CN102060437B - Brittle material thermal stress cutting method based on large-area uneven temperature distribution and thermal stress cutting device - Google Patents
Brittle material thermal stress cutting method based on large-area uneven temperature distribution and thermal stress cutting device Download PDFInfo
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- CN102060437B CN102060437B CN2010105083322A CN201010508332A CN102060437B CN 102060437 B CN102060437 B CN 102060437B CN 2010105083322 A CN2010105083322 A CN 2010105083322A CN 201010508332 A CN201010508332 A CN 201010508332A CN 102060437 B CN102060437 B CN 102060437B
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Abstract
A brittle material thermal stress cutting method based on large-area uneven temperature distribution and a thermal stress cutting device which are provided in the invention can achieve no thermal damage resulted from material heating on a workpiece, realize a high cutting speed and high cutting position precision and be suitably applied for cutting solar battery glass slabs with a more or less 5-millimeter thickness. Static or moving low-temperature uneven heating temperature distribution is smoothly arranged as large as possible on the workpiece so as to lower the heating temperature for stress generation and prevent the workpiece from being thermally damaged. On the other hand, the heating temperature distribution is overlapped with concentrating static or moving heating energy in a relatively small area of a cutting position determination factor. Moreover, the position is set in a deviating way or the position is made under negative feedback control. The cutting position precision is improved by performing positive feedback control as required.
Description
Technical field
The present invention relates to a kind of hard brittle material particularly thermal stresses cutting method and the device of flat panel display glass and solar cell substrate glass.
Background technology
In glass cutting, used the thermal stresses patterning method based on laser radiation recently, to replace the mechanical means based on diamond head used in number century in the past always.
Can eliminate the intrinsic shortcoming of mechanical means according to the method, there are lower value etc. in pollution, applicable thickness of slab that the generation of the cullet when reduction, the cutting that produce the strength of glass that tiny crack causes causes.
Its result, do not need to carry out to grind, clean as the postorder operation of cut mechanically according to the thermal stresses patterning method, can obtain the minute surface of surfaceness below 1 μ m, and the product design dimensional precision is more than ± 25 μ m.Have again, can also be thinned to for sheet thickness the thickness of 0.1mm, can be on glass for flat panel display glass, solar cell substrate from now on.
The party's ratio juris is as described below.To glass irradiating laser locally, carry out can not cracking, the heating of the degree such as melting, gasification.Although now glass heats section will expand, because the retroaction from peripheral glass can not be expanded fully, and produce stress under compression with the point of irradiation center.At the non-heating region of periphery, also by the expansion from heating part, to be pressed and produce distortion with respect to periphery, its result produces stress under compression.Such stress under compression is the stress along radial direction.In the situation that there is stress under compression on object, on its orthogonal directions, produce by the relevant tensile stress of Poisson's ratio.Here this direction is tangential direction.This information slip is shown in Fig. 2.
This Fig. 2 is for meaning the radial direction stress components σ of Gaussian distribution when temperature rises centered by initial point
xwith tangential direction stress components σ
ysituation about changing according to place.The former is always stress under compression (in this Fig. 2 for negative value), and the latter is stress under compression at the heating central part, and is changed to tensile stress (this Fig. 2 on the occasion of) away from this center the time.Take the stress distribution shown in this Fig. 2 as basis, for general temperature distribution, also can be processed into the linear combination of this stress distribution.In this situation, on the each point on sheet glass, one fixes on orthogonal directions generation stress under compression and tensile stress.
Relevant with direct cutting in these stress is tensile stress.When this stress surpasses the destruction toughness value as the material proper value, produce and destroy and can not be controlled everywhere.In the situation that, as thermal stresses cutting of the present invention, because tensile stress is chosen to be this below value, thereby can not produce destruction.
But, in the situation that on the tensile stress location, be full of cracks is arranged, at its front end stress, enlarge, if this power exceeds the destruction toughness value of material, be full of cracks can enlarge.That is the cutting, produced as being controlled of processing.By the scan laser point of irradiation, can make be full of cracks extend.In this thermal stresses cutting, because the cleavage plane of cut surface and crystallization is similar, thereby can not produce tiny crack, cullet, can eliminate the shortcoming of above-mentioned mechanical means, there is very good characteristic as the working method of glass.
This thermal stresses is cut with two kinds of situations shown in Figure 14.Heated 2 and cooling 3 result shown in Figure 14 (a), only for example, at the upper layer (degree of depth 100 μ m) of workpiece 1, produced the situation of be full of cracks 4, be commonly referred to as surface scratch.5 mean the cut direction.
On the other hand, shown in Figure 14 (b) is the situation of be full of cracks that produces on the whole thickness of workpiece, is commonly referred to as full cutting.5 mean cut direction, and 6 mean the cutting preset lines.In the situation of the full cutting shown in this figure, do not carry out cooling.Obviously carry out the cooling formation to tensile stress favourable, but this is the method for cooling that involves in large quantities inside workpiece owing to can not find.Both respectively have relative merits.The former needs to cut off operation after cut, and this is maximum shortcoming.This operation is unwanted in the latter, reduces but exist in this latter's technology for the large-scale workpiece cutting speed in feet per minute, or reduce the shortcoming of the so-called size effect such as cutting position precision near workpiece end.
This technology of surface scratch to the glass irradiating laser is poured into energy by Kondratenko Vladimir S. and is developed, and has applied for the Japanese Patent of patent documentation 1.This patent has also been applied for Europe patent and the United States Patent (USP) of patent documentation 2 and patent documentation 3.This contriver has selected CO
2laser is as laser.
Equally, utilize CO
2laser carries out the technology of surface scratch, and application has based on beam splitter will justify the Japanese Patent of patent documentation 4 that symmetrical laser beam is converted to the technology of a plurality of beam point ranges of arranging on straight line.
For above surface scratch patent, wish to carry out the exploitation of the full cutting mode technology shown in Figure 14 (b) in order to remove above-mentioned shortcoming, and apply for the Japanese Patent of patent documentation 5 of technology of the irradiation semiconductor laser on glass of oriented rare earth doped dvielement.
Thermal stresses is cut into full cutting mode or terminates in surface scratch, be to terminate in the poor of surface phenomena or scale of construction phenomenon (laser based on non-patent literature 1) according to workpiece heating, only at upper layer, produce or spread all over the difference that the full depth of workpiece produces by thermal stresses and decide.As mentioned above, both respectively have relative merits, thereby use and get final product respectively according to purpose.This patent can be applicable to two technology simultaneously, and is the improvement patent that can further improve the performance of hard brittle material thermal stresses cutting.Particularly in surface scratch, it has done that technique improvement using can be that the used for solar batteries glass of 5mm left and right is as its object by the glass thickness of slab.
Patent documentation 1: コ Application De ラ テ Application コ V.S. (Kondratenko Vladimir S.), the method for dividing of brittle non-metallic material, No. 3027768th, Japan's patent
Patent documentation 2:Kondratenko Vladimir S., Method of splitting non-metallic materials, EP0633867B1
Patent documentation 3:Kondratenko Vladimir S., Method of splitting non-metallic materials, USP5609284
Patent documentation 4: originally exert oneself at temple, shut-off device, No. 3792639th, Japan's patent
5: three Pus of patent documentation are grand, the light rule husband of section, the cut-off method of hard brittle material and device, No. 4179314th, Japan's patent
Non-patent literature 1:Vladimir V.Fedorov et al.3.77-5.05 μ m Tunable Solid-State Lasers Based on Fe
2+-Doped ZnSe Crystals Operating at Low and Room Temperatures, IEEE Journal of Quantum Electronics, Vol.42, No.9, pp 906-917, September (2006).
Thermal stresses cutting based on laser radiation etc. is characterised in that comparing mechanical means is a kind of high-quality processing method.But this processing method also has shortcoming.Its first shortcoming is that to compare normal temperature be high temperature to the processing stand temperature.Mechanical means carries out at normal temperatures, more than the thermal stresses cutting must be heated to normal temperature correspondingly.Particularly, when large-scale workpiece is cut entirely, in order to increase cutting speed in feet per minute, need to increase thermal stresses.Need further to improve Heating temperature for this reason.On the other hand, because glass has sex change point temperature, melting point, while particularly on glass surface, film being arranged, in order to prevent that the workpiece damage from needing to reduce Heating temperature, this is maximum problem in the thermal stresses cutting.
Especially, the shortcoming as surface scratch can not be applicable in plate glass.Now, this technology is applied in the flat panel display glass cutting, and glass thickness of slab at this moment is generally 0.7mm.CO
2when glass surface is arrived in laser radiation, the upper layer that is 3.7 μ m by the degree of depth absorbs 99% projectile energy.Therefore, scratch depth is defined as 200 μ m left and right usually.When thickness of slab is 0.7mm, if there is the scratch depth of 200 μ m can carry out follow-up mechanical cutting., when but thickness of slab is the 5mm left and right, under this scratch depth, can not carry out mechanical cutting.Can not carry out the laser cutting of solar battery glass by present cut technology.
Summary of the invention
In order to address these problems, the workpiece heating not to be defined in to a bit on workpiece in the present invention, but to be distributed in large zone.So, can divide the thermal stresses in the each point generation of heating region by area in the heating all zones, significantly to increase the thermal stresses of generation.But, do not produce thermal stresses during workpiece all zones homogeneous heating.In order to remove the residual stress in workpiece, usually workpiece is put into to process furnace heats gradually or cooling processing gradually.In order to produce thermal stresses, need uneven temperature to distribute.This distribute to form on principle and both can realize by heating, also can be by cooling realization, but the method that in fact execution is heated is easier.And both and used time also produce effect.By the heating of this profile, the lesser temps that Heating temperature when we can accomplish that second, full cutting mode cut the large-scale non-alkali glass that thickness of slab is 0.7mm with cutting speed in feet per minute 300mm/ is 50 ℃.
The method produces effect to the Heating temperature that reduces processing stand.But because temperature distribution enlarges gently, and there is no the certainty factor of cutting position, so produce the shortcoming that precision reduces.For preventing this shortcoming, overlapping sharp-pointed peak use and get final product as the cutting position certainty factor in mild temperature distribution.But usually, temperature distribution is inconsistent with the stress distribution of using during interatomic bond separates.That in fact work piece cut is exerted an influence is the latter, and this not only depends on the one-piece construction that temperature distribution also depends on workpiece.Therefore, only make temperature distribution consistent with the cutting preset lines, can not realize higher cutting position precision.Can improve by the following method this precision: by theoretical or experiment, can under the situation of Accurate Prediction deviation between the two, use migration technology; This is predicted in comparatively difficult situation and passes through negative feedback control, or carries out as required positive regeeration control.
And, in order to solve the problem of slab, utilized in the present invention the Amplification phenomenon of be full of cracks front end.In the situation that the surface scratch that the degree of depth 200 μ m are arranged on glass of thickness of slab 5mm, be full of cracks can not be quickly up and down direction advance.But, after only near the zone of the restriction end of glass, to the thickness of slab direction, carrying out mechanical cutting, mechanical cutting is advanced along score line, carry out mechanical cutting on the total length of glass and get final product.Once mechanical cutting forms, just than being easier to, continue to cut off after this, but initial starting is more difficult.So need to make the degree of depth of cut to be set as almost approaching the numerical value of whole thickness of slab rather than 200 μ m in the zone of above-mentioned glass end.
According to the present invention, can realize the high quality that the thermal stresses cutting has, can also make Heating temperature fully be reduced to and not damage the lower value of glass self and lip-deep film, and can also fully improve positional precision.And, can make the object thickness of slab increase to the 5mm of solar battery glass or this is more than thickness.Glass cutting based on laser, although have a lot of technical advantages on processing quality, also could not replace over and use the mechanical system based on diamond head so far several centuries always.The present invention is for changing this situation.
The thermal stresses cutting of the glass of realizing by the present invention has advantages of following.
1) method of comparing in the past can significantly improve the speed of cutting.
2) do not need grinding after cutting, the postorder operation such as clean.
3) do not produce tiny crack near cut surface, the value of the strength of materials of workpiece is higher.
4) there is no adhering to of cullet on cut surface, become clean.
5) can cut plate glass.
6) the cutting position precision is high.
7) cut surface is fully vertical with respect to glass surface.
8) cut surface is minute surface, and surfaceness is good.
9) can use the selectivity cutting that realizes overlapping glass from the laser beam irradiation of a direction, and not need the operations such as reversion of sheet glass.
10) can realize the automatization of cutting.
The accompanying drawing explanation
Fig. 1 means the schematic diagram of the thermal stresses incision principle distributed based on large regional uneven temperature.
Fig. 2 be based on the Gaussian temperature distribution and thermal stress distribution figure.
Fig. 3 means the example distributed for generation of the large regional non-uniform heat flux under the lesser temps of thermal stresses.
Fig. 4 is illustrated in the stress intensity factor distribution plan produced in an example of large regional non-uniform heat flux distribution.
Fig. 5 means that the stress intensity factor of laser facula scanning distributes.
Stress intensity factor when Fig. 6 is illustrated in overlapping scan laser facula on large regional non-uniform heat flux distributes.
Fig. 7 means that Gaussian laser beam is converted to line beam by DOE.
The rotation of line beam direction when Fig. 8 means to carry out the thermal stresses cutting along profile is controlled.
Line beam length when Fig. 9 means to carry out the thermal stresses cutting along profile and the control of direction.
The cutting position of reality and the deviation between target location when Figure 10 means near thermal stresses cut workpiece side.
Figure 11 means the infrared rays light transmission rate of the non-alkali glass plate that thickness is 0.7mm.
Figure 12 is illustrated in the example of the very dark cut direction quadrature of full cut direction and the degree of depth in a large amount of cuttings of workpiece.
Figure 13 means the schematic diagram that the desirable scratch depth of the mechanical cutting that easily carries out plate glass distributes.
Figure 14 means surface scratch (a) while carrying out laser radiation on glass and the schematic diagram of full cutting (b).
Embodiment
Fig. 1 illustrates the schematic diagram of embodiments of the present invention.Basic structure as embodiments of the present invention, static or the mobile uneven temperature distribution that temperature in large zone on workpiece is lower than the thermal damage temperature of workpiece is overlapping with the static or mobile temperature distribution of being concentrated in the tiny area of cutting position certainty factor, only near this tiny area, makes the opening mode stress strength factor K
1value be greater than the destruction toughness value K of material
1cvalue, and set as required side-play amount on the temperature distribution of this cutting position certainty factor, perhaps carry out negative feedback control or according to circumstances carry out positive regeeration control, so that cutting position is consistent with target location, the thermal stresses cutting method of this hard brittle material is characterised in that, for forming the cutting position certainty factor, use line beam laser changed obtained by the diffraction grating type optical element.
The thermal stresses cutting unit of a kind of hard brittle material that embodiments of the present invention relate to, for realizing the thermal stresses cutting method of above-mentioned hard brittle material, static or the mobile uneven temperature distribution that temperature in large zone on workpiece is lower than the thermal damage temperature of workpiece is overlapping with the static or mobile temperature distribution of being concentrated in the tiny area of cutting position certainty factor, only near this tiny area, makes the opening mode stress strength factor K
1value be greater than the destruction toughness value K of material
1cvalue, and set as required side-play amount on the temperature distribution of this cutting position certainty factor, perhaps carry out negative feedback control or according to circumstances carry out positive regeeration control, so that cutting position is consistent with target location, the thermal stresses cutting unit of above-mentioned hard brittle material is characterised in that, for forming the cutting position certainty factor, there is light beam and produce mechanism, the line beam that output obtains laser changed by the diffraction grating type optical element.
If the brief description present embodiment, by the non-uniform heat flux temperature distribution of the static of mild distribution or mobile lower temperature is set in zone large as far as possible on workpiece, realize the reduction for generation of the Heating temperature of stress, and prevent the thermal damage of workpiece.On the other hand, overlapping heat energy on this Heating temperature distributes, this energy is concentrated and is static or mobile in the more small zone as the cutting position certainty factor, and this position of offset setting, perhaps carry out negative feedback control or carry out as required positive regeeration control, to improve the cutting position precision.When the uneven temperature for realizing required thermal stress distribution design distributes, can use linear elasticity to destroy the method for mechanics.Use laser as heating, can use by diffraction grating optics element and section shape is converted to the CO of line beam
2laser, can realize full cutting Er:YAG laser, can select to realize the wavelength variable Fe of full cutting or darker cut for the glass of various thicknesss of slab
+ 2: ZnSe laser.The cut-out of plate glass arranges to such an extent that fully deeply realize by the scratch depth that makes the glass end.
Present embodiment below more specifically is described, as mentioned above, although have advantages of that larger its Heating temperature in zone that heating region relates to is also lower, the cutting position precision also reduces but then.For preventing the problems referred to above, utilized as Fig. 1 11 as shown in temperature distribution, this temperature distribution is the sharp-pointed waveform 7 of overlapping crest on the crest line of the wide waveform of temperature distribution.In this case, sharp-pointed crest line position 7 becomes the cutting position certainty factor.As the integrated value that spreads all over large-scale heating region, heat stress value becomes greatly, low irrelevant with the height of crest, not reach cutting threshold also preferably only to set over the mode of this threshold value at sharp-pointed crest location.In the figure, to such an extent as to meaned that with 10 thermal stresses causes fully greatly the zone that interatomic bond separates.In this zone, use * meaned the state separated by interatomic bond between the adjacent atom of zero expression, wherein with line segment, mean interatomic bond.8 mean the cutting of full cutting mode, and 9 mean the be full of cracks front end.5 is cut direction.In this case, crest more sharply more can improve the cutting position precision.
Destroy mechanics according to linear elasticity, according near the characteristic of stress field be full of cracks front end on workpiece, produce cutting.Set the heat stress value except this characteristic, make it less than adjacent Binding Forces Between Atoms.Even the thermal stresses that produces under near characteristic condition be full of cracks, also can allow the value of value of workpiece deformation for the combination of initial separation atom by exceeding.The former mainly depends on Workpiece structure, and its value of large-scale workpiece is higher.The latter depends on the workpiece material constant, irrelevant with the workpiece shape.According to linear elasticity destructive force theory, as the physical quantity K that represents the latter
1(opening mode stress intensity factor) meets K
1>K
1c(K here
1cbe the destruction toughness value of material, be 0.73MPa/m in common glass
2) time, cutting is carried out with the development of be full of cracks front end.Select in the present invention only in required cutting position, to meet K
1>K
1ctemperature distribution get final product.In this case, design should make this condition realize at low temperatures as far as possible.Linear elasticity destructive force theory provides calculating K
1method, it is known method, here description thereof is omitted.
According to this embodiment, can obtain large regional non-uniform heat flux effect, reduce Heating temperature, and can avoid the thermal damage of workpiece.And, by overlapping cutting position certainty factor in the heating of large zone, can realize high cutting position precision.Its result, can obtain the intrinsic high quality cutting characteristic that the thermal stresses cutting has.
As the first embodiment, introduce first concrete Heating temperature distribution design example.This example to as if on the central part of the non-alkali glass plate of width 580mm, thickness of slab 0.7mm with the situation of the full cutting mode cutting of linearity.This situation is as full cutting mode, in large-scale workpiece inevitably because there is sizable difficulty in dimensional effect.As the mild waveform of Fig. 1, set and there is the Gaussian temperature distribution of the thermal spike of about 50 ℃ at glass width central part as shown in Figure 3.For specific implementation, on the position that the height on sheet glass is 200mm, used the electric power be arranged in parallel with glass length to be input as the column infrared lamp of 1kW.Figure 3 illustrates the glass surface temperature of electric power input after 3 minutes of measuring when carrying out cutting.Here, the reason that the rear wait of lighting a lamp starts cutting in 3 minutes again is that the part of light energy is absorbed by glass surface, and reaching inner by thermal conduction needs the regular hour to reach the required condition of full cutting mode.If infrared light is irradiated via the bandpass filter of 3-4 μ m, irradiate after light arrives inside glass and directly be absorbed, reach this condition and needed wait time not when lighting a lamp.
Fig. 4 illustrates the K of the glass width central authorities of calculating with finite element method for this temperature distribution
1the glass length direction of value distributes.Also show in the figure the K for non-alkali glass
1cvalue.K
1compare K
1clarge zone, for the zone till from the top section that cuts open of glass to 310mm, stops full cutting if surpass this point.Under the heating of this condition, from end to 310mm, automatically entirely cut and stop at the 310mm place cutting.
If the raising Heating temperature, the forward travel distance of full cutting increases, if reduce Heating temperature, distance reduces.No matter be what situation, at large width as shown in Figure 3, add and hanker obtaining high cutting position precision.Advantage under this condition is to make maximum heating temperature be reduced to 50 ℃.
For forming the cutting position certainty factor (overlapping heating) in the present invention, the light beam of the line beam that has used output by the diffraction grating type optical element, laser changed to be obtained produces mechanism.Use above-mentioned light beam to produce mechanism, produced following single laser facula: the absorbing laser of glass is output as 100W, and spot diameter is 3mm, and sweep velocity is 300mm/s.At first only pass through the finite element method calculating K for this LASER HEATING
1.Used the LD laser beam that wavelength is 976nm in actual experiment.Fig. 5 shows the K on the laser beam flying line
1the distribution of value calculation result on the glass length direction.Scanning laser beam position shown in this figure from the glass end start to arrive respectively 30,100,200,250,300,400, the K during position of 510mm
1distribute and temperature distribution.Hanker near the local K beyond the glass end in adding of only being undertaken by this laser
1lower than K
1c, do not produce cutting.
Purport of the present invention is to make the heating of infrared lamp and laser beam overlapping, and realizes that the Heating temperature shown in Fig. 1 distributes.Fig. 6 shows K when overlapping
1the distribution of value calculation result on the glass length direction.K under position same case in laser beam position shown in this figure and Fig. 5
1distribute and temperature distribution.Here, the K of each point
1value and temperature become Fig. 4 and Fig. 5 institute indicating value sum.For these physical quantitys, superposition theorem is set up.Its result, only need cut K on preset lines
1surpass K
1cget final product.K shown in Fig. 6
1value compares K near laser beam
1cgreatly, thereby cutting only proceeds to this position, and stops in this position.Stopping cutting is because exist and suppress stress under compression in laser beam position.
In situation about being heated by infrared lamp shown in Fig. 3, at K
1>K
1cscope in very high speed, cut.This is because the velocity of propagation of the thermal stress distribution in workpiece approaches the velocity of sound basically.In this situation, on cut surface, crack.In contrast, making in infrared lamp and the overlapping situation of laser beam heats shown in Fig. 6, as mentioned above because the cutting be full of cracks can not be crossed laser beam, so cutting speed in feet per minute is identical with laser beam flying speed.The method can maintain high cutting quality, therefore easily.
Shown here is following embodiment: the thermal stresses cutting heating of 50 ℃ of being up to based on the column infrared lamp, carry out the cutting of high quality thermal stresses with the speed of 300mm/s on the central part that overlapping scan type laser facula is 0.7mm, the width non-alkali glass plate that is 580mm at thickness of slab after irradiating in low-down low-temperature heat, can obtain the effect that any technology does not in the past all reach, prove high-performance of the present invention.
In the second structure example that Heating temperature shown in Fig. 7 distributes, light beam as the cutting position certainty factor produces mechanism, utilization, as the diffraction grating type optical element (DOE) 14 of line beam homogenizer, makes the Gaussian laser beam 13 penetrated from laser oscillator 12 be converted to line beam 15.Fig. 7 illustrates the schematic diagram that produces the situation of mechanism's output line beam by above-mentioned light beam.In figure, 15 mean to realize that by the laser beam after DOE design feature is line beam 16 in predetermined position.Other structures are with identical in the first embodiment.As this line beam 16, it is the line beam that 0.1～1mm, length are the 25mm left and right that the study plot use has width.The uniform strength that is distributed as of length direction distributes in this case, but the distribution of width can be both that to be uniformly distributed can be also Gaussian distribution.And, can carry out the adjustment such as incident laser beam diameter, position to intensity distribution and make its variation.
Compare the first embodiment, in the situation that the second embodiment cutting positional precision further increases, required Heating temperature further reduces, and in the situation of surface scratch, scratch depth further deepens.These are effects of this structure example.
Fig. 8 illustrates the 3rd structure example of the present invention.The light beam as the cutting position certainty factor shown in Fig. 8 produces mechanism, utilizes the diffraction grating type optical element (DOE) 14 as the line beam homogenizer, makes the Gaussian laser beam 13 penetrated from laser oscillator 12 be converted to line beam 15.In the situation that carry out the profile cut as free curve, need to make as the line beam 16 of cutting position certainty factor consistent with the tangent line of profile.Therefore need to be all the time the direction of line beam 16 be rotated to control.This control can be controlled 17 with the rotation of DOE14 and carry out.
In Fig. 8,1 is workpiece, and 6 is the cutting preset lines, and 21 is the point-like laser hot spot, and 22 is the short lines bundle, and 23 is long line beam, and 8 is full cutting mode cutting.19 mean the wedge type mask, and 20 mean the travel direction of wedge type mask 19.
As the effect of this structure, because the long axis direction of line beam is always consistent with skeletal lines, so can improve the cutting position precision, increase the thermal stresses produced, its result can improve cutting speed in feet per minute etc.
Fig. 9 illustrates the 4th structure example of the present invention.In the situation of cutting curve random bend, the direction of only controlling line beam is inadequate, needs shorten its length or according to circumstances be made as point-like.Such control can be used wedge type mask 19 to carry out when controlling the rotation of DOE, and this wedge type mask 19 rotates simultaneously and moves forward and backward with DOE.Mean that with 20 this seesaws in the drawings, the length that can control line beam 16 by this control becomes the required values such as point-like laser hot spot 21, short lines bundle 22, long line beam 23.Especially, shown in laser facula 21 is a some shaped laser spot, corresponding with the bending that cutting curve is acute angle.
As the effect of this structure, profilograph, with in or situation that bend with acute angle crooked than small curve, also can prevent the reduction of cutting position precision and the reduction of cutting speed in feet per minute.
The thermal stresses cutting occurs on the maximum thermal stress position for separating of interatomic bond, rather than is created on the top temperature position.We can be used as initial conditions and provide temperature distribution, rather than this thermal stress distribution.The latter is the distribution as a result of occurred according to conditions such as Workpiece structures.Cause-effect relationship is obviously arranged between the two, but usually be difficult to hold all the time this relation in actual production.According to the principle of the invention shown in Fig. 1, the actual thermal stresses cutting position produced is not to be limited near the some positions of this certainty factor, because this position is exactly not necessarily to cut target location, need to a kind of position control technology so control for high precision.
Deviation when between temperature distribution and this cutting generation position does not have in definite situation in theory, can be by originally side-play amount just being set on temperature distribution to realize high off-position precision in order to compensate this deviation.Figure 10 illustrates an example calculating this deviation also proved by experiment based on finite element method.The width of the workpiece shown here is that 500mm, length are that 1000mm, thickness are that 0.7mm and width are that 2000mm, length are in 2000mm, the thickness 2 kinds of non-alkali glass plates that are 0.7mm in the situation that the cutting position of the reality scanned in the longitudinal direction from the laser beam that is 1.5mm with diameter on side 20mm position.Near cutting beginning and terminal, produced the position deviation that is 0.7mm to the maximum, and it has the repeatability of height.In the situation that allow the position deviation of 0.7mm to carry out according to original method, but need position control in unallowed situation.As long as calculate and record under various conditions this departure with finite element method, just can set the side-play amount of thermal stress distribution, can realize high cutting position precision.This is the 5th structure example of the present invention.
According to this structure, can realize that heat answers the further high precision int of cutting position.Constant repeatedly in the operation repeatedly under condition in conditions such as workpiece shape, cutting positions, as long as allow positionerror, be 50 μ m left and right, just can use the method.This device does not need negative feedback control section, but the simplification device structure.
Embodiment 6
The negative feedback control of laser beam position is the 6th structure example of the present invention.Sometimes be difficult to set above-mentioned side-play amount at production plant, so detect actual cutting position with the cut watch-dog, carry out negative feedback control on the illuminating laser beam position corresponding with the cutting position certainty factor, or carry out as required positive regeeration control, to realize predetermined cutting position precision.This control can be realized by known control techniques.
Embodiment 7
With respect to the above cutting position high precision int based on laser beam position controller, can also control to realize the cutting position high precision int by the rectilinear beam rotation angle, this is the 7th structure example of the present invention.The party's ratio juris is as follows: the rotation angle by rectilinear beam is controlled, and can make K
11(inplane shear type stress intensity factor) becomes zero or very little value, at this moment can utilize the consistent fact in maximum temperature position and maximum thermal stress position.Calculate to have confirmed this fact by finite element method.At this moment also with laser beam position controller, similarly there is side-play amount setting and reverse feedback or positive regeeration and control 2 kinds of methods.But, because it is very complicated to calculate the method for migration amount, in actual production plant, uses and have any problem, so the method that reverse feedback or positive regeeration are controlled is more real.The method also can utilize known control techniques to realize.
Control according to above-mentioned 2 kinds of reverse feedbacks or positive regeeration, do not need to estimate in advance the departure between temperature distribution and cutting position, can realize by automated operation the high precision int of cutting position, there is immeasurable advantage in actual production.
Embodiment 8
Laser as heating use, can be used the laser beam that can be inhaled by glass.Representational laser is the CO that wavelength is 10.6 μ m
2laser.This laser easily obtains high Output of laser as commercial lasers, therefore easily.This laser to be characterized as the uptake factor absorbed by glass very large, to such an extent as to be absorbed 99% projectile energy in the upper layer of the degree of depth 3.7 μ m, can not carry out the scale of construction (Bulk) heating to glass.Therefore be applicable to surface scratch, but can not use in full cutting mode.
The infrared light that Figure 11 illustrates the non-alkali glass plate that thickness is 0.7mm sees through characteristic (%).The laser beam of using as full cutting mode, ideal situation is absorbed about 50% by sheet glass, therefore can use the laser beam of wavelength region in 2.75～4.5 μ m scopes of oscillation wavelength.In the situation that the larger use of thickness of slab minimal wave length to be 2.5 μ m, thickness of slab less that to use long wavelength be that oscillation wavelength in 5 μ m scopes gets final product.Therefore, the laser of using as full cutting mode can be used Er:YAG laser (2.94 μ m).
By using wavelength region at 3.77～5.05 μ m and wavelength variable mid-infrared laser, can obtain desirable effect.This laser is the ZnSe crystal laser of the doping divalent iron ion that excites with disc type laser device, optical fiber laser.Nearly 50% oscillation efficiency nearly, can also high output.In non-patent literature 1, report has this laser technology.
Now, the thickness of slab of flat panel display glass has the trend reduced gradually to 0.1mm from current value 0.7mm.The condition that can absorb 99% incident light energy in described thickness of slab is, according to relational expression I/I
0=e
-α x, the value of absorption coefficient is at 65～230cm
-1scope in.Corresponding and wavelength region that determined by the absorption characteristic of non-alkali glass is fully in the wavelength resonances scope of above-mentioned this laser with it.Thereby, even the glass thickness of slab changes, also can make most luminous energy arrive the back side of sheet glass by this wavelength resonances, and can not connect sheet glass, can make scratch depth become the value that approaches the glass thickness of slab.Proved the following fact: the intersection processing at the crossing place formed between full cutting mode is difficult, but residually overleaf can intersect processing when some non-incised layer are arranged.Figure 12 illustrates this situation.Carry out the initial laser penetration based on wavelength resonances on sheet glass 1, generation does not arrive the very dark cut 24,241,242,243 at the back side etc.Then carry out wavelength resonances on shorter wavelength direction, make laser see through sheet glass fully, realize full cutting 25,251,252 on the direction with above-mentioned cut quadrature.Because does not also separate at the back side, therefore can proceed full cutting in the point of crossing of two lines.Wherein, omitted the first be full of cracks be located on glass plate ends in this explanation.
Carry out mechanical cutting along dark score line after this operation.Because scratch depth is fully dark, this cut-out is easy to carry out.In this operation, for each sheet around that does not make entirely to be cut, spatter, in necessary operation, to be fixed on workpiece on electrostatic attraction board 26.The structure of this adsorption plate be for can independently control the voltage that applies in each position, and removes absorption in desired position and the required moment.
According to this structure, can realize full cutting for the glass of various thicknesss of slab, can also realize not arriving the very dark cut of full cutting degree.This technology can realize cross cut when being reported to the leadship after accomplishing a task cutting by thermal stresses cutting, exceedingly useful on practical use.
Embodiment 9
Can use the full cutting mode cutting solar battery glass shown in Figure 14 (b) in technology of the present invention, but also can cut with the surface scratch shown in Figure 14 (a), below be described.There is shown and make it become the variation of the possible degree of depth of the surface scratch in the score line direction in the signal of Figure 13.This figure is the situation of the thickness of slab alkali glass that is 5mm, and this is the thickness of common solar battery glass., corresponding to glass thickness of slab and the surface scratch degree of depth, be vertically laterally the cut direction.As shown in the figure from the cut starting point of glass end in length (be 10mm～20mm left and right the proof experiment the contriver) scope, scratch depth is about 3～4mm, slowly is reduced to as shown in figure 13 thereafter normal scratch depth 200 μ m.Be 30～53mm/s in the situation that irradiating laser is output as the 70W laser scanning speed, but, in order in the glass end, to obtain dark cut, produce effect just will drop to the low speed of 20mm/s.
In the situation that scratch depth is this distribution, on this deep, behind localized area, just easily on whole thickness of slab, carry out mechanical cutting.Even it is shallow to 200 μ m to have surpassed this zone scratch depth, as long as carry out the cut-out of whole thickness, just can easily make mechanical cutting slowly advance along the cut direction.So, can make to become the thickness shown in Figure 13 along the scratch depth of score line, and make the slab of 5mm left and right carry out mechanical cutting on total length.
The generation method distributed as the cut shown in Figure 13, reduce the method explanation in front of laser beam flying speed in order to increase scratch depth.Utilize Fig. 6 to illustrate that thermal stresses produces in mechanism here darker than the position beyond end in glass end scratch depth.Fig. 6 is illustrated in the stress strength factor K produced on sheet glass
1changing conditions, the direction of this variation is the laser beam flying direction of the glass heats that causes for the laser beam irradiation under certain condition.Laser beam flying is carried out continuously, but the stress intensity factor when showing this light beam simultaneously arriving at 7 in Fig. 6 distributes and the Heating temperature distribution.Only be concerned about the variation that the stress intensity factor of direct relation is arranged with scratch depth here.Stress intensity factor distribution during 3 positions that to observe laser beam position from Fig. 6 be 10mm, 30mm, 100mm from the distance of end, can know no matter be that situation, this coefficient is got higher value near the glass end.The increase of this stress distribution has directly related with the increase of scratch depth.Fig. 6 is the data under certain heating condition, and trend shown here is general situation.
Embodiment is described so from now on.The invention belongs to the surface scratch shown in Figure 14 (a).Thereby spotting scaming has based on CO on glass surface
2the heating of laser radiation and after it spotting scaming the cooling body based on the cooling fluid spraying is arranged.And, be provided with just be full of cracks starting to form on the glass end of cut.Such know-why and method are now known.
Shown in Figure 14 (a), the situation that the laser section shape is roundlet is arranged, in the situation that cut is linearity or will deepens this degree of depth, take and get final product as the laser that the purpose Usage profile is shaped as line beam heat-up time of extending glass.Due to the laser penetrated from laser oscillator normally section shape be circular Gaussian beam, so the conversion section shape has been described in the method shown in Fig. 7, Fig. 8, Fig. 9.
Carry out mechanical cutting according to above-mentioned explanation along score line after such operation.
Described above is for realizing several embodiment of function of the present invention, obvious purport of the present invention can realize by other a variety of methods.
So, if the thermal stresses of glass cutting is imported to the manufacturing processed of flat-panel monitor, solar cell, when improving process velocity, processing quality, economic benefits and overcome the weakness of prior art, its effect is very significant.These processing are to carry out with diamond custting machine now, to such an extent as to but presented such as because producing after cullet cuts, needing to carry out cleaning process or due to degradation problem under the existence strength of materials of tiny crack.Can solve such problem based on thermal stresses cutting of the present invention.And, because Heating temperature is fully low, on the film forming that can not arrange, cause thermal damage on glass substrate, its surface.Also because the precision of thermal stresses cutting position is fully high, and can make heat-affected zone fully be confined in the cut width range, therefore technology of the present invention not only can also be for the processing of battery for the processing of base plate glass.
Claims (5)
1. the thermal stresses cutting method of a hard brittle material, is characterized in that,
Using temperature in the large zone on workpiece, the uneven temperature lower than the thermal damage temperature of workpiece distributes overlapping with temperature distribution concentrated in the tiny area of cutting position certainty factor, only near this tiny area, make can allow the opening mode stress strength factor K of value of workpiece deformation as exceeding
1value be greater than the destruction toughness value K as the value that makes Materials be full of cracks
1cvalue, and set as required side-play amount on the temperature distribution of this cutting position certainty factor, or carry out negative feedback control or according to circumstances carry out positive regeeration control so that cutting position is consistent with target location,
By the irradiation of the line beam that laser changed obtained by the diffraction grating type optical element, form the temperature distribution of cutting position certainty factor,
When above-mentioned overlapping temperature distribution is moved along cut direction, what by said temperature, distribute is overlapping, makes the speed of above-mentioned thermal stresses cutting identical with the sweep velocity of above-mentioned laser, and carries out above-mentioned thermal stresses cutting.
2. the thermal stresses cutting method of hard brittle material according to claim 1, is characterized in that,
According to the shape of the cutting profile of cutting position, control the direction of above-mentioned line beam by the rotation of controlling the diffraction grating type optical element, or use mask to control the length of above-mentioned line beam when controlling the rotation of diffraction grating type optical element.
3. the thermal stresses cutting method of hard brittle material according to claim 1, is characterized in that,
For fixation workpiece, use can opsition dependent be switched respectively and is executed alive electrostatic attraction board.
4. the thermal stresses cutting method of hard brittle material according to claim 1, is characterized in that,
Make cooling unit synchronized movement after mobile laser beam, near and the translational speed cut starting point of reduction glass end, thereby the increase scratch depth, become easily the mechanical cutting of this regional postorder operation, and advanced in this cut-out other zones shallow to scratch depth that start.
5. the thermal stresses cutting unit of a hard brittle material, is characterized in that,
Using temperature in the large zone on workpiece, the uneven temperature lower than the thermal damage temperature of workpiece distributes overlapping with temperature distribution concentrated in the tiny area of cutting position certainty factor, only near this tiny area, make can allow the opening mode stress strength factor K of value of workpiece deformation as exceeding
1value be greater than the destruction toughness value K as the value that makes Materials be full of cracks
1cvalue, and set as required side-play amount on the temperature distribution of this cutting position certainty factor, or carry out negative feedback control or according to circumstances carry out positive regeeration control so that cutting position is consistent with target location,
For forming the cutting position certainty factor, there is light beam and produce mechanism, the line beam that output obtains laser changed by the diffraction grating type optical element;
When above-mentioned overlapping temperature distribution is moved along cut direction, what by said temperature, distribute is overlapping, makes the speed of above-mentioned thermal stresses cutting identical with the sweep velocity of above-mentioned laser, and carries out the thermal stresses cutting.
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| JP2009-232125 | 2009-10-06 | ||
| JP2009232125A JP2011079690A (en) | 2009-10-06 | 2009-10-06 | Laser thermal stress dividing of thick plate glass using diffraction grating |
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