CN1541155A - Method and device for scribing brittle material substrate - Google Patents

Method and device for scribing brittle material substrate Download PDF

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Publication number
CN1541155A
CN1541155A CNA028157028A CN02815702A CN1541155A CN 1541155 A CN1541155 A CN 1541155A CN A028157028 A CNA028157028 A CN A028157028A CN 02815702 A CN02815702 A CN 02815702A CN 1541155 A CN1541155 A CN 1541155A
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China
Prior art keywords
mentioned
laser facula
brittle substrate
along
preset lines
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Granted
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CNA028157028A
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Chinese (zh)
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CN1242458C (en
Inventor
若山治雄
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN1541155A publication Critical patent/CN1541155A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

A method for scribing a brittle material substrate, comprising the steps of radiating laser beam transmitted from a laser transmitter (34) on the surface of a mother glass substrate (50) along a predicted scribing line to form a laser spot on the mother glass substrate (50), spraying coolant on an area close to the laser spot from a cooling nozzle (37) to form a large stress gradient between the end part of the laser spot close to the area in which coolant is sprayed and the area in which the coolant is sprayed since the laser spot has the maximum intensity of thermal energy only at the end part thereof, whereby cracks are surely formed on the mother glass substrate (50) along the vertical direction thereof and a scribing line can be surely and efficiently formed on the mother glass substrate.

Description

The scribble method of brittle substrate and chalker
Technical field
The present invention relates to scribble method and chalker, it is used to cut apart the glass substrate that is used in flat-panel screens (hereinafter to be referred as FPD), and the brittle substrate of semiconductor wafer etc., and forms line on the surface of brittle substrate.
Background technology
The example that the following describes is, forms line on female glass substrate of LCD panel, and above-mentioned LCD panel is to form by fitting as a kind of glass substrate of brittle substrate.
By the fit FPD of the LCD panel that forms etc. of a pair of glass substrate, be after a pair of large-sized female glass substrate is fitted each other, again each female glass substrate is divided into the size of the glass substrate of formation FPD.Each female glass substrate is to form line by adamantine cutter (カ ッ ), along this line it is cut apart again.
If be mechanically formed line, then will form the state of stress accumulation at formed line peripheral part by cutter.And if cut apart female glass substrate along line, then lateral edges end and the periphery thereof on divided glass baseplate surface can accumulate the place owing to stress accumulation produces stress.Accumulate the place at such stress, will put aside the latent stress that can make the crack expansion near the glass baseplate surface,, then might cause producing the breach of crack and edge part if accumulating the stress of accumulating in the place at this stress is released.And the fragment that produces owing to the edge part breach will have a strong impact on the FPD that is produced.
In recent years, use laser beam to be applied in the practice gradually in the method that the surface of female glass substrate forms line.Use laser beam on female glass substrate, to form the method for ruling, as shown in Figure 4, to the laser beam of female glass substrate 50 irradiations from laser oscillation apparatus 61.From laser oscillation apparatus 60 emitted laser bundles,, on the surface of female glass substrate 50, form oval-shaped laser facula LS along the cut preset lines SL that on female glass substrate 50, forms.Female glass substrate 50 and can relatively move along the longitudinally of laser facula LS from the laser beam that laser oscillation apparatus 61 is launched.
Female glass substrate 50 is because laser beam, and is heated to than the low temperature of temperature that makes female glass substrate 50 fusings.Thus, the surface of the female glass substrate 50 that is shone by laser facula LS is heated to the temperature that can not be melted.
And, around the irradiation area of female glass substrate 50 lip-deep laser beams, as forming line like that, spray the cooling medium of cooling fluids etc. from cooling jet 62.On the surface of the female glass substrate 50 that is shone by laser beam,, when producing compression stress, go back spraying, and produce tensile stress owing to cooling medium by the heating of laser beam.Like this, owing near near the zone that produces compression stress, produce tensile stress, therefore between two zones, generation is based on the stress gradient of each stress, on female glass substrate 50, produce vertical crack along cut preset lines SL from being pre-formed in the entry TR of female glass substrate 50 ends.
Like this,, with the naked eye can't see usually, therefore be called as dark crackle (Block ラ イ Application De Network ラ Star Network) because formed vertical crack is very little on the surface of female glass substrate 50.
Fig. 5 is the schematic perspective view that is illustrated in the formation state of the dark crackle on female glass substrate 50 of being rule by laser scribe apparatus.Fig. 6 is the floor map of the physical change state on the above-mentioned female glass substrate 50 of expression.
Laser beam from laser oscillation apparatus 61 vibrated and sends forms oval-shaped laser facula LS on the surface of female glass substrate 50.Laser facula LS for example is that major diameter b is 30.0mm, and minor axis a is the ellipse of 1.0mm, and its major axis and cut preset lines SL match.
In this case, be formed at the laser facula LS on female glass substrate 50, the heat energy intensity of its outer peripheral portion (Hot エ ネ Le ギ one intensity) is than the heat energy intensity height of central portion.Such laser facula LS forms by following manner, that is, the heat energy intensity that heat energy intensity is the laser beam of Gauss (ガ ウ ス) distribution forms, and is the highest heat energy intensity in each end of y direction.Therefore, in each end that is positioned at the y direction on the cut preset lines SL, it is the highest that heat energy intensity is respectively, the heat energy intensity of the middle body of folded laser facula LS between each end, and all the heat energy intensity than each end is low.
Female glass substrate 50 can relatively move along the y direction of laser facula LS, therefore, female glass substrate 50, along cut preset lines SL by the heating of the high heat energy intensity on the end of laser facula LS one side after, by the low heat energy intensity heating of laser facula LS middle body, then by high heat energy intensity heating.And, after this from laser facula LS rear end, for example, y direction at interval L be on the cooling point CP in the line of 2.5mm, from cooling jet 62 injection cooling fluids.
Thus, produce thermograde between laser facula LS and the cooling point CP, and in zone, produce big tensile stress with respect to a cooling point CP and an opposite side with laser facula LS.And, utilize this tensile stress, will on the thickness t direction of female glass substrate 50, form vertical crack from the formed entry TR in the end of female glass substrate 50 along the cut preset lines.
Female glass substrate 50 is heated by oval-shaped laser facula LS.In this case, female glass substrate 50, by being positioned at the high heat energy intensity of laser facula LS one side end, heat is handed on to inside along vertical direction from its surface, relatively move with respect to female glass substrate 50 by laser facula LS, just can make by the part of laser facula LS front end heating, be positioned at after the low heat energy intensity heating of laser facula LS central portion, be positioned at the high heat energy intensity heating of laser facula LS rearward end once more.
Like this, the surface of female glass substrate 50, after high heat energy intensity heating, by low heat energy intensity heating, during this period, its heat fully is passed to inside again.And, at this moment, can prevent that the surface of female glass substrate 50 from continuing to be heated by high heat energy intensity, can prevent the surface melting of female glass substrate 50.Then, if by high heat energy intensity female glass substrate 50 is heated once more, then, produce compression stress in the surface and the inside of female glass substrate 50 until the inside of female glass substrate 50 is all fully heated.And near the cooling point CP the zone of the such compression stress of generation produces tensile stress owing to spraying cooling fluid.
If coming area heated to produce compression stress by laser facula LS, produce tensile stress at cooling point CP by the cooling fluid cooling, then because the compression stress that is produced on the thermal diffusion zone between laser facula LS and the cooling point CP will produce bigger tensile stress in the zone with respect to the opposite side with laser facula LS of cooling point CP.And, utilize this tensile stress, will produce dark crackle along the cut preset lines from being formed at the entry TR of female glass substrate 50 ends.
If on female glass substrate 50, form dark crackle as line, then female glass substrate 50 is provided to next segmentation process, on female glass substrate 50, can be applied in power, this power can be in the both sides of dark crackle, and generation can make dark crackle expand the moment of flexure of opening.Thus, female glass substrate 50 will be separated along the dark crackle that forms along cut preset lines SL.
In such chalker, the surperficial formed laser facula LS of female glass substrate 50 can form following heat energy intensity distribution, that is, and and in the heat energy intensity maximum of y direction.Like this, because heat energy intensity is maximum in each end of the longitudinal axis, the absolute value that then is positioned at the heat energy intensity of each end will diminish relatively.Therefore, if accelerate the relative moving speed of laser facula LS and female glass substrate 50, near though the rearward end of the laser facula LS the cooling point CP, become maximum heat energy intensity, but female glass substrate 50 also possibly can't fully be heated, and and cooling point CP between can not obtain sufficient stress gradient yet.
In this case, the relative moving speed of just must slow down female glass substrate 50 and laser facula LS, thus prolonging heat time heating time by laser facula LS end, the result just may not can form dark crackle efficiently.
Summary of the invention
To the present invention seeks in order addressing the above problem, a kind of scribble method and chalker of brittle substrate to be provided, it can efficiently and effectively form line on the fragile material pole plate of female glass substrate etc.
The scribble method of brittle substrate of the present invention is, along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, so that form laser facula with temperature lower than above-mentioned brittle substrate softening point, and by along the cut preset lines and following this laser facula and make near this laser facula zone cooling continuously, and formation is along the crackle of cut preset lines, it is characterized in that, above-mentioned laser facula only has maximum heat energy intensity in the end near zone one side that is cooled.
Its feature is that also above-mentioned cooled region extends along above-mentioned cut preset lines.
Its feature also is, with respect to above-mentioned cooled region, an opposite side with above-mentioned laser facula, near the zone of above-mentioned cooled region, as along above-mentioned cut preset lines and following above-mentioned cooled region and the 2nd heating region that heated continuously increases.
Its feature is that also above-mentioned the 2nd heating region is heated by the laser facula that is formed by laser beam.
Its feature also is, the laser facula of above-mentioned the 2nd heating region has maximum heat energy intensity in the end near the zone that is cooled.
Its feature also is, the laser facula of above-mentioned the 2nd heating region is that this brittle substrate is carried out annealing in process.
The scribble method of brittle substrate of the present invention is, along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, so that form laser facula with temperature lower than above-mentioned brittle substrate softening point, by following this laser facula and cooling off continuously near the zone of this laser facula along the cut preset lines, and formation is along the crackle of cut preset lines, it is characterized in that, the Temperature Distribution of the brittle substrate that is heated by above-mentioned laser facula is only to have maximum temperature in the end near cooled region one side.
Its feature is that also above-mentioned cooled region extends along above-mentioned cut preset lines.
Its feature also is, with respect to above-mentioned cooled region, an opposite side with above-mentioned laser facula, near the zone of above-mentioned cooled region, as along above-mentioned cut preset lines and follow the 2nd heating region that above-mentioned cooled region heated continuously and add
Its feature also is, above-mentioned the 2nd heating region has maximum temperature in the end near the zone that is cooled.
Its feature also is, the laser facula of above-mentioned the 2nd heating region has maximum heat energy intensity in the end near the zone that is cooled.
The chalker of fragile material of the present invention, it can form crackle along the cut preset lines that is positioned at the brittle substrate surface, it is characterized in that having: the mechanism of Continuous irradiation laser beam, so that form laser facula with temperature lower than above-mentioned brittle substrate softening point; And cooling body, it can make by near the zone the above-mentioned laser facula institute area heated, is cooled off continuously along the cut preset lines, and above-mentioned laser facula only has maximum heat energy intensity in the end near the zone that is cooled.
The chalker of fragile material of the present invention, it can form crackle along the cut preset lines that is positioned at the brittle substrate surface, it is characterized in that, have: the mechanism of Continuous irradiation laser beam, so that form the 1st laser facula and the 2nd laser facula with temperature lower than above-mentioned brittle substrate softening point; And cooling body, it can be along the cut preset lines, and cooling is by near the zone above-mentioned the 1st laser facula area heated continuously, and above-mentioned the 1st laser facula and the 2nd laser facula only have maximum heat energy intensity in the end near the zone that is cooled.
Description of drawings
Fig. 1 (a) is the floor map that expression scribble method of the present invention is implemented state, and the heat energy intensity of each laser facula that is to use this method of Fig. 1 (b) expression distributes.
Fig. 2 is the front view of an example of expression chalker embodiment of the present invention.
Fig. 3 is the brief configuration figure that expression is used for an example of the laser oscillation apparatus of chalker of the present invention and optical system.
Fig. 4 is the schematic diagram that is used to illustrate the chalker action of using laser beam.
Fig. 5 is the schematic perspective view of the formation state of the dark crackle on female glass substrate of representing to be rule by laser scribe apparatus.
Fig. 6 is the floor map of the physical change state on female glass substrate of representing to be rule by laser scribe apparatus.
The specific embodiment
Below, embodiments of the present invention are described with reference to the accompanying drawings.
Fig. 1 (a) is the floor map that expression scribble method of the present invention is implemented female glass baseplate surface of state.The enforcement purpose of this scribble method is, for example, forms a plurality of glass substrates of the FPD that constitutes LCD panel etc. and when cutting apart large-area female glass substrate, before cutting apart female glass substrate, forms the dark crackle as line on female glass substrate.
Shown in Fig. 1 (a),,, and form the 1st laser facula LS1 along the irradiation of cut preset lines SL by laser beam on the surface of female glass substrate.And the end at female glass substrate of the extended line of the cut preset lines SL that is positioned at female glass baseplate surface is formed with along the entry of above-mentioned cut preset lines.
The 1st laser facula LS1 is that for example major diameter is 30.0mm, and minor axis is the ellipse of 1.0mm, and forms the state of its major diameter along cut preset lines SL that make, and with respect to the surface of female glass substrate, does relative motion in the direction shown in the arrow A.
In this case, be distributed as along heat energy intensity at the long axis direction of formed the 1st laser facula LS1 of female glass baseplate surface, shown in Fig. 1 (b), though increase slowly to rearward end from leading section with respect to the direction of advance of female glass substrate, but this intensity energy level (level) is less, in the rearward end of direction of advance, its intensity energy level increases sharply, and only portion just has maximum heat energy intensity in its back-end.Oval-shaped the 1st laser facula LS1 moves along the cut preset lines SL that is positioned at female glass baseplate surface, and cut preset lines SL is heated in turn.
The temperature of the 1st laser facula LS1 is lower than the temperature that can make female glass substrate fusing, and in female relatively glass substrate high-speed motion, heats female glass substrate.Thus, the surface of the female glass substrate that is shone by laser facula LS1 is heated under the state that is not melted.
Be formed with rectangular cooling point CA on the surface of female glass substrate, it is at the rear of the direction of advance of the 1st laser facula LS1, and is close with the 1st laser facula LS1, and extends along cut preset lines SL.A cooling point CA is by with cooling fluid, He gas, N 2Gas, CO 2The cooling medium of gas etc., the surface that is ejected into female glass substrate from cooling jet forms, and,, move along the cut preset lines of female glass baseplate surface with same speed with respect on female glass substrate and the equidirectional the 1st laser facula LS1.
On the surface of female glass substrate, be formed with oval-shaped the 2nd laser facula LS2, it is positioned at the rear of cooling point CA direction of advance, and a close cooling point CA, and extends along the cut preset lines.The 2nd laser facula LS2 is for example identical with the 1st laser facula LS1, be that major diameter is 30.0mm, minor axis is the ellipse of 1.0mm, and form the state of its major diameter that make along cut preset lines SL, and with respect to the surface of female glass substrate, on the direction identical with cooling point CA, move with identical speed with the 1st laser facula LS1.
At this moment, distribute along heat energy intensity at the y direction of surperficial formed the 2nd laser facula LS2 of female glass substrate, shown in Fig. 1 (b), be distributed symmetrically with the heat energy intensity of the 1st laser facula LS1, only at leading section with respect to the direction of advance of female glass substrate, have maximum heat energy intensity, play rearward end, reduce lentamente with less heat energy intensity energy level from part with maximum heat energy intensity energy level.
The temperature of the 2nd laser facula LS2 is also low than the temperature that can make female glass substrate fusing, and in female relatively glass substrate high-speed motion, heats female glass substrate.
After the surface of female glass substrate is heated along cut preset lines SL in turn by the 1st laser facula LS1, again this heating part is cooled off in turn by cooling point CA, and then this cooling segment is heated in turn by the 2nd laser facula LS2.
At this moment, the 1st laser facula LS1 only in the rearward end with respect to the direction of advance of female glass baseplate surface, has maximum heat energy intensity, on the surface of female glass substrate by after the slow heating, in this rearward end by heat intensive.And, will be by the part of the rearward end heat intensive of the 1st laser facula LS1, CA cools off by the cooling point.
Like this, the maximum heat energy intensity that is had by the 1st laser facula LS1 rearward end heats, and produces compression stress, if cooled off by a cooling point CA, then can produce tensile stress again.At this moment, the absolute value of the heat energy intensity of the 1st laser facula LS1 rearward end is bigger, can produce bigger compression stress, and therefore, and the stress gradient between the cooling point tensile stress that CP produced also can increase.
Like this, increase, just can shorten the heat time heating time of cut preset lines SL, thus, can improve the relative moving speed of the 1st laser facula LS1 and female glass substrate by the heat energy intensity absolute value that rearward end had that makes the 1st laser facula LS1.As a result, the distance between the 1st laser facula LS1 and the cooling point CA can be shortened, the stress gradient between the 1st laser facula LS1 and the cooling point CP can also be increased thus.
Thus, by between the 1st laser facula LS1 and cooling point CA, producing bigger stress gradient, just can on female glass substrate, form the dark crackle of vertical direction really along cut preset lines SL.And, owing to improved the relative moving speed of the 1st laser facula LS1 and female glass substrate, just can form dark crackle efficiently.
Like this, if form vertical crack along cut preset lines SL, the zone that then is formed with dark crackle is heated once more by the 2nd laser facula LS2.Thus, produce the zone of tensile stress and owing to the heating of the 2nd laser facula LS2 produces between the zone of compression stress in cooling owing to cooling point CA, produce stress gradient, because this stress gradient makes the vertical crack that is formed on female glass substrate further deepen along vertical direction.
In this case, owing to cool off some CA along the long formation of cut preset lines SL quilt, so can be sufficiently cooled by the 1st laser facula LS1 area heated.At formed the 2nd laser facula LS2 in a CA cooled zones rear that is cooled, only has maximum heat energy intensity at leading section near cooling point CA, therefore, the absolute value of the heat energy intensity of this leading section increases, and will produce bigger stress gradient between the cooling point CA.Therefore, along the formed vertical crack of cut preset lines SL, further deepen to the back side of female glass substrate.
And the 2nd laser facula LS2 only has maximum heat energy intensity at leading section, thereafter, will be heated by less heat energy intensity.Therefore, the tissue that is formed with the neighboring area of vertical crack changes owing to being carried out annealing, therefore can slow down the stress that remains on female glass substrate.
Fig. 2 is the structural representation of the chalker embodiment of expression brittle base material of the present invention.Chalker of the present invention is used for, and for example, large-sized female glass substrate is divided into the line of a plurality of glass substrates that are used for FPD.As shown in Figure 2, this chalker has sliding stand 12, and it can move back and forth in the predetermined horizontal direction (Y direction) in pallet 11 upper edges of level.
Sliding stand 12 is supported on, and on the pair of guide rails 14,15 that be arranged in parallel along the Y direction on pallet 11, and can slide by each guide rail 14,15 in the level lower edge.The pars intermedia of two guide rails 14,15 is provided with the ball-screw 13 parallel with each guide rail 14,15, and can rotate down in the drive of motor (figure does not show).Ball-screw 13 can just change or reverse, and with the state that screws togather ball nut 16 is installed on this ball-screw 13.Ball nut 16 is fixed on the sliding stand 12 with the state that can not rotate and becomes one with it, and it can be by the just commentaries on classics and the reverse of ball-screw 13, moves to both direction along ball-screw 13.Thus, with ball nut 16 fixedly all-in-one-piece sliding stand 12 can on the Y direction, slide along each guide rail 14,15.
On sliding stand 12, be horizontally disposed with pedestal 19.Pedestal 19 is supported on the pair of guide rails 21 that is set in parallel on the sliding stand 12, and can slide.Each guide rail 21 is configured to along directions X, and this directions X is perpendicular with the Y direction as the glide direction of sliding stand 12.And the central portion between each guide rail 21 is provided with the ball-screw 22 that parallels with each guide rail 21, and this ball-screw 22 can just change and reverses by the drive of motor 23.
On ball-screw 22, ball nut 24 is installed with spiral shell and state.Ball nut 24 is installed on the pedestal 19 and becomes one with it, and can not rotate, and by the just commentaries on classics and the reverse of ball-screw 22, can move to both direction along ball-screw 22.Therefore, pedestal 19 can slide on directions X along each guide rail 21.
On pedestal 19, be provided with rotating mechanism 25, on this rotating mechanism 25, level is provided with turntable 26, and this turntable 26 is used for the female glass substrate 50 of mounting as cutting object.Rotating mechanism 25 can make turntable 26 around vertically central shaft rotation, and can make it be any anglec of rotation θ with respect to normal place to rotate like that.On turntable 26, female glass substrate 50 is fixed by for example sucker.
Above turntable 26, be provided with brace table 31, itself and this turntable 26 maintains appropriate intervals.This brace table 31 is by the bottom of horizontal support at the 1st optics support 33 that is configured to plumbness.The upper end of the 1st optics support 33 be installed in the erecting bed 32 be located on the pallet 11 below.On erecting bed 32, being provided with to vibrate sends the 1st laser oscillation apparatus 34 of the 1st laser beam, is radiated on the optical system that is fixed in the 1st optics support 33 by the 1st laser oscillation apparatus 34 laser beam that sends that vibrated.
The heat energy intensity of the laser beam that the 1st laser oscillation apparatus 34 is sent is normal distribution, by set optical system in the 1st optics support 33, form oval-shaped the 1st laser facula LS1, it has heat energy intensity predetermined like that shown in Fig. 1 (b) and distributes, and its y direction, with be loaded into turntable 26 on the state that parallels of the directions X of female glass substrate 50 under, illuminated.
And, on erecting bed 32, be provided with adjacent with the 1st laser oscillation apparatus 34, and can vibrate and send the 2nd laser oscillation apparatus 41 of the 2nd laser beam, and the laser beam that is vibrated and send by the 2nd laser oscillation apparatus 41, be irradiated onto on the optical system in the 2nd optics support 42, the 2nd optics support 42 is set at brace table 31, and adjacent with the 1st optics support 33.The heat energy intensity of the laser beam that is sent by the 2nd laser oscillation apparatus 41 becomes normal distribution, by being arranged on the optical system in the 2nd optics support 42, be formed with oval-shaped the 2nd laser facula LS2, it has heat energy intensity predetermined like that shown in Fig. 1 (b) and distributes, its y direction is illuminated under following state, that is, along the directions X that is loaded into the female glass substrate 50 on the turntable 26, and and the 1st laser facula LS1 between be separated with under the state of suitable distance.
Between the 1st optics support 33 and the 2nd optics support 42 on the brace table 31, be provided with cooling jet 37, it is faced mutually with the female glass substrate 50 on being loaded in turntable 26.This cooling jet 37 can spray cooling fluid, and it is rectangle along y direction between the 1st laser facula LS1 that is penetrated by the 1st optics support 33 and the 2nd laser facula LS2 that is penetrated by the 2nd optics support 42.
In addition,, also can form as described above on the basis of structure of rectangle ground spraying cooling fluid, be arranged side by side at directions X and a plurality ofly can spray the cooling jet of cooling fluid among a small circle as cooling jet 37.
And, on brace table 31, with respect to the 1st laser facula LS1 that penetrates from the 1st optics support 33, at the opposite side of cooling jet 37, be provided with flywheel knife formula cutter (ホ イ one Le カ Star ) 35, and its with turntable 26 on female glass substrate 50 of being loaded face mutually.Flywheel knife formula cutter 35 is provided with along the y direction of the 1st laser facula LS1 that is penetrated by the 1st optics support 33, and the lateral edge portion of the female glass substrate 50 that is loaded on turntable 26, forms along the entry of the direction of cut preset lines.
And, carry out the control of control, the 1st laser oscillation apparatus 34 and the 2nd laser oscillation apparatus 41 etc. of location, the rotating mechanism 25 of sliding stand 12 and pedestal 19 by control part.
Fig. 3 is the brief configuration figure that the optical system in the 1st optics support 33 is located in expression.The 1st laser beam by the 1st laser oscillation apparatus 34 is vibrated and sends carries out total reflection by set speculum 33a in the 1st optics support 33, shines on the diffraction grating lens 33b.Diffraction grating lens 33b sets its grating distance and raster width under following state, promptly, be distributed as under the state that the heat energy intensity of the 1st laser facula LS1 shown in Fig. 1 (b) distributes in the heat energy intensity of the laser beam that is shone, that is to say, this intensity distributions is to gradually change along y direction, has maximum in the end of a side.
And, in the 2nd optics support 42, also have: speculum, it can carry out total reflection with the 2nd laser beam that is sent by the 2nd laser oscillation apparatus 41; And diffraction grating lens, it can shine the light that is reflected by speculum, by the diffraction grating lens, can under following state, set grating distance and raster width, that is, be distributed as under the state that the heat energy intensity of the 2nd laser facula LS2 shown in Fig. 1 (b) distributes, that is to say in the heat energy intensity of the laser beam that is shone, this intensity distributions is to gradually change along y direction, has maximum in the end of a side.
When forming dark crackle on the surface of female glass substrate 50, at first need import the size of female glass substrate 50, the information such as position of cut preset lines at control part by such chalker.
And female glass substrate 50 is loaded on the turntable 26, and is fixed by suction device.When this state,, the alignment mark (ア ラ イ メ Application ト マ one Network) of being located at female glass substrate 50 is made a video recording by ccd video camera 38,39.The alignment mark that is taken is shown by display 28,29, and handle the positional information of alignment mark in image processing apparatus.
If turntable 26 is positioned with respect to brace table 31, then turntable 26 is slided along directions X, and the cut preset lines on the lateral edge portion of female glass substrate 50 is faced mutually with flywheel knife formula cutter 35.Then, flywheel knife formula cutter 35 is descended, form entry along the end of the cut preset lines of female glass substrate 50.
Then, with turntable 26 along the cut preset lines when directions X slides, launch the 1st laser beam and the 2nd laser beam respectively from the 1st laser oscillation apparatus 34 and the 2nd laser oscillation apparatus 41, and cooling fluid and compressed air sprayed from cooling jet 37 together, form the rectangle cooling point CA that its long edge the cut preset lines.
By the laser beam that sends from the 1st laser oscillation apparatus 34,, on female glass substrate 50, form the ellipse 1st laser facula LS1 of its major diameter along X week direction along the scanning direction of female glass substrate 50.And, at the rear of this laser facula LS1, form the cooling point CA that sprays cooling fluid along the cut preset lines.In addition, by by the 2nd laser oscillation apparatus 41 emitted laser bundles, the rear of the cooling point CA on female glass substrate 50 is formed with the ellipse 2nd laser facula LS2 of its major diameter along X-direction.
In this case, formed the 1st laser facula LS1 in female glass substrate 50 surfaces only have maximum heat energy intensity in the rearward end near the cooling point CA of injected cooling fluid, therefore, portion in its back-end, female glass substrate 50 can fully be heated.And, as mentioned above because the heating of the end of this laser facula LS1, with the formed stress gradient of cooling of cooling point CA, on female glass substrate 50, form dark crackle.And the 2nd laser facula LS2 also only has maximum heat energy intensity at the leading section near the cooling point CA of injected cooling fluid, therefore, at its leading section, female glass substrate 50 can fully be heated, thereby the dark crackle that has formed is further deepened to the back side of female glass substrate 50.
After being formed on dark crackle on female glass substrate 50, this mother's glass substrate 50 is provided to next segmentation process, then female glass substrate is applied power by moment of flexure effect at dark crackle width.Therefore, female glass substrate 50 is cut apart along dark crackle from being located at the entry of its end.
Though explanation is in the above description, the heat energy intensity distribution example as shown in Figure 1 of the 1st laser facula LS1 and the 2nd laser facula LS2, also can make by the Temperature Distribution of the brittle substrate of the 1st laser facula LS1 and the 2nd laser facula LS2 heating, distribute identical with the 1st laser facula LS1 of Fig. 1 and the heat energy intensity of the 2nd laser facula LS2.
And, the heat energy intensity of the 1st laser facula LS1 and the 2nd laser facula LS2 is distributed as state shown in Figure 1, preferably make by the Temperature Distribution of the heating region of the 1st laser facula LS1 and the 2nd laser facula LS2 heating, distribute identical with the heat energy intensity of the 1st laser facula LS1 and the 2nd laser facula LS2.
In the above-described embodiment, though explanation be to use female glass substrate as the LCD panel of brittle substrate one example, in the line processing of bonding glass substrate, single-glass substrate, semiconductor wafer, pottery etc., can produce effect same.
Practicality on the industry
The scribble method of brittle substrate of the present invention and device as mentioned above, make at female glass Formed laser facula such as surface such as the brittle substrate of glass substrate etc. is only near the cooling point The end has maximum heat energy intensity, therefore can and the cooling point between form big stress gradient, Thus can be fully and form efficiently dark crackle.
Claims
(according to the modification of the 19th of treaty)
1. (revise afterwards) scribble method of brittle substrate, it is along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, to form the laser facula lower than the softening point temperature of above-mentioned brittle substrate, and pass through along the cut preset lines, and following this laser facula with near the cooling continuously of the zone this laser facula, and formation is along the vertical crack of cut preset lines, it is characterized in that, above-mentioned laser facula, only has maximum heat energy intensity in end near zone one side that is cooled, and above-mentioned cooled region extends along above-mentioned cut preset lines.
2. (revise afterwards) scribble method of brittle substrate, it is along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, to form 1st laser facula and 2nd laser facula lower than the softening point temperature of above-mentioned brittle substrate, by following above-mentioned the 1st laser facula, and cool off near the 1st laser facula zone continuously along the cut preset lines, and with respect to this cooled region and the opposite side of above-mentioned the 1st laser facula, zone near this cooled region, by along above-mentioned cut preset lines and follow above-mentioned the 2nd laser facula of this cooled region, heated continuously, thereby form vertical crack along above-mentioned cut preset lines, it is characterized in that, above-mentioned the 1st laser facula and above-mentioned the 2nd laser facula only have maximum heat energy intensity in the end near above-mentioned cooled region one side.
3. the scribble method of (after revising) brittle substrate as claimed in claim 2 is characterized in that above-mentioned cooled region extends along above-mentioned cut preset lines.
4. (revise afterwards) scribble method of brittle substrate as claimed in claim 1, it is characterized in that, with respect to the opposite side of above-mentioned cooled region with above-mentioned laser facula, near the zone of above-mentioned cooled region, as along above-mentioned cut preset lines and following above-mentioned cooled region and the 2nd heating region that heated continuously increases.
5. the scribble method of (after revising) brittle substrate as claimed in claim 4 is characterized in that above-mentioned the 2nd heating region is heated by the laser facula that is formed by laser beam.
6. the scribble method of (after revising) brittle substrate as claimed in claim 5 is characterized in that the laser facula of above-mentioned the 2nd heating region has maximum heat energy intensity in the end near the zone that is cooled.
7. the scribble method of (after revising) brittle substrate as claimed in claim 6 is characterized in that the laser facula of above-mentioned the 2nd heating region is that this brittle substrate is carried out annealing in process.
8. the scribble method of (after revising) brittle substrate as claimed in claim 2 is characterized in that above-mentioned the 2nd laser facula is that this brittle substrate is carried out annealing in process.
9. (revise afterwards) scribble method of brittle substrate, it is along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, to form the laser facula lower than the softening point temperature of above-mentioned brittle substrate, by following this laser facula, and cool off near this laser facula zone continuously along the cut preset lines, and formation is along the vertical crack of cut preset lines, it is characterized in that, the Temperature Distribution of the brittle substrate that is heated by above-mentioned laser facula is, only has maximum temperature in end near zone one side that is cooled, and above-mentioned cooled region extends along above-mentioned cut preset lines.
10. (revise afterwards) scribble method of brittle substrate, it is along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, to form 1st laser facula and 2nd laser facula lower than the softening point temperature of above-mentioned brittle substrate, by following above-mentioned the 1st laser facula, and cool off near the 1st laser facula zone continuously along the cut preset lines, and with respect to this cooled region and the opposite side of above-mentioned the 1st laser facula, zone near this cooled region, by along above-mentioned cut preset lines and follow above-mentioned the 2nd laser facula of above-mentioned cooled region, heated continuously, thereby form vertical crack along this cut preset lines, it is characterized in that, above-mentioned the 1st laser facula and the 2nd laser facula only have maximum temperature in the end near above-mentioned cooled region one side.
11. the scribble method of (revising the back) brittle substrate as claimed in claim 10 is characterized in that above-mentioned cooled region extends along above-mentioned cut preset lines.
The scribble method of (12. revising the back) brittle substrate as claimed in claim 9, it is characterized in that, with respect to the opposite side of above-mentioned cooled region with above-mentioned laser facula, near the zone of above-mentioned cooled region, as along above-mentioned cut preset lines and follow the 2nd heating region that above-mentioned cooled region heated continuously and add.
13. the scribble method of (revising the back) brittle substrate as claimed in claim 12 is characterized in that above-mentioned the 2nd heating region has maximum temperature in the end near the zone that is cooled.
14. the scribble method of (increase) brittle substrate as claimed in claim 13 is characterized in that, the laser facula of above-mentioned the 2nd heating region has maximum heat energy intensity in the end near the zone that is cooled.
15. the scribble method of (increase) brittle substrate as claimed in claim 14 is characterized in that, the laser facula of above-mentioned the 2nd heating region carries out annealing in process to this brittle substrate.
16. the scribble method of (increase) brittle substrate as claimed in claim 10 is characterized in that, above-mentioned the 2nd laser facula carries out annealing in process to this brittle substrate.
The chalker of (17. increase) brittle substrate, it can form crackle along the cut preset lines that is positioned at the brittle substrate surface, it is characterized in that having: the mechanism of Continuous irradiation laser beam, to form the laser facula lower than the softening point temperature of above-mentioned brittle substrate; And cooling body, it can make by near the zone the above-mentioned laser facula area heated, is cooled off continuously along the cut preset lines, and above-mentioned laser facula only has maximum heat energy intensity in the end near the zone that is cooled.
The chalker of (18. increase) brittle substrate, it can form crackle along the cut preset lines that is positioned at the brittle substrate surface, it is characterized in that, have: the mechanism of Continuous irradiation laser beam, to form 1st laser facula and 2nd laser facula lower than the softening point temperature of above-mentioned brittle substrate; And cooling body, it can be along the cut preset lines, and cooling is by near the zone above-mentioned the 1st laser facula area heated continuously, and above-mentioned the 1st laser facula and the 2nd laser facula only have maximum heat energy intensity in the end near the zone that is cooled.

Claims (13)

1. the scribble method of brittle substrate, be along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, so that form laser facula with temperature lower than above-mentioned brittle substrate softening point, and by along the cut preset lines and following this laser facula and make near this laser facula zone cooling continuously, and formation is along the crackle of cut preset lines, it is characterized in that, above-mentioned laser facula only has maximum heat energy intensity in the end near zone one side that is cooled.
2. the scribble method of brittle substrate as claimed in claim 1 is characterized in that, above-mentioned cooled region extends along above-mentioned cut preset lines.
3. the scribble method of brittle substrate as claimed in claim 1, it is characterized in that, with respect to above-mentioned cooled region, an opposite side with above-mentioned laser facula, near the zone of above-mentioned cooled region, as along above-mentioned cut preset lines and following above-mentioned cooled region and the 2nd heating region that heated continuously increases.
4. the scribble method of brittle substrate as claimed in claim 3 is characterized in that, above-mentioned the 2nd heating region is heated by the laser facula that is formed by laser beam.
5. the scribble method of brittle substrate as claimed in claim 4 is characterized in that, the laser facula of above-mentioned the 2nd heating region has maximum heat energy intensity in the end near the zone that is cooled.
6. the scribble method of brittle substrate as claimed in claim is characterized in that, the laser facula of above-mentioned the 2nd heating region is that this brittle substrate is carried out annealing in process.
7. the scribble method of brittle substrate, be along the cut preset lines that is positioned at the brittle substrate surface, the Continuous irradiation laser beam also moves it, so that form laser facula with temperature lower than above-mentioned brittle substrate softening point, by following this laser facula and cooling off continuously near the zone of this laser facula along the cut preset lines, and formation is along the crackle of cut preset lines, it is characterized in that, the Temperature Distribution of the brittle substrate that is heated by above-mentioned laser facula is only to have maximum temperature in the end near cooled region one side.
8. the scribble method of brittle substrate as claimed in claim 7 is characterized in that, above-mentioned cooled region extends along above-mentioned cut preset lines.
9. the scribble method of brittle substrate as claimed in claim 7, it is characterized in that, with respect to above-mentioned cooled region, an opposite side with above-mentioned laser facula, near the zone of above-mentioned cooled region, as along above-mentioned cut preset lines and follow the 2nd heating region that above-mentioned cooled region heated continuously and add.
10. the scribble method of brittle substrate as claimed in claim 9 is characterized in that, above-mentioned the 2nd heating region has maximum temperature in the end near the zone that is cooled.
11. the scribble method of brittle substrate as claimed in claim 10 is characterized in that, the laser facula of above-mentioned the 2nd heating region has maximum heat energy intensity in the end near the zone that is cooled.
12. the chalker of brittle substrate, it can form crackle along the cut preset lines that is positioned at the brittle substrate surface, it is characterized in that having: the mechanism of Continuous irradiation laser beam, so that form laser facula with temperature lower than above-mentioned brittle substrate softening point; And cooling body, it can make by near the zone the above-mentioned laser facula institute area heated, is cooled off continuously along the cut preset lines, and above-mentioned laser facula only has maximum heat energy intensity in the end near the zone that is cooled.
13. the chalker of brittle substrate, it can form crackle along the cut preset lines that is positioned at the brittle substrate surface, it is characterized in that, have: the mechanism of Continuous irradiation laser beam, so that form the 1st laser facula and the 2nd laser facula with temperature lower than above-mentioned brittle substrate softening point; And cooling body, it can be along the cut preset lines, and cooling is by near the zone above-mentioned the 1st laser facula area heated continuously, and above-mentioned the 1st laser facula and the 2nd laser facula only have maximum heat energy intensity in the end near the zone that is cooled.
CNB028157028A 2001-08-10 2002-08-08 Method and device for scribing brittle material substrate Expired - Fee Related CN1242458C (en)

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