptus oil is not attached to the first crack (X-1). There are four markers shown in Fig. 6(c) to Fig. 6(e). Ρι~ρ4. These are used to illustrate the positional change of the substrate of the second crack forming step by the movement of the mark.

The breaking of the predetermined line (L0) has not yet caused a crack. At this time, the four marks Ρ4 are marked from the intersection of the first crack (χ-i) and the line of disconnection (L〇). As shown in Fig. 6(d), just after the cooling point CS passes 1) becomes a coarse crack i and the point F stops. This F stops. After that 'when the cooling point CS reaches the region S, 4 breaks the predetermined line (L0) to form a second crack (Y-1). After that, a strong tensile stress is generated, so that the second crack (γ L1. The friction coefficient of the second crack (γ-1) at the front end of the fissure 15 1375664 is the first crack (x-1) due to the adhesion of the eucalyptus oil, so that the pull on the P1 side (P2 side) The tensile stress is not transmitted to the P4 side (P3 side) beyond the intersection F. At this time, the crack surface of the P1 side (p2 side) slides in the direction of the arrow with respect to the crack surface of the P4 side (P3 side). The travel of the crack is stopped. At this time, the beam spot BS passes over the intersection point f and reaches the front (p 3, P4 side). However, only the compressive stress is imparted without causing the crack to travel. As long as the intersection F does not form an initial In the crack TR, even if a little heating is applied to the P4 side (P3 side), the crack cannot travel. Fig. 6(b) is a comparative example 'in the crack of the first crack (χ _ i) At this time, the cooling point CS sometimes reaches the region s. Since the crack is generated on the crack surface of the first crack (X-1), if P1 When the crack surface of the side (P2 side) moves in the direction of the first crack, the crack surface of the P4 side (P3 side) is moved by the frictional force, that is, the movement of the p4 side and the P1 side. Moves in conjunction with each other, and the p3 side moves in conjunction with the movement of the p2 side. Therefore, the second crack forming step produces a strong tensile stress immediately after the cooling point cs passes, so that the second crack (γ_υ becomes When the coarse cracks li expand, the coarser crack L1 will pass over the intersection and the point F, and form a coarser crack *L4 which expands with the same crack width as the crack L1. That is, the crack does not stop at the intersection. Example (Experiment) A comparative experiment was carried out in the case where the refrigerant contained eucalyptus oil as a friction coefficient reducing agent, and 1375664 and oyster oil were not contained. The experimental conditions are as follows.

Glass substrate alkali-free glass (#173 7 manufactured by Corning Incorporated) Laser output 160W Scanning speed 200mm/sec Refrigerant injection volume 2ml/min Crack depth 125 /z m Refrigerant Water 99.6%

Oyster sauce 0.4% (KF-643 manufactured by Shin-Etsu Chemical Co., Ltd.) is sprayed with compressed air at the above mixing ratio to perform laser scribing processing under the above conditions. First, a first crack is formed in the X direction, and then Y is formed. The direction forms a second crack, and when the second crack is formed, the beam spot BS and the cooling point CS are scanned over the two-point of the first-crack. And it did not cross the first result. The second rift was at the point of crossing and completely stopped a crack and proceeded to the front.

As a comparative example, the refrigerant was changed to 1% by weight of water (the result of the same laser scribing process for the eucalyptus oil, and the second crack was not crossed and stopped) and traveled to the front beyond the first crack. As a result of the above, it is understood that by adhering a trace amount of eucalyptus oil (friction coefficient reducing agent) to the crack of the first crack, it is possible to suppress the progress of the crack at the point of intersection. Further, the material other than the stone oil is also rubbed. Review of the material of the coefficient reducing agent. The result is that the refrigerant contains the base alcohol, the base of the base, and the fatty acid base (with the carbon 17 1375664 number 1~30). When the straight-line or the key base is used as the material of the solution as the friction coefficient reducing agent, the effect of stopping the travel of the crack can be obtained. (Modification embodiment) In the above embodiment, the cooling nozzle is used. The eucalyptus oil (friction coefficient reducing agent) is sprayed together with the refrigerant, but the second nozzle may be disposed after the cooling nozzle, and only the eucalyptus oil (friction coefficient reducing agent) is sprayed on the necessary portion. The point in pay and vicinity F. By this way, in the case of attachment of the intended use of silicone oil, silicone oil can affect the inhibition in the minimum limit.

Further, in the above embodiment, the eucalyptus oil is adhered by the ejection from the f-mouth, but it may be adhered by coating. Even in this case, it is easy to enter the crack when it is applied immediately after cooling.

Further, in the second crack forming step, when the beam spot reaches the intersection with the first crack #, as long as the laser irradiation is stopped to eliminate the beam spot, the substrate can be suppressed from being heated by the J-crack. The result is not, the impact. At this time, by stopping the cooling after the cooling point is moved to the intersection, the second crack can be surely formed to the intersection. It can be used for a brittle material such as a glass substrate. The crack forming method of the present invention is to break the material substrate. [Simple description of the diagram] () (c) is a schematic diagram of a typical processing sequence that is not processed by laser scribing.啄时· Fig. 2(a) to (c) are diagrams showing the processing sequence in which a plurality of strips are cut by laser scribing processing; 18 J375664 Figures 3(a) and (c) show the state of the glass substrate in laser scribing. 4(a) to 4(d) are cross-sectional views showing a state in which cracks are generated at respective positions on a line to be broken. Fig. 5 (a) and (b) show the steps of a method for forming a crack according to an embodiment of the present invention. The shape of a crack Fig. 6(a) to (e) show the state of arrival of the cooling point cs. [Main component symbol description] 10 Circular member 11 Strip member BS Beam point CS Cooling point L0 Disconnected line L1 Rough crack L2 Fine crack L3 Blind crack F Cross point X-1 First crack Y- 1 Second crack 19

Claims (1)

1375664 \/ July 12, 101 revised replacement page ten, the scope of patent application: 1, a method of crack formation of a brittle material substrate, is formed by laser scribing processing, the laser marking process will be laser The light beam is irradiated onto the substrate of the brittle material to form a beam spot, and the beam spot is relatively moved and heated at a temperature lower than the softening temperature of the substrate, and then the substrate is cooled along a path through which the beam spot passes. The first laser scribing process forms a first crack; after the friction coefficient reducing agent that reduces the friction coefficient is attached to the crack of the first crack, the second crack is processed by the second laser scribing process The direction of the intersection of the first crack is formed to the intersection with the first crack; the second crack stops at the point of the second crack at the point of intersection with the first crack. 2. For the method of forming a crack in the special item (4), the coefficient of friction reducing agent contains lubricating oil. 3. The method of forming a crack according to item 2 of the patent application, wherein the friction coefficient reducing agent contains Shixia oil. 4. The method for forming a crack according to the first item of the patent scope is as follows: The coefficient of friction reducing agent contains any one of a hospital alcohol, a hospital base, and a fatty acid ketone vinegar. 5. For example, the first friction coefficient reducing agent in the patent application scope is a method for forming a crack in which the β item is sprayed together with the refrigerant, wherein the laser scribing process cools the substrate. Use water containing eucalyptus oil. The method for forming a crack of the item, wherein the method of forming a crack according to the first item of the patent application, wherein the friction coefficient reducing agent is processed in the first laser scribing process, Immediately after the substrate is cooled, it is coated or sprayed near the intersection. XI. Schema: as the next page 21