CN1541800A - Trembling laser cutting device and method thereof - Google Patents
Trembling laser cutting device and method thereof Download PDFInfo
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- CN1541800A CN1541800A CNA031143555A CN03114355A CN1541800A CN 1541800 A CN1541800 A CN 1541800A CN A031143555 A CNA031143555 A CN A031143555A CN 03114355 A CN03114355 A CN 03114355A CN 1541800 A CN1541800 A CN 1541800A
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Abstract
The vibrating laser cutter includes one laser optical unit, one cooling fluid supplier with nozzle, one vibrator, one workpiece fixing seat and one control mechanism. The vibrator alters the strength of laser beam, uneven heat distribution, alternate temperature change in the machining trace, heat shock effect forming crack and easy separation of the cut body. The present invention is used in cutting workpiece with at least partial same curvature radius and has low operation cost and less energy loss. The present invention also has matched diameter cutter to produce cutting line and laser is guided along the diameter cutter path for fast cutting and regular separation. In addition, elastic pressure wave may be also used to deepen cutting line and raise cutting quality.
Description
Technical field
The present invention relates to a kind of laser cutting device and method, particularly relate to a kind of device and method with the cutting of vibration laser beam, be used for cutting brittle material workpiece such as glass, or other material is as quartzy, pottery, photoelectricity and semiconductor crystal material, the workpiece that be cut into small circular or arc, be cut into wafer, cutting thickness is bigger.
Background technology
As the cutting of quartzy, pottery, photoelectricity, use diamond cutter or tungsten-carbide knife for fragile material workpiece such as glass or other material usually, utilize mechanical force that it is separated again the standardized zanjon trace of the workpiece of cutting with the semiconductor crystal material.But too dark and too wide because of the cutting groove mark, may undermine assembly, but and the usable floor area of waste workpiece, and cause and irregular be full of cracks along thickness direction make the cutting decrease in yield.Recently utilize the method for laser cutting general gradually, this method is to utilize the local laser heated parts, makes its fusion and forms a deep trench, makes it separately with mechanical force again.
U.S. Pat 5,609,284 disclose a kind of laser cutting method, this method utilizes laser to streak workpiece, the selected laser that makes of its speed is through part, workpiece does not reach fusing point, but expanded by heating, as shown in Figure 1, laser beam 102 streaks to the direction of arrow 105 on workpiece 101, thereafter followed by a cooling fluid spray 103, workpiece is stressed because of the upper strata is subjected to tension force lower floor, thereby produce thermal shock and be formed on subsurface dark crackle, give heating again if finish in cutting, dark crackle is enlarged and be separated into two.Used laser beam is an oval-shaped beam, is all Gaussian distribution at x and y direction, shown in the curve among Fig. 2 202 and 203; Its defective is: because of when it streaks workpiece, uniform heat distribution causes the thermal shock effect limited.
Therefore, the invention provides a kind of cutting method, can make laser streak part, the heat skewness forms a cold heat; Its thermal shock effect is increased, thereby secretly split intensification, be easier to separate.
Laser cutting can be used on straight line and curved path, and wherein the straight cuts ratio is easier to operation and control.Generally use scan pattern and vector pattern to operate as for curvilinear cut, scan pattern is according to the different characteristic that preestablishes on the workpiece, optionally is switched on or switched off switch in scanning process.Vector pattern then comes mobile focus point by the path of following the trail of graphical definition.The former cutting speed is comparatively slow, and using energy source is also uneconomical, and is therefore more welcome with the operation of vector pattern at present.During laser cutting, continuous mobile focus point promptly constantly changes the position or the angle of speculum and condenser lens, and its operation is controlled cost higher, and process causes energy loss easily, and this is a big shortcoming.
General glass or Silicon Wafer or the semiconductor-based end, need at both direction cutting groove, as shown in figure 10 in the time of need being cut into square, rectangle or rhombus.Vertically after the Cutting Road 2a cutting crystal boundary slight crack is arranged among the figure, shown in the enlarged drawing of Figure 11.When making transverse cuts, the direction of laser promptly shifts into track 4 with the guiding of slight crack having met crystal boundary slight crack 3 parts, though finally still can return to correct direction, wafer has irregular shape, and is very big to the yield rate influence.Also have behind the vertical Cutting Road 2a of cutting, when cutting transverse cuts road 2,, restart cutting again running into vertical Cutting Road part laser that stops.This moment, laser was on vertical Cutting Road 2a, and the interference that is subjected to vertically cutting groove crystal boundary slight crack 3 has problems continuity, and cutting that restarts and previous cutting are discontinuous and skew arranged slightly.And the method for stopping when cutting during this kind also increases the time of cutting, and operation is difficulty also, makes output restricted.When beginning to cut vertical Cutting Road 2a, laser does not run into the slight crack of crystal boundary, unless workpiece has flaw, as cut, indentation or other defective, general laser can not leave Cutting Road; But when cutting transverse cuts road 2, exist, vertically formed many crystal boundary slight cracks 3 on the Cutting Road 2a,, cause Cutting Road and produce and be offset and undermine workpiece if laser is subjected to its guiding and is partial to when running into crystal boundary slight crack 3 when making transverse cuts because of vertical Cutting Road 2a.Still do not have method at present and overcome this difficulty.The present invention promptly proposes solution at this cutting problem, to increase the precision of cutting, improves the yield rate of cutting.
For the cutting of thicker fragile workpiece such as glass, use diamond cutter or tungsten-carbide knife to the standardized zanjon of workpiece usually, utilize mechanical shock as knocking or curved power makes it separately again, but often be difficult to make it to separate, or the slight crack after separating is irregular because workpiece is thicker; And, if Cutting Road is too wide, but also can waste the usable floor area of workpiece.
Laser beam is shone and local cooling in another laser cutting method system to workpiece, make its front produce thermal shock and produce dark crackle, and heated parts makes the generation thermal stress and separates again, but for thicker workpiece, all is difficult for making workpiece to separate.
Laser beam is produced at transverse width tremble and the cutting method of enhancing thermal shock effect,, but still be difficult to make its separation with thermal stress though secretly crackle is deepened.
The present invention is promptly at the laser cutting of thicker brittle workpiece, and when reaching glass pieces more than the 2mm as cutting thickness, the effective ways of effect that can be separated fast and neatly split are the industry person of seeking for.
Summary of the invention
One of purpose of the present invention is to provide a kind of vibration laser cutting device, can make laser beam be subjected to subtle disruption and produces vibration, forms zone and the increase thermal shock effect that colds and heat succeed each other at surface of the work during cutting, with must be darker secretly split.
To achieve these goals, and overcome the shortcoming of fixed beam laser cutting in the prior art, vibration laser cutting device of the present invention comprises: a laser optics, and its wavelength is opaque person to workpiece or wafer; One coolant supply and nozzle provide fluid spray column certain distance behind laser beam to cool off workpiece with the part; One fine motion vibration device changes the luminous intensity of laser beam, forms the zone of a cold heat on the Cutting Road of workpiece, to increase the effect of thermal shock; One workpiece fixing seat, the control of controlled main frame are done moving or rotating around the z axle of x direction and y direction, with aligning and the cutting action that carries out workpiece; And the tool heater is with heated parts; One main control system, the power of control laser beam, focusing and beat frequency, amplitude; The open and close and the pressure of control fluid; The heating-up temperature of control workpiece fixing seat, move and rotate etc. to cut.
In one embodiment, described fine motion vibration device is one to be fixed in the piezoelectric element on the plane mirror group, makes plane mirror group vertical tremor and laser beam edge Cutting Road is beated back and forth and forms the zone of a cold heat.The frequency of described piezoelectric element is 1000Hz to 10000Hz.
In another embodiment, described fine motion vibration device is one to be fixed in the piezoelectric element on the set of lenses, makes the set of lenses vertical tremor and makes laser light lose burnt and change light intensity distributions and form the zone of a cold heat.Wherein, described fine motion vibration device can be to connect optical filtering to a motor with rotating shaft, makes the optical filtering rotation and disturbs light beam to make it that Energy distribution that vibration makes laser beam changes and the zone that forms a cold heat.The rotating speed of described motor is more than the 5000rpm.
The present invention's a time purpose is to provide a kind of vibration laser cutting method, makes the laser of vibration streak workpiece with the speed near fusing point, produces the zone that colds and heat succeed each other and strengthens the thermal shock effect, enlarges thermal shock and makes the workpiece separation with heating again.
In order to achieve the above object, vibration laser cutting method of the present invention comprises the following steps: that (1) places workpiece on the cutting bed; (2), make on the Cutting Road of light beam in the edge of workpiece with the first Cutting Road alignment of wafer; (3) start the vibration device, transfer to required beat frequency, the Cutting Road of cut workpiece; (4) cutting the back heated parts makes it to separate.
The present invention's a purpose again is to provide a kind of method and device thereof with vibration laser cutting workpiece, can reduce operation controls cost and reduces energy loss, and the periphery to be cut of described workpiece at least partly has the same curvature radius, and its center of circle is positioned on this workpiece.
When being cut into small circular or arc, the direction that at first defines by vibration LASER Light Source outgoing beam is the x direction, perpendicular horizontal direction is the y axle, for reaching above-mentioned purpose, the present invention is earlier this workpiece to be fixed on the rotatable workpiece fixing seat with the method for vibration laser cutting workpiece, makes the rotating shaft of this workpiece fixing seat be positioned at the below, the center of circle of this block to be cut.Also can be after fixing this workpiece, the light beam with a diamond cutter or vibration LASER Light Source forms shallow trench between adjacent block earlier.
Then, the light beam of guiding this vibration LASER Light Source makes laser beam form a focus point on block via a speculum and a condenser lens; This focus point is aimed at this center of circle, again this focus point is moved the position of a radius to periphery to be cut along x or y direction.
At last, be rotating shaft with the center of circle, rotate this workpiece fixing seat, make this focus point cut workpiece when workpiece rotates, form the cutting path of a circular arc, the cutting of this periphery is finished in the path of having cut with a cooling fluid (liquid or gas) cooling simultaneously.
The LASER Light Source of the present invention's use can be the vibration LASER Light Source, makes the width of cutting path do regular the change; The vibration LASER Light Source is 1KHz to 10MHz in the preferable beat frequency of y direction.
The vibration laser cutting device that small circular or arc are cut in the present invention mainly comprises a workpiece fixing seat, a LASER Light Source, a speculum, a condenser lens and a cooling unit.Workpiece fixing seat system is in order to carrying and fix this workpiece, and can be around rotating shaft rotation, and this rotating shaft can be aimed at this center of circle.It is opaque person that the wavelength of LASER Light Source needs this workpiece, and definition is the x direction by the direction of this LASER Light Source outgoing beam, and perpendicular horizontal direction is the y direction.Speculum can reflex to the direct beam of this LASER Light Source this periphery to be cut and this center of circle.Condenser lens be generally one can with the convex lens of this speculum interlock, in order to converging the light beam of this mirror reflects, on the periphery to be cut of this block, form a focus point.Cooling unit then comprises cooling fluid outlet at least, makes the periphery of cooling fluid in the local cooling cutting of this a distance, focus point rear.
The rotating shaft of above-mentioned workpiece fixing seat is preferably and can transfers, and can proofread and correct with the beam alignment of this mirror reflects.Above-mentioned speculum and condenser lens can move or turn usually along the x direction, make this focus point move or can move along the y direction at least along the x direction.
Another object of the present invention is to provide a kind of vibration laser cutting method and device, utilizes the shallow cut channel of diamond cutter, the guiding laser make cut direction with the guiding ditch of diamond cutter before so that unlikely skew.
The vibration laser cutting device of the diamond cutter guiding among the present invention comprises (a) LASER Light Source, and its wavelength is opaque person to workpiece or wafer; (b) laser optics focuses on the Cutting Road of workpiece laser light, forms an oval vibration laser beam; (c) coolant supply and nozzle deepen the crack to provide fluid column to hold certain distance to form thermal shock with local cooling work after the vibration laser beam; (d) diamond cutter that is fixed on the case group of described laser optics, when cutting, fall be positioned at laser beam before δ
1The place, δ
1Length suitable less than being of a size of of wafer, or suitable less than being divided between first Cutting Road, and form the usefulness that shallow trench is made guiding laser with the certain pressure cut workpiece, the time spent can not rise along the z axle; (e) workpiece fixing seat, the control of controlled main frame are done moving or rotating around the z axle of x direction and y direction, with aligning and the cutting action that carries out workpiece; And the tool heater is with heated parts; (f) vibration, focusing and the power adjustment of main control system control laser beam, the switch of fluid and pressure adjustment, the lifting of diamond cutter and pressure adjustment, the heating and temperature control of workpiece fixing seat and move, rotation etc., to cut automatically.
In an embodiment of the present invention, the base of tool of described diamond cutter be fixed on the case component from the diamond cutter track base on, make diamond cutter do along guide rail that the x direction is to be moved, when cutting, fall and be positioned at before the vibration laser beam, form the usefulness that shallow trench is made guiding laser with the certain pressure cut workpiece; The time spent can not rise along the z axle.
The vibration laser cutting method of diamond cutter guiding among the present invention comprises the following steps: that (a) puts workpiece on holder, and first Cutting Road is aimed at the edge of workpiece; (b) with first Cutting Road of ellipse vibration laser beam cut workpiece or wafer, cut all first Cutting Roads after; (c) workpiece is rotated an angle, if institute's pellet or workpiece monomer are square or rectangular, then half-twist; If rhombus or other shape are then rotated a required angle, again second Cutting Road in the alignment pieces edge; (d) place before the laser beam with diamond cutter, the vibration laser beam is positioned at δ after the diamond cutter
1Cut simultaneously to second Cutting Road that intersects with first Cutting Road at the place, diamond cutter cuts out the guiding that shallow trench becomes laser, makes that original cut misleads and the offset direction on the crystal boundary slight crack that formed when the cutting path of laser is unlikely to be cut first Cutting Road or the workpiece; (e) to heat again with wafer or workpiece monomer separation.It is between 0.01 μ m to the 0.5 μ m that the pressure of adjusting diamond cutter in when cutting makes the shallow trench degree of depth, and not produce crystal boundary slight crack degree of being, it is shallow better to heal.
In the laser cutting method of the present invention's diamond cutter guiding, also can will cut with second Cutting Road that first Cutting Road intersects with diamond cutter earlier, form a shallow trench, along the shallow trench that diamond cutter is cut into second Cutting Road is carried out laser cutting with the vibration laser beam then.This moment before with the shallow trench of diamond cutter formation promptly as the guiding of laser, make that original cut misleads and the offset direction on the crystal boundary slight crack that formed when the path of laser cutting is unlikely to be cut first Cutting Road or the workpiece.
The present invention's another purpose is to provide a kind of vibration laser cutting device and method, utilizes the elastic pressure ripple that the slight crack of laser cutting formation is deepened and separated in synchronization, and the reliability of promoting cutting to get the neat broken face on the thickness direction improves the cutting yield rate.
For overcoming general diamond cutter cutting or laser cutting shortcoming to thick work piece cut; The present invention utilizes the laser cutting device of elastic wave, comprising: (a) LASER Light Source, and its wavelength is opaque person to workpiece or wafer; (b) laser light-source device can focus on the Cutting Road of workpiece oval vibration laser beam; (c) coolant supply and nozzle, provide the fluid spray column after laser beam, to hold certain distance, with part cooling workpiece: (d) elastic pressure ripple power supply unit guide rail that is fixed in workpiece fixing seat, the elastic wave generator pole, elastic wave generator, the elastic wave probe that are connected on the elastic wave power supply unit can be moved in the y direction, elastic wave generator pole can be flexible in z direction and x direction, and the elastic wave probe can be positioned on the contact point of workpiece one end; (e) an elastic wave generator is a piezoelectric element, changes electric energy into elastic wave; (f) a pair of elastic wave probe is connected in the contact point of elastic wave generator and workpiece, to transmit elastic wave to workpiece; (g) workpiece fixing seat, the control of controlled main frame are done moving or rotating around the z axle of x, y direction, with aligning and the cutting of carrying out workpiece; And the tool heater is with heated parts; (h) main control system, the power of control laser light, focusing, beat frequency, amplitude etc., switch, the pressure of control fluid; The power of the lifting of control elastic wave probe, aligning, elastic wave and frequency etc.; The heating-up temperature of control workpiece fixed, move, rotation etc. to be to cut automatically.
In this device, described elastic wave is produced by piezo-electric effect, and the frequency of elastic wave at 100Hz to 1000Hz for suitable, be preferably 400Hz to 500Hz.The elastic wave contact point of described workpiece promptly is positioned at the Cutting Road starting point both sides of workpiece, and apart from the distance of the Cutting Road width less than the workpiece monomer.
The laser cutting method that utilizes elastic wave of the present invention comprises the following steps: that (a) puts workpiece on holder, aims at Cutting Road; (b) the elastic wave probe is contacted with elastic wave probe contact point on the workpiece; And with the starting point of laser beam alignment pieces inner edge Cutting Road; (c), apply elastic wave simultaneously workpiece is separated with the laser cutting workpiece.In the method, described elastic wave is produced by piezo-electric effect, and the frequency of elastic wave is 100Hz to 1000Hz for suitable, is preferably 400Hz to 500Hz.In the last example, the elastic wave contact point of workpiece promptly is positioned at the Cutting Road starting point both sides of workpiece, and apart from the distance of the Cutting Road width less than the workpiece monomer.
The present invention compared with prior art has the following advantages: (a) vibration laser cutting of the present invention can make laser streak the workpiece part, and the heat skewness forms a cold heat, its thermal shock effect is increased, thereby secretly split intensification, is easier to separate.When (b) vibration laser cutting of the present invention is used for periphery and at least partly has the workpiece of same curvature radius, can reduce operation and control cost and reduce energy loss.(c) at the laser cutting of thicker brittle workpiece, the present invention utilizes the shallow cut channel of diamond cutter, before guiding laser makes cut direction with the guiding ditch of diamond cutter and then unlikely skew, can reach quick separation and also neatly split.(d) the present invention also can utilize the elastic pressure ripple that the slight crack of laser cutting formation is deepened and separated in synchronization, and the reliability of promoting cutting to get the neat broken face on the thickness direction improves the cutting yield rate.
Below in conjunction with drawings and Examples the present invention is described in further detail.
Description of drawings
Fig. 1 is a laser cutting method schematic diagram of the prior art.
Fig. 2 is the light intensity distributions figure of oval-shaped laser bundle in the prior art.
Fig. 3 is the vibration laser cutting device structural representation in the first embodiment of the invention.
Fig. 4 is the light intensity distributions figure according to the vibration laser beam in the first embodiment of the invention.
Fig. 5 is the flow chart of the described vibration laser cutting method of second embodiment of the invention.
Fig. 6 is the wafer to be cut in the third embodiment of the invention and the schematic diagram of wafer.
Fig. 7 is the operational flowchart of cutting wafer shown in Figure 6 and wafer.
Fig. 8 is shown in the shallow trench that cuts out the x direction on the wafer and the shallow trench of y direction.
Fig. 9 demonstration cuts out with the vibration LASER Light Source has the regular path width that changes.
Figure 10 is the Cutting Road that becomes wafer in the prior art with the laser cutting wafer.
Figure 11 is the enlarged diagram of Cutting Road and crystal boundary slight crack in the prior art.
Figure 12 is the schematic diagram of four embodiment of the invention with the laser cutting device of diamond cutter guiding.
Figure 13 is the position relation of laser beam in the four embodiment of the invention and diamond cutter.
Figure 14 is the position relation of laser beam and diamond cutter in the fifth embodiment of the invention.
Figure 15 is the flow chart of the vibration laser cutting method of diamond cutter guiding in the sixth embodiment of the invention.
Figure 16 is the flow chart of the vibration laser cutting method of diamond cutter guiding in the seventh embodiment of the invention.
Figure 17 is the schematic diagram according to the laser aid of the laser cutting device of eighth embodiment of the invention and elastic wave generator structure.
Figure 18 is the schematic diagram of the wavefront of the travel direction of laser beam during according to the laser cutting device of eighth embodiment of the invention and elastic wave.
Figure 19 is the flow chart that utilizes the laser cutting method of elastic wave according to ninth embodiment of the invention.
Description of reference numerals
1 wafer, 2 first Cutting Roads
2a second Cutting Road. 3 crystal boundary slight cracks. 4 laser are with the skew of crystal boundary slight crack.
10 elastic wave laser cutting devices
11,12 circular wafers
21,22 shallow trench
101 workpiece, 102 oval-shaped beams
103 cooling fluids are annotated 104 dark crackles
105 laser cutting directions of advance, 108 elastic wave power supply units
109 elastic wave generators, 110 elastic wave probes
111 workpiece heater 117z axles
118 elastic wave generator poles, 119 elastic wave power supply unit guide rails
201 laser beams
The illumination Gaussian distribution that 202 vertical illumination Gaussian distribution 203 are horizontal
204 elastic wave wavefront, 205 laser beam travel directions
206 Cutting Roads, 207 elastic wave probe contact points
302 are disturbed laser beam 301 to be disturbed the back vertical lighting
303 are disturbed back transverse illumination 304 laser case groups
The 306 diamond cutter base of tools
307 diamond cutters, 308 fluid pumps
309 fluid circuits, 310 nozzles
311 fluid columns, 312 workpiece fixing seat
401 LASER Light Sources
402 laser rays, 403 speculums
The laser rays of 404 laser rays, 405 focusing
406 set of lenses, 407 set of lenses supports
408 piezoelectric elements, 409 piezoelectric elements
411 rotating shafts of 410 optical filterings
412 motors, 413 main control systems
414 diamond cutter track bases, 415 diamond cutter guide rails
The specific embodiment
The structural representation of the vibration laser cutting device in the first embodiment of the invention is shown in 3 figure.
As shown in Figure 3, the wavelength of LASER Light Source 401 wherein is to being cut workpiece for opaque relatively, thus be advisable with infrared ray, as CO
2The wavelength of laser is 10.6 μ m; The wavelength of CO laser is 5.5 μ m; Other wavelength as HF laser is shorter, is 2.9 μ m, all meets the requirements, and looks the material of workpiece and selectes.Infrared laser beam 402 is through plane mirror 403 reflections, be focused to light beam 405 through set of lenses 406, be projeced on the workpiece 101, form an oval-shaped beam 102, for making the laser vibration produce an effect that colds and heat succeed each other on workpiece, present embodiment can be established a piezoelectric element 409 at level crossing 403 back sides, make the frequency vibration of level crossing with 100Hz to 10000Hz, make laser beam reciprocal on Cutting Road direction of advance 105, the effect that can cold and heat succeed each other.For example the cutting speed of laser is 1000mm/sec, tremble with 1000Hz as level crossing, then laser whenever advance 1mm promptly back and forth the vibration once, there is the subregion to be subjected to after-sun on the Cutting Road, the subregion is exposure not, can get zone that colds and heat succeed each other of every 1mm, if beat frequency is that 10000Hz can get zone that colds and heat succeed each other of every 0.1mm.
For making the laser vibration on workpiece, produce an effect that colds and heat succeed each other, present embodiment also can be established a piezoelectric element 408 on the support of set of lenses 406, set of lenses 406 is trembleed up and down with the frequency of 1000Hz to 10000Hz and changed the focal length of laser beam 405, that is lose burnt, cause that its luminous intensity is disturbed and become multimode (multi-mode) by Gaussian distribution and distribute, as shown in Figure 4.Fig. 4 is the light intensity distributions figure according to the vibration laser beam of present embodiment.Display beams is because of moving under the lens among the figure, light path is reduced, poor focusing and become big, and be the change of shape of summary with a+bsin ω t, wherein a is a mean breadth, and b is an amplitude, and ω is a vibration frequency, vertical light intensity distributions becomes multimode by Gaussian distribution and distributes 301, and horizontal luminous intensity also becomes multimode and distributes 303.Cutting speed as laser is that the 1000mm/sec set of lenses is trembleed with 1000Hz, then the laser 1mm that whenever advances promptly once loses burnt effect, that is every 1mm has a zone that colds and heat succeed each other, if beat frequency is 10000Hz, then can get zone that colds and heat succeed each other of every 0.1mm.
For making the laser vibration on workpiece, produce an effect that colds and heat succeed each other, present embodiment also can be set up an optical filtering 410 in the way of folded light beam 404, be connected to motor 412 with rotating shaft 411, if motor 412 rotates with 1000Hz to 10000Hz, the intensity of laser beam 404 is subjected to faint interference and trembles.Cooling fluid among Fig. 3 is annotated (not shown) and then is positioned at side after the laser beam, produces stress to form cool region and forms and secretly split, and this is the structure that those skilled in the art know, and repeats no more herein.
To knowing the personage of this technology, obviously the device of teachings of the present invention is not limited to utilize the revolution optical filtering or trembles level crossing or set of lenses with piezoelectric element, and any means of light beam vibration that make all can be utilized.
Embodiment 2
Fig. 5 is the cutting flow chart of the described laser vibration of second embodiment of the present invention cutting method.Start from steps A 1, workpiece or wafer 101 are placed on the cutting pedestal.In steps A 2,, make light beam in the edge of workpiece or wafer 101 with article one Cutting Road alignment 102 of wafer.In steps A 3, start the vibration device, transfer to required beat frequency.In first Cutting Road of steps A 4 with vibration laser cutting workpiece.In steps A 5, judge whether to cut all Cutting Roads, if not, get back to steps A 4, cut next bar Cutting Road; If, then enter steps A 6, with cutting bed heated parts or wafer, workpiece is separated with thermal shock.
Embodiment 3
The 3rd the described vibration laser cutting device of embodiment of the present invention as shown in figure 12, its cut workpiece is as shown in Figure 6 a wafer 1, wafer 1 comprises many round LED wafer 11,12... according to x and the arrangement of y direction.Workpiece fixing seat 312 (with reference to Figure 12) can make x and the y direction is mobile, and its below has the rotating shaft that can transfer 314, can make its rotation.
The straight horizontal irradiating light beam of LASER Light Source 401 is projected to behind the speculum 403 vertically downward.Focusing unit mainly comprises convex lens 406, the light beam of speculum 403 reflections can be converged on the Cutting Road.Cooling unit mainly comprises a cooling fluid supply tank 308 and a cooling fluid nozzle 310, and cooling fluid is sprayed in laser beam cutting part, and cooling fluid can use carbon dioxide, nitrogen or air.But speculum 403, convex lens 406 and cooling fluid nozzle 310 interlocks.
The operating process of the vibration laser cutting method in the present embodiment as shown in Figure 7.At first, in step B1 wafer 1 is sent to workpiece fixing seat 312 by mechanical arm or other anchor clamps (not being shown in figure), and wafer 1 is fixed on the workpiece fixing seat 312 by vacuum attraction.Step B2 then cuts out the shallow trench 21 of x direction as shown in Figure 8 and the shallow trench 22 of y direction on wafer 1, to isolate each circular wafer 11,12...; The slight crack that the present invention can make subsequent wafer produce in cutting process by this step stops at directly to shallow trench 21 or horizontal shallow trench 22, and avoids injuring the wafer of vicinity; This kind cutting mode is similar to the mode of the square wafer of general cutting, so locate seldom to give unnecessary details.In addition, shallow trench also can use the cutting tool of tradition such as diamond cutter to finish.Step B3 system makes the rotating shaft 314 of workpiece fixing seat 312 belows aim at the center of circle of wafer 1.
Step B4 then rotating shaft 314 makes the center of circle of circular wafer 11 be positioned at the straight horizontal irradiating light beam below of LASER Light Source 301.Then in step B5 along x direction mobile mirror 403 and convex lens 406, make the center of circle of focus point alignment wafer 11.Step B6 then by aiming at folded light beam, is transferred to rotating shaft 314 below, the center of circle of wafer 11.Once more along the distance of x direction, make the periphery of focus point alignment wafer 11 among the step B7 with speculum 403 and convex lens 406 displacement wafers 11 radiuses.
Step B8 then revolves three-sixth turn with suitable rotating speed with rotating shaft 314, and starts cooling unit, makes the spray site of cooling fluid and focus point keep certain distance, then the periphery of wafer 11 because of be heated and rapidly quenching generation STRESS VARIATION split.
Before continuing other wafer of cutting, need get back to step B3 earlier rotating shaft 314 is moved to the center of circle of wafer 1, repeating step B4 and rotating shaft 314 make the center of circle of wafer 12 be positioned at the straight horizontal irradiating light beam below of laser beam 405.Follow-up flow process is identical with above-mentioned step, all finishes laser cutting up to all wafers 11,12....
Embodiment 4
The present invention's the 4th embodiment is the vibration laser cutting device with the diamond cutter guiding, and its structure as shown in figure 12.Wherein, the wavelength of vibration LASER Light Source 401 is preferably opaque relatively to the workpiece that is cut, thus be advisable with infrared ray, as CO
2The wavelength of laser is 10.6 μ m; The wavelength of CO laser is 5.5 μ m, other as the wavelength of HF laser weak point be 2.9 μ m, look the material of workpiece and select to be fit to required optical maser wavelength.Infrared ray vibration laser beam 402 focuses on the workpiece 1 through set of lenses 406 through 403 reflections of the level crossing case group 304 in, is to produce thermal shock, is injected on the workpiece laser direction of advance δ afterwards with fluid 311
2The place.Fluid can be gas or liquid, is good with water generally.Water is by 308 pressurizations of fluid pump, and the fluid circuit 309 through being fixed in case group 304 forms superfine water column 311 with nozzle 310 and sprays to laser beam direction of advance end afterwards, make work-piece cools produce stress and split, this is a known techniques, and non-the present invention's emphasis is not so describe in detail.δ before laser beam
1Part is provided with the diamond cutter base of tool 306, is to become one with laser case group 304, but can be along the y directional trim, the base of tool 306 front ends are fixed with diamond cutter or tungsten-carbide knife 307, and diamond cutter 307 is δ before the laser beam direction of advance
1The place, δ
1Length less than the size of wafer or less than vertically between the Cutting Road every getting final product.In when cutting, diamond cutter 307 streaks gently with the workpiece 1 of the vertical Cutting Road 2a of laser cutting, forms a shallow trench on the transverse cuts road, with guiding immediately at δ
1The synchronous cutting of the laser beam 402 of back, and the unlikely crystal boundary slight crack of going up by vertical Cutting Road 2a is misled, as shown in figure 13.The pressure of diamond cutter 307 is by main control system 413 controls, to obtain the not reason cutting and form the crystal boundary slight crack of extremely shallow groove, wafer or workpiece 1 place on wafer or the workpiece fixing seat 312, wafer or workpiece fixing seat 312 controlled main frames 413 controls and do moving or rotating of x direction and y direction around axle 314, carrying out the wafer aligning and the cutting action in when cutting, and has heater, with heated parts, its structure and function also are well known to those skilled in the art, so do not give unnecessary details.
Embodiment 5
The difference of present embodiment and embodiment 4 is: described diamond cutter can be fixed in before the laser beam, is arranged and can divide.Just with the diamond cutter that separates, carry out cutting the first time transverse cuts road 2a earlier, carry out the cutting second time with laser again, its structure as shown in figure 14, wherein, the structure of laser beam 402, fluid column 312 supply structures are all identical with above-mentioned the 4th embodiment, but the base of tool 306 of diamond cutter 307, then be fixed on the diamond cutter track base 414 that separates with case group 304, track base is provided with guide rail 415 and makes diamond cutter seat 306, can move along the x direction also can be along the y directional trim, this moment diamond cutter earlier with the workpiece 1 of the vertical Cutting Road 2a of laser cutting, on transverse cuts road 2, form a shallow trench, treat that diamond cutter has been finished the groove that rows dry in all transverse cuts roads 2 after, carry out laser cutting with laser along this Cutting Road 2 again, this moment, the shallow trench that before formed by diamond cutter can be guided the cutting of laser beam 402, and it is unlikelyly misled by the last crystal boundary slight crack 3 of vertical Cutting Road 2a.How the 6th following embodiment of the method once cuts formality, promptly once uses diamond cutter, another time laser cutting.
Embodiment 6
The cutting flow process of the described vibration laser cutting method of present embodiment as shown in figure 15, start from step C1, in step C2, workpiece 1 or wafer are placed on the cutting pedestal 312, and in step C3, the first Cutting Road 2a with wafer, in alignment with diamond cutter 307 and laser beam 402,, rise diamond cutter in step C4, promptly do not use diamond cutter, separately with the laser cutting first Cutting Road 2a; In step C5, judge whether cut the cutting of all first Cutting Road 2a, if not, then get back to step C4, continue another first Cutting Road of cutting 2a; If, promptly enter step C6, workpiece is revolved turn to another direction, for example the wafer of cutting or workpiece are square or rectangle, half-twist then is arbitrarily angled if cut into the angle that rhombus then rotates.Fall diamond cutter, adjust pressure to required value, decide, make the diamond cutter part that rowed dry form the shallow trench of 0.01 μ m～0.5 μ m on the material of institute's cut spare, usefulness as the guiding of laser diamond blocking cutter, this moment diamond cutter preceding laser knife after, cut second Cutting Road 2 of workpiece simultaneously, in step C7, judge whether to cut all second Cutting Roads 2, if not, then get back to step C6, continue another second Cutting Road 2 of cutting; If, promptly enter rapid C8, after separating wafer or workpiece are single wafer or monomer, stop at step C9.
Embodiment 7
Present embodiment is more suitable for cutting the Cutting Road of non-rectilinear, for example the cutting in small circular or other less knee.Its cutting flow process starts from step D1 as shown in figure 16, in step D2 workpiece 1 or wafer placed on the cutting pedestal 312, and in step D3, with the first Cutting Road 2a of wafer, in alignment with diamond cutter 307 and laser beam 402; In step D4, rise diamond cutter, promptly do not use diamond cutter, separately with laser cutting Cutting Road 2a; In step D5, judge whether to cut all first Cutting Road 2a, if not, then get back to step D4,, promptly enter step D6 if continue another first Cutting Road of cutting 2a, workpiece revolved turn to another direction, for example the wafer of cutting or workpiece are square or rectangle half-twist then, if cut into rhombus, then the angle of rotation is arbitrarily angled.Fall diamond cutter, adjust pressure, decide to make the diamond cutter part that rowed dry to form the shallow trench of 0.01 μ m～0.5 μ m on the material of institute's cut spare, as the usefulness of laser guiding to required value.Close LASER Light Source, cut second Cutting Road 2 with diamond cutter separately, in step D7, judge whether to cut all second Cutting Roads 2, if not, then get back to step D6, continue with diamond cutter 307 another second Cutting Roads 2 of cutting, if, promptly enter step 608, rise diamond cutter 307, open laser 402, with the cutting groove of laser along diamond cutter, with guiding laser cutting second Cutting Road 2,, judge whether to cut all second Cutting Roads 2 in step D9, if not, then get back to step D8, promptly enter step D9 with laser cutting second Cutting Road 2 if continue, separating wafer or workpiece are behind the single wafer or monomer, to stop at step D10.To step D9, the present invention's the 7th embodiment system all cuts with diamond cutter 307 second Cutting Road 2, again with laser cutting at step D6; But also can be to each second Cutting Road 2 earlier with diamond cutter 307 cuttings, succeeded by laser cutting, then with diamond cutter cutting second second Cutting Road 2, succeeded by laser cutting, secondly to the 3rd article the 4th .... second Cutting Road 2 cut with diamond cutter, succeeded by laser cutting, its order of operation can change arbitrarily, decides on the setting of equipment.
The 8th embodiment of the present invention is the laser cutting device that utilizes elastic wave, and the schematic diagram of its laser aid and elastic wave generator structure as shown in figure 17.The wavelength of LASER Light Source 401 is preferably opaque relatively to the workpiece that is cut, thus be advisable with infrared ray, as CO
2The wavelength of laser is 10.6 μ m; The wavelength of CO laser is 5.5 μ m; Other wavelength as HF laser is shorter, is 2.9 μ m; Look the material of workpiece and select the LASER Light Source of suitable wavelength.Infrared laser beam 402 is focused into oval-shaped beam 405 through 403 reflections of the level crossing case group 304 on workpiece 1 through set of lenses 406, is the generation thermal shock, is injected on the workpiece δ after the laser direction of advance with fluid spray column 311
1The place is shown in the 17th figure, the 18th figure.Fluid can be gas or liquid, is good with water generally, and water is by fluid pump 114 pressurization, and the fluid circuit 308 through being fixed in case group 304 forms superfine water column 311 with nozzle and sprays to end after the laser beam direction of advance, makes work-piece cools generation thermal stress and splits.
The laser beam of present embodiment adopts the vibration laser beam, and its beat frequency is 1KHz to 10KHz, and the width of the oval-shaped beam that is formed is a+bsin ω t, and ω=2nf, f are frequency.
Workpiece 1 places on the workpiece fixing seat 312, the control of workpiece fixing seat 312 controlled main frames 413 and do moving or rotating of x direction and y direction around axle 117, aligning and cutting action when carrying out work piece cut, but and have heater 111 heated partses 1, its structure and function are well known to those skilled in the art, so do not give unnecessary details.The power supply unit 108 of elastic wave is fixed on the workpiece fixing seat 312.Elastic wave generator support 118 is supported elastic wave generator 109 and elastic wave probe 110, probe 110 is closely contacted, as Figure 18 and shown in Figure 19 with the both sides of the Cutting Road starting point of workpiece.Support 118 can move probe 110 is moved to the starting point both sides of Cutting Road 206 in x direction and y direction.It moves the control of controlled main frame 413.Elastic wave power supply unit 108 is fixed on the workpiece fixing seat 312, can move Cutting Road 206 with alignment pieces in the y direction along slide rail (not shown).Elastic wave generator 109 is a piezoelectric element, electric energy can be transformed into the elastic wave vibration, via the contact point 203 and 203 of two elastic wave probes 110 and 110 ' transmission elastic wave to the workpiece ' on, (as shown in figure 18), make workpiece produce elastic wave to assist the separation of workpiece.Elastic wave generator 109 is being connected on the elastic wave power supply unit 108 along the pole 118 that x axle and z shaft extension contract.Before cutting, by main control system 413 control, make probe move to the contact point 203 and 203 of Cutting Road 206 both sides on the workpiece ' on.Elastic wave contact point 203,203 ' apart from Cutting Road apart from the width of δ less than the workpiece monomer, (as shown in figure 18).Laser cutting device is by main control system 413 its runnings of control, as actions such as aligning, cutting, heating, coolings.
Embodiment 9
Present embodiment is the laser cutting method that the present invention utilizes elastic wave, and its cutting flow process starts from step e 1 as shown in figure 19.In step e 2, the workpiece 1 of putting glass or other material on holder 312, the travelling workpiece holder, first Cutting Road of alignment pieces arrives the position of laser beam.In step e 3, the starting point that laser beam is aimed at Cutting Road 206, that is one of workpiece 1 side inner edge, and with elastic wave probe 110,110 ' with probe contact point 203, the 203 ' contact of the both sides of the first Cutting Road starting point.In step e 4, with the laser cutting workpiece, applying elastic wave simultaneously separates workpiece, the frequency of elastic wave is 100Hz to 1000Hz, be preferably 400Hz to 500Hz, elastic wave is the center of circle with elastic wave probe contact point promptly, with concentric circles to external diffusion shown in the wavefront 204 of the 19th figure, workpiece macroseism because of elastic wave after laser cutting is separated.Because of the time of cutting very short, when cutting speed is 1000mm/sec, only need one second with the interior time.Laser beam one streaks, and workpiece splits immediately, and needn't remake other and handle as actions such as heating, so cutting speed is fast than known techniques, high efficiency, and the section of cutting is neat, and the cutting yield rate can improve.For the thick workpiece that reaches 2mm to 30mm, the present invention's the laser cutting technique that utilizes elastic wave, confirm its cutting yield rate tradition utilize mechanical force person for good.And at this thickness, the thermal stress that general using heats again is difficult for making its separation.So the present invention's making progress property on effect.In step e 5, judge whether to cut all Cutting Roads, if not, enter step e 6, then laser beam 201 is aimed at the starting point of next Cutting Road, and with elastic wave probe 110,110 ' the move to probe contact point 203 of next Cutting Road, 203 ', get back to step e 4 then, continue cutting.If, enter step e 7, promptly take out the workpiece monomer that has cut and separated.Cutting promptly stops at step e 8.
The above is the present invention's preferred embodiment, is not in order to qualification the present invention, and all other do not break away from the equivalence of finishing under the disclosed spirit and change or modification, all should be included in the protection domain of the present invention.
Claims (31)
1. a vibration laser cutting device comprises
One laser optics, its wavelength is opaque person to workpiece or wafer;
One coolant supply and nozzle provide fluid spray column certain distance behind laser beam to cool off workpiece with the part;
One fine motion vibration device changes the luminous intensity of laser beam, forms the zone of a cold heat on the Cutting Road of workpiece;
One workpiece fixing seat, the control of controlled main frame are done moving or rotating around the z axle of x direction and y direction, with aligning and the cutting action that carries out workpiece; And the tool heater is with heated parts;
One main control system, the power of control laser beam, focusing and beat frequency, amplitude; The open and close and the pressure of control fluid; The heating-up temperature of control workpiece fixing seat, move and rotate etc. to cut.
2. vibration laser cutting device as claimed in claim 1, described fine motion vibration device are one to be fixed in the piezoelectric element on the plane mirror, make the plane mirror vibrations and make laser beam beat back and forth and form the zone of a cold heat along Cutting Road.
3. vibration laser cutting device as claimed in claim 2, the frequency of wherein said piezoelectric element are 1000Hz to 10000Hz.
4. vibration laser cutting device as claimed in claim 1, wherein said fine motion vibration device are one to be fixed in the piezoelectric element on the set of lenses, make the set of lenses vertical tremor and make laser light lose burnt and change light intensity distributions and form a cold and hot zone.
5. vibration laser cutting device as claimed in claim 1, wherein said fine motion vibration device is that rotating shaft connects optical filtering to a motor, makes the optical filtering rotation and disturbs light beam to make it that Energy distribution that vibration makes laser beam changes and the zone that forms a cold heat.
6. vibration laser cutting device as claimed in claim 5 is characterized in that: the rotating speed of wherein said motor is more than the 5000rpm.
7. a vibration laser cutting method comprises the following steps:
(a) workpiece is placed on the cutting bed;
(b), make on the Cutting Road of light beam in the edge of workpiece with the first Cutting Road alignment of wafer;
(c) start the vibration device, transfer to required beat frequency and injecting fluid in the light beam rear, with the cutting worker
The Cutting Road of part;
(d) cutting the back heated parts makes it to separate.
8. one kind is trembleed laser cutting method, be used to cut a workpiece to obtain at least one block, the periphery to be cut of this block at least partly has the same curvature radius, and its center of circle is positioned on this workpiece, and definition is the x direction by the direction of LASER Light Source outgoing beam, and perpendicular horizontal direction is the y direction; This method comprises the following steps:
(a) this workpiece is fixed on the rotatable workpiece fixing seat, the rotating shaft of this workpiece fixing seat is positioned at
This does not cut this below, center of circle of one of block;
(b) light beam that makes this LASER Light Source is via a speculum and a condenser lens, in the week to be cut of this block
Form a focus point on the edge; And
(c) rotate this workpiece fixing seat, make this periphery to be cut by this focus point, simultaneously with a cooling fluid
The periphery that cooling has been cut is finished the cutting of this periphery.
9. method as claimed in claim 8, wherein said step a) form shallow trench with a diamond cutter earlier between adjacent block after fixing this workpiece.
10. method as claimed in claim 8, wherein said step a) form shallow trench with the vibration laser beam earlier between adjacent block after fixing this workpiece.
11. as any one described method in the claim 8 to 10, wherein said LASER Light Source is a vibration LASER Light Source, makes the width of cutting path do regular the change, this LASER Light Source is 1KHz to 10MHz in the beat frequency of y direction.
12. a vibration laser cutting device is used to cut a workpiece to obtain at least one block, the periphery to be cut of this block at least partly has the same curvature radius, and its center of circle is positioned on this workpiece; This device comprises:
One workpiece fixing seat, in order to carrying and fix this workpiece, and can be around rotating shaft rotation, this rotating shaft can be aimed at this center of circle;
One LASER Light Source, its wavelength is opaque person to this workpiece, and definition is the x direction by the direction of this LASER Light Source outgoing beam, perpendicular horizontal direction is the y direction;
One speculum can reflex to the direct beam of this LASER Light Source this periphery to be cut and this center of circle;
One condenser lens, can with this speculum interlock, in order to converging the light beam of this mirror reflects, on the periphery to be cut of this block, form a focus point; And
One cooling unit comprises cooling fluid outlet at least, makes the periphery of cooling fluid in the local cooling cutting of this a distance, focus point rear.
13. vibration laser cutting device as claimed in claim 12, the rotating shaft of wherein said workpiece fixing seat is for transferring.
14. vibration laser cutting device as claimed in claim 13, the rotating shaft of wherein said workpiece fixing seat can be proofreaied and correct with the beam alignment of this mirror reflects.
15. as any one described vibration laser cutting device in the claim 12 to 14, wherein said LASER Light Source is a vibration LASER Light Source, makes the width of cutting path can do regular the change; This vibration LASER Light Source in the beat frequency of cutting path width between between the 1KHz to 10MHz.
16. the laser cutting device with the diamond cutter guiding comprises:
(a) LASER Light Source, its wavelength is opaque person to workpiece or wafer;
(b) laser optics can focus on the Cutting Road of workpiece oval vibration laser beam;
(c) coolant supply and nozzle provide the fluid spray column to cool off workpiece in vibration laser beam certain distance with the part;
(d) diamond cutter that is fixed on the case group of described laser optics, when cutting, fall be positioned at laser beam before with the certain pressure cut workpiece, form the usefulness that shallow trench is made guiding laser;
(e) moving or rotating around the z axle of x axle and y direction done in the control of the controlled main frame of a workpiece fixing seat, with aligning and the cutting action that carries out workpiece; And the tool heater is with heated parts;
(f) power, focusing and the vibration of main control system control laser beam, frequency, spoke shakes; The switch and the pressure of control fluid; The lifting and the pressure of control diamond cutter, the heating-up temperature of workpiece fixing seat move, locate and rotation etc. to cut automatically.
17. laser cutting device as claimed in claim 16, wherein, the base of tool of described diamond cutter be fixed on the case component from the diamond cutter track base on, track base is fixed on the matrix, it is mobile to make diamond cutter make the x direction along guide rail, the time fall before be positioned at laser beam with the certain pressure cut workpiece in cutting, form the usefulness that shallow trench is made guiding laser.
18. as claim 16 or 17 described laser cutting devices, wherein said oval-shaped laser bundle is the vibration laser beam, the transverse width of the short-axis direction of light beam trembles with certain frequency, and its beat frequency is 1KHz to 10MHz.
19. laser cutting device as claimed in claim 16, diamond cutter certain distance δ 1 before the direction of advance of laser beam wherein, the length of δ 1 less than between the size of crystalline substance side or first Cutting Road every.
20. the laser cutting method with the diamond cutter guiding comprises the following steps:
(a) put workpiece and on holder, aim at first Cutting Road;
(b) with first Cutting Road of oval-shaped laser bundle cut workpiece or wafer;
(c) workpiece is rotated an angle, second Cutting Road in the alignment pieces edge;
(d) place before the laser beam laser beam to be positioned at certain distance δ 1 place after the diamond cutter with diamond cutter, second Cutting Road that intersects with first Cutting Road is cut simultaneously, diamond cutter cuts out the guiding that shallow trench becomes laser.
(e) to heat again with wafer or workpiece monomer separation.
21. laser cutting method as claimed in claim 20, wherein, in step (d), to cut with second Cutting Road that first Cutting Road intersects with diamond cutter earlier and form a shallow trench, along the shallow trench that diamond cutter is cut into second Cutting Road is carried out laser cutting with laser beam again, diamond cutter forms the guiding of shallow trench as laser.
22. as claim 20 or 21 described laser cutting methods, wherein, described oval-shaped laser bundle is the vibration laser beam, the transverse width of the short-axis direction of light beam trembles with certain frequency, and this beat frequency is 1KHz to 10MHz.
23. as any one described laser cutting method in the claim 20 to 22, the degree of depth of the shallow trench of wherein said diamond cutter cutting is 0.01 μ m to 0.5 μ m.
24. a laser cutting device that utilizes elastic wave comprises:
(a) LASER Light Source, its wavelength is opaque person to workpiece or wafer;
(b) laser optics can focus on the incisor path of workpiece the oval-shaped laser bundle;
(c) coolant supply and nozzle provide the fluid spray column to hold certain distance to cool off workpiece with the part after laser beam;
(d) an elastic wave power supply unit guide rail that is fixed in workpiece fixing seat, the elastic wave generator pole, elastic wave generator, the elastic wave probe that are connected on the elastic wave power supply unit can be moved in the y direction, elastic wave generator pole can be flexible in z direction and x direction, and the elastic wave probe can be positioned on the contact point of workpiece one end;
(e) an elastic wave generator is a piezoelectric element;
(f) a pair of elastic wave probe is connected in the contact point of elastic wave generator and workpiece, to transmit elastic wave to workpiece;
(g) workpiece fixing seat, the control of controlled main frame are done moving or rotating around the z axle of x, y direction, with aligning and the cutting of carrying out workpiece; And the tool heater is with heated parts;
(h) main control system, power, focusing, beat frequency and the amplitude etc. of control laser light, switch, the pressure of control fluid; The power of the lifting of control elastic wave probe, aligning, elastic wave and frequency etc.; The heating-up temperature of control workpiece fixing seat, move, rotation etc. to be to cut automatically.
25. as laser cutting device as claimed in claim 24, wherein said elastic wave is produced by piezo-electric effect, the frequency of elastic wave is 100Hz to 1000Hz.
26. as laser cutting device as claimed in claim 25, the frequency of wherein said elastic wave is 400Hz to 500Hz.
27. as any one described laser cutting device in the claim 24 to 26, the elastic wave contact point of wherein said workpiece is positioned at the Cutting Road starting point both sides of workpiece, the elastic wave contact point is apart from the distance of the Cutting Road width less than the workpiece monomer.
28. a laser cutting method that utilizes elastic wave comprises the following steps:
(a) put workpiece on holder, aim at Cutting Road;
(b) the elastic wave probe is contacted with elastic wave probe contact point on the workpiece; And with the starting point of laser beam alignment pieces inner edge Cutting Road;
(c), apply elastic wave simultaneously workpiece is separated with the laser cutting workpiece.
29. laser cutting method as claimed in claim 28, wherein said elastic wave is produced by piezo-electric effect, and the frequency of elastic wave is 100Hz to 1000Hz.
30. laser cutting method as claimed in claim 29, the frequency of wherein said elastic wave are 400Hz to 500Hz.
31. as any one described laser cutting method in the claim 28 to 30, wherein, the elastic wave contact point of described workpiece is positioned at the Cutting Road starting point both sides of workpiece, the elastic wave contact point is apart from the distance of the Cutting Road width less than the workpiece monomer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031143555A CN1541800A (en) | 2003-04-30 | 2003-04-30 | Trembling laser cutting device and method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031143555A CN1541800A (en) | 2003-04-30 | 2003-04-30 | Trembling laser cutting device and method thereof |
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| CN1541800A true CN1541800A (en) | 2004-11-03 |
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| CN101844865A (en) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | Cutter for substrate and the method for utilizing this cutter for substrate cutting substrate |
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| CN103212831B (en) * | 2012-01-19 | 2016-04-27 | 昆山思拓机器有限公司 | SMT template laser wet cutting and detect equipment |
| CN103212837A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Processing equipment for laser wet cutting of SMT (Surface Mounting Technology) template |
| CN103212831A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Equipment for laser wet cutting and detecting of SMT (Surface Mounting Technology) template |
| CN103212837B (en) * | 2012-01-19 | 2016-08-31 | 昆山思拓机器有限公司 | The process equipment of the wet cutting of SMT template laser |
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