KR100583889B1 - Scribing device for fragile material substrate - Google Patents

Abstract

A plurality of laser spots are formed to have a plurality of intensity distribution peaks in a direction along a predetermined scribe line of the brittle material substrate, and brittleness is formed to form a scribe line between the intervals between the plurality of laser spots and the peak intervals of the intensity distribution of the laser spots. Set according to the type of material substrate.

Description

SCRIBING DEVICE FOR FRAGILE MATERIAL SUBSTRATE}             

The present invention is used when cutting brittle material substrates such as glass substrates and semiconductor wafers used in flat panel displays (hereinafter referred to as flat panel displays). It relates to a scribe device (scribe 裝置).

The FPD in which a pair of glass substrates are bonded is cut and manufactured to a predetermined size after bonding a pair of mother glass substrates each having a large dimension to each other. When cutting the mother glass substrate, a scribe line is formed on the mother glass substrate by a cutter in advance. When forming a scribe line by a cutter or when cutting a glass substrate after forming a scribe line, fine glass powder and glass cullets generate | occur | produced various defects.

In order to avoid the generation of fine glass powder and glass cullet when scribing and cutting using a cutter, a method of using a laser beam has recently been put into practice to form scribe lines. In the method of forming a scribe line on the glass substrate using the laser beam, the laser beam is irradiated from the laser oscillator 61 onto the glass substrate 50 as shown in FIG. The laser beam irradiated from the laser oscillation device 61 forms an elongated elliptical laser spot LS on the glass substrate 50 along a scribe predetermined line formed on the glass substrate 50. . The laser beam irradiated from the glass substrate 50 and the laser oscillation device 61 is relatively moved along the longitudinal direction of the laser spot.

The glass substrate 50 is heated to a temperature lower than the temperature at which the glass substrate 50 is melted by the laser beam, that is, the softening point of the glass substrate. As a result, the surface of the glass substrate 50 irradiated with the laser spot LS is heated without melting.

In the vicinity of the laser beam irradiation area on the surface of the glass substrate 50, a cooling medium such as cooling water is injected from the cooling nozzle 62 so that a scribe line is formed. On the surface of the glass substrate to which the laser beam is irradiated, after the compressive stress is generated by the heating by the laser beam, the cooling medium is injected to generate tensile stress. As the tensile stress is generated close to the region where the compressive stress is generated in this way, a stress gradient based on the respective stresses is generated between the regions, so that the glass substrate 50 is formed at the end of the glass substrate 50. A vertical crack BC in the thickness direction of the glass is advanced from the cut line formed in advance along the scribe line to form a scribe line.

In this way, the vertical cracks formed on the surface of the glass substrate 50 are called microscopic cracks because they are not normally visible to the naked eye.

FIG. 6 is a schematic perspective view showing an irradiation state of a beam on a glass substrate 50 scribed by a laser scribe device, and FIG. 7 is a plan view schematically showing a physical change state on the glass substrate 50.

The laser beam LB oscillated from the laser oscillation device 61 forms an elliptic laser spot LS on the surface of the glass substrate 50. For example, the laser spot LS has an elliptical shape having a long diameter b of 30.0 mm and a short diameter a of 1.0 mm, and is irradiated so that the direction of the scribe line to be formed coincides with the long axis. do.

In this case, the laser spot LS formed on the glass substrate 50 is such that the beam intensity of the outer circumferential edge is larger than the beam intensity of the central portion. Therefore, the beam intensity is maximized at each end portion in the long axis direction located on the scribe line, and the beam intensity at the center portion of the laser spot LS between the end portions is smaller than the beam intensity at each end portion. It is supposed to be built.

The glass substrate 50 is relatively moved along the major axis direction of the laser spot LS. Therefore, the glass substrate 50 is heated according to a large beam intensity at one end of the laser spot LS along the scribe scheduled line. After it is heated in accordance with the small beam intensity of the central portion of the laser spot LS and thereafter also in accordance with the large beam intensity. Then, the cooling water from the cooling nozzle 62 to the cooling point CP on the scheduled scribe line at a spacing L of 2.5 mm in the long axis direction of the laser spot LS, for example, in the area irradiated with the end of the laser spot LS. Is sprayed.

As a result, a temperature gradient occurs in the region between the laser spot LS and the cooling point CP, and a large tensile stress is generated in the region opposite to the laser spot LS with respect to the cooling point CP. By using the tensile stress, the blind crack BC is advanced along the scribe schedule line from the cut line formed by the wheel cutter 35 at the end portion of the glass substrate 50.

The glass substrate 50 is heated by an elliptic laser spot LS. In this case, the glass substrate 50 transfers heat from the surface to the inside in the vertical direction due to the large beam intensity at one end of the laser spot LS, but the laser beam moves relative to the glass substrate 50 so that the laser The portion heated by the end of the spot LS is heated according to the small beam intensity at the center of the laser spot LS and then again according to the large beam intensity at the end of the laser spot LS.

Thus, on the surface of the glass substrate 50, the part heated initially according to a large beam intensity is reliably conducted in the inside of a glass substrate, while being heated by the small beam intensity after that. In addition, the surface of the glass substrate 50 is prevented from being continuously heated in accordance with a large beam intensity, thereby preventing melting of the surface of the glass substrate 50. After that, when the glass substrate 50 is heated again according to a large beam intensity to ensure that the inside of the glass substrate 50 is reliably heated, the compressive stress is generated on the surface and the inside of the glass substrate 50.

After this time elapses, the cooling water is injected into the cooling point CP near the region where the compressive stress is generated, thereby causing the tensile stress. When compressive stress occurs in the heating zone by the laser spot LS and tensile stress occurs in the cooling point CP by the coolant, the compressive stress generated in the thermal diffusion region HD between the laser spot LS and the cooling point CP As a result, a large tensile stress is generated in the region opposite to the laser spot with respect to the cooling point CP. Using this tensile stress, the blind crack BC is advanced along the scribe schedule line from the cut line formed by the wheel cutter 35 at the end of the glass substrate 50.

In addition, by slowing the movement speed of the laser beam relative to the glass substrate 50, the blind crack BC (vertical crack) is diffused in the thickness direction of the glass substrate 50 and progresses along the scheduled scribe line while penetrating the glass substrate 50. (Scribing like this is usually called full body cut of the glass substrate 50).

In the above description of the conventional example, the blind crack BC is advanced from the cut line formed by the wheel cutter 35 at the end of the glass substrate 50. However, the cut line formed by the wheel cutter 35 is always glass. It may not be the end of the substrate 50.

In addition, it is not necessary to form the groove which goes to the glass substrate 50 in formation of blind crack BC.

When the blind crack BC as a scribe line is formed on the glass substrate 50, the glass substrate 50 is supplied to the next cutting process to give a bending moment in the width direction of the blind crack BC, which is the direction indicated by the arrow in FIG. Force is applied to the glass substrate so that it acts. Accordingly, the glass substrate 50 is cut along the scribe line, which is the line of the blind crack BC.

In such a scribing apparatus, when conditions such as material and thickness of the glass substrate 50 are changed, it is necessary to also change the heating conditions by the laser beam. In the laser oscillation apparatus, the arrangement, the focus, and the like of an optical device such as a lens are set in advance so that the oscillated laser beam becomes a laser spot LS of a predetermined ellipse shape on the glass substrate 50, and the heating conditions by the laser beam are preset. In order to change the shape, the shape of the laser spot LS formed on the surface of the glass substrate 50 needs to be changed. However, in order to change the shape of the laser spot LS, there is a problem that the adjustment is not easy, such as replacement of the lens of the optical device, adjustment of the focus, and adjustment of the laser mode oscillated from the laser oscillator.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and its object is to meet the conditions of the brittle material substrate even when the conditions such as the material and thickness of the brittle material substrate are changed when the scribe line is formed on the brittle material substrate such as the glass substrate. It is an object of the present invention to provide a scribing apparatus for a brittle material substrate that can be easily coped.

The scribe device of the brittle material substrate of the present invention has a softening point of the brittle material substrate along an area where a scribe line is to be formed on the surface of the brittle material substrate. 예정 A scribe scheduled line by continuously cooling the laser beam near the laser spot while irradiating the laser beam continuously or at high speed so as to form an irradiation spot having a lower temperature than A scribing apparatus for a brittle material substrate in which vertical cracks are formed along a scribe setting line, comprising a plurality of laser oscillators generating laser beams having the same wavelength or different wavelengths. The laser beam to be oscillated has a scanning speed of the laser beam so that a plurality of irradiation spots are formed on the brittle material substrate. It is characterized by being irradiated to the brittle material substrate in a state in which the scanning path is adjusted at high speed.

And the plurality of laser spots have peaks of a plurality of intensity distributions.

In addition, the intensity distribution of the plurality of laser spots is characterized in that the non-gauss mode (non-gauss mode).

In addition, the scribing apparatus for the brittle material substrate of the present invention continuously or continuously irradiates a laser beam such that an irradiation spot having a temperature lower than the softening point of the brittle material substrate is formed along a region where a scribe line is to be formed on the surface of the brittle material substrate. A scribing apparatus for a brittle material substrate in which vertical cracks are formed along a scribe scheduled line by continuously cooling the area near the laser spot while irradiating at high speed intermittently,

A laser beam oscillated from a plurality of laser oscillators, respectively, is synthesized to obtain peaks of a plurality of intensity distributions and is irradiated to a brittle material substrate.

The intensity distribution of the laser beam oscillated from the laser oscillator is characterized in that the Gaussian mode (gauss mode).

The intensity distribution of the laser beam oscillated from the laser oscillator is characterized in that the non-Gaussian mode.

In addition, the scribing apparatus for the brittle material substrate of the present invention continuously or continuously irradiates a laser beam such that an irradiation spot having a temperature lower than the softening point of the brittle material substrate is formed along a region where a scribe line is formed on the surface of the brittle material substrate. A scribing apparatus for a brittle material substrate in which vertical cracks are formed along a scribe scheduled line by continuously cooling an area near the laser spot while irradiating at high speed intermittently, wherein a plurality of intensity distributions are generated from a laser beam oscillated from one laser oscillator. It is characterized in that it is divided once to obtain a peak of and synthesized and irradiated to the brittle material substrate.

The intensity distribution of the laser beam oscillated from the laser oscillator is characterized in that the Gaussian mode.

The intensity distribution of the laser beam oscillated from the laser oscillator is characterized in that the non-Gaussian mode.

1 is a front view showing an example of an embodiment of a scribing apparatus for a brittle material substrate in the present invention.

2 is a schematic configuration diagram showing an example of a laser oscillation apparatus and an optical apparatus used in the scribing apparatus according to the present invention.

Fig. 3 (a) is a schematic block diagram showing another example of the laser oscillation apparatus and the optical apparatus used in the scribing apparatus of the present invention, and Figs. 3 (b) and (c) are respectively irradiated to the glass substrate from the apparatus. It is a schematic diagram which shows the intensity distribution of a laser spot.

Fig. 4 (a) is a schematic block diagram showing another example of the laser oscillation apparatus and the optical apparatus used in the scribing apparatus of the present invention, and Figs. 4 (b) and (c) are irradiated from the apparatus to the glass substrate, respectively. It is a schematic diagram which shows the intensity distribution of the laser spot.

5 is a schematic view for explaining the operation of the scribing apparatus using the laser beam.

6 is a perspective view schematically showing a state of a glass substrate during a scribe line forming operation by a laser scribe device.

7 is a plan view schematically showing a state of the glass substrate.

8A is a schematic diagram showing a plurality of laser spots formed on a glass substrate by a laser oscillation apparatus and an optical apparatus used in the scribing apparatus of the present invention shown in FIGS. 3A and 4B, Fig. 8B is an enlarged view of the laser spot and the intensity distribution diagram.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described based on drawing.

1 is a schematic configuration diagram showing an embodiment of a scribe device for a brittle material substrate according to the present invention. This scribing apparatus is used to form a scribe line on the glass substrate 50, for example, when cutting a glass substrate used for FPD, and a horizontal mounting table as shown in FIG. (Iii) A slide table 12 which reciprocates along a predetermined horizontal direction (Y direction) is provided on the frame 11).

The slide table 12 is supported by a pair of guide rails 14 and 15 arranged in parallel in the Y direction on the upper surface of the mounting table 11 so as to be able to slide along each guide rail 14 and 15 in a horizontal state. In the middle part of both guide rails 14 and 15, the ball screw 13 is installed in parallel with each guide rail 14 and 15 so that it may rotate with a motor (not shown). The ball screw 13 is capable of forward rotation and reverse rotation, and a ball nut 16 is screwed into the ball screw 13. The ball nut 16 is integrally provided on the slide table 12 so as not to rotate, and slides in both directions along the ball screw 13 by forward and reverse rotation of the ball screw 13. As a result, the slide table 12 integrally attached to the ball nut 16 slides along the guide rails 14 and 15 in the Y direction.

On the slide table 12, the pedestal 19 is arranged in a horizontal state. The pedestal 19 is slidably supported by a pair of guide rails 21 arranged in parallel on the slide table 12. Each guide rail 21 is arranged along the X direction orthogonal to the Y direction, which is the slide direction of the slide table 12. In addition, a ball screw 22 is arranged in the center between each guide rail 21 in parallel with each guide rail 21, and the ball screw 22 is rotated forward and reverse by the motor 23.

The ball screw 22 is provided with the ball nut 24 screwed on. The ball nut 24 is integrally installed on the pedestal 19 so as not to rotate, and moves in both directions along the ball screw 22 by the forward and reverse rotation of the ball screw 22. Accordingly, the pedestal 19 slides in the X direction along each guide rail 21.

A rotation mechanism 25 is provided on the pedestal 19, and a rotation table 26 on which the glass substrate 50 to be cut is placed is provided on the rotation mechanism 25 in a horizontal state. The rotating mechanism 25 rotates the rotary table 26 about the center axis | shaft along a vertical direction. On the turntable 26, the glass substrate 50 is fixed by, for example, a suction chuck.

Above the turntable 26, the support base 31 is arrange | positioned with the appropriate space | interval with the turntable 26. FIG. The support 31 is supported in a horizontal state at the lower end of the optical holder 33 which is arranged in a vertical state. The upper end of the optical holder 33 is attached to the lower surface of the mounting table 32 provided on the mounting table 11. On the mounting table 32, a laser oscillator 34 for oscillating a laser beam is provided.                 

The laser oscillation device 34 irradiates a laser beam irradiated from the laser oscillator with an optical device supported in the optical holder 33.

The support 31 attached to the lower end of the optical holder 33 is provided with a wheel cutter 35 for forming a cut line at the end face of the glass substrate 50. The wheel cutter 35 is disposed along a line shape along the longitudinal direction of the laser beam at an appropriate interval with respect to the longitudinal end of the laser beam irradiated onto the glass substrate 50, and a tip holder. It is supported so that it can be raised and lowered by 36).

In addition, the support 31 is provided with a cooling nozzle 37 in proximity to the optical holder 33. From this cooling nozzle 37, cooling media such as cooling water, He gas, N ₂ gas, and CO ₂ gas are blown onto the glass substrate 50. The cooling medium injected from the cooling nozzle 37 is injected at a position close to the longitudinal end of the laser spot irradiated from the optical holder 33 to the glass substrate 50.

The mounting table 32 is provided with a pair of CCD cameras 38 and 39 for photographing alignment marks imprinted on the glass substrate 50 in advance. Monitors 28 and 29, which display i), are provided on the mounting table 32, respectively.

2 is a schematic configuration diagram of an optical device installed in the laser oscillation device 34 and the optical holder 33. The laser oscillator 34 includes a laser oscillator 34a for oscillating one laser beam, and the laser beam oscillated from the laser oscillator 34a is X-axis galvanomirror 34b, Y-axis galvanometer mirror 34c, and The glass substrate 50 is irradiated through the f-θ lens 33a disposed in the optical holder 33.

The X-axis galvanometer mirror 34b rotates at high speed, and scans the laser beam radiated from the laser oscillator 34a at high speed and reflects it toward the Y-axis galvanometer mirror 34c. Similarly, the Y-axis galvano mirror 34c rotates at high speed, and the laser beam irradiated from the X-axis galvano mirror 34c is scanned at high speed and reflected toward the glass substrate 50. The laser beam reflected by the Y-axis galvano mirror 34c is irradiated onto the glass substrate 50 through the f-? Lens 33a.

The laser beam irradiated onto the glass substrate 50 through the f-θ lens 33a has a long axis along the Y-axis direction based on the respective rotation speeds of the X-axis galvano mirror 34b and the Y-axis galvano mirror 34c. The elliptical laser spot LS1 and the major axis form the elliptical laser spot LS2 along the X-axis direction, respectively.

The lens used for the laser beam reflected by the Y-axis galvano mirror 34c is not limited to the f-θ lens.

The interval between the laser beams LS1 and LS2 is changed by adjusting the respective rotation speeds of the X-axis galvano mirror 34b and the Y-axis galvano mirror 34c. Cooling water is injected from the cooling nozzle 37 at a position where the long axis is close to the elliptical shape LS2 along the X axis direction.

When scribing the glass substrate 50 by such a scribing apparatus, first, the glass substrate 50 cut | disconnected to predetermined size is mounted on the rotating table 26 of a scribing apparatus, and is fixed by a suction means. And the alignment mark formed in the glass substrate 50 by CCD cameras 38 and 39 is image | photographed. The photographed alignment marks are displayed on the monitors 28 and 29, and the glass substrate 50 is positioned at a predetermined position based on the display.

A laser is scribed to the glass substrate 50 positioned relative to the support 31 positioned at the lower end of the optical holder 33. When scribing the glass substrate 50, each laser spot LS1 and LS2 irradiated from the optical holder 33 to the surface of the glass substrate 50 is formed on the scribe setting line of the glass substrate 50. As shown in FIG. Positioning of the turntable 26 is performed by the slide of the slide table 12, the slide of the base 19, and the rotation of the turntable 26 by the rotating mechanism 25. As shown in FIG.

When the rotary table 26 is positioned relative to the support 31, the rotary table 26 slides along the X direction so that the end portion of the glass substrate 50 faces the wheel cutter 35. The wheel cutter 35 is lowered to form a cut line along the scribe line on the end of the glass substrate 50.

Thereafter, the rotary table 26 slides in the X direction along the scribe scheduled line, and the laser beam is oscillated from the laser oscillation device 34, and at the same time, a cooling medium, for example, cooling water, is injected from the cooling nozzle 37 together with the compressed air.

Along the scanning direction of the glass substrate 50 formed on the glass substrate 50 by a laser beam oscillated from the laser oscillation unit 34, the major axes of the laser spot LS1 of the long oval shape in the Y-axis direction and the major axis along the X-axis direction length The long elliptic laser spot LS2 is formed at a predetermined distance apart. Cooling water is then injected into the laser spot LS2 at a predetermined interval on the side opposite to the moving direction of the glass substrate 50. As a result, blind cracks are formed in the glass substrate 50 as scribe lines.

When a blind crack as a scribe line is formed on the glass substrate 50, the glass substrate 50 is supplied to the next cutting process so that a force is applied to the glass substrate so that a bending moment acts in the width direction of the scribe line. As a result, the glass substrate 50 is cut along the scribe line.

When the type of the glass substrate 50 on which the scribe line is formed by the scribing device is changed, the rotation speeds of the X-axis galvano mirror 34b and Y-axis galvano mirror 34c in the laser oscillation device 34 are adjusted, respectively, and the glass is controlled by the laser beam. The distance between the laser spots LS1 and LS2 formed on the surface of the substrate 50 is adjusted.

In addition, the intensity distribution along the long axis directions of the laser spots LS1 and LS2 is changed by changing the scanning pattern of the laser beam by the X-axis galvano mirror 34b and the Y-axis galvano mirror 34c. It is possible to have a plurality of peaks.                 

From these, the distance between the laser spots LS1 and LS2 and the state of the respective intensity distributions become suitable for the kind of material of the glass substrate 50 and the like, so that the laser beam is irradiated onto the glass substrate 50, so that the glass substrate 50 is blind over the inside thereof. The crack is reliably heated to the state that is necessary for the crack to be deeply formed.

Further, by varying the scanning pattern of the laser beam by the X-axis galvano mirror 34b and the Y-axis galvano mirror 34c, a plurality of laser spots LS2 are formed in series at predetermined intervals, and the intensity distribution of the formed plurality of laser spots is distributed. You can set various states of.

Preferably, the peaks of the plurality of intensity distributions formed in the plurality of laser spots LS2 are formed in a straight line so that the glass substrate 50 can be more adapted to the type of material or the like, thereby forming a blind crack deeper. Setting becomes easy.

As described above, a plurality of laser spots are formed by adjusting the scanning speed and the scanning path of the laser beam at high speed. These plurality of laser spots are formed on the glass substrate 50 as if they were multi-mode laser spots.

When the glass substrate 50 is thick or when the thermal conductivity is low, the distance between the laser spots LS1 and LS2 is set small, and when there are a plurality of LS2s, the distance between the LS2s is set small, and the long- axis laser spot along the X axis. The peak interval of the intensity distribution is also set small. On the contrary, when the glass substrate 50 is thin or the thermal conductivity is high, the distance between the laser spots LS1 and LS2 is set to be large, and when the LS2 is plural, the distance between the LS2 is set to be large and the long axis of the plurality of laser spots along the X axis is set. The peak interval of the intensity distribution is also set large.

In this way, even when conditions such as the material of the scribed glass substrate 50 are changed, the laser beam irradiated onto the glass substrate can be easily changed to a state suitable for the glass substrate 50, so that the glass substrate with various conditions can be easily coped with. .

The laser spot LS1 is formed so that the whole spot becomes a uniform intensity distribution. Alternatively, the laser spot LS1 preferably has a long axis along the Y axis so as to have two intensity distribution peaks across the scribe line.

As a result, a squeezed stress is applied to the scribe scheduled line from both sides of the line, and abnormal cracks different from the blind cracks when heated to the scribe scheduled line on the glass substrate 50 by the laser spot LS1 are applied. ) Can be prevented from occurring at the end of the glass substrate 50 or the like.

In the above description, in the case of the scribing apparatus including the laser oscillation device 34a and the optical device as shown in FIG. 2, and the laser oscillation device 34 and the optical holder 33 for oscillating one laser beam from the laser oscillation device 34a. As described above, the scribing apparatus may include a plurality of laser oscillation apparatuses and a plurality of optical holders corresponding thereto, and the optical apparatus as shown in FIG. 2 is provided in the plurality of optical holders.

Thus, by providing a some laser oscillation apparatus and a some optical holder, the laser beam which has a some different wavelength can be irradiated on the glass substrate 50. FIG. Usually, the material has a wavelength range of light that is optimal for absorbing light, and when a laser beam near the wavelength range is irradiated onto the material, it is heated to the inside of the material in a short time. Therefore, blind cracks are easily formed by irradiating a laser beam close to the absorption wavelength of light of the brittle material substrate.

In order to form a line of blind cracks optimal for cutting various brittle material substrates, the spacing of the plurality of laser spots formed on the brittle material substrate, the intensity distribution of the plurality of laser spots, and the wavelength of the laser beam forming the plurality of laser spots It needs to be optimally adjusted. For this reason, the scribing apparatus provided with the some laser oscillation apparatus and the some optical holder is used.

In addition, the intensity distribution of the laser spot LS1 and the plurality of laser spots LS2 may be in a non-gauss mode.

3 is a schematic configuration diagram showing another example of the laser oscillation device 34 and the optical device. The laser oscillation device 34 includes a first laser oscillator 34a and a second laser oscillator 34g. Each of the first and second laser oscillators 34a and 34g irradiates the laser beams having intensity distributions in a Gaussian mode along the horizontal direction so as to be parallel to each other.

The laser beam oscillated from the first laser oscillator 34a is vertically reflected toward the glass substrate 50 by the first reflecting mirror 33c attached to the moving stage 33d. The first reflecting mirror 33c is configured to move in a direction approaching and separating from the first laser oscillator 34a by the moving stage 33d. The movement stage 33d is moved by a stepping motor, whereby the position of the first reflection mirror 33c relative to the first laser oscillator 34a is finely adjusted.

Moreover, the laser beam irradiated from the 2nd laser oscillator 34g is irradiated with the 1st semi-circle mirror 33f fixed to the movement stage 33d 'below the 1st reflection mirror 33c. The first semi-circular mirror 33f transmits the laser beam reflected by the first reflection mirror 33c disposed above and reflects the laser beam emitted from the second laser oscillator 34g downward.

The laser beams oscillated from each of the first and second laser oscillators irradiated with the first semicircular mirror 33f are in a phase shifted state, and the peaks of the pair of intensity distributions in the first semicircular mirror 33f are separated. To a laser beam. In this case, the peak spacing of each intensity distribution can be changed and set at any time by adjusting the positions of the first reflection mirror 33c and the first semicircular mirror 33f by the moving stages 33d and 33d '.

In this way, the laser beam synthesized by the first semicircular mirror 33f to have the peak of the pair of intensity distributions is irradiated onto the glass substrate 50 through the f-? Lens 33a.

On the other hand, the lens used for the laser beam synthesized by the first semi-circular mirror 33f is not limited to the f-θ lens.

The laser beam synthesized by the first semi-circular mirror 33f is irradiated onto the glass substrate 50 so that the peak of the intensity distribution is in the state along the X axis direction which is the moving direction of the glass substrate 50.

The scribing device including the laser oscillation device and the optical device is also irradiated with a laser beam having a peak of a pair of intensity distributions along the X axis direction with respect to the glass substrate 50 moving along the X axis direction. Heated. The cooling medium is sprayed onto the surface of the glass substrate 50 close to the heated portion by the irradiation of the laser beam, thereby forming a blind crack as a scribe line on the glass substrate.

In this case, if the material or thickness of the glass substrate 50 on which the blind crack is formed by the scribing device is changed, the reflection position of the laser beam with respect to the first semi-circular mirror 33f by the first reflection mirror 33c is shifted to the stage 33d and / or 33d ', the peak spacing of the intensity distribution of the laser spot formed on the surface of the glass substrate 50 by the laser beam is adjusted. As a result, the glass substrate 50 is in a suitable state. Thus, when a laser spot having a pair of intensity distribution peaks along the moving direction of the glass substrate 50 is formed on the glass substrate 50, it is effectively heated up to the state required to form a blind crack over the inside of the glass substrate 50. do.

Therefore, even in the scribing apparatus having the optical apparatus shown in Fig. 3, even if conditions such as the material of the scribing glass substrate 50 are changed, various physical parameters of the laser beam irradiated to the glass substrate are suitable for the glass substrate 50. It can be easily changed to a state, and can easily respond also to the glass substrate in the case where various conditions change.

Fig. 3B is a schematic diagram showing the manner in which a laser spot having a pair of intensity distribution peaks with respect to the glass substrate 50 is obtained when the intensity distribution of the laser beams oscillated from the laser oscillators 34a and 34g is Gaussian mode.

On the other hand, the distance between the peaks can be changed by adjusting the moving stages 33d and 33d ', and if necessary, the order of the two peaks can be changed.

Further, by moving the first reflecting mirror 33c of FIG. 3A at a high pitch several times at high speed, a plurality of laser spots as shown in FIG. 8 can be formed on the glass substrate 50. The distance between the laser spots formed at this time is the movement amount at which the first reflection mirror 33c is pitch-feeded. Even if the conditions such as the material of the glass substrate 50 to be scribed are changed by changing the amount of movement, the intervals of the plurality of laser beams irradiated onto the glass substrate can be easily changed to a state suitable for the glass substrate 50. It can respond easily to a board | plate.

When the intensity distribution of the laser beam oscillated from the laser oscillators 34a and 34g is in the Gaussian mode, the outer circumferential portion of the laser spot formed on the glass substrate 50 does not directly participate in heating of the glass substrate 50, There is a fear that the heating efficiency is lowered. For this reason, as shown in Fig. 3C, the intensity distribution of the laser beam oscillated from the laser oscillators 34a and 34g is preferably in the non-Gaussian mode.

Further, in addition to the configuration shown in Fig. 3, a plurality of laser oscillators and corresponding semi-circular mirrors and means for moving the semi-circular mirrors are irradiated to the glass substrate 50 through the lens of 33a, and formed on the glass substrate 50. It is preferable that the laser spot is configured such that peaks of a plurality of intensity distributions are obtained along the moving direction of the glass substrate 50.

The plurality of laser oscillators may oscillate laser beams of different wavelengths.

4 is a schematic configuration diagram showing another example of the laser oscillation device 34 and the optical device. In this case, only the first laser oscillator 34a is provided in the laser oscillator 34, and the laser beam oscillated from the laser oscillator 34a is irradiated with the second half mirror 33b fixedly disposed at the moving stage 33b '. It is supposed to be. The second half mirror 33b divides the laser beam oscillated from the laser oscillator 34a into a beam which is transmitted toward the first reflection mirror 33c and a beam which is reflected downward.

The laser beam reflected downward by the second half mirror 33b is irradiated to the first semi-circular mirror 33f by the second reflection mirror 33e disposed below the second half mirror 33b.

Other configurations are similar to those of the laser oscillation apparatus and the optical apparatus shown in FIG.

In this configuration, the laser beam split by the second half mirror 33b is synthesized by the first semi-circular mirror 33f and irradiated onto the glass substrate 50 through the f-θ lens 33a to provide a pair of intensities on the surface of the glass substrate 50. Laser spots with peaks in the distribution are formed. The peak spacing of the pair of intensity distributions in the laser spot is similar to the case of Fig. 3, and the reflection position of the laser beam with respect to the first semi-circular mirror by the first reflection mirror 33c is determined by the movement stages 33d, 33d 'and 33b'. It can set suitably by adjusting by movement. Therefore, even if the conditions of the material of the scribing glass substrate 50 are changed, the intensity distribution and the distance between the laser beams irradiated onto the glass substrate 50 can be easily changed to a suitable state for the glass substrate 50. It can be easily responded to.

Fig. 4 (b) shows how a pair of thermal energy peaks of laser spots are obtained with respect to the glass substrate 50 when the intensity distribution of the laser mode oscillated from the laser oscillator 34a is in the Gaussian mode. Schematic diagram.

On the other hand, the distance between the peaks can be changed by adjusting the moving stages 33d, 33d 'and 33b', and if necessary, the order of the two peaks can be changed.

Further, by moving the first reflecting mirror 33c of FIG. 4A at a high speed several times, a plurality of laser spots as shown in FIG. 8 can be formed on the glass substrate 50. The distance between the laser spots formed at this time is the movement amount at which the first reflection mirror 33c is pitch-feeded. Even if the conditions such as the material of the glass substrate 50 to be scribed are changed by changing the amount of movement, the intervals of the plurality of laser beams irradiated onto the glass substrate can be easily changed to a state suitable for the glass substrate 50. It can be easily responded to.

In this case, when the laser beam oscillated from one laser oscillator 34a is divided and synthesized, when the intensity distribution of the laser beam oscillated from the laser oscillator 34a is in the Gaussian mode, the outer circumference of the laser spot formed on the glass substrate 50 is obtained. In the scribe of the glass substrate 50, a part does not immediately participate in heating after irradiation, and there exists a possibility that the heating efficiency of the glass substrate 50 may fall. For this reason, as shown in Fig. 4C, the intensity distribution of the laser beam oscillated from the laser oscillator 34a is preferably in the non-Gaussian mode.

According to the present invention, in the technical field of the scribing apparatus for a brittle material substrate, even if the type or thickness of the brittle material substrate such as the glass substrate on which the blind crack is formed is changed, the blind can be reliably deep with respect to various brittle material substrates. Cracks may form.

Claims (16)

In order to form an irradiation spot at a temperature lower than the softening point of the brittle material substrate along a region where a scribe line is to be formed on the surface of the brittle material substrate. Along the scribe setting line by continuously cooling the laser beam near the laser spot while irradiating the laser beam continuously or at high speed intermittently. In a scribe device for a brittle material substrate in which a vertical crack is formed, One laser oscillator, The laser beam oscillated from the laser oscillator is irradiated, and a plurality of laser spots are formed on the brittle material substrate by the irradiated laser beam, and the scanning speed and the scanning path of the irradiated laser beam Is provided with optical means configured such that each of the plurality of laser spots has a peak of a plurality of intensity distributions, The thickness of the brittle material substrate is thicker than the thickness of the brittle material substrate suitable for the spacing of the plurality of laser spots set in advance, and the brittleness is greater than the thermal conductivity of the brittle material substrate suitable for the spacing of the plurality of laser spots set in advance. In at least one of the cases where the thermal conductivity of the material substrate is low, the spacing of the plurality of laser spots formed along the scribe line by the optical means is adjusted to be smaller than the preset spacing of the plurality of laser spots. The peak spacing of the intensity distributions of the plurality of laser spots is set smaller than the peak spacing of the intensity distributions of the plurality of laser spots preset. The thermal conductivity of the brittle material substrate when the thickness of the brittle material substrate is thinner than the thickness of the brittle material substrate suitable for the spacing of the plurality of laser spots preset, and the thermal conductivity of the brittle material substrate suitable for the spacing of the plurality of laser spots preset. In at least one of these cases, the spacing of the plurality of laser spots formed along the scribe line by the optical means is set larger than the spacing of the plurality of laser spots and the intensity of the plurality of laser spots. A scribing apparatus for a brittle material substrate, characterized in that the peak spacing of the distribution is set larger than the peak spacing of the intensity distribution of the plurality of laser spots set in advance. delete The method of claim 1, And a intensity distribution of the plurality of laser spots in a non-gauss mode. In the vicinity of the laser spot while irradiating the laser beam continuously or at high speed intermittently so that an irradiation spot at a temperature lower than the softening point of the brittle material substrate is formed along the region where the scribe line is to be formed on the surface of the brittle material substrate. A scribing apparatus for a brittle material substrate in which vertical cracks are formed along a scribe line by cooling the region continuously, A plurality of laser oscillators, A first laser beam and a second laser beam oscillated from the plurality of laser oscillators, respectively; A reflecting mirror reflecting the first laser beam, A semi-circular mirror combining the first laser beam and the second laser beam, A moving stage for changing and setting the position of the reflecting mirror in a direction approaching and separating from the laser oscillator. And The synthesized plurality of laser beams each intensity distribution of the laser spot formed on the brittle material substrate to heat the brittle material substrate to the state where the vertical crack is deeply formed over the inside of the brittle material substrate by the moving stage. A scribe apparatus for a brittle material substrate, characterized in that the peak spacing is set by varying the peak spacing according to the conditions of the brittle material substrate. In the vicinity of the laser spot while irradiating the laser beam continuously or at high speed intermittently so that an irradiation spot at a temperature lower than the softening point of the brittle material substrate is formed along the region where the scribe line is to be formed on the surface of the brittle material substrate. A scribing apparatus for a brittle material substrate in which vertical cracks are formed along a scribe line by cooling the region continuously, A plurality of laser oscillators, A reflection mirror reflecting the laser beam oscillated from the laser oscillator, A moving stage for changing and setting the position of the reflecting mirror in the direction of approach and separation from the laser oscillator. And By the movement stage, the position of the reflecting mirror is moved at a high pitch by moving, According to the condition of the brittle material substrate, the pitch transfer movement amount of the reflecting mirror is changed to change the spacing of the plurality of laser spots, and the brittle material substrate has its vertical crack over the inside of the brittle material substrate by the laser beam. A scribing apparatus for a brittle material substrate, characterized in that the brittle material substrate is heated to such a deeply formed state. delete delete In the vicinity of the laser spot while irradiating the laser beam continuously or at high speed intermittently so that an irradiation spot at a temperature lower than the softening point of the brittle material substrate is formed along the region where the scribe line is to be formed on the surface of the brittle material substrate. A scribing apparatus for a brittle material substrate in which vertical cracks are formed along a scribe line by cooling the region continuously, With one laser oscillator, A laser beam oscillated from the laser oscillator, A half mirror for dividing the laser beam into a first laser beam and a second laser beam, A reflecting mirror reflecting the first laser beam, A semi-circular mirror combining the first laser beam and the second laser beam, A first moving stage for changing and setting the position of the half mirror in a direction approaching and separating from the laser oscillator; A second moving stage for changing and setting the position of the reflecting mirror in a direction approaching and separating from the laser oscillator; Third moving stage for changing and setting the position of the semi-circular mirror in the direction of approach and separation from the laser oscillator And The first laser beam and the second laser beam are combined to form a laser spot having a peak of a pair of intensity distributions on the brittle material substrate, and the pair of intensity distributions according to the conditions of the brittle material substrate. The peak spacing is changed by adjusting the positions of the first to third moving stages, and the brittle material substrate is heated by the laser beam to a state where the vertical crack is deeply formed over the inside of the brittle material substrate. A scribe device for a brittle material substrate, characterized in that. The method according to any one of claims 4, 5 and 8, And an intensity distribution of the laser beam oscillated from the laser oscillator is a Gaussian mode. The method according to any one of claims 4, 5 and 8, And an intensity distribution of the laser beam oscillated from the laser oscillator is a non-Gaussian mode. In the vicinity of the laser spot while irradiating the laser beam continuously or at high speed intermittently so that an irradiation spot at a temperature lower than the softening point of the brittle material substrate is formed along the region where the scribe line is to be formed on the surface of the brittle material substrate. In the scribing method of a brittle material substrate in which vertical cracks are formed along a scribe line by cooling the region continuously, The thickness of the brittle material substrate is thicker than the thickness of the brittle material substrate suitable for the spacing of the plurality of laser spots set in advance, and the brittleness is greater than the thermal conductivity of the brittle material substrate suitable for the spacing of the plurality of laser spots set in advance. In at least one of the cases where the thermal conductivity of the material substrate is low, the spacing of the plurality of laser spots formed along the scribe line by the optical means is adjusted to be smaller than the preset spacing of the plurality of laser spots. The peak spacing of the intensity distributions of the plurality of laser spots is set smaller than the peak spacing of the intensity distributions of the plurality of laser spots preset. The thermal conductivity of the brittle material substrate when the thickness of the brittle material substrate is thinner than the thickness of the brittle material substrate suitable for the spacing of the plurality of laser spots set in advance, and the thermal conductivity of the brittle material substrate suitable for the spacing of the plurality of laser spots preset. In at least one of these cases, the spacing of the plurality of laser spots formed along the scribe line by the optical means is set larger than the spacing of the plurality of laser spots and the intensity of the plurality of laser spots. So that the peak spacing of the distribution is set to be larger than the peak spacing of the intensity distributions of the plurality of laser spots preset. The laser beam whose scanning speed and the scanning path are adjusted by the optical means is irradiated to the brittle material substrate to adjust the spacing of the plurality of laser spots and the peak spacing of the intensity distribution of the plurality of laser spots. Scribe method. In the vicinity of the laser spot while irradiating the laser beam continuously or at high speed intermittently so that an irradiation spot at a temperature lower than the softening point of the brittle material substrate is formed along the region where the scribe line is to be formed on the surface of the brittle material substrate. In the scribing method of a brittle material substrate in which vertical cracks are formed along a scribe line by cooling the region continuously, The laser beams oscillated from the plurality of laser oscillators are synthesized using a reflection mirror and a semicircle mirror to form a laser spot on the surface of the brittle material substrate, and the position of the reflection mirror is determined according to the conditions of the brittle material substrate. By varying the peak spacing of the plurality of intensity distributions of the laser spot by changing in the direction of approach and separation from the oscillator, the brittle material substrate is heated to a state where the vertical crack is deeply formed over the inside of the brittle material substrate. A method of scribing a brittle material substrate. In the vicinity of the laser spot while irradiating the laser beam continuously or at high speed intermittently so that an irradiation spot at a temperature lower than the softening point of the brittle material substrate is formed along the region where the scribe line is to be formed on the surface of the brittle material substrate. In the scribing method of a brittle material substrate in which vertical cracks are formed along a scribe line by cooling the region continuously, A plurality of laser spots are formed on the surface of the brittle material substrate by moving the positions of the plurality of reflection mirrors reflecting the laser beams oscillated from the plurality of laser oscillators at high speed in the direction of approach and separation from the laser oscillator. By changing the pitch transfer movement amount of the reflecting mirror according to the condition of the brittle material substrate and changing the spacing of the plurality of laser spots, the laser beam has a state where the vertical crack is deeply formed inside the brittle material substrate. A method of scribing a brittle material substrate, characterized in that for heating the brittle material substrate. In the vicinity of the laser spot while irradiating the laser beam continuously or at high speed intermittently so that an irradiation spot at a temperature lower than the softening point of the brittle material substrate is formed along the region where the scribe line is to be formed on the surface of the brittle material substrate. In the scribing method of a brittle material substrate in which vertical cracks are formed along a scribe line by cooling the region continuously, A half mirror for dividing a laser beam oscillated from one laser oscillator into a first laser beam and a second laser beam, a reflecting mirror reflecting the first laser beam, the first laser beam and the second laser beam By using a semicircular mirror to be synthesized, a laser spot is formed on the surface of the brittle material substrate, and the position of the half mirror, the reflective mirror and the semicircular mirror is approached to the laser oscillator according to the conditions of the brittle material substrate. And changing the peak spacing of the plurality of intensity distributions of the laser spot by changing in the separation direction, thereby heating the brittle material substrate to a state where the vertical crack is deeply formed throughout the brittle material substrate. Method of scribing substrates. The method according to any one of claims 12 to 14, And an intensity distribution of the laser beam oscillated from the laser oscillator is a Gaussian mode. The method according to any one of claims 12 to 14, And an intensity distribution of the laser beam oscillated from the laser oscillator is in a non-gauss mode.

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