WO2009157319A1

WO2009157319A1 - Chamfering apparatus

Info

Publication number: WO2009157319A1
Application number: PCT/JP2009/060716
Authority: WO
Inventors: 一星熊谷; 富久砂田; 政二清水
Original assignee: 三星ダイヤモンド工業株式会社
Priority date: 2008-06-25
Filing date: 2009-06-11
Publication date: 2009-12-30
Also published as: CN102123817A; JP5320395B2; KR101306673B1; KR20110030622A; TW201002460A; CN102123817B; JPWO2009157319A1; TWI414383B

Abstract

Provided is a chamfering apparatus for chamfering or rounding a brittle material substrate. The chamfering apparatus is provided with a beam deflecting section (14), which is arranged on a laser beam optical path between a laser light source (13) and a light focusing member (15) and makes the position of a light focused point formed by laser beams outputted from the light focusing member scan the substrate by deflecting an incoming optical path of the laser beam to the light focusing member. The chamfering apparatus is also provided with substrate supporting sections (2, 7, 11, 12) which support the substrate so that the laser beam is applied diagonally from the front of an edge line (EL) toward the edge line and that the light focused point scans the substrate along a surface which intersects with the edge line on a surface or inside the substrate at the vicinity of the edge line. The light focusing member (15) is formed as an optical element unit wherein the scan track of the light focused point formed on the surface which intersects with the edge line has a recessed shape or is linear when viewed from the focusing member, and thus a shape protruding toward the outer side of the substrate is chamfered.

Description

Chamfering device

The present invention relates to a method for chamfering an edge line (ridge line) formed on an end face of a brittle material substrate, and more particularly, a chamfering method and a chamfering apparatus for performing R chamfering or C chamfering of an edge line by laser beam irradiation. About.
Here, the brittle material substrates to be processed include substrates such as quartz, single crystal silicon, sapphire, semiconductor wafers, and ceramics in addition to glass substrates.

Brittle material substrates such as glass substrates are used in various products by processing them into desired dimensions and shapes. In general, processing of brittle material substrates is performed by existing processing technologies such as dicing, wheel scribe, laser scribe, etc., but the edge line of the substrate end face divided by these processing technologies is very sharp and a slight impact is applied. Even alone, defects such as chipping and microcracks occur. For example, in a glass substrate for a flat panel display (FPD), fragments generated due to chipping of edges cause damage to the surface of the FPD substrate, which affects the product yield.
Therefore, chamfering is performed along the edge lines in order to prevent chipping of the edge portion of the substrate that occurs after the substrate is divided.

One conventional chamfering process is a wet polishing method in which a large amount of water is supplied and polished with a diamond grindstone. However, minute cracks remain continuously on the chamfered surface formed by the wet polishing method, and the strength of the chamfered surface is significantly lower than the surroundings.

In contrast, a heating / melting method in which a laser beam is scanned along the edge line to be chamfered, and the edge is heated and melted by moving the focal point of the laser beam along the edge line, thereby performing chamfering. Has been proposed. For example, a method is disclosed in which chamfering is performed by heating the vicinity of a ridge line portion with a laser to soften and round the ridge line portion while keeping the entire glass member at a temperature higher than room temperature (remaining heat) (see Patent Document 1). ).

FIG. 8 is a cross-sectional view showing a laser irradiation state when chamfering is performed by a heat melting method using a CO ₂ laser light source. In advance, along the edge line 51 that chamfers the glass substrate 10 that has been gradually heated to a predetermined temperature lower than the softening temperature by using a heater (not shown) and then maintained at the predetermined temperature. The laser light from the CO ₂ laser light source 50 is condensed by the condenser lens 53, and the focal point is scanned in the vicinity of the processing portion. At that time, by adjusting the laser output and the scanning speed, the edge portion irradiated with the laser becomes high temperature and softens, and thereby the edge portion irradiated with the laser is processed to be rounded.

In this case, it takes time for preheating and cooling after processing. In addition, if the entire substrate needs to be preheated and a functional film such as a device or sensor that cannot be heated is already formed on the substrate, chamfering by this method may not be performed. Further, if the residual heat is insufficient, a crack is generated due to thermal stress, and good chamfering cannot be performed. Further, in the chamfering process by the heating and melting method described above, the melted part is deformed and a part thereof (part of the rounded part) is swollen from the surroundings, and the flatness of the substrate end face may be impaired. .

Unlike the heating and melting method, as a chamfering method by laser irradiation that does not require preheating, a laser beam is irradiated near the edge and heated to generate a crack in the glass substrate 10, and the laser beam is relatively edge-lined. A laser scribing method is disclosed in which a crack is grown along an edge line by scanning in a direction, and chamfering is performed by separating the vicinity of the edge from a glass substrate (Patent Document 2).

FIG. 9 is a diagram showing a laser irradiation state when chamfering is performed by laser scribing using a CO ₂ laser light source. The laser light from the CO ₂ laser light source 50 is locally irradiated near the edge line 51 of the glass substrate 10 by the condenser lens 53 and heated at a temperature lower than the softening temperature. At this time, the crack 52 is generated by the thermal stress accompanying the local thermal expansion. Then, by scanning the laser beam along the edge line 51, sequentially generated cracks 52 grow along the edge line 51, and the vicinity of the edge (corner portion) including the edge line 51 is separated.
According to Patent Document 2, it is said that by performing chamfering by laser scribing, chamfering that does not require high productivity and a cleaning step can be performed without impairing the accuracy of the glass substrate.
JP-A-2-241684 JP-A-9-225665

Here, a processed surface formed by chamfering by laser scribing will be described. FIG. 10 is an enlarged view of a processed cross section when chamfering is performed by laser scribing using a CO ₂ laser.

The corner portion U of the glass substrate 10 is separated (peeled) by the chamfering process, and the edge line 53 of the glass substrate 10 disappears together with the corner portion U, but a new chamfered surface 54 is formed.
When the cross-sectional shape of the chamfered surface 54 is observed, it has an arcuate inverted R surface that is recessed toward the glass substrate 10 side. As a result of the chamfered surface 54 being recessed, two

edge lines

57 and 58 are formed at the intersections of the glass substrate S with the

substrate surfaces

55 and 56. These

edge lines

57 and 58 have improved edge sharpness compared to the original edge line 53, but if the dent becomes large, a sharp edge will be formed.
In particular, for flat panel display (FPD) glass substrates, TAB tape may be wired immediately above the

edge lines

57 and 58. If a sharp edge remains in this area after chamfering, the TAB tape breaks. Is likely to be.
For this reason, the chamfered surface 54 is required to be a C surface where the chamfered portion is a flat surface, or an R surface which is convex toward the outside.

However, in the chamfered surface 54 by the laser scribing method using the conventional CO ₂ laser as described above, a dent is inevitably generated on the chamfered surface. Even if the irradiation direction of the laser irradiating the edge line 53 is changed, the result is almost the same, and it is difficult to control the shape of the chamfered surface.

In recent years, glass substrates for flat panel displays (FPD), etc., have been using larger glass substrates than before, and with the increase in size of glass substrates, the processing quality of the substrates is also higher than ever before with higher accuracy and reliability. Has come to be required. As for the shape of the chamfered surface, higher accuracy and reliability than ever are required.

Accordingly, the present invention provides a chamfering apparatus capable of forming a chamfered surface formed by laser irradiation into a curved surface that is convex toward the C or R surface, or the outside of the substrate, instead of the reverse R surface. With the goal.

The chamfering processing apparatus of the present invention made to solve the above problems is convex toward the C-plane, R-plane, and the outside of the substrate by scanning the condensing point of the laser beam using a special optical element unit. The chamfering of the curved surface is realized.
That is, the chamfering apparatus of the present invention is a chamfering apparatus that chamfers a brittle material substrate, and includes a laser light source, a condensing member that condenses the laser beam emitted from the laser light source and guides the substrate to the substrate, A beam deflecting unit that is provided on the optical path of the laser beam from the laser light source to the substrate through the condensing member, deflects the incident optical path of the laser beam, and scans the position of the condensing point formed by the laser beam; With respect to the edge line to be chamfered, a laser beam is irradiated toward the edge line from diagonally forward of two adjacent surfaces having the edge line as an end, and the condensing point is formed on the substrate surface in the vicinity of the edge line or inside the substrate. A substrate support portion that supports the substrate so as to be scanned along a surface intersecting with the edge line, and the condensing member is configured to run a condensing point formed on the surface intersecting with the edge line. Trajectory is set to be an optical element unit comprising an optical parameter of the concave or straight as viewed from the light collector.

Here, the brittle material substrate includes a glass substrate, a quartz substrate, a silicon substrate, a sapphire substrate, a silicon or other semiconductor wafer, and a ceramic substrate.
Further, since the laser light source has different absorption characteristics of the substrate depending on the wavelength of the laser light, the laser light source to be used is selected depending on the type of the substrate and whether the substrate is scanned from the substrate surface or the inside of the substrate.
For example, when scanning the vicinity of the surface of a glass substrate, it is preferable to use a CO ₂ laser or CO laser whose substrate material has a large absorption coefficient (however, if the substrate surface is scanned, the laser only needs to be condensed). (It can be used with lasers with low absorption) On the other hand, when scanning the inside of the substrate, it is preferable to use a YAG laser (Nd-YAG laser, Er-YAG laser, etc.) having a small absorption coefficient of the substrate material.

In addition, a lens unit or a mirror unit can be used as the optical element unit serving as a light collecting member. In general, by adjusting the refractive index distribution and lens curved surface shape in the lens unit, and by adjusting the reflecting surface shape in the mirror unit, the optical path direction of the outgoing light with respect to the incident light to the lens unit and mirror unit A condensing point can be designed. Therefore, as the optical parameter of the optical element unit (lens unit, mirror unit) used in the present invention, the scanning locus of the condensing point formed by the condensing member when the incident optical path is deflected by the beam deflecting unit is the condensing member. An optical parameter having an optical parameter that becomes concave or linear when viewed from the side is used. The optical parameters for obtaining such a scanning locus can be obtained by geometric calculation, analysis by a finite element method, or trial and error design.

In addition, the optical element unit here is not limited to a single lens, but has a structure in which a plurality of lenses and mirrors are arranged in series, such as a combination lens. In this case, the shape of the light collecting member is concave when viewed from the light collecting member.

According to the present invention, the optical system is configured such that the laser beam emitted from the laser light source is irradiated from the obliquely forward direction of the substrate to the edge line for chamfering the substrate through the beam deflecting unit and the condensing member. Is placed. The beam deflecting unit deflects an incident optical path of the laser beam emitted from the laser light source to the condensing member. The condensing member is deflected in the incident optical path by the beam deflecting unit, so that the traveling direction of the laser beam emitted from the condensing member is deflected. As a result, the position of the condensing point formed by the laser beam emitted from the condensing member is scanned in the vicinity of the edge line of the substrate. At this time, since the condensing member uses an optical element unit having an optical parameter in which the scanning locus of the condensing point formed on the surface intersecting the edge line is concave or linear when viewed from the condensing member, the edge The scanning locus of the condensing point near the line is concave or linear when viewed from the condensing member. When the condensing point is scanned on the substrate surface or inside the substrate, an ablation phenomenon occurs along the locus, and a part of the substrate is removed along the scanning locus of the condensing point. Therefore, when the scanning locus is a straight line, chamfering of the C surface is performed, and when the scanning locus is concave when viewed from the light collecting member, an R surface, a paraboloid, an elliptical surface, and the like determined according to the concave shape. A convex chamfering process is performed.

According to the present invention, the chamfered surface formed by laser irradiation can be a C surface, an R surface, or a curved surface that is convex toward the outside of the substrate.

(Other problem solving means and effects)
In the above invention, the light collecting member may be an optical element unit including an fθ lens or an fθ mirror.
Since the scanning locus of the condensing point is a straight line when the condensing member is an optical element unit composed of an fθ lens or an fθ mirror, the C surface can be chamfered.

In the above invention, the light condensing member may be an optical element unit in which a non-telecentric fθ lens and a plane parallel plate are combined.
When the condensing member is an optical element unit that is a combination of a non-telecentric fθ lens and a plane parallel plate, the scanning locus of the condensing point is convex toward the outside of the substrate, so that the convex chamfering is performed. be able to.

In the above invention, a feeding mechanism for moving the substrate side or the laser beam side so that the condensing point relatively moves along the edge line may be provided.
According to this, the entire edge line can be chamfered along the edge line.

In the above invention, the substrate support portion includes a table for horizontally placing the substrate, and the light condensing member and the beam deflection portion are inclined at 45 degrees with respect to the edge line of the horizontally placed substrate as a central direction. You may make it arrange | position so that a condensing point may be scanned.
According to this, it is possible to perform chamfering while the substrate is stably placed on a horizontal table.

In the above invention, the beam deflection unit may be constituted by a galvanometer mirror or a polygon mirror.
In the case of a galvano mirror, the laser beam directed to the condensing member can be deflected accurately and with high reproducibility by a simple mechanism by the swinging motion of the reflecting mirror and in the case of a polygon mirror by the rotating motion of the reflecting mirror.

In the above invention, a depth adjusting mechanism for adjusting the position of the condensing point in the depth direction with respect to the substrate by moving the position of the substrate or the condensing member in the laser beam irradiation direction may be further provided. .
According to this, it is possible to perform chamfering at a desired depth by chamfering the depth position of the condensing point in the substrate in accordance with the planned chamfering depth.
In addition, when deep chamfering is performed, shallow chamfering is performed, deep chamfering is performed by gradually changing the depth, and from the origin of the edge line while adjusting the scanning position in the depth direction. By relatively moving relative to the end point continuously, it is possible to perform chamfering without difficulty.

The figure which shows the structure of the chamfering processing apparatus of the brittle material board | substrate which is one Embodiment of this invention. The enlarged view of the scanning optical system of FIG. The block diagram of the control system of the chamfering apparatus of FIG. The figure which shows the procedure in the case of forming a chamfering processed surface deeply. The enlarged view of the modification of a scanning optical system. The enlarged view of the modification of a scanning optical system. The enlarged view of the modification of a scanning optical meter. Sectional view of a laser irradiation state at the time of performing the chamfering by heating and melting method using a CO ₂ laser source. It shows a laser irradiation state at the time of performing the chamfering by a laser scribing method using a CO ₂ laser source. Enlarged view of a processed cross section when performing chamfering by CO ₂ laser scribing method using a laser.

2 Slide table 7 Base 11 Lifting table 12 Suction table 13 Laser light source 14 Galvano mirror (beam deflection unit)
14a Polygon mirror 15 Lens unit (Condensing member)
15afθ lens 15b unit 16 scanning optical system

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, the chamfering process for the glass substrate will be described.
Note that the present invention is not limited to the embodiments described below, and it goes without saying that various aspects are included without departing from the spirit of the present invention.

FIG. 1 is a view showing a brittle material substrate chamfering apparatus LM according to an embodiment of the present invention. FIG. 2 is an enlarged view showing the scanning optical system of FIG.

The chamfering apparatus LM is provided with a slide table 2 that reciprocates in the front-rear direction of the paper surface (hereinafter referred to as the Y direction) in FIG. 1 along a pair of

guide rails

3 and 4 arranged in parallel on a horizontal base 1. ing. A screw screw 5 is arranged between the

guide rails

3 and 4 along the front-rear direction, and a stay 6 fixed to the slide table 2 is screwed to the screw screw 5. The slide table 2 is formed so as to reciprocate in the Y direction along the

guide rails

3 and 4 by forward and reverse rotation (not shown).

On the slide table 2, a horizontal pedestal 7 is arranged so as to reciprocate in the left-right direction in FIG. A screw 10 that is rotated by a motor 9 is threaded through a stay 10a that is fixed to the pedestal 7, and the pedestal 7 moves along the guide rail 8 in the X direction when the screw 10 rotates forward and backward. Move back and forth.

On the pedestal 7, a lifting table 11 for adjusting the height direction (hereinafter referred to as Z direction) and a suction table 12 on which a suction chuck is mounted are provided. On the suction table 12, a glass substrate G is mounted. Set in a horizontal state. At this time, the edge line EL to be chamfered is directed upward, and is supported so that a laser beam to be described later is incident obliquely from a 45 degree direction.
The glass substrate G is positioned using the camera 20 and alignment marks (not shown) formed on the substrate so that the edge line EL is directed in the Y direction. When the substrate G is constant, positioning may be performed by providing a positioning guide on the surface of the suction table 12 and bringing a part of the substrate into contact with the guide.

Above the glass substrate G, a laser light source 13, a galvanometer mirror 14 (beam deflection unit), and a lens unit 15 (light condensing member) are attached. The galvanometer mirror 14 and the lens unit 15 constitute a scanning optical system 16.
An Nd-YAG laser light source is used as the laser light source 13. In the XZ plane, the laser light source 13 has an emission direction directed obliquely downward 45 degrees to the left.
The galvanometer mirror 14 has a reflecting mirror disposed on the optical path of the laser beam emitted from the laser light source 13, emits the laser beam obliquely downward to the right, and changes the beam emitting direction by the swinging motion of the reflecting mirror. Deflection in the XZ plane. The range of the oscillating motion of the galvanometer mirror 14 at this time is adjusted according to the angle range for chamfering the workpiece.
The lens unit 15 condenses the laser beam emitted from the galvanometer mirror 14 to form a condensing point. Further, as a result of the emission direction being deflected by the galvanometer mirror 14 and the incident position of the laser beam on the lens unit 15 being scanned, the condensing point of the laser beam emitted from the lens unit 15 is within the XZ plane (that is, the edge). Scanning is performed in a plane orthogonal to the line EL, and the scanning locus becomes concave (convex toward the outside of the substrate) when viewed from the lens unit side.
For example, as shown in FIG. 2, the scanning locus of the condensing point is an arc R0 connecting F0, F1, and F2 due to the swinging motion of the galvanometer mirror 14.

Here, a specific example of the lens unit 15 will be described. The lens unit 15 is a lens unit that is a combination of a non-telecentric fθ lens and a plane-parallel plate, so that the scanning locus of the condensing point is shaped like an arc R0 connecting F0, F1, and F2 (on the outside of the substrate). Can be convex).

The galvano mirror 14 and the lens unit 15 are fixed to the frame of the apparatus, and the position of the condensing point and the scanning locus of the condensing point formed by these optical elements are a constant position and locus, A function representing the coordinates of the condensing point (coordinates of F0, F1, and F2) and the locus (arc R0) can be obtained by geometric calculation (or by actual measurement).

Therefore, after the glass substrate G is set, the focusing point F0 is set on the edge line EL or in the vicinity of the edge line EL by adjusting the position in the XYZ directions by the slide table 2, the base 7, and the lifting table 11. Match the position of the planned surface.

Subsequently, a control system of the chamfering processing apparatus LM will be described. FIG. 3 is a block diagram of the control system. The chamfering apparatus LM includes a control unit 50 including a memory that stores various control data, setting parameters, and a program (software), and a CPU that executes arithmetic processing.

The control unit 50 includes a table driving unit 51 that drives a motor (such as the motor 9) for positioning and moving the slide table 2, the pedestal 7, and the lifting table 11, and a suction mechanism drive that drives the suction chuck of the suction table 12. The drive system of the part 52, the beam deflection part drive part 53 which drives the galvanometer mirror 14, and the laser drive part 54 which performs laser irradiation is controlled. The control unit 50 is connected to an input unit (not shown) including a keyboard and a mouse, and a display unit (not shown) that performs various displays on the display screen, and displays necessary information on the screen. Necessary commands and settings can be input.

Next, a chamfering operation by the chamfering apparatus LM will be described. The substrate G is placed on the suction table 12 and the position is adjusted using the camera 20. Then, the edge line EL is directed in the Y direction, and the position is adjusted by the slide table 2, the pedestal 7, and the lifting table 11 so that the coordinates of the condensing point F0 are at the depth of the processing planned surface on or near the edge line EL. .
In this case, if the pedestal 7 and the lifting table 11 are moved in conjunction with each other, the substrate can be moved in an oblique direction, so that it can be used as a position adjustment mechanism in the depth direction of the substrate at the focal point F0. .
Subsequently, the galvanometer mirror 14 and the laser light source 13 are driven to scan the laser beam in the vicinity of the edge line. As a result, the substrate material is melted and removed by ablation near the condensing point, and a chamfered surface is formed.

When chamfering the entire length of the edge line EL, the slide table 2 is sent at a constant speed, and the substrate G is moved in the Y direction with respect to the scanning surface (XZ surface) of the laser beam. At this time, the slide table 2 may be intermittently fed so that the laser beam is scanned a plurality of times at the same processing position.

Also, when forming a chamfered surface deeply, chamfering is performed in multiple steps. That is, as shown in FIG. 4, the first chamfering process is performed while setting the condensing point at a shallow position close to the edge line EL and moving in the Y direction. The same process is repeated by gradually shifting to the inner side.

Next, a modified embodiment will be described.
FIG. 5 is an enlarged view of the scanning optical system when the condensing member is changed from the lens unit 15 to the fθ lens 15a. In this case, since the scanning locus of the condensing point is linear on the XZ plane, the C surface can be chamfered.

If the optical parameters such as the curved surface shape, the radius of curvature, and the refractive index of the lens unit 15 are appropriately designed, a free-form surface lens that can draw a desired scanning locus can be created. Thus, the chamfered surface can be a parabolic surface, an elliptical surface, or an arbitrary free-form surface. Further, the same trajectory as the scanning trajectory by the lens can be drawn using a reflecting mirror instead of the lens.

Also, the same chamfering can be performed even if the beam deflecting unit is changed from a galvanometer mirror to a polygon mirror.

FIG. 6 shows a modification of the scanning optical system. The same components as those shown in FIG. In the scanning optical system of FIG. 2, the focal position is scanned by the galvanometer mirror 14, but here, instead of the galvanometer mirror 14, a swing mechanism (not shown) is attached to the plane parallel plate of the lens unit 15 to swing this. Thus, the scanning trajectory is substantially the same as in FIG.

FIG. 7 is an enlarged view of the scanning optical system when the condensing member is replaced with a unit 15b composed of a non-telecentric fθ mirror and a plane parallel plate.
Similarly to the combination of the non-telecentric fθ lens and the plane parallel plate described with reference to FIG. 2, the unit 15b also has a shape like an arc R0 that connects the scanning locus of the condensing point to the above-described F0, F1, and F2. It can be convex toward the outside of the substrate).
Even when these scanning optical systems are used, the same chamfering as in FIG. 2 can be performed.

In addition, by designing an aspherical lens or aspherical mirror having appropriate optical parameters using the finite element method, it is equivalent to a single lens or a single mirror alone and a combination lens of a non-telecentric fθ lens and a plane parallel plate. It is also possible to form an optical system.

Further, when the chamfering process is performed along the edge line EL, the slide table 2 on which the substrate G is placed is moved in the chamfering apparatus LM in FIG. 2, but the scanning optical system (galvano mirror 14, lens unit 15) side is moved. It can also be moved.

The chamfering process for the glass substrate has been described above. For other brittle material substrates, the same chamfering process can be realized by selecting a laser light source that can be used according to the absorption characteristics of each substrate material. Can do.

The present invention is used for chamfering a brittle material substrate such as a glass substrate.

Claims

A chamfering device for chamfering a brittle material substrate,
A laser light source;
A condensing member that condenses the laser beam emitted from the laser light source and guides it to the substrate;
Beam deflection is provided on the optical path of the laser beam from the laser light source to the substrate through the condensing member, and deflects the incident optical path of the laser beam to scan the position of the condensing point formed by the laser beam. And
With respect to the edge line to be chamfered, a laser beam is irradiated toward the edge line from diagonally forward of two adjacent surfaces having the edge line as an end, and the condensing point is formed on the substrate surface in the vicinity of the edge line or inside the substrate. A substrate support for supporting the substrate so that the substrate is scanned along a plane intersecting the edge line,
The condensing member is composed of an optical element unit having an optical parameter in which a scanning locus of a condensing point formed on a surface intersecting with an edge line is concave or linear when viewed from the condensing member. apparatus.
2. The chamfering apparatus according to claim 1, wherein the light collecting member is an optical element unit including an fθ lens or an fθ mirror.
2. The chamfering apparatus according to claim 1, wherein the condensing member is an optical element unit in which a non-telecentric fθ lens and a plane parallel plate are combined.
2. The chamfering apparatus according to claim 1, further comprising a feed mechanism that moves the substrate side or the laser beam side so that the condensing point relatively moves along the edge line.
The substrate support portion is composed of a table for horizontally placing the substrate, and the light condensing member and the beam deflecting portion are the light condensing points with a 45 ° oblique direction as a center direction with respect to the edge line of the horizontally placed substrate. The chamfering apparatus according to claim 1, wherein the chamfering apparatus is arranged to be scanned.
2. The chamfering apparatus according to claim 1, wherein the beam deflection unit is constituted by a galvanometer mirror or a polygon mirror.
4. The chamfering apparatus according to claim 3, wherein the plane parallel plate of the light collecting member is configured to be swingable and also serves as a beam deflecting unit.
2. The chamfering according to claim 1, further comprising a depth adjusting mechanism that adjusts a position of the condensing point in a depth direction with respect to the substrate by moving a position of the substrate or the condensing member in a laser beam irradiation direction. Processing equipment.