CN206084139U - System for dual laser processing water logging work piece - Google Patents
System for dual laser processing water logging work piece Download PDFInfo
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- CN206084139U CN206084139U CN201620370348.4U CN201620370348U CN206084139U CN 206084139 U CN206084139 U CN 206084139U CN 201620370348 U CN201620370348 U CN 201620370348U CN 206084139 U CN206084139 U CN 206084139U
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- laser
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- water tank
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Abstract
The utility model relates to a system for dual laser processing water logging work piece, this system produces the solid laser of wavelength 1064nm's A laser and produces laser head position in the water tank top that the wavelength is the CO2 gas laser of 10640nm's B laser, the central line of A laser beam is the plumb line, the central line and the A laser beam of B laser beam intersect in the focus of A laser at the work piece upper surface, is the two angle of intersection 10 30, the focus point of A and B laser is at a distance of hundreds of microns. Worktable height is adjustable. Is workpiece surface water layer thickness 1 3 the millimeter. The laser breakdown aquatic products is given birth to the shock wave and is acted on workpiece surface and by the malactic region in part, get rid of malactic material and realize grooving processing. Compare with the processing of laser fusion cutting, the utility model discloses the heating temperature of A laser is less than the material fusing point, can reduce local overheat's influence, guarantees to be processed into the article quality.
Description
Technical field
This utility model is related to liquid assisted laser machining, and specially a kind of double excitation processes water logging work
The system of part.
Background technology
Laser machine as micro- damage and the manufacturing process of precision is more and more wider in the application of minute yardstick manufacture field
It is general.Laser Processing is the heat effect using laser mostly, makes material local heating reach fusing point melting, from
And portion of material is removed, complete the lithography of grooving.
Various materials cannot all avoid the presence of certain trickle tissue defects.Change local material in LASER HEATING
During material state, removal material, the high temperature of laser processing procedure is made in region certain around grooving
It is inevitably thermally influenced.The trickle tissue defects under the high thermogenetic stress gradient in local of material
It is easy to germinate the hard brittle material of micro-crack, particularly silicon etc.
Laser melts to be cut the heat affecting of the course of processing and has：
1. melt in the heat affected area for cut pyroprocess generation and there is larger thermal stress, can lure that material is deposited in itself into
Microcrack extension, cause material local chips；
2. make the grooving surface of workpiece produce initial micro-crack, stress will focus on the point of micro-crack during stress
End；Workpiece under arms when, when external load exceedes material micro-crack dimension in the stress that its crack tip is produced
Extension is caused workpiece fracture damage by the crack growth resistance for hold present situation, not extending, micro-crack.
The hidden danger that low stress brittle fracture is produced when workpiece is on active service has been buried in the heat affecting of the visible laser course of processing.
Therefore, with deepening continuously to Reciprocity of Laser ＆ Materials mechanism understanding, laser machine at present
One of emphasis of research is the heat affecting for reducing laser while Laser Processing removes material as far as possible, is contracted
Little heat affected area, to avoid the occurrence of micro-crack.
Utility model content
The purpose of this utility model is the system that a kind of double excitation of design processes water logging workpiece, and which includes water
Case, the workbench in which, the A optical maser wavelengths of the generation of solid state laser are 1064nm, focus on workpiece
Surface, the B optical maser wavelengths that gas laser is produced are 10640nm, focus on above surface of the work, with
The focus point of A laser has certain distance.Two kinds of laser are removed predetermined to the workpiece synergism in liquid
The material in cutting-up path, completes the Laser Processing of workpiece at a temperature of less than workpiece material fusing point.
The system that a kind of double excitation of this utility model design processes water logging workpiece, including water tank, positioned at water
The workbench in bottom portion, table surface is horizontal plane, and workpiece is fixed on table surface, laser instrument
Laser head is located above water tank, and in surface of the work, one solid state laser of the system swashs laser beam condensation
Shaven head is located above water tank, and which produces A laser of the wavelength for 1064nm, and A laser beams directly focus on water
On the cutting-up path of middle surface of the work；Another CO2The laser head of gas laser also is located above water tank,
Which produces B laser of the wavelength for 10640nm, and the focal spot of B laser beams is located above workpiece
In water, the distance between focus point of focus point and A laser of B laser is (1～4) × 102μm.Institute
The centrage for stating A laser beams is plumb line, and the centrage of B laser beams intersected with the centrage of A laser beams
In A laser beams surface of the work focus point, the angle of cut of the two be 10 °～30 °.
The workbench is the adjustable workbench of table surface height.
Water is full of in the water tank, water layer thickness is 1～3 millimeter above surface of the work.
Water inlet is arranged at the water tank bottom, is installed into water valve on water inlet, and water tank has salable at the top of which
Top cover, has air vent on top cover, air bleeding valve is installed on air vent.When water tank water intake, enter water valve and row
Air valve is opened, and in order to the gas in water tank is discharged, makes water tank be full of water.Enter when the system is operating
Water valve and air bleeding valve are turned off, so that the water layer of surface of the work is stable.
The water tank connects pressure-measuring pipe, its connection hydraulic pressure gauge, in order to detect water tank in laser processing procedure
Interior pressure.Pressure-measuring pipe Jing pressure valves connect hydraulic pressure gauge, to select to turn off or to open.
The top cover of the water tank is transparent cap, is passed through in order to observe Laser Processing situation and laser.
The wavelength that solid state laser is produced directly focuses on surface of the work in water for the A laser of 1064nm
On cutting-up path, the heat effect of laser on the focus point of A laser makes workpiece be heated local softening, but poly-
Phase transition temperature of the temperature of focus less than workpiece material.The A laser of 1064nm in water absorbance very little and
Absorbance within the workpiece is higher, therefore the energy of A laser beams is mainly absorbed by workpiece and produces heat.
CO2Gas laser produce wavelength for 10640nm B laser focal spot above workpiece,
It is in water, the distance between focus point of focus point and A laser of B laser is (1～4) × 102
μm.B laser has very high absorbance in water, and the water around B laser focusings point is hit under its effect
Wear, the water for puncturing produces cavitation cavity and plasma stock wave, the partial high pressure effect that shock wave is produced
In surface of the work by the region of local softening, after the material softening at A laser focusings, intensity is substantially reduced,
The impulsive force of the shock wave produced by B laser is removed, and realizes that grooving is processed.
Compared with prior art, a kind of advantage of the system of double excitation processing water logging workpiece of this utility model is：
1st, the impact of the hot-spot of Laser Processing is reduced, workpiece local is by A when this utility model is laser machined
LASER HEATING but at a temperature below fusing point, the shock wave produced with B laser is removing because being heated and intensity
The local material of reduction, and temperature is above tens degree of fusing point to hundreds of degree when typically lf is cut；Cause
And heat affecting during this utility model Laser Processing greatly reduces, by taking silicon chip as an example, its fusing point is 1687K,
And the heating of A laser of the present utility model softens silicon sheet material by only needing to reach 1100K, B swashs
The shock wave impulsive force that light is produced is enough to the material removal at A local laser softenings；2nd, because this practicality is new
Heat affecting when type is laser machined is reduced, therefore this law is laser machined compared with conventional laser melts the processing cut,
The microstructure defect of material greatly reduces to the situation that micro-crack develops, and otch is smooth, ultramicroscope
Under have no micro-crack；And the thermal stress in the heat affected area of the workpiece of this law Laser Processing test gained is only
About 1/5 to the 1/3 of smelting method；3rd, because the shock wave of B laser generation is to not thermoplastic portion on workpiece
Divide and be not enough to produce destruction, A laser focusings point determines processing along the precision that cutting-up path is moved
Precision, because under the heating of A laser, material does not melt, without melted material around joint-cutting, B laser is produced
Shock wave the material around joint-cutting will not be removed along band, joint-cutting further can reduce, and improve laser and add
Work precision and workpiece quality.
Description of the drawings
Fig. 1 is the system embodiment structural representation that this double excitation processes water logging workpiece.
1st, water inlet, 2, enter water valve, 3, water tank, 4, top cover, 5, B laser, 6, A laser, 7,
Air vent, 8, air bleeding valve, 9, workpiece, 10, workbench, 11, hydraulic pressure gauge, 12, pressure valve.
Specific embodiment
With reference to the accompanying drawings and examples this utility model is described in detail：
The structure of the system embodiment of this double excitation processing water logging workpiece is as shown in figure 1,3 bottom of this example water tank
There is water inlet 1, install on water inlet into water valve 2, water tank 3 has salable transparent glass roof at the top of which
Lid 4, has air vent 7 on top cover 4, air bleeding valve 8 is installed on air vent 7.Water tank 3 connects pressure-measuring pipe,
Pressure-measuring pipe Jing pressure valves 12 connect hydraulic pressure gauge 11.When water tank 3 is intake, enter water valve 2, air bleeding valve and survey
Pressure valve 12 is opened.Enter water valve 2, air bleeding valve 8 and pressure valve 12 when the system is operating to be turned off.
This example table top for horizontal plane workbench 10 be located at 3 bottom of water tank, its table surface height scalable,
Workpiece 9 is fixed on 10 table top of workbench.The laser head of one solid state laser is located above water tank 3, its
A laser 6 of the wavelength for 1064nm is produced, 6 energy density of this example A laser is 191J/cm2, pulsewidth 42ns,
Repetition rate 40kHz.A laser beams are directly focused on the cutting-up path of surface of the work in water, A laser beams
Centrage be plumb line；Another CO2The laser head of gas laser also is located above water tank 3, its
B laser 5 of the wavelength for 10640nm is produced, the focal spot of B laser beams is located above workpiece 9
In water.5 energy density of this example B laser is 60J/cm2, pulsewidth 100ns, repetition rate 40kHz；B swashs
The centrage of light beam is 30 ° with the angle of cut of the centrage of A laser beams, and the intersection point of two centrages is A laser
Focus point of the beam on 9 surface of workpiece.Between the focus point of the focus point and A laser 6 of B laser 5 away from
From for 200 μm.
Water is full of in this example water tank 3,9 surface water layer thickness of workpiece is 2 millimeters.
During use, workpiece 9 is fixed on the table top of workbench 10.
Enter water valve 2, air bleeding valve 8 and pressure valve 12 to open before processing, water enters water tank from water valve 2 is entered
3, full of water to transparent 4 bottom surface of glass roof in water tank 3, water is overflowed from air vent 7.Turn off into water
Valve 2, air bleeding valve 8 and pressure valve 12.
The solid state laser of the A laser 6 for producing wavelength 1064nm is adjusted, makes A laser 6 focus on 9 table of workpiece
Face.The CO of the B laser 5 for producing wavelength 10640nm is adjusted again2Gas laser, first makes B laser 5 focus on work
The angle of inclination of gas laser laser head on the focus point of 9 surface A laser 6 of part, is kept, that is, keeps B to swash
The centrage of light beam is constant with 30 ° of the angle of cut of the centrage of A laser beams, fine tuning C02Gas laser so as to
Focus point is slightly upper to be moved, while detecting that grooving effect is fixed when reaching optimal.In the course of processing, B laser beams and A
The focus point relative position of laser beam is constant.Control centre's Synchronization Control solid state laser and CO2Gas laser
Device, makes their focus move along cutting-up path, and A laser 6 softens 9 local surfaces of workpiece, and B laser 5 punctures
The water of its focal point produces cavitation cavity, plasma stock wave, and 9 surface of blast effect impact workpiece is soft
Change region and remove material, complete grooving processing.
This example processes silicon slice workpiece, surface of the work maximum temperature 1200K.
Same silicon slice workpiece 9 adopts traditional lf lithography as a comparison case, laser energy
Density is 191J/cm2, pulsewidth 42ns is identical with the A laser 6 of above-described embodiment, and 9 surface of workpiece is most
High-temperature reaches 3538K.
This example processes silicon chip, and in the grooving of processing workpiece, otch is smooth, 200x1400 μm2In region, electricity
Do not observe on tangent plane, there is fragmentation under sub- microscope, without cladding layer.Comparative example processes identical silicon slice workpiece,
Tangent plane in same regional extent, in the identical grooving of electron microscope observation, it can be seen that staggeredly crackle 12
Root, has 5 to extend to surface of the work；These micro-cracks will necessarily affect the service life of workpiece.In addition
Understand that the heat affected area maximum thermal stress of comparative example smelting method is the heat of the present embodiment according to local stress calculation
3 to 5 times of zone of influence maximum thermal stress, it is clear that the laser processing of the present invention significantly reduces laser
The micro-crack extension power of processing workpiece.
Above-described embodiment, it is only further detailed to the purpose of this utility model, technical scheme and beneficial effect
Describe bright specific case in detail, this utility model is not limited to this.It is all in disclosed model of the present utility model
Any modification, equivalent substitution and improvements done within enclosing etc., are all contained in protection model of the present utility model
Within enclosing.
Claims (7)
1. the system that a kind of double excitation processes water logging workpiece, including water tank (3), positioned at water tank (3) bottom
The workbench (10) in portion, workbench (10) surface are horizontal plane, and workpiece (9) is fixed on workbench (10)
Surface, the laser head of laser instrument are located above water tank (3), laser beam condensation in workpiece (9) surface,
It is characterized in that：
The laser head of one solid state laser is located above water tank (3), and which produces wavelength for 1064nm's
A laser (6), A laser beams are directly focused on the cutting-up path on workpiece (9) surface in water；Another
CO2The laser head of gas laser also is located above water tank (3), and which produces B of the wavelength for 10640nm
Laser (5), the focal spot of B laser beams are in water above workpiece (9), B laser (5)
Focus point and the distance between the focus point of A laser (6) be (1～4) × 102μm。
2. the system that double excitation according to claim 1 processes water logging workpiece, it is characterised in that：
The centrage of the A laser beams is plumb line, the centrage of B laser beams and the center of A laser beams
Line intersects at focus point of the A laser beams on workpiece (9) surface, and the angle of cut of the two is 10 °～30 °.
3. the system that double excitation according to claim 1 processes water logging workpiece, it is characterised in that：
The workbench (10) is the adjustable workbench of table surface height.
4. the system that double excitation according to claim 1 processes water logging workpiece, it is characterised in that：
Water is full of in the water tank (3), workpiece (9) surface water layer thickness is 1～3 millimeter.
5. the system that double excitation according to claim 1 processes water logging workpiece, it is characterised in that：
Water inlet (1) is arranged at water tank (3) bottom, is installed into water valve (2), water on water inlet (1)
Case (3) has salable top cover (4) at the top of which, has air vent (7), air vent (7) on top cover (4)
Upper installation air bleeding valve (8).
6. the system that double excitation according to claim 1 processes water logging workpiece, it is characterised in that：
The water tank (3) connects pressure-measuring pipe, pressure-measuring pipe connection hydraulic pressure gauge (11).
7. the system that double excitation according to claim 1 processes water logging workpiece, it is characterised in that：
The top cover (4) of the water tank (3) is transparent cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620370348.4U CN206084139U (en) | 2016-04-27 | 2016-04-27 | System for dual laser processing water logging work piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620370348.4U CN206084139U (en) | 2016-04-27 | 2016-04-27 | System for dual laser processing water logging work piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206084139U true CN206084139U (en) | 2017-04-12 |
Family
ID=58472316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620370348.4U Expired - Fee Related CN206084139U (en) | 2016-04-27 | 2016-04-27 | System for dual laser processing water logging work piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206084139U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114888459A (en) * | 2022-04-22 | 2022-08-12 | 西安尚泰光电科技有限责任公司 | Method and device for processing nano-hole of transparent material |
| CN115323370A (en) * | 2022-08-19 | 2022-11-11 | 江苏宇钛新材料有限公司 | Underwater laser material increase device and method for tc4 titanium alloy |
-
2016
- 2016-04-27 CN CN201620370348.4U patent/CN206084139U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114888459A (en) * | 2022-04-22 | 2022-08-12 | 西安尚泰光电科技有限责任公司 | Method and device for processing nano-hole of transparent material |
| CN115323370A (en) * | 2022-08-19 | 2022-11-11 | 江苏宇钛新材料有限公司 | Underwater laser material increase device and method for tc4 titanium alloy |
| CN115323370B (en) * | 2022-08-19 | 2023-11-14 | 江苏宇钛新材料有限公司 | Underwater laser material adding device and method for tc4 titanium alloy |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170412 Termination date: 20170427 |
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| CF01 | Termination of patent right due to non-payment of annual fee |