KR101306673B1 - Chamfering apparatus - Google Patents

Abstract

The chamfering apparatus of a brittle material board | substrate which can be used as a chamfering surface, such as C surface or an R surface, is provided. It is provided in the optical path of the laser beam between the laser light source 13 and the light converging member 15, and scans the position of the light converging point formed by the laser beam emitted from the light converging member by deflecting the incident light path to the light converging member. The laser beam is irradiated from the oblique front side of the edge line EL and the beam deflection portion 14 to the edge line so as to be scanned along the surface where the light collecting point intersects the edge line on the substrate surface near the edge line or inside the substrate. The substrate support parts 2, 7, 11, and 12 which support a board | substrate are provided, and the light condensing member 15 has a concave shape or a straight line shape when the scanning locus of the light converging point formed in the surface which intersects an edge line is seen from the light collecting member. By setting it as the optical element unit used, convex chamfering process is performed toward a board | substrate outer side.

Description

Chamfer Processing Equipment {CHAMFERING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for chamfering an edge line (ridgeline) formed in a cross section of a brittle material substrate, and more particularly, to R of an edge line by irradiation of a laser beam. A chamfering method and a chamfering apparatus which perform chamfering or C chamfering.

In addition to the glass substrate, the brittle material substrate to be processed includes substrates such as quartz, single crystal silicon, sapphire, semiconductor wafers and ceramics.

Brittle material substrates, such as a glass substrate, are used for various products by processing to a desired dimension and shape. Generally, processing of brittle material substrates is performed by conventional processing techniques such as dicing, wheel scribing, laser scribing, etc., but the edges of the substrate cross-section divided by these processing techniques The lines are so sharp that problems such as chipping or microcracks arise just by applying a slight impact. For example, in the glass substrate for flat panel displays (FPD), the debris which generate | occur | produces by falling off of the edge becomes a cause of a flaw in the surface of the board | substrate for FPD, and affects the yield of a product.

Therefore, the chamfering process is performed along the edge line, in order to prevent the edge part of the board | substrate, etc. which generate | occur | produce after splitting a board | substrate.

As one of the conventional chamfering processes, there is a wet polishing method of polishing by diamond grindstone while supplying a large amount of water. However, on the chamfered surface formed by the wet polishing method, minute cracks remain continuously, and the strength of the chamfered surface is considerably lowered than the surroundings.

On the other hand, the heat-melting method which scans a laser beam along the edge line which is going to perform a chamfering process, and performs a chamfer by heat-melting the edge image by moving the focal point of a laser beam along an edge line is proposed. . For example, the method of carrying out chamfering by laser heating the vicinity of a ridge part and softening and rounding a ridge part in the state which hold | maintained (heated) the glass member whole at higher temperature than normal temperature is disclosed (patent document) 1).

8 is a cross-sectional view showing a laser irradiation state when performing the chamfering by the heating and melting method using a CO ₂ laser source. The edge line 51 which previously heats the whole glass substrate 10 gradually to predetermined temperature lower than a softening temperature using the heater which is not shown in figure, and then performs chamfering of the glass substrate 10 maintained at predetermined temperature is carried out. Therefore, the laser beam from the CO ₂ laser light source 50 is collected by the condenser lens 53, and the focal point is scanned in the vicinity of the processed portion. At that time, by adjusting the laser output and the scanning speed, the edge irradiated with the laser becomes high temperature and softened, thereby processing the edge irradiated with the laser to be rounded.

In this case, preheating and cooling after processing take time. In addition, when the whole board | substrate needs to be preheated and the functional film | membrane, such as a device which cannot be heated, or a sensor is already formed on the board | substrate, the chamfering process by this method may not be performed. Insufficient heat may cause cracks (cracks) due to thermal stress, which prevents good chamfering. In addition, in the chamfering process by the above-mentioned heat melting method, the molten portion deforms and a part (a part of the rounded portion) swells more than the surroundings, and the flatness of the substrate cross section may be damaged.

Unlike the heat melting method, as a chamfering method by laser irradiation, which does not require preheating, cracks are generated in the glass substrate 10 by heating by irradiating a laser light near the edges, thereby causing the laser light to be relatively moved in the edge line direction. The laser scribing method which grows a crack along an edge line by scanning and isolates the edge vicinity from a glass substrate, and performs chamfering (patent document 2) is disclosed.

9 is a diagram illustrating a laser irradiation state when chamfering is performed by a laser scribe using a CO ₂ laser light source. The laser beam from the CO ₂ laser light source 50 is locally irradiated by the condensing lens 53 near the edge line 51 of the glass substrate 10 and heated to a temperature lower than the softening temperature. At this time, the crack 52 is generated by the thermal stress accompanying the local thermal expansion. Then, by scanning the laser beam along the edge line 51, cracks 52 sequentially generated grow along the edge line 51, and the vicinity of the edge (edge portion) including the edge line 51 is separated. .

According to patent document 2, it is supposed that by performing a chamfering process by a laser scribe, the chamfering process which does not require high productivity and a washing process can be performed, without impairing the precision of a glass substrate.

Japanese Patent Application Laid-open No. Hei 2-241684 Japanese Patent Application Laid-Open No. 9-225665

Here, the processing surface formed by the chamfering process by a laser scribe is demonstrated. FIG. 10 is an enlarged view of a processing cross section when chamfering is performed by a laser scribe using a CO ₂ laser. FIG.

By the chamfering process, the edge portion U of the glass substrate 10 is separated (peeled), so that the edge line 53 of the glass substrate 10 is lost together with the edge portion U, but the newly chamfered surface ( 54) is formed.

When the cross-sectional shape of this chamfering process surface 54 is observed, it has a reverse arc surface of the arc shape which dug to the glass substrate 10 side. As a result of the chamfering processing surface 54 being dug, two edge lines 57 and 58 are formed in the intersection part with the substrate surface 55 and 56 of the glass substrate S. As shown in FIG. These edge lines 57 and 58 have improved edge sharpness as compared to the original edge line 53. However, if the dent increases, sharp edges are formed.

In particular, in glass substrates for flat panel displays (for FPDs), the TAB tape may be wired directly above the edge lines 57 and 58, and after chamfering, if a sharp edge remains in this portion, the TAB tape may be disconnected. Is higher.

Therefore, it is desired that the chamfered surface 54 removes the dents, and sets the chamfered portion to a C surface where the chamfered portion is a flat surface or an R surface that becomes convex toward the outside.

However, in the chamfered surface 54 by a conventional laser scribing method using a CO ₂ laser as described above it ends up somehow a depression occurs in the chamfered surface. Even if this changes the irradiation direction of the laser which irradiates the edge line 53, the result is substantially the same and it was difficult to control the shape of the chamfering process surface.

In recent years, in glass substrates for flat panel displays (FPDs), larger glass substrates have been used than in the past, and with the increase in the size of the glass substrates, the processing quality of the substrates is required to be higher than ever before. It is becoming. Also about the shape of the chamfering surface, high precision and reliability are calculated | required more than ever.

Therefore, an object of the present invention is to provide a chamfering apparatus in which the chamfered surface formed by laser irradiation can be a curved surface that is convex toward the C surface, the R surface, or the substrate outside, instead of the reverse R surface. do.

In order to solve the above problems, the chamfering apparatus of the present invention uses a special optical element unit to scan the converging point of the laser beam to realize the chamfering processing of the curved surface which is convex toward the C surface, the R surface, and the outside of the substrate. Doing.

That is, the chamfering apparatus of this invention is a chamfering apparatus which chamfers a brittle material substrate, Comprising: A light source for condensing a laser light source, the laser beam radiated from the laser light source to a board | substrate, and a light collecting member from a laser light source. A beam deflector provided on the optical path of the laser beam through the laser beam to the substrate, for deflecting the incident optical path of the laser beam to scan the position of the focusing point formed by the laser beam, and an edge line for chamfering, The laser beam is irradiated toward the edge line from an inclined front of two adjacent surfaces having the edge line as the short side, so that the condensing point intersects the edge line on the substrate surface or inside the substrate near the edge line. And a substrate support for supporting the substrate to be scanned along the surface, wherein the light collecting member crosses the edge line. The scanning locus of the light-converging point judging from the converging member formed to have to occur in the optical element unit having the optical parameters which the concave shape or a linear shape.

Here, the brittle material substrate includes a glass substrate, a quartz substrate, a silicon substrate, a sapphire substrate, a silicon or other semiconductor wafer, and a ceramic substrate.

In addition, since the absorption characteristic of a board | substrate differs with the wavelength of a laser beam, a laser light source selects the laser light source to be used according to the kind of board | substrate, whether it scans from the substrate surface, or the inside of a board | substrate.

For example, for a glass substrate, in the case of scanning the vicinity of the surface, it is preferred to use a CO ₂ laser is the absorption coefficient of the substrate material large or CO laser (simply by the light-converging the laser when scanning the end surface of the substrate absorb Small lasers can be used). On the other hand, when scanning the inside of a board | substrate, it is preferable to use the YAG laser (Nd-YAG laser, Er-YAG laser etc.) with a small absorption coefficient of a board | substrate material.

In addition, a lens unit or a mirror unit can be used for the optical element unit used as a light condensing member. In general, in the lens unit, by adjusting the refractive index distribution and the lens curved shape, and in the mirror unit, by adjusting the reflection surface shape, the optical path direction or the converging point of the outgoing light with respect to the incident light to the lens unit and the mirror unit can be designed. Can be. Therefore, as the optical parameters of the optical element unit (lens unit, mirror unit) used in the present invention, when the incident light path is deflected by the beam deflector, the scanning locus of the light collecting point formed by the light collecting member is concave when viewed from the light collecting member. Or the thing which has an optical parameter becoming linear form is used. In addition, the optical parameter which acquires such a scanning trace can be calculated | required by performing geometric calculation, analysis by a finite element method, or trial and error design.

In addition, the optical element unit described herein has a structure in which a plurality of lenses and mirrors are arranged in series, not only a single lens but a combination lens, so that the scanning trajectory of the light collection point as a whole is concave when viewed from the light collecting member. Included are also included.

According to this invention, an optical system is arrange | positioned so that the laser beam radiated | emitted from a laser light source may be irradiated from the inclined front direction of a board | substrate with respect to the edge line which performs a chamfering process of a board | substrate through a beam deflection part and a light condensing member. The beam deflector deflects the incident optical path of the laser beam emitted from the laser light source to the light collecting member. The light converging member deflects the incident light path by the beam deflector, so that the traveling direction of the laser beam emitted from the light converging member is deflected. As a result, the position of the light converging point formed by the laser beam emitted from the light collecting member is scanned near the edge line of the substrate. At this time, the light collecting point near the edge line is used for the light collecting member because the scanning trajectory of the light collecting point formed on the surface intersecting the edge line is used as an optical element unit having an optical parameter that becomes concave or straight when viewed from the light collecting member. The scanning trajectory of the is concave or straight when viewed from the light converging member. When the light collecting point is scanned on the substrate surface or inside the substrate, ablation occurs along the trajectory, and a part of the substrate is removed along the scanning trajectory of the light collecting point. Therefore, when the scan trajectory is straight, the C plane is chamfered, and when the scan trajectory is concave when viewed from the light collecting member, the convex chamfers such as the R plane, the parabolic plane, and the ellipsoid are determined according to the concave shape. Processing is performed.

According to this invention, the chamfering process surface formed by laser irradiation can be made into the C surface, the R surface, or the curved surface which becomes convex toward the board | substrate outer side.

(Other problem solving means and effects)

In the above invention, the light collecting member may be an optical element unit made of a fθ lens or a fθ mirror.

Since the scanning trajectory of the condensing point when the light collecting member is an optical element unit composed of an fθ lens or an fθ mirror becomes a linear shape, the C plane can be chamfered.

In the above invention, the light collecting member may be an optical element unit combining a f? Lens and a planar parallel plate which are not telecentric.

When the light collecting member is an optical element unit combining a fθ lens and a planar parallel plate instead of telecentric, the scanning locus of the light collecting point becomes convex toward the outside of the substrate, so that the convex chamfering process can be performed. have.

In the said invention, you may make it provide the conveyance mechanism which moves a board | substrate side or a laser beam side so that a light-converging point may move relatively along the said edge line.

According to this, the chamfering process of the whole edge line can be performed along an edge line.

In the above invention, the substrate support portion is formed of a table on which the substrate is placed horizontally, and the light collecting member and the beam deflection portion are scanned at the condensing point with the centering direction inclined 45 degrees with respect to the edge line of the substrate placed horizontally. It may be arranged to be.

According to this, a chamfering process can be performed, putting a board | substrate on the horizontal table stably.

In the above invention, the beam deflection portion may be constituted by a galvano mirror or a polygon mirror.

In the case of the galvano mirror, the laser beam that is directed to the light collecting member can be deflected accurately and reproducibly with a simple mechanism by the oscillating motion of the reflector, and the polygon mirror in the rotational motion of the reflector.

In the said invention, you may further provide the depth adjustment mechanism which adjusts the position of the said light converging point with respect to the board | substrate by moving the position of a board | substrate or the said light converging member to the irradiation direction of a laser beam.

According to this, a chamfering process of a desired depth can be performed by performing a chamfering process to the depth position in the board | substrate of a light collection point in accordance with the process planned depth of a chamfering process.

In addition, in the case of performing a deep chamfering process, the shallow chamfering process is performed, and the depth is gradually changed to perform the deep chamfering process, and the relative movement is continuously performed from the start point of the edge line to the end point while adjusting the scanning position in the depth direction. By doing this, a chamfering process can be performed without difficulty.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the chamfering apparatus of the brittle material substrate which is one Embodiment of this invention.
FIG. 2 is an enlarged view of the scanning optical system of FIG. 1.
3 is a block diagram of a control system of the chamfering processing device of FIG. 1.
It is a figure which shows the procedure in the case of deeply forming a chamfering process surface.
5 is an enlarged view of a modification of the scanning optical system.
6 is an enlarged view of a modification of the scanning optical system.
7 is an enlarged view of a modification of the scanning optical system.
Figure 8 is a cross-sectional view showing a laser irradiation state when performing the chamfering by the heating and melting method using a CO ₂ laser source.
9 is a view showing a laser irradiation state at the time using a CO ₂ laser source to be chamfered by a laser scribe method.
Figure 10 is an enlarged view of the processing section when performing the chamfered by a laser scribing method using a CO ₂ laser.

Best Mode for Carrying Out the Invention [

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, the chamfering process with respect to a glass substrate is demonstrated.

In addition, this invention is not limited to embodiment as described below, Needless to say that various embodiment is included in the range which does not deviate from the meaning of this invention.

1: is a figure which shows the chamfering apparatus LM of the brittle material substrate which is one Embodiment of this invention. FIG. 2 is an enlarged view illustrating the scanning optical system of FIG. 1.

The chamfering processing apparatus LM is along the pair of guide rails 3 and 4 arranged in parallel on a horizontal stand 1, and the front and rear directions in the ground of FIG. 1 (hereinafter referred to as Y). Direction) is provided with a slide table 2 for reciprocating. The screw screw 5 is arrange | positioned along the front-back direction between both guide rails 3 and 4, The stay 6 fixed to the said slide table 2 is screwed to this screw screw 5, As a result, the slide table 2 is formed to reciprocate in the Y direction along the guide rails 3 and 4 by rotating the screw screw 5 forward and backward with a motor (not shown).

On the slide table 2, a horizontal pedestal 7 is arranged along the guide rail 8 so as to reciprocate in the left-right direction (hereinafter referred to as the X-direction) in FIG. The screw screw 10 which is rotated by the motor 9 is screwed through to the stay 10a fixed to the pedestal 7, and the screw screw 10 rotates forward and reverse, and the pedestal 7 is Along the guide rail 8, it reciprocates in the X direction.

On the pedestal 7, a lifting table 11 for adjusting the height direction (hereinafter referred to as Z direction) and a suction table 12 on which a suction chuck is mounted are provided, and the suction table 12 is provided. On the above, the glass substrate G is set in a horizontal state. At this time, the edge line EL which chamfers is directed upward, and it is supported so that the laser beam mentioned later may be incident from the 45 degree inclination direction.

In addition, the glass substrate G performs positioning using the alignment mark (not shown) formed in the camera 20 and the board | substrate, and makes the edge line EL face a Y direction. When the board | substrate G is constant, the positioning guide may be provided in the surface of the adsorption table 12, and a part of board | substrate may contact a guide, and positioning may be performed.

Above the glass substrate G, the laser light source 13, the galvano mirror 14 (beam deflection part), and the lens unit 15 (condensing member) are attached. The galvano mirror 14 and the lens unit 15 constitute the scanning optical system 16.

The Nd-YAG laser light source is used for the laser light source 13. The emission direction of the laser light source 13 is inclined 45 degrees downward to the left in the XZ plane.

The galvano mirror 14 arrange | positions a reflecting mirror on the optical path of the laser beam radiate | emitted from the laser light source 13, emits a laser beam inclined downward and to the right, and emits a beam by the oscillation motion of a reflecting mirror. Deflect in the XZ plane. The range of the rocking motion of the galvano mirror 14 at this time is adjusted according to the angle range which chamfers the object to be processed.

The lens unit 15 condenses a laser beam emitted from the galvano mirror 14 to form a condensing point. In addition, as a result of the emission direction being deflected by the galvano mirror 14 and the incident position of the laser beam into the lens unit 15 being scanned, the converging point by the laser beam emitted from the lens unit 15 is XZ. Scanned in the plane (that is, in the plane orthogonal to the edge line EL), the scanning trajectory is concave (convex toward the substrate outside) when viewed from the lens unit side.

For example, as shown in FIG. 2, the scanning locus of a light-converging point becomes the arc R0 which connects F0, F1, F2 by the rocking motion of the galvano mirror 14. As shown in FIG.

Here, the specific example of the lens unit 15 is demonstrated. The lens unit 15 is a lens unit that combines a non-telecentric fθ lens and a planar parallel plate, so that the scanning locus of the condensing point is the same as the arc R0 connecting the F0, F1, and F2 described above. It can be set as a shape (a convex shape toward a board | substrate outer side).

Since the galvano mirror 14 and the lens unit 15 are fixed to the frame of the apparatus, the positions of the condensing points and the scanning locus of the condensing points formed by these optical elements become constant positions and locus, A function indicating the coordinates (F0, F1, F2 coordinates) or the trajectory (arc R0) of the condensing point can be obtained by geometric calculation (or measurement).

Therefore, after setting the glass substrate G, by adjusting the position of the XYZ direction by the slide table 2, the pedestal 7, and the elevation table 11, condensing point F0 is set on the edge line EL, Or it is made to match with the position of the process plan surface set near the edge line EL.

Next, the control system of the chamfering processing apparatus LM is demonstrated. 3 is a block diagram of a control system. The chamfering processing apparatus LM is equipped with the control part 50 which consists of a memory which stores various control data, setting parameters, and a program (software), and a CPU which performs arithmetic processing.

This control part 50 is a table drive part 51 which drives the motor (motor 9 etc.) for positioning and moving the slide table 2, the pedestal 7, and the elevation table 11, and adsorption | suction. Each drive system of the suction mechanism drive part 52 which drives the suction chuck of the table 12, the beam deflector part drive part 53 which drives the galvano mirror 14, and the laser drive part 54 which irradiates a laser is controlled. In addition, the control unit 50 is connected to an input unit (not shown) made of a keyboard, a mouse, or the like, and a display unit (not shown) for performing various types of display on the display screen, and necessary information is displayed on the screen. Necessary commands and settings can be entered.

Next, the chamfering operation by the chamfering apparatus LM is demonstrated. The board | substrate G is mounted on the suction table 12, and position adjustment is performed using the camera 20. FIG. Then, the edge line EL is oriented in the Y direction, and the slide table 2, the pedestal 7, and the lift are placed so that the coordinates of the light collection point F0 are at the depth of the machining plan surface on or near the edge line EL. The position is adjusted by the table 11.

In this case, when the base 7 and the elevating table 11 are moved in conjunction with each other, the substrate can be moved in the inclined direction, and thus it can be used as a position adjustment mechanism in the depth direction of the substrate at the condensing point F0.

Then, the galvano mirror 14 and the laser light source 13 are driven to scan the laser beam in the vicinity of the edge line. As a result, the substrate material is melted and removed by ablation near the condensing point, and a chamfered surface is formed.

When chamfering is performed over the entire length of the edge line EL, the slide table 2 is moved at a constant speed to move the substrate G in the Y direction with respect to the scanning surface (XZ surface) of the laser beam. At this time, the slide table 2 may be moved intermittently so that the laser beam may be scanned multiple times for the same machining position.

In addition, when forming a chamfering surface deeply, it divides into multiple times and performs a chamfering process. That is, as shown in Fig. 4, the first chamfering process is performed while setting the condensing point at a shallow position close to the edge line EL and moving in the Y direction, and the second transition moves the condensing point to the inside of the substrate. Shift by little to repeat the same machining.

Next, the modified embodiment is described.

5 is an enlarged view of the scanning optical system when the light collecting member is changed from the lens unit 15 to the f? Lens 15a. In this case, since the scanning locus of the condensing point becomes a straight line in the XZ plane, the C plane can be chamfered.

In addition, if the optical parameters such as curved shape, curvature radius, and refractive index of the lens unit 15 are properly designed, a free curved lens capable of drawing a desired scanning trajectory can be created. The machined surface may be a parabolic surface, an elliptical surface, or any free curved surface. In addition, the same trace as the scanning trace by the lens can be drawn using a reflecting mirror instead of the lens.

Moreover, the same chamfering process can be performed even if a beam deflection part is changed into a polygon mirror from a galvano mirror.

6 is a modification of the scanning optical system. The same components as in Fig. 2 are omitted by the same reference numerals. In the scanning optical system of FIG. 2, the position of the focal point is scanned by the galvano mirror 14, but instead of the galvano mirror 14, a swing mechanism (not shown) is applied to the plane parallel plate of the lens unit 15. By attaching and rocking, the scanning trajectory is substantially the same as in FIG. 2.

FIG. 7 is an enlarged view of the scanning optical system when the light collecting member is replaced with a unit 15b consisting of a fθ mirror and a flat parallel plate rather than a telecentric one.

Also for the unit 15b, the scanning trajectory of the light-converging point and the arc R0 connecting F0, F1, and F2 described above are the same as when the non-telecentric fθ lens described in Fig. 2 is combined with the planar parallel plate. It can be set as the same shape (convex shape toward a board | substrate outer side).

Even when such a scanning optical system is used, the same chamfering process as in FIG. 2 can be performed.

In addition, by designing a non-spherical lens or an aspheric mirror with appropriate optical parameters using the finite element method, an optical system that is equivalent to a combination lens of a non-telecentric fθ lens and a planar parallel plate only with a single lens or a single mirror It is also possible to form a.

In addition, when performing the chamfering process along the edge line EL, although the slide table 2 which mounted the board | substrate G was moved in the chamfering apparatus LM of FIG. 2, the scanning optical system (galvano mirror 14, The lens unit 15 may be moved to the side.

As mentioned above, although the chamfering process with respect to a glass substrate was demonstrated, the same chamfering process can be implement | achieved by selecting the laser light source which can be used also with respect to the other brittle material substrate according to the absorption characteristic of each board | substrate material.

This invention is used for the chamfering process of brittle material board | substrates, such as a glass substrate.

2: slide table
7: pedestal
11: lifting table
12: adsorption table
13: laser light source
14 galvano mirror (beam deflection part)
14a: polygon mirror
15: lens unit (condensing member)
15a: fθ lens
15b: unit
16: scanning optical system

Claims (8)

A chamfering apparatus for chamfering a brittle material substrate,
Laser light source,
A light collecting member for collecting and guiding the laser beam radiated from the laser light source to the substrate;
A beam deflection portion provided on the optical path of the laser beam from the laser light source to the substrate via the light collecting member, and for deflecting the incident optical path of the laser beam to scan the position of the condensing point formed by the laser beam;
With respect to the edge line for chamfering, a laser beam is irradiated toward the edge line from an inclined front of two adjacent surfaces having the edge line as the short side, and the substrate surface or the inside of the substrate is located near the edge line. A substrate support for supporting the substrate such that the focusing point is scanned along the plane intersecting the edge line;
A laser driver for performing laser irradiation to remove a part of the substrate along the scanning trajectory of the light collecting point by laser ablation;
And a transfer mechanism for moving the substrate side or the laser beam side such that the focusing point moves relative along the edge line,
And the light collecting member is an optical element unit having an optical parameter such that a scanning trajectory of a light collecting point formed on a surface intersecting an edge line is concave or linear when viewed from the light collecting member. The method of claim 1,
The chamfering processing apparatus whose optical collection unit consists of f (theta) lenses or f (theta) mirrors. The method of claim 1,
A chamfering device, wherein the light collecting member is an optical element unit combining a non-telecentric fθ lens and a planar parallel plate. delete The method of claim 1,
The substrate support part includes a table on which the substrate is placed horizontally, and the light collecting member and the beam deflection portion are chamfered so that the condensing point is scanned with the center direction in a direction inclined 45 degrees with respect to the edge line of the substrate placed horizontally. Processing equipment. The method of claim 1,
The chamfering apparatus in which a beam deflection part is comprised by a galvano mirror or a polygon mirror. The method of claim 3,
The chamfering apparatus which the said planar parallel plate of the said light converging member is comprised so that rocking is possible, and serves as a beam deflection part. The method of claim 1,
The chamfering apparatus further equipped with the depth adjustment mechanism which adjusts the position of the said light converging point with respect to the board | substrate by moving the position of the said board | substrate or the said light converging member to the irradiation direction of a laser beam.

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