JP2002087836A - Method of machining brittle non-metallic material - Google Patents

Method of machining brittle non-metallic material

Info

Publication number
JP2002087836A
JP2002087836A JP2000278938A JP2000278938A JP2002087836A JP 2002087836 A JP2002087836 A JP 2002087836A JP 2000278938 A JP2000278938 A JP 2000278938A JP 2000278938 A JP2000278938 A JP 2000278938A JP 2002087836 A JP2002087836 A JP 2002087836A
Authority
JP
Japan
Prior art keywords
crack
substrate
metallic material
brittle
solar cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000278938A
Other languages
Japanese (ja)
Inventor
Nobuo Hanawahira
信夫 塙平
Masayoshi Maehane
昌佳 前羽
Toshihiro Nomura
敏宏 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2000278938A priority Critical patent/JP2002087836A/en
Publication of JP2002087836A publication Critical patent/JP2002087836A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04Cutting or splitting in curves, especially for making spectacle lenses

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method capable of easily machining and segmentizing a brittle non-metallic material into a required shape. SOLUTION: In the method of machining the brittle non-metallic material by which cracks are continuously formed from the surface to the inside in the plate like brittle non-metallic material substrate I such as glass, a plurality of crack outer peripheral lines 3 having the required shape (equal to solar cell device 2) arranged at a certain interval on the substrate 1 are formed and linear cracks 5 reaching the adjacent outer peripheral line 3 and linear cracks 4 reaching the required shaped outer peripheral line 3 adjacent to the outer periphery from the outer periphery of the substrate 1 are formed among the required shaped outer peripheral lines adjacent to each other. The adjacent required shaped (=solar cell device 2) crack outer peripheral lines 3 are formed in contact with each other.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ガラス等の脆性非
金属材料の加工、分断の方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing and cutting brittle nonmetallic materials such as glass.

【0002】[0002]

【従来の技術】従来より、脆性非金属材料であるガラス
基板上に形成された太陽電池装置が利用されて、このよ
うな太陽電池装置を腕時計の文字盤として円形板状に加
工しても利用されている。
2. Description of the Related Art Conventionally, a solar cell device formed on a glass substrate which is a brittle non-metallic material has been used, and such a solar cell device is used even when processed into a circular plate shape as a dial of a wristwatch. Have been.

【0003】このような円形板状の太陽電池装置にガラ
スを分断加工するには、まず、図4(a)に示すよう
に、矩形状大型ガラス基板21上に、複数の太陽電池装
置22が形成される。ここで、腕時計の文字盤に利用さ
れる太陽電池装置は、略20〜40mm程度の直径であ
り、このような小面積の円形状を、ガラスカッター等に
よりスクライブ線を形成し、その後、手作業等により力
を加えて、スクライブ線に沿って分断することは、困難
であった。
In order to cut glass into such a circular plate-shaped solar cell device, first, as shown in FIG. 4A, a plurality of solar cell devices 22 are formed on a large rectangular glass substrate 21. It is formed. Here, the solar cell device used for the dial of the wristwatch has a diameter of about 20 to 40 mm, and a circular shape having such a small area is formed with a scribe line by a glass cutter or the like. It has been difficult to apply a force or the like to cut along the scribe line.

【0004】そこで、次の工程を採用していた。図4
(a)に示すように、矩形大型ガラス基板21の外周辺
と平行に、スクライブ線23を形成し、図4(b)に示
すように、円形太陽電池装置22より大面積である矩形
中間体24に、一旦、分断する。その後、円形太陽電池
装置22の外周線状の形状を有する型を、超音波振動を
加えながら矩形中間体24表面に押圧することにより、
ガラス基板材料を分断し、図4(c)に示す円形太陽電
池装置22を完成させていた。
Therefore, the following steps have been adopted. FIG.
As shown in FIG. 4A, a scribe line 23 is formed in parallel with the outer periphery of the rectangular large-sized glass substrate 21, and a rectangular intermediate body having a larger area than the circular solar cell device 22 as shown in FIG. At 24, it is divided once. Thereafter, by pressing a mold having a shape of an outer peripheral line of the circular solar cell device 22 onto the surface of the rectangular intermediate body 24 while applying ultrasonic vibration,
The glass substrate material was cut, and the circular solar cell device 22 shown in FIG. 4C was completed.

【0005】[0005]

【発明が解決しようとする課題】このように、従来にお
いて、ガラス基板等の脆性非金属材料の加工、分断方法
では、円形の太陽電池装置を完成するのに、手間とコス
トを要するものであった。
As described above, in the conventional method of processing and cutting a brittle nonmetallic material such as a glass substrate, it takes time and cost to complete a circular solar cell device. Was.

【0006】本発明はこのような問題点を解決するため
に成されたものであり、所望の形状に容易に加工、分断
できる脆性非金属材料の加工方法を提供することを目的
とする。
The present invention has been made in order to solve such problems, and an object of the present invention is to provide a method for processing a brittle nonmetallic material which can be easily processed and cut into a desired shape.

【0007】[0007]

【課題を解決するための手段】本発明の主要な構成は、
板状脆性非金属材料基板において、表面から内部に至る
亀裂を連続して形成する脆性非金属材料加工方法であっ
て、前記基板に、間隔をおいて配置される複数の所望形
状の亀裂外周線を形成すると共に、隣接する前記所望形
状の間において隣接する両前記外周線に至る線状の亀裂
と、前記基板の外周から、該外周に近接する所望形状の
前記亀裂外周線に至る線状の亀裂とを形成することであ
る。
The main constitution of the present invention is as follows.
A brittle non-metallic material processing method for continuously forming a crack extending from a surface to an inside in a plate-shaped brittle non-metallic material substrate, wherein the substrate has a plurality of crack peripheral lines having a desired shape arranged at intervals. And a linear crack extending from the outer periphery of the substrate to a linear crack extending from the outer periphery of the substrate to the crack outer peripheral line having a desired shape close to the outer periphery. Is to form cracks.

【0008】また、板状脆性非金属材料基板において、
表面から内部に至る亀裂を連続して形成する脆性非金属
材料加工方法であって、隣接する所望形状の亀裂外周線
を接して形成することである。
[0008] In a plate-shaped brittle nonmetallic substrate,
A brittle nonmetallic material processing method for continuously forming a crack extending from the surface to the inside, wherein the crack is formed in contact with adjacent crack outer peripheral lines having a desired shape.

【0009】[0009]

【発明の実施の形態】以下に本発明の第1実施例を、図
1を用いて詳細に説明する。図1において、まず、板状
脆性非金属材料基板である大型ガラス基板1上に、外形
が略円形である太陽電池装置2を、間隔をおいて形成す
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described in detail with reference to FIG. In FIG. 1, first, a solar cell device 2 having a substantially circular outer shape is formed at intervals on a large-sized glass substrate 1 which is a plate-shaped brittle nonmetallic material substrate.

【0010】このような円形の太陽電池装置2は、実開
昭63−115239号に開示されるようなものが利用
できる。ガラス基板1上より、透明電極層/アモルファ
スシリコン層/金属電極層からなり、中心角が略90度
の4つの隣接した扇型太陽電池素子を、外周部で電気接
続する構造で、太陽電池素子の裏面上は保護膜で覆われ
た構造である。
As such a circular solar cell device 2, one disclosed in Japanese Utility Model Laid-Open No. 63-115239 can be used. A structure in which four adjacent fan-shaped solar cell elements composed of a transparent electrode layer / amorphous silicon layer / metal electrode layer and having a central angle of about 90 degrees are electrically connected at the outer periphery from the glass substrate 1. Has a structure covered with a protective film.

【0011】次に、CO2レーザを利用して、ガラス基
板1において、表面から内部に至る亀裂を連続して形成
する。このような加工方法は、例えば、特表平8−50
9947号に開示されており、ガラス基板1の表面に、
CO2レーザのビームスポットを照射しつつ、空気また
は/及び水からなる冷媒を当て、ガラス基板1を移動さ
せ、連続した亀裂を形成するものである。
Next, cracks from the surface to the inside are continuously formed in the glass substrate 1 using a CO 2 laser. Such a processing method is disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 8-50.
No. 9947, on the surface of the glass substrate 1,
While irradiating a beam spot of a CO 2 laser, a coolant made of air or / and water is applied to move the glass substrate 1 to form a continuous crack.

【0012】そして、図1(a)に示すように、円形太
陽電池装置2の円形外周に、上述の方法を用いて、連続
した亀裂からなる亀裂外周線3を形成する。続いて、基
板1の外周から、CO2レーザを直線的に走査しつつ、
太陽電池装置2上においては、CO2レーザのビームス
ポットを遮断することにより、基板1の外周から近接す
る亀裂外周線3に至る線状の亀裂4aと、隣接する亀裂
外周線間に線状の亀裂5bとを、形成する。同様に、亀
裂4b、5b、亀裂4c、5cを形成する。
Then, as shown in FIG. 1A, a crack outer peripheral line 3 composed of continuous cracks is formed on the circular outer periphery of the circular solar cell device 2 by using the above-described method. Subsequently, while linearly scanning the CO 2 laser from the outer periphery of the substrate 1,
On the solar cell device 2, by blocking the beam spot of the CO 2 laser, a linear crack 4 a extending from the outer periphery of the substrate 1 to the adjacent crack outer line 3 and a linear crack 4 a between the adjacent crack outer lines. A crack 5b is formed. Similarly, cracks 4b and 5b and cracks 4c and 5c are formed.

【0013】以上の工程の後、亀裂が形成された基板1
を、外周からの亀裂4aの両側に力を加えて分断するこ
とで、左上コーナー近傍の太陽電池装置2を分断し、図
1(b)に示す太陽電池装置2が完成する。続いて、こ
れと連続する亀裂5aの両側に力を加えることにより太
陽電池装置2を分離することができ、同様にして、亀裂
5a、4aに接続された太陽電池装置2を、次々と、容
易に分離することができる。
After the above steps, the cracked substrate 1
Is divided by applying force to both sides of a crack 4a from the outer periphery, thereby dividing the solar cell device 2 near the upper left corner, and the solar cell device 2 shown in FIG. 1B is completed. Subsequently, the solar cell device 2 can be separated by applying a force to both sides of the continuous crack 5a. Similarly, the solar cell devices 2 connected to the cracks 5a, 4a can be easily and successively removed. Can be separated.

【0014】そして、同様にして、亀裂4b、5b、亀
裂4c、5c・・・に接続された太陽電池装置2を容易
に分離することができる。また、第1実施例において
は、上述の従来例と比較して、矩形状中間体に分離する
必要がなく、太陽電池装置2とならない基板1の捨て部
分を少なくすることができるので、基板1の単位面積あ
たりより取れる太陽電池装置2の数が増加している。
In the same manner, the solar cell devices 2 connected to the cracks 4b, 5b, 4c, 5c,... Can be easily separated. Further, in the first embodiment, compared to the above-described conventional example, it is not necessary to separate the rectangular intermediate body, and the discarded portion of the substrate 1 that does not become the solar cell device 2 can be reduced. The number of solar cell devices 2 that can be obtained per unit area is increasing.

【0015】また、太陽電池装置2の分離をより容易に
するために、図2に示すように、追加の直線状の横方向
亀裂10、10・・・、直線状の縦方向亀裂11、11
・・・を、形成することも可能である。
Further, as shown in FIG. 2, additional straight lateral cracks 10, 10,..., Straight longitudinal cracks 11, 11, as shown in FIG.
... can also be formed.

【0016】次に、本発明の第2実施例を、図3を用い
て説明する。上記の第1実施例と同等の構造について
は、同符号を用い、説明を省略する。基板1上に、外形
が略円形である太陽電池装置2が、隣接する太陽電池装
置2と外周が接するように形成する。そして、円形太陽
電池装置2の円形外周に、CO2レーザを利用して、連
続した亀裂からなる亀裂外周線3を、隣接する太陽電池
装置2の亀裂外周線3と接するようにして、形成する。
また、基板1の外周側に位置する太陽電池装置2の亀裂
外周線3は、基板1の外周と接するように形成される。
Next, a second embodiment of the present invention will be described with reference to FIG. The same structures as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. A solar cell device 2 having a substantially circular outer shape is formed on a substrate 1 such that the outer periphery of the solar cell device 2 is in contact with an adjacent solar cell device 2. Then, on the circular outer periphery of the circular solar cell device 2, a crack outer peripheral line 3 composed of continuous cracks is formed using a CO 2 laser so as to be in contact with the crack outer peripheral line 3 of the adjacent solar cell device 2. .
Further, the crack outer peripheral line 3 of the solar cell device 2 located on the outer peripheral side of the substrate 1 is formed so as to be in contact with the outer peripheral of the substrate 1.

【0017】以上の工程の後、亀裂が形成された基板1
を、基板1の外周と接する亀裂外周線3の両側に、力を
加えることにより、太陽電池装置2を容易に分断し、続
いて、この外周側の亀裂外周線3と接する亀裂外周線3
に従って、次々と、太陽電池装置2を容易に分断するこ
とができる。また、本第2実施例は、円形太陽電池装置
2が接して隣接配置されていることより、第1実施例よ
りも、基板1の単位面積あたりより取れる太陽電池装置
2の数が増加している。
After the above steps, the cracked substrate 1
The solar cell device 2 is easily separated by applying a force to both sides of the crack outer peripheral line 3 contacting the outer periphery of the substrate 1, and subsequently, the crack outer peripheral line 3 contacting the outer peripheral side crack outer peripheral line 3
Accordingly, the solar cell device 2 can be easily divided one after another. Further, in the second embodiment, since the circular solar cell devices 2 are disposed in contact with and adjacent to each other, the number of solar cell devices 2 that can be obtained per unit area of the substrate 1 is increased as compared with the first embodiment. I have.

【0018】以上の実施例においては、所望の形状とし
て、円形形状の太陽電池装置を利用しているが、このよ
うな形状以外にも、本発明は利用できる。また、本発明
が利用できる脆性非金属材料としては、ガラス以外に、
石英、セラミック等にも応用できる。
In the above embodiment, a circular solar cell device is used as a desired shape, but the present invention can be used in other shapes. In addition, as a brittle nonmetallic material that can be used in the present invention, in addition to glass,
It can be applied to quartz, ceramic, etc.

【0019】[0019]

【発明の効果】本発明は、板状脆性非金属材料基板にお
いて、隣接する所望形状の間の線状の亀裂、接して隣接
する所望形状における亀裂外周線、基板の外周から所望
形状に至る亀裂により、容易に、所望形状を分断するこ
とができる。
According to the present invention, there is provided a plate-shaped brittle non-metallic material substrate having a linear crack between adjacent desired shapes, a crack peripheral line in contact with and adjacent to a desired shape, and a crack extending from the outer periphery of the substrate to a desired shape. Thereby, the desired shape can be easily divided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施例を示す図であり、(a)は
基板状態の平面図、(b)は分断した状態の太陽電池装
置の平面図である。
FIGS. 1A and 1B are diagrams showing a first embodiment of the present invention, wherein FIG. 1A is a plan view of a substrate state, and FIG. 1B is a plan view of a separated solar cell device.

【図2】本発明の第1実施例の追加例を示す平面図であ
る。
FIG. 2 is a plan view showing an additional example of the first embodiment of the present invention.

【図3】本発明の第2実施例を示す平面図である。FIG. 3 is a plan view showing a second embodiment of the present invention.

【図4】従来例を示す図であり、(a)は基板状態の平
面図、(b)は中間体の平面図、(c)は分断した状態
の太陽電池装置の平面図である。
4A and 4B are diagrams showing a conventional example, in which FIG. 4A is a plan view of a substrate state, FIG. 4B is a plan view of an intermediate body, and FIG. 4C is a plan view of a split solar cell device.

【符号の説明】[Explanation of symbols]

1 基板 2 太陽電池装置 3 亀裂外周線 4、5 亀裂 DESCRIPTION OF SYMBOLS 1 Substrate 2 Solar cell device 3 Crack peripheral line 4, 5 Crack

フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) G04B 19/06 B23K 101:40 B23K 101:40 H01L 31/04 M (72)発明者 野村 敏宏 大阪府守口市京阪本通2丁目5番5号 三 洋電機株式会社内 Fターム(参考) 4E068 AD01 CA04 DA09 DA14 DB13 4G015 FA03 FA04 FA06 FB01 FC02 FC05 5F051 AA05 BA04 CB28 GA03 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (Reference) G04B 19/06 B23K 101: 40 B23K 101: 40 H01L 31/04 M (72) Inventor Toshihiro Nomura Keihanmoto, Moriguchi-shi, Osaka 2-5-5, Sanyo Electric Co., Ltd. F-term (reference) 4E068 AD01 CA04 DA09 DA14 DB13 4G015 FA03 FA04 FA06 FB01 FC02 FC05 5F051 AA05 BA04 CB28 GA03

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 板状脆性非金属材料基板において、表面
から内部に至る亀裂を連続して形成する脆性非金属材料
加工方法であって、 前記基板に、間隔をおいて配置される複数の所望形状の
亀裂外周線を形成すると共に、 隣接する前記所望形状の間において隣接する両前記外周
線に至る線状の亀裂と、前記基板の外周から、該外周に
近接する所望形状の前記亀裂外周線に至る線状の亀裂と
を形成することを特徴とする脆性非金属材料加工方法。
1. A brittle non-metallic material processing method for continuously forming a crack extending from a surface to an inside of a plate-like brittle non-metallic material substrate, the method comprising: A linear crack extending from the outer periphery of the substrate to the crack outer periphery having a desired shape and adjacent to the outer periphery of the substrate, while forming a crack outer periphery having a shape; A brittle non-metallic material processing method, comprising forming a linear crack leading to a crack.
【請求項2】 板状脆性非金属材料基板において、表面
から内部に至る亀裂を連続して形成する脆性非金属材料
加工方法であって、 前記基板に、間隔をおいて配置される複数の所望形状の
亀裂外周線を形成すると共に、隣接する前記所望形状の
間において隣接する両前記外周線に至る線状の亀裂を形
成することを特徴とする脆性非金属材料加工方法。
2. A brittle non-metallic material processing method for continuously forming a crack extending from the surface to the inside in a plate-like brittle non-metallic material substrate, the method comprising: A method for processing a brittle nonmetallic material, comprising: forming a crack outer peripheral line having a shape; and forming a linear crack extending between adjacent adjacent outer peripheral lines between adjacent desired shapes.
【請求項3】 板状脆性非金属材料基板において、表面
から内部に至る亀裂を連続して形成する脆性非金属材料
加工方法であって、 前記基板において所望形状の亀裂外周線を形成すると共
に、 前記基板の外周から前記外周線に至る線状の亀裂を形成
することを特徴とする脆性非金属材料加工方法。
3. A brittle non-metallic material processing method for continuously forming a crack extending from the surface to the inside in a plate-like brittle non-metallic material substrate, wherein a crack-shaped peripheral line having a desired shape is formed on the substrate. A method for processing a brittle nonmetallic material, comprising forming a linear crack extending from the outer periphery of the substrate to the outer peripheral line.
【請求項4】 板状脆性非金属材料基板において、表面
から内部に至る亀裂を連続して形成する脆性非金属材料
加工方法であって、 隣接する所望形状の亀裂外周線を接して形成することを
特徴とする脆性非金属材料加工方法。
4. A brittle non-metallic material processing method for continuously forming a crack extending from a surface to an inside of a plate-shaped brittle non-metallic material substrate, wherein adjacent crack peripheral lines having a desired shape are formed in contact with each other. A method for processing a brittle nonmetallic material, comprising:
【請求項5】 前記基板の前記所望の形状内において、
太陽電池装置が形成されていることを特徴とする請求項
1、2、3又は4の脆性非金属材料加工方法。
5. Within the desired shape of the substrate,
5. The method for processing a brittle nonmetallic material according to claim 1, wherein a solar cell device is formed.
【請求項6】 前記脆性非金属材料基板がガラスである
ことを特徴とする請求項1、2、3又は4の脆性非金属
材料基板の加工方法。
6. The method for processing a brittle non-metallic material substrate according to claim 1, wherein the brittle non-metallic material substrate is glass.
【請求項7】 前記亀裂にて前記基板を分断することを
特徴とする請求項1、2、3又は4の脆性非金属材料基
板の加工方法。
7. The method for processing a brittle non-metallic material substrate according to claim 1, wherein the substrate is divided by the crack.
【請求項8】 前記所望形状が少なくとも曲線部分を有
することを特徴とする請求項1、2、3又は4の脆性非
金属材料基板の加工方法。
8. The method for processing a brittle nonmetallic material substrate according to claim 1, wherein the desired shape has at least a curved portion.
JP2000278938A 2000-09-13 2000-09-13 Method of machining brittle non-metallic material Pending JP2002087836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000278938A JP2002087836A (en) 2000-09-13 2000-09-13 Method of machining brittle non-metallic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000278938A JP2002087836A (en) 2000-09-13 2000-09-13 Method of machining brittle non-metallic material

Publications (1)

Publication Number Publication Date
JP2002087836A true JP2002087836A (en) 2002-03-27

Family

ID=18764023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000278938A Pending JP2002087836A (en) 2000-09-13 2000-09-13 Method of machining brittle non-metallic material

Country Status (1)

Country Link
JP (1) JP2002087836A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005113212A1 (en) * 2004-05-20 2005-12-01 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard cutting method, motherboard scribing apparatus, program and recording medium
WO2009084398A1 (en) * 2007-12-27 2009-07-09 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming cracks on substrate made of brittle material
US7785336B2 (en) 2006-08-01 2010-08-31 Abbott Medical Optics Inc. Vacuum sense control for phaco pulse shaping
US7842005B2 (en) 2002-10-21 2010-11-30 Abbott Medical Optics, Inc. System and method for pulsed ultrasonic power delivery employing cavitational effects
US7857783B2 (en) 1997-01-22 2010-12-28 Abbott Medical Optics Inc. Micro-burst ultrasonic power delivery
US7938120B2 (en) 2002-10-21 2011-05-10 Abbott Medical Optics, Inc. Enhanced microburst ultrasonic power delivery system and method
US8020565B2 (en) 2002-10-21 2011-09-20 Abbott Medical Optics, Inc. Modulated pulsed ultrasonic power delivery system and method
JP2012089712A (en) * 2010-10-20 2012-05-10 Mitsubishi Electric Corp Thin film solar cell and method for manufacturing the same
US8195286B2 (en) 1997-01-22 2012-06-05 Abbott Medical Optics Inc. Control of pulse duty cycle based upon footswitch displacement
CN103481381A (en) * 2012-06-12 2014-01-01 清华大学 Cutting method for fragile sheet structures
US9050627B2 (en) 2011-09-02 2015-06-09 Abbott Medical Optics Inc. Systems and methods for ultrasonic power measurement and control of phacoemulsification systems
EP3109208A1 (en) * 2015-06-22 2016-12-28 Flabeg France SAS Method for separating a glass substrate
US11877953B2 (en) 2019-12-26 2024-01-23 Johnson & Johnson Surgical Vision, Inc. Phacoemulsification apparatus

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8197436B2 (en) 1997-01-22 2012-06-12 Abbott Medical Optics Inc. Micro-burst ultrasonic power delivery
US9788998B2 (en) 1997-01-22 2017-10-17 Abbott Medical Optics Inc. Control of pulse duty cycle based upon footswitch displacement
US8195286B2 (en) 1997-01-22 2012-06-05 Abbott Medical Optics Inc. Control of pulse duty cycle based upon footswitch displacement
US8876747B2 (en) 1997-01-22 2014-11-04 Abbott Medical Optics Inc. Micro-burst ultrasonic power delivery
US7857783B2 (en) 1997-01-22 2010-12-28 Abbott Medical Optics Inc. Micro-burst ultrasonic power delivery
US10245179B2 (en) 2002-10-21 2019-04-02 Johnson & Johnson Surgical Vision, Inc. System and method for pulsed ultrasonic power delivery employing cavitation effects
US7938120B2 (en) 2002-10-21 2011-05-10 Abbott Medical Optics, Inc. Enhanced microburst ultrasonic power delivery system and method
US8020565B2 (en) 2002-10-21 2011-09-20 Abbott Medical Optics, Inc. Modulated pulsed ultrasonic power delivery system and method
US9642745B2 (en) 2002-10-21 2017-05-09 Abbott Medical Optics Inc. Modulated pulsed ultrasonic power delivery system and method
US10765557B2 (en) 2002-10-21 2020-09-08 Johnson & Johnson Surgical Vision, Inc. Modulated pulsed ultrasonic power delivery system and method
US7842005B2 (en) 2002-10-21 2010-11-30 Abbott Medical Optics, Inc. System and method for pulsed ultrasonic power delivery employing cavitational effects
US9707127B2 (en) 2002-10-21 2017-07-18 Abbott Medical Optics Inc. Modulated pulsed ultrasonic power delivery system and method
US8852138B2 (en) 2002-10-21 2014-10-07 Abbott Medical Optics Inc. Modulated pulsed ultrasound power delivery system and method
US8945162B2 (en) 2002-10-21 2015-02-03 Abbott Medical Optics Inc. System and method for pulsed ultrasonic power delivery employing cavitational effects
US8231564B2 (en) 2002-10-21 2012-07-31 Abbott Medical Optics Inc. Modulated pulsed ultrasonic power delivery system and method
US8887735B2 (en) 2002-10-21 2014-11-18 Abbott Medical Optics Inc. Modulated pulsed ultrasonic power delivery system and method
KR101181707B1 (en) 2004-05-20 2012-09-19 미쓰보시 다이야몬도 고교 가부시키가이샤 Motherboard cutting method, motherboard scribing apparatus, program and recording medium
WO2005113212A1 (en) * 2004-05-20 2005-12-01 Mitsuboshi Diamond Industrial Co., Ltd. Motherboard cutting method, motherboard scribing apparatus, program and recording medium
US8034067B2 (en) * 2006-08-01 2011-10-11 Abbott Medical Optics Inc. Vacuum sense control for phaco pulse shaping
US8366728B2 (en) 2006-08-01 2013-02-05 Abbott Medical Optics Inc. Vacuum sense control for phaco pulse shaping
US7785336B2 (en) 2006-08-01 2010-08-31 Abbott Medical Optics Inc. Vacuum sense control for phaco pulse shaping
US8202287B2 (en) 2006-08-01 2012-06-19 Abbott Medical Optics Inc. Vacuum sense control for phaco pulse shaping
US7998156B2 (en) 2006-08-01 2011-08-16 Abbott Medical Optics Inc. Vacuum sense control for phaco pulse shaping
US9226849B2 (en) 2006-08-01 2016-01-05 Abbott Medical Optics Inc. Vacuum sense control for phaco pulse shaping
KR101139306B1 (en) 2007-12-27 2012-04-26 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for forming cracks on substrate made of brittle material
WO2009084398A1 (en) * 2007-12-27 2009-07-09 Mitsuboshi Diamond Industrial Co., Ltd. Method for forming cracks on substrate made of brittle material
JP5055383B2 (en) * 2007-12-27 2012-10-24 三星ダイヤモンド工業株式会社 Method for forming a crack in a brittle material substrate
JP2012089712A (en) * 2010-10-20 2012-05-10 Mitsubishi Electric Corp Thin film solar cell and method for manufacturing the same
US9050627B2 (en) 2011-09-02 2015-06-09 Abbott Medical Optics Inc. Systems and methods for ultrasonic power measurement and control of phacoemulsification systems
CN103481381A (en) * 2012-06-12 2014-01-01 清华大学 Cutting method for fragile sheet structures
US8906783B2 (en) 2012-06-12 2014-12-09 Tsinghua University Method for cutting brittle sheet-shaped structure
TWI458617B (en) * 2012-06-12 2014-11-01 Hon Hai Prec Ind Co Ltd Method for cutting brittle sheet-shaped structure
EP3109208A1 (en) * 2015-06-22 2016-12-28 Flabeg France SAS Method for separating a glass substrate
US11877953B2 (en) 2019-12-26 2024-01-23 Johnson & Johnson Surgical Vision, Inc. Phacoemulsification apparatus

Similar Documents

Publication Publication Date Title
JP2002087836A (en) Method of machining brittle non-metallic material
EP1491309B1 (en) Parting method for fragile material substrate and parting device using the method
US4589194A (en) Ultrasonic scribing of thin film solar cells
JP2002094089A (en) Manufacturing method of compound thin-film solar cell
KR101721709B1 (en) Method for cutting processing target
WO2007074823A1 (en) Laser beam machining method and semiconductor chip
EP0134669A1 (en) Photoelectric conversion device and its manufacturing method
WO2006051861A1 (en) Laser processing method
WO2006101091A1 (en) Laser machining method
WO2006051866A1 (en) Laser beam machining method and semiconductor chip
WO2007004607A1 (en) Method for cutting workpiece
JPH0582993B2 (en)
JP4616441B2 (en) Solar cell manufacturing method
KR20120009405A (en) Method for dividing round planar plate formed of brittle material into a plurality of individual plates by using laser
JP2001127369A (en) Method of making for semiconductor laser element and cleaving device
JP4112202B2 (en) Method for manufacturing thin film solar cell
JP4720775B2 (en) Laminate processing method
JPS6156842A (en) Electrostatic attractive plate
JPH01215736A (en) Cutting of thin glass plate
JPS5994436A (en) Manufacture of semiconductor pellet
JPH0442949A (en) Semiconductor device with dicing slit
JP2000039959A (en) Device for inputting coordinate and manufacture of the same
JPS63127582A (en) Manufacture of amorphous silicon solar cell
JPS6286874A (en) Manufacture of solar battery
JPH01134976A (en) Manufacture of solar cell

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20051227

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060509

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060926

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070206