CN105665950A - Indention pore forming device and method of laser in-situ auxiliary transparent diamond indenter - Google Patents
Indention pore forming device and method of laser in-situ auxiliary transparent diamond indenter Download PDFInfo
- Publication number
- CN105665950A CN105665950A CN201610019585.0A CN201610019585A CN105665950A CN 105665950 A CN105665950 A CN 105665950A CN 201610019585 A CN201610019585 A CN 201610019585A CN 105665950 A CN105665950 A CN 105665950A
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- Prior art keywords
- transparent diamond
- laser
- diamond penetrator
- knife
- handle
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to an indention pore forming device of a laser in-situ auxiliary transparent diamond indenter. The device comprises a hard substrate, a knife handlecorrespondingly positioned at the upper part of the hard substrate and axially provided with an inner through hole, and a transparent diamond indenter fixed at one end of the knife handle; and embedded optical fiber laser penetrating through the inner through hole and the transparent diamond indenter and focused at the bottom of the transparent diamond indenter is introduced to the other end of the knife handle. The invention further provides an indention pore forming method of the laser in-situ auxiliary transparent diamond indenter. Based on ultrahard and ultra-sharp mechanical indention effect of diamond, and supplemented by an in-situ laser auxiliary thermal stress effect, the device and the method can realize the formation of large-size taper holes, can realize the formation of single-side ultramicro holes with a high depth-diameter ratio, and are high in processing quality.
Description
Technical field
The present invention relates to material micropore, ultramicropore processing technique field, be specifically related to laser in-situ and assist transparent diamond penetrator coining hole-forming device and method.
Background technology
Current material micropore, ultramicropore processing method a lot, such as mechanical processing method, special process method and Compound Machining method etc., but the capillary processing technology for big thickness material still suffers from a lot of technical problem, processing yardstick is limited, it is difficult to realize the capillary processing technology of big aspect ratio, difficult-to-machine material.
Summary of the invention
It is an object of the invention to provide a kind of laser in-situ and assist transparent diamond penetrator coining hole-forming device, additionally provide a kind of laser in-situ and assist transparent diamond penetrator coining forming hole method, be used for solving above-mentioned deficiency.
For solving above-mentioned technical problem, the present invention provides techniques below scheme: laser in-situ assists transparent diamond penetrator coining hole-forming device, being placed in hard base upper portion including hard substrate, correspondence and axially offer the handle of a knife of inner via hole, be fixed on the transparent diamond penetrator of handle of a knife one end, the described handle of a knife other end passes into through inner via hole and transparent diamond penetrator, focuses on the embedded optical-fiber laser bottom transparent diamond penetrator.
On such scheme basis preferentially, described inner via hole is positioned at handle of a knife center.
On such scheme basis preferentially, described transparent diamond penetrator is cone shape structure.
On such scheme basis preferentially, described transparent diamond penetrator is brazed on handle of a knife.
Laser in-situ assists the method for transparent diamond penetrator coining pore-forming, including:
(1) cutter is made: at the transparent diamond penetrator of handle of a knife one end soldering with inner via hole;
(2) optical-fiber laser is passed into: the inner via hole toward handle of a knife passes into embedded optical-fiber laser, makes laser focus on bottom transparent diamond penetrator through handle of a knife, transparent diamond penetrator;
(3) workpiece is placed: be positioned over by workpiece to be processed in the hard substrate of the certain area of certain thickness, forms bottom restraint and the supporting role of workpiece;
(4) elaboration: according to workpiece pore-forming needs, regulates related process parameters; Under the original position effect of laser, transparent diamond penetrator is vertically pressed down on relative workpiece to be processed surface; Utilize the modifying function of material, under the compound action of hard substrate, make workpiece to be processed coining pore-forming.
The present invention compared with prior art have the beneficial effect that the present invention propose a kind of by laser in-situ assist transparent diamond penetrator difficult-to-machine material is carried out big aspect ratio hole shape coining processing unit (plant) and method, sharp mechanical pressure-applying superhard based on diamond, super, it is aided with local laser auxiliary thermal stress effect, both the taper hole (blind hole) that can realize large scale shapes, the unilateral ultramicropore (through hole) that can also realize big aspect ratio shapes, and crudy is high.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram.
Number in the figure is: 1-optical-fiber laser, 2-handle of a knife, 21-inner via hole, the transparent diamond penetrator of 3-, 4-workpiece to be processed, the hard substrate of 5-.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated. Should be appreciated that specific embodiment described herein is only in order to explain the present invention, is not intended to limit the present invention.
In describing the invention, it will be appreciated that, term " longitudinal direction ", " transverse direction ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention, rather than instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Known with reference to Fig. 1, laser in-situ assists transparent diamond penetrator coining hole-forming device, being placed in hard substrate 5 top including hard substrate 5, correspondence and central axial offer the handle of a knife 2 of inner via hole 21, be brazed in the transparent diamond penetrator 3 of the cone shape of handle of a knife 2 one end, described handle of a knife 2 other end passes into through inner via hole 21 and transparent diamond penetrator 3, focuses on the embedded optical-fiber laser 1 bottom transparent diamond penetrator 3.
Its processing method, including:
(1) cutter is made: at the transparent diamond penetrator 3 of handle of a knife 2 one end soldering with inner via hole 21; Transparent diamond penetrator 3 brazed portions ensures transparent, and solder does not block handle of a knife 2 inner via hole 21 joint portion.
(2) optical-fiber laser is passed into: the inner via hole 21 toward handle of a knife 2 passes into embedded optical-fiber laser 1, makes laser focus on bottom transparent diamond penetrator 3 through handle of a knife 2, transparent diamond penetrator 3;
(3) workpiece is placed: be positioned over by workpiece to be processed 4 in the hard substrate 5 of the certain area of certain thickness, forms bottom restraint and the supporting role of workpiece;
(4) elaboration: according to workpiece pore-forming needs, regulates related process parameters; Under the original position effect of laser, transparent diamond penetrator 3 is vertically pressed down on relative workpiece to be processed surface; Utilize the modifying function of material, under the compound action of hard substrate 5, make workpiece to be processed 4 coining pore-forming.
Passing into embedded optical-fiber laser 1 in handle of a knife 2 inner via hole 21 of transparent diamond penetrator 3, the transparent diamond penetrator 3 of laser light focuses on bottom it, and concrete focusing performance is relevant with laser parameter, the geometric parameter of transparent diamond penetrator, material parameter etc. Workpiece to be processed 4 is positioned on hard substrate 5 supporter, then the laser in-situ formed is assisted transparent diamond penetrator alignment workpiece to be processed carry out vertical coining. Under press through in journey, according to the interaction relationship focusing on laser and workpiece to be processed, it is determined that the dead time of pressure head, be beneficial to workpiece to be processed 4 and fully absorb laser energy and reach interior tissue and purpose that material mechanical performance changes. When pressure head continues deeper into, can effectively utilize the modifying function of material, under the compound action of hard substrate 5, make the effective pore-forming of workpiece to be processed 4. Have the volume under pressure of transparent diamond penetrator and become hole size according to, needed for pore-forming, determining by regulating technological parameter involved above.
The present invention propose a kind of by laser in-situ assist transparent diamond penetrator difficult-to-machine material is carried out big aspect ratio hole shape coining processing unit (plant) and method, sharp mechanical pressure-applying superhard based on diamond, super, it is aided with local laser auxiliary thermal stress effect, both the taper hole (blind hole) that can realize large scale shapes, the unilateral ultramicropore (through hole) that can also realize big aspect ratio shapes, and crudy is high.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all any amendment, equivalent replacement and improvement etc. made within the spirit and principles in the present invention, should be included within protection scope of the present invention.
Claims (5)
1. laser in-situ assists transparent diamond penetrator coining hole-forming device, it is characterized in that: include hard substrate, correspondence is placed in hard base upper portion and axially offers the handle of a knife of inner via hole, be fixed on the transparent diamond penetrator of handle of a knife one end, and the described handle of a knife other end passes into through inner via hole and transparent diamond penetrator, focuses on the embedded optical-fiber laser bottom transparent diamond penetrator.
2. laser in-situ according to claim 1 assists transparent diamond penetrator coining hole-forming device, it is characterised in that: described inner via hole is positioned at handle of a knife center.
3. laser in-situ according to claim 1 assists transparent diamond penetrator coining hole-forming device, it is characterised in that: described transparent diamond penetrator is cone shape structure.
4. laser in-situ according to claim 1 assists transparent diamond penetrator coining hole-forming device, it is characterised in that: described transparent diamond penetrator is brazed on handle of a knife.
5. the method that laser in-situ assists transparent diamond penetrator coining pore-forming, it is characterised in that including:
(1) cutter is made: at the transparent diamond penetrator of handle of a knife one end soldering with inner via hole;
(2) optical-fiber laser is passed into: the inner via hole toward handle of a knife passes into embedded optical-fiber laser, makes laser focus on bottom transparent diamond penetrator through handle of a knife, transparent diamond penetrator;
(3) workpiece is placed: be positioned over by workpiece to be processed in the hard substrate of the certain area of certain thickness, forms bottom restraint and the supporting role of workpiece;
(4) elaboration: according to workpiece pore-forming needs, regulates related process parameters; Under the original position effect of laser, transparent diamond penetrator is vertically pressed down on relative workpiece to be processed surface; Utilize the modifying function of material, under the compound action of hard substrate, make workpiece to be processed coining pore-forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610019585.0A CN105665950B (en) | 2016-01-09 | 2016-01-09 | Laser in-situ aids in transparent diamond penetrator coining hole-forming device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610019585.0A CN105665950B (en) | 2016-01-09 | 2016-01-09 | Laser in-situ aids in transparent diamond penetrator coining hole-forming device and method |
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| CN105665950A true CN105665950A (en) | 2016-06-15 |
| CN105665950B CN105665950B (en) | 2017-10-13 |
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Cited By (6)
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| CN110434191A (en) * | 2019-09-09 | 2019-11-12 | 长春理工大学 | A kind of two-way coining pore-forming circular cone pressure head centering detection and bearing calibration |
| CN110682209A (en) * | 2019-09-09 | 2020-01-14 | 长春理工大学 | Laser in-situ assisted grinding method for typical crystal face of single crystal diamond |
| CN111299868A (en) * | 2020-03-03 | 2020-06-19 | 长春理工大学 | Optical system for mechanically scribing echelle grating by aid of laser in-situ |
| CN112894148A (en) * | 2021-01-17 | 2021-06-04 | 长春理工大学 | Processing equipment and processing method for preparing multi-stage microstructure |
| CN113218317A (en) * | 2021-04-23 | 2021-08-06 | 长春理工大学 | In-situ detection method in laser in-situ pressure head coining workpiece pore-forming process |
| CN113478069A (en) * | 2021-07-23 | 2021-10-08 | 哈尔滨理工大学 | Laser heating auxiliary scribing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434191A (en) * | 2019-09-09 | 2019-11-12 | 长春理工大学 | A kind of two-way coining pore-forming circular cone pressure head centering detection and bearing calibration |
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| CN110682209B (en) * | 2019-09-09 | 2022-03-29 | 长春理工大学 | Laser in-situ assisted grinding method for typical crystal face of single crystal diamond |
| CN111299868A (en) * | 2020-03-03 | 2020-06-19 | 长春理工大学 | Optical system for mechanically scribing echelle grating by aid of laser in-situ |
| CN112894148A (en) * | 2021-01-17 | 2021-06-04 | 长春理工大学 | Processing equipment and processing method for preparing multi-stage microstructure |
| CN112894148B (en) * | 2021-01-17 | 2022-06-28 | 长春理工大学 | Processing equipment and processing method for preparing multi-stage microstructure |
| CN113218317A (en) * | 2021-04-23 | 2021-08-06 | 长春理工大学 | In-situ detection method in laser in-situ pressure head coining workpiece pore-forming process |
| CN113478069A (en) * | 2021-07-23 | 2021-10-08 | 哈尔滨理工大学 | Laser heating auxiliary scribing device |
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| CN105665950B (en) | 2017-10-13 |
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