HK1069797A1 - Scribing device and method for fragile material substrate and scribing method for fragile material substrate - Google Patents

Scribing device and method for fragile material substrate and scribing method for fragile material substrate

Info

Publication number
HK1069797A1
HK1069797A1 HK05102267A HK05102267A HK1069797A1 HK 1069797 A1 HK1069797 A1 HK 1069797A1 HK 05102267 A HK05102267 A HK 05102267A HK 05102267 A HK05102267 A HK 05102267A HK 1069797 A1 HK1069797 A1 HK 1069797A1
Authority
HK
Hong Kong
Prior art keywords
material substrate
fragile material
scribing
scribing device
fragile
Prior art date
Application number
HK05102267A
Inventor
Haruo Wakayama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of HK1069797A1 publication Critical patent/HK1069797A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
HK05102267A 2001-07-16 2005-03-15 Scribing device and method for fragile material substrate and scribing method for fragile material substrate HK1069797A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001215055 2001-07-16
PCT/JP2002/007233 WO2003008168A1 (en) 2001-07-16 2002-07-16 Scribing device for fragile material substrate

Publications (1)

Publication Number Publication Date
HK1069797A1 true HK1069797A1 (en) 2005-06-03

Family

ID=19049763

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05102267A HK1069797A1 (en) 2001-07-16 2005-03-15 Scribing device and method for fragile material substrate and scribing method for fragile material substrate

Country Status (6)

Country Link
JP (1) JPWO2003008168A1 (en)
KR (1) KR100583889B1 (en)
CN (2) CN100411825C (en)
HK (1) HK1069797A1 (en)
TW (1) TW542763B (en)
WO (1) WO2003008168A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070005604A (en) * 2004-04-27 2007-01-10 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for forming vertical crack on brittle board and vertical crack forming apparatus
JP4856931B2 (en) * 2004-11-19 2012-01-18 キヤノン株式会社 Laser cleaving method and laser cleaving apparatus
US8093530B2 (en) 2004-11-19 2012-01-10 Canon Kabushiki Kaisha Laser cutting apparatus and laser cutting method
CN101296787B (en) * 2005-10-28 2012-02-15 三星钻石工业股份有限公司 Method of forming scribe line on substrate of brittle material and scribe line forming apparatus
WO2008104560A1 (en) * 2007-02-28 2008-09-04 Ceramtec Ag Method for producing a component using asymmetrical energy input along the parting or predetermined breaking line
JP2008229716A (en) * 2007-03-23 2008-10-02 Toray Eng Co Ltd Method and device for laser scribing, and cleaved substrate cleaved using the same method or the same device
JP2008264805A (en) * 2007-04-17 2008-11-06 Disco Abrasive Syst Ltd Laser beam machining apparatus and laser beam machining method for adhesive film mounted on reverse side of wafer
JP5060880B2 (en) * 2007-09-11 2012-10-31 三星ダイヤモンド工業株式会社 Fragment material substrate cutting apparatus and method
CN102239034A (en) * 2008-12-16 2011-11-09 镭美科技股份有限公司 Splitting apparatus and cleavage method for brittle material
DE112010003736T5 (en) * 2009-08-06 2013-02-28 Applied Materials, Inc. Scratches of transverse ISO lines, linking, and simplified laser and scanner controls
CN102282485B (en) * 2009-08-06 2012-08-29 住友化学株式会社 Method for manufacturing polarizing plate
CN102012552B (en) * 2010-09-27 2012-08-15 江苏大学 Light path automatic adjusting system for multi-window multi-wavelength laser
TW201301557A (en) * 2011-06-17 2013-01-01 Univ Nat Cheng Kung Light-emitting device structure and method for manufacturing the same
CN102248308A (en) * 2011-06-24 2011-11-23 广东工业大学 Method for performing microprocessing by utilizing laser cavitation micro jet flow
JP6721439B2 (en) * 2016-07-11 2020-07-15 株式会社ディスコ Laser processing equipment
CN113618251A (en) * 2021-08-04 2021-11-09 昆山燎原自动化设备有限责任公司 Laser processing equipment for substrate scribing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01306088A (en) * 1988-06-01 1989-12-11 Nippei Toyama Corp Variable beam laser processing device
JPH0639572A (en) * 1991-01-11 1994-02-15 Souei Tsusho Kk Wafer cutting device
JPH06234092A (en) * 1993-02-12 1994-08-23 Nikon Corp Laser beam working machine
JPH0929472A (en) * 1995-07-14 1997-02-04 Hitachi Ltd Method and device for splitting and chip material
JP3164508B2 (en) * 1996-05-22 2001-05-08 株式会社システクアカザワ Scoring device
JPH1034364A (en) * 1996-07-25 1998-02-10 Souei Tsusho Kk Brittle material splitting method by plural point heat sources
JPH10128567A (en) * 1996-10-30 1998-05-19 Nec Kansai Ltd Laser beam splitting method
JP3526175B2 (en) * 1997-06-11 2004-05-10 三菱電機株式会社 Laser processing equipment
JP2000058489A (en) * 1998-08-07 2000-02-25 Disco Abrasive Syst Ltd Work dividing method and device
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
CN1413136A (en) * 1999-11-24 2003-04-23 应用光子学公司 Method and apparatus for separating non-metallic materials
JP4390937B2 (en) * 1999-11-25 2009-12-24 三星ダイヤモンド工業株式会社 Glass plate dividing method and apparatus

Also Published As

Publication number Publication date
KR100583889B1 (en) 2006-05-26
CN1827311A (en) 2006-09-06
CN1529648A (en) 2004-09-15
KR20040017248A (en) 2004-02-26
CN1255858C (en) 2006-05-10
TW542763B (en) 2003-07-21
WO2003008168A1 (en) 2003-01-30
JPWO2003008168A1 (en) 2004-11-04
CN100411825C (en) 2008-08-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100716