CN102765876A - Glass cutting method by laser self-focusing and wire feeding - Google Patents
Glass cutting method by laser self-focusing and wire feeding Download PDFInfo
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- CN102765876A CN102765876A CN2011101173644A CN201110117364A CN102765876A CN 102765876 A CN102765876 A CN 102765876A CN 2011101173644 A CN2011101173644 A CN 2011101173644A CN 201110117364 A CN201110117364 A CN 201110117364A CN 102765876 A CN102765876 A CN 102765876A
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Abstract
A glass cutting method by laser self-focusing and wire feeding comprises the following steps of: focusing laser beams into the inside of glass to promote internal refractive index of the glass to change, using distortion generated by laser wave front to generate laser self-focusing, using laser energy near focus formed by the laser self-focusing to generate multiphoton absorption ionization puncture damage inside the glass so as to form long wire damage crack, moving the laser beam along the cutting path so as to expand the long wire damage crack into a fine band-shaped damage crack, changing the height of the focus formed by the laser self-focusing inside the glass, repeatedly moving the laser beam along the cutting path so as to make the fine band-shaped damage crack penetrate the whole glass substrate, and finally using thermal stress, mechanical force or chemical method to form stress on the glass surface so as to break the glass along the fine band-shaped damage crack. The glass cutting method has advantages of high cutting precision, fast speed, low cost and high notch quality. By the adoption of the method, no subsequent polishing and grinding treatment is required, sharp edge will not be formed, and glass with any thickness and shapes can be cut.
Description
Technical field:
The present invention relates to physical field, relate in particular to optical technology, particularly Laser cutting technology, concrete is that a kind of laser self-focusing is worn a glass cutting method.
Background technology
From flat-panel monitor and the used electronic glass substrate of electron trade, used large-sized sheet glass to extensive manufacturing field such as car industry or construction industry, the application of glass is very extensive.Modal type of glass is a soda-lime glass, is mainly used in car industry, construction industry and home appliances field, and general thickness is 1.6～12mm.Thickness is called borosilicate glass less than the glass of 1mm, is mainly used in flat-panel monitor (FPD) and electronic product field.Application along with more product innovations; Specification of quality for glasswork is also increasingly high, except the material behavior that will consider glass, also must realize more accurate glass processing; The conventional glass cutting technique has been difficult to satisfy the requirement of fine fisssure and edge quality aspect; And the cutting that utilizes laser to carry out glass not only can make the cut edge smooth neat, has avoided fine slight crack, and cutting quality is greatly improved.And laser cutting is down auxiliary computingmachine, can continuously, accurately accomplish the curvilinear cut of setting pattern, and extraordinary application prospect is arranged in the glass processing in modern times.
In the prior art, the cutting glass by laser technology is divided into the molten cutting of LASER HEAT, LASER HEAT separation cuts and laser ablation cutting.
Wherein, the principle of laser hot melt cutting method is to utilize glass to be in and have plasticity and ductility preferably under the remollescent temperature; Superpower carbon dioxide laser with focusing on shines the remollescent glass surface, and high energy density can cause glass to melt, and blows away fused glass with air-flow then; Produce groove; Realization glass melting cutting, the key of this method is exactly glass heats to a suitable temperature, the thermal stresses that reduces to produce in the laser cutting process.But, utilize the cutting of laser hot melt that glass is had very strong heat affecting, deal with improperly and will produce damage glass, have influence on the processing quality of glass.
The principle of LASER HEAT separation cuts is: at first utilize laser that glass surface is heated; Higher energy can make the temperature at this place sharply raise; The surface produces bigger stress, does not break but this stress can not make glass produce, and then rapid cooling is carried out in this zone; General cooling gas or the quench liquid of adopting; Rapid cooling can make glass surface produce bigger thermograde and bigger tensile stress, and this tensile stress can make glass surface begin to break along the direction of predetermined line, realizes the cutting of glass.The whole machining process process can be eliminated trickle crack and fragment fully, need not follow-up grinding and buffing step.Just because of this, the isolating glass edge of LASER HEAT is also very sharp, very easily the oarsman.And there is thermal stresses in glass edge, though strengthened glass edge intensity, if take place slightly to collide with, also causes whole glass broken as toughened glass, the following process operation required high.In addition, in crack propagation process,, will badly influence cutting quality, even make the cutting failure if crackle can not get better controlled.
The principle of laser ablation cutting is: utilize the direct etching glass of ultra-short pulse laser, accomplish glass cutting.Ultra-short pulse laser has the short advantage of energy height, action time; Can material become plasma body and volatilize away in situation following moment of avoiding material to be melted; And in this extremely short action time; Heat has little time in material, to pile up, thus the heat effect that produces when having avoided above-mentioned two kinds of methods to carry out glass cutting.But equipment cost is high, and the not high and glass-cutting thickness of cutting efficiency has restriction.
Summary of the invention:
The object of the present invention is to provide a kind of laser self-focusing to wear a glass cutting method, described this laser self-focusing is worn a glass cutting method and will be solved thermal stresses in the existing cutting glass by laser technology and influence processing quality, cutting efficiency is low, glass-cutting thickness is limited technical problem.
This laser self-focusing of the present invention is worn a glass cutting method; Comprise one with acting on step on glass and a step of utilizing thermal stresses, mechanical external force or chemical method with described glass disjunction after the laser beam focusing; Wherein, act in the step on glass after laser beam is focused on, focus the laser beam to the inside of described glass described; Impel the glass inner refractive index to change; The distortion that utilizes the laser wave front to take place again produces laser self-focusing, and near the laser energy of the focus of utilizing laser self-focusing to form produces multiphoton absorption ionization puncture damage in glass inside, forms rectangular filament damage slight crack; Laser beam is moved along cutting path; Described rectangular filament damage slight crack is expanded to the faciola shape destroy slight crack, the focus that changes laser self-focusing formation repeats to move laser beam along cutting path then at the inner height of glass; Make described faciola shape destroy slight crack and run through whole glass substrate; Utilize in thermal stresses, mechanical external force or chemical method the step described, utilize thermal stresses, mechanical external force or chemical method to form stress, make glass destroy the slight crack disjunction along the faciola shape at glass surface with the glass disjunction.
Further, the diameter of described rectangular filament damage slight crack is between 1 micron to 99 microns, and the length of rectangular filament damage slight crack is less than 10 millimeters.
Further, utilize before thermal stresses, mechanical external force or chemical method carry out the step of glass disjunction described, at the auxiliary slight crack of cutting on glass.
Further, utilize in thermal stresses, mechanical external force or chemical method the step, can utilize and accomplish the glass disjunction in the tempering process in the glass processing operation automatically the glass disjunction described.
Principle of work of the present invention is: high intensity laser beam focuses on glass inside; The glass inner refractive index is changed, and it changes with laser intensity through glass and is directly proportional, and the distribution of laser intensity on its beam cross section is to be Gaussian distribution; The centre portions light intensity is high; The specific refractory power increase is also big, and a little less than the light intensity of edge section, variations in refractive index is little.Distortion has just taken place in the laser wave front, produces the self-focusing phenomenon.After the laser beam self-focusing; Near focus regional light intensity can become stronger, causes the inner generation of glass multiphoton absorption ionization puncture damage, stays the rectangular filament damage slight crack that diameter has only several microns to tens microns; The length of filament slight crack can reach several millimeters, but that diameter is close to is constant.Then laser is moved along cutting path; Destroy slight crack at faciola shape that forms by thread slight crack of the inner formation of glass; Change laser spot at the inner height of glass, repeat to move laser along cutting path then, destroy slight crack thereby form the faciola shape that runs through whole glass substrate.Because the thread destruction slight crack of glass inside is very thin, therefore not a step to divide glass fully.Glass generally all needs disjunction to handle after having cut, and the present invention utilizes thermal stresses, mechanical external force or chemical method to accomplish severing of glass at the stress that glass surface forms.Further, in order to guarantee the glass breakage quality, need cut some auxiliary slight cracks simultaneously.Further, in the technology of glass disjunction, can utilize in the tempering process in the glass processing operation and accomplish automatically, thereby reduce intermediate steps, save the glass rubbing down fully and clean.The glass processing two step method can be accomplished,
The present invention and prior art are compared, and its effect is actively with tangible.The self-focusing phenomenon that the present invention utilizes high intensity laser beam to focus on earlier and produces behind the glass inside causes rectangular filament damage slight crack in glass inside, repeat to move laser along cutting path, makes rectangular filament damage slight crack form the faciola shape that runs through whole glass substrate and destroys slight crack; Utilize thermal stresses, mechanical external force or chemical method to accomplish severing of glass again at the stress that glass surface forms; Cutting accuracy is high, and speed is fast, and cost is low; No fragment produces in the cutting process; Kerf quality is high, need not follow-up rubbing down and handles, and can not form sharp edges.The present invention can cut the glass of any thickness and shape, realizes the high precision of glass laser cutting, high-speed, high quality and versatility.
Description of drawings:
Fig. 1 is that the glass that laser self-focusing of the present invention is worn in the glass cutting method is worn the synoptic diagram that silk destroys slight crack.
Fig. 2 is the synoptic diagram that laser self-focusing of the present invention is worn the faciola shape destruction slight crack in the glass cutting method.
Fig. 3 is the synoptic diagram that laser self-focusing of the present invention is worn the auxiliary slight crack among the embodiment of a glass cutting method.
Embodiment:
Embodiment 1
As shown in Figure 1, laser self-focusing of the present invention is worn a glass cutting method, comprises one with acting on step and the step of utilizing thermal stresses, mechanical external force or chemical method with described glass 3 disjunctions on the glass 3 after laser beam 1 focusing; Wherein, Act in the step on the glass 3 after laser beam 1 is focused on described, laser beam 1 is focused on the inside of described glass 3, impel glass 3 inner refractive index to change; The distortion that utilizes the laser wave front to take place again produces laser self-focusing; Near the laser energy of the focus of utilizing laser self-focusing to form damages in glass 3 inner generation multiphoton absorption ionization punctures, forms rectangular filament damage slight crack 2, and is as shown in Figure 2; Laser beam 1 is moved along cutting path; Described rectangular filament damage slight crack 2 is expanded to the faciola shape destroy slight crack 4, change the height of the focus of laser self-focusing formation, repeat to move laser beam 1 along cutting path then in glass 3 inside; Make described faciola shape destroy slight crack 4 and run through whole glass 3 substrates; Utilize in thermal stresses, mechanical external force or chemical method the step described, utilize thermal stresses, mechanical external force or chemical method to form stress, make glass 3 destroy slight crack 4 disjunctions along the faciola shape on glass 3 surfaces with glass 3 disjunctions.
Further, the diameter of described rectangular filament damage slight crack 2 is between 1 micron to 99 microns, and the length of rectangular filament damage slight crack 2 is less than 10 millimeters.
Further, utilize before thermal stresses or mechanical external force carry out the step of glass 3 disjunctions the auxiliary slight crack 5 of cutting on glass 3 described.
Further, utilize in thermal stresses, mechanical external force or chemical method the step, can utilize and accomplish glass 3 disjunctions in the tempering process in the glass processing operation automatically glass 3 disjunctions described.
Principle of work of the present invention is: high intensity laser beam focuses on glass 3 inside; Glass 3 inner refractive index are changed, and it changes with laser intensity through glass 3 and is directly proportional, and the distribution of laser intensity on its beam cross section is to be Gaussian distribution; The centre portions light intensity is high; The specific refractory power increase is also big, and a little less than the light intensity of edge section, variations in refractive index is little.Distortion has just taken place in the laser wave front, produces the self-focusing phenomenon.After laser beam 1 self-focusing; Near focus regional light intensity can become stronger, causes glass 3 inner generation multiphoton absorption ionization puncture damages, stays the rectangular filament damage slight crack 2 that diameter has only several microns to tens microns; The length of filament slight crack can reach several millimeters, but that diameter is close to is constant.Then laser is moved along cutting path; Destroy slight crack 4 at faciola shape that forms by thread slight crack of glass 3 inner formation; Change the height of laser spot in glass 3 inside; Repeat to move laser along cutting path then, destroy slight crack 4 thereby form the faciola shape that runs through whole glass 3 substrates.Because the thread destruction slight crack of glass 3 inside is very thin, therefore not a step to divide glass 3 fully.Glass 3 generally all needs tempering to handle after having cut, and the present invention utilizes the stress that forms on glass 3 surfaces in physics or chemically toughened glass 3 processes to accomplish glass 3 and cuts off.Further, in order to guarantee glass 3 fracture quality in the tempering process, need cut some auxiliary slight cracks 5 simultaneously.
More than be preferred embodiment of the present invention, all changes of doing according to technical scheme of the present invention when the function that is produced does not exceed the scope of technical scheme of the present invention, all belong to protection scope of the present invention.
Claims (4)
1. a laser self-focusing is worn a glass cutting method; Comprise one with acting on step on glass and a step of utilizing thermal stresses, mechanical external force or chemical method with described glass disjunction after the laser beam focusing; It is characterized in that: act in the step on glass after laser beam is focused on described; Focus the laser beam to the inside of described glass, impel the glass inner refractive index to change, the distortion that utilizes the laser wave front to take place again produces laser self-focusing; Near the laser energy of the focus of utilizing laser self-focusing to form damages in the ionization puncture of the inner generation of glass multiphoton absorption; Form rectangular filament damage slight crack, laser beam is moved along cutting path, described rectangular filament damage slight crack is expanded to the faciola shape destroy slight crack; The focus that changes laser self-focusing formation is at the inner height of glass; Repeat to move laser beam along cutting path then, make described faciola shape destroy slight crack and run through whole glass substrate, utilize in thermal stresses, mechanical external force or chemical method the step the glass disjunction described; Utilize thermal stresses, mechanical external force or chemical method to form stress, make glass destroy the slight crack disjunction along the faciola shape at glass surface.
2. laser self-focusing as claimed in claim 1 is worn a glass cutting method, it is characterized in that: the diameter of described rectangular filament damage slight crack is between 1 micron to 99 microns, and the length of rectangular filament damage slight crack is less than 10 millimeters.
3. laser self-focusing as claimed in claim 1 is worn a glass cutting method, it is characterized in that: utilize before thermal stresses, mechanical external force or chemical method carry out the step of glass disjunction described, at the auxiliary slight crack of cutting on glass.
4. laser self-focusing as claimed in claim 1 is worn a glass cutting method; It is characterized in that: utilize in thermal stresses, mechanical external force or chemical method the step described, utilize the tempering process in the glass processing operation to accomplish the glass disjunction automatically the glass disjunction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011101173644A CN102765876A (en) | 2011-05-05 | 2011-05-05 | Glass cutting method by laser self-focusing and wire feeding |
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| CN2011101173644A CN102765876A (en) | 2011-05-05 | 2011-05-05 | Glass cutting method by laser self-focusing and wire feeding |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104310779A (en) * | 2014-09-29 | 2015-01-28 | 合肥鑫晟光电科技有限公司 | Method for cutting base plate by laser and laser cutting equipment |
| CN104891496A (en) * | 2015-05-11 | 2015-09-09 | 常州市奥普泰科光电有限公司 | Method for non-destructive cutting of large optical glass to small ones |
| CN107074604A (en) * | 2014-07-14 | 2017-08-18 | 康宁股份有限公司 | Method and apparatus for manufacturing glassware |
| CN108463309A (en) * | 2016-07-18 | 2018-08-28 | 微林股份有限公司 | Laser emission tool |
| CN110526564A (en) * | 2019-09-16 | 2019-12-03 | 蓝思科技（长沙）有限公司 | A kind of glass splinter method |
| CN110770180A (en) * | 2017-03-13 | 2020-02-07 | 相干激光系统有限公司 | Controlled separation of laser processed brittle materials |
| CN114131212A (en) * | 2021-11-10 | 2022-03-04 | 江苏大学 | Laser modification cutting and automatic separation method for transparent material closed solid structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1259924A (en) * | 1997-06-11 | 2000-07-12 | 乔治·居维利耶 | Method for cracking off glassware |
| CN1473087A (en) * | 2000-09-13 | 2004-02-04 | ��ɹ���ѧ��ʽ���� | Laser beam machining method and laser beam machining device |
| CN1541800A (en) * | 2003-04-30 | 2004-11-03 | 蔡良贤 | Trembling laser cutting device and method thereof |
| CN101391860A (en) * | 2007-09-21 | 2009-03-25 | 韩国情报通信大学校产学协力团 | A cutter for substrate using microwaves laser beam and method thereof |
| CN101468875A (en) * | 2007-12-24 | 2009-07-01 | 鸿富锦精密工业（深圳）有限公司 | Friable non-metal base material and cutting method therefor |
-
2011
- 2011-05-05 CN CN2011101173644A patent/CN102765876A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1259924A (en) * | 1997-06-11 | 2000-07-12 | 乔治·居维利耶 | Method for cracking off glassware |
| CN1473087A (en) * | 2000-09-13 | 2004-02-04 | ��ɹ���ѧ��ʽ���� | Laser beam machining method and laser beam machining device |
| CN1541800A (en) * | 2003-04-30 | 2004-11-03 | 蔡良贤 | Trembling laser cutting device and method thereof |
| CN101391860A (en) * | 2007-09-21 | 2009-03-25 | 韩国情报通信大学校产学协力团 | A cutter for substrate using microwaves laser beam and method thereof |
| CN101468875A (en) * | 2007-12-24 | 2009-07-01 | 鸿富锦精密工业（深圳）有限公司 | Friable non-metal base material and cutting method therefor |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107074604A (en) * | 2014-07-14 | 2017-08-18 | 康宁股份有限公司 | Method and apparatus for manufacturing glassware |
| CN104310779A (en) * | 2014-09-29 | 2015-01-28 | 合肥鑫晟光电科技有限公司 | Method for cutting base plate by laser and laser cutting equipment |
| US9963376B2 (en) | 2014-09-29 | 2018-05-08 | Boe Technology Group Co., Ltd. | Method for cutting substrate by laser and laser cutting device |
| CN104891496A (en) * | 2015-05-11 | 2015-09-09 | 常州市奥普泰科光电有限公司 | Method for non-destructive cutting of large optical glass to small ones |
| CN108463309A (en) * | 2016-07-18 | 2018-08-28 | 微林股份有限公司 | Laser emission tool |
| CN110770180A (en) * | 2017-03-13 | 2020-02-07 | 相干激光系统有限公司 | Controlled separation of laser processed brittle materials |
| CN110770180B (en) * | 2017-03-13 | 2022-10-21 | 相干激光系统有限公司 | Controlled separation of laser processed brittle materials |
| CN110526564A (en) * | 2019-09-16 | 2019-12-03 | 蓝思科技（长沙）有限公司 | A kind of glass splinter method |
| CN114131212A (en) * | 2021-11-10 | 2022-03-04 | 江苏大学 | Laser modification cutting and automatic separation method for transparent material closed solid structure |
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Application publication date: 20121107 |