CN108067751A - Plate grade material abnormity processing method - Google Patents
Plate grade material abnormity processing method Download PDFInfo
- Publication number
- CN108067751A CN108067751A CN201711330381.XA CN201711330381A CN108067751A CN 108067751 A CN108067751 A CN 108067751A CN 201711330381 A CN201711330381 A CN 201711330381A CN 108067751 A CN108067751 A CN 108067751A
- Authority
- CN
- China
- Prior art keywords
- grade material
- plate grade
- laser beam
- processing method
- abnormity processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
- C04B41/5338—Etching
- C04B41/5353—Wet etching, e.g. with etchants dissolved in organic solvents
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structural Engineering (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides a kind of plate grade material abnormity processing method, comprises the following steps：Step S1, using pulse width range femtosecond to picosecond laser generate laser beam；Step S2, laser beam are incident to second surface after focusing from the first surface of plate grade material to be cut；Step S3, laser beam foucing, perpendicular to incidence surface direction, form the vertical cutting column formed by multiple fine fisssure points from top to bottom in plate grade material；Step S4, cutting route relatively moves laser beam on demand with plate grade material；What laser beam passed through cutting route is needed to form multiple vertical cutting columns；Step S5, by wet etching along need cutting route by plate grade material separate.Further, the plate grade material is transparent or semitransparent material.The present invention can solve the problems, such as that plate grade material easily generates chipping, micro-crack and layering equivalent damage in cutting process.
Description
Technical field
The invention belongs to material abnormity manufacture field more particularly to a kind of methods of plate grade material abnormity processing.
Background technology
With the rapid development of electronic products, the device of mobile terminal is all towards volume is thinner, weight is lighter and is manufactured into
This lower direction is developed.In including for abnormity processing involved in these electronic products：Glass cover-plate, stainless steel plate, silicon chip,
Three-five chip, ceramic material and polymer material.At present, the thickness of the sheets of glass on electronic product has already decreased to
0.3mm is even lower.The thinner sheets of glass of thickness is more sensitive to active force, and brittle failure occurs after being more easily hit, this is undoubtedly
Add the difficulty of cutting processing.
For example, existing glass-cutting method substantially has mechanical patterning method and common laser cutting method.Machinery is cut
The method of cutting is in glass-cutting road one of line of scribing using diamond cutter.But there are problems, examples for this machine cuts method
Such as the chipping of glass material, chip and micro-crack, the strength reduction of cut edge, the deep torn grain of generation is usually not orthogonal to glass
Surface reduces the intensity and reliability of glass, while output capacity is also very low.Common laser cutting method is using at glass
At a temperature of softening there is preferable plasticity and ductility, irradiate the surface of glass pieces to be cut with the laser of focusing,
Glass is melted by the energy density of superelevation, while air-flow is coordinated to blow away the glass of melting, so as to directly by a monolithic glass
Workpiece, which is divided into two to cut open, to be come.Since glass pieces are heat fusing to the laser, the cutting effect of the cutting method compared with
Difference, joint-cutting is irregular, and easily forming fire check in entire joint-cutting section substantially reduces strength of glass, and is produced in cutting process
Raw slag can also pollute glass surface.
The content of the invention
It is an object of the present invention to overcome the shortcomings of the prior art and provide a kind of special-shaped processing sides of plate grade material
Method can solve the problems, such as that plate grade material easily generates chipping, micro-crack and layering equivalent damage in cutting process.What the present invention used
Technical solution is：
A kind of plate grade material abnormity processing method, comprises the following steps：
Step S1, using pulse width range femtosecond to picosecond laser generate laser beam；
Step S2, laser beam are incident to second surface after focusing from the first surface of plate grade material to be cut；
Step S3, laser beam foucing, perpendicular to incidence surface direction, are formed and hung down by what multiple fine fisssure points were formed in plate grade material
Vertical cut cuts column；
Step S4, cutting route relatively moves laser beam on demand with plate grade material；Cutting road is needed what laser beam passed through
Line forms multiple vertical cutting columns；
Step S5, by wet etching along need cutting route by plate grade material separate.
Further, the multiple fine fisssure point vertically in cutting column is uniform along plate grade material first surface to second surface
Vertical distribution.
Further, the plate grade material is transparent or semitransparent material.
Further, the wavelength of laser beam is 355 nanometers~1064 nanometers.
Further, in step S2, laser beam line focus is after plate grade material from first surface to second surface shape one by one
Into vertical uniform hot spot, the diameter range of the vertical uniform hot spot is 0.5 micron~15 microns.
Further, the pulse width range of laser beam is 10 femtosecond~100 picosecond.
Further, single-point energy scope is the μ J of 0.1 μ J~20 after laser beam focus.
Further, the plate grade material includes the three of non-quartz glass, quartz glass, lithium tantalate, lithium niobate or light transmission
Five race's materials.
Further, planarization detection device is set with the planarization data of detection plate grade material laser beam incidence surface；
The control device of the planarization detection device of plate grade material and laser is connected, laser is moved according to the planarization data of reception
Dynamic laser focus point.
Further, the thickness range of plate grade material is 0.05 millimeter~2 millimeters.
The advantage of the invention is that：The present invention solve easily generated in cutting plate grade materials process chipping, micro-crack with
And layering equivalent damage problem, while can realize the subvertical cutting orifice angle more than 80 °, and greatly improve cutting production
Efficiency；High precision and smooth cutting surfaces can be obtained.Moreover, this method will not generate slight crack, broken in laser process
Bits etc., can effectively ensure processing quality.
Description of the drawings
Fig. 1 is the processing method schematic diagram of the present invention.
Fig. 2 is the schematic diagram that vertical cutting column is formed in the processing method of the present invention.
Specific embodiment
With reference to specific drawings and examples, the invention will be further described.
The present invention proposes a kind of plate grade material abnormity processing method, is suitable for these following plate grade materials 1：Non- quartz glass
Glass, quartz glass, lithium tantalate, lithium niobate and the three-five of light transmission material；The step of processing method is described in detail below.
Step S1, using pulse width range femtosecond to picosecond laser 2 generate laser beam 3；
The wavelength of laser beam 3 is 355 nanometers~1064 nanometers, and representative value is 700 nanometers~800 nanometers；
Step S2, laser beam 3 are incident to second surface after focusing from the first surface of plate grade material 1 to be cut；
The plate grade material 1 is transparent or semitransparent material；
3 line focus of laser beam forms vertical uniform hot spot to second surface one by one after plate grade material 1 from first surface, described to hang down
The diameter range of straight uniform light spots is 0.5 micron~15 microns, and representative value is 2~5 microns；
Step S3, laser beam foucing, perpendicular to incidence surface direction, are formed micro- by the distribution of multiple uniform verticals in plate grade material
The vertical cutting column 4 that knick point 41 is formed；
Under laser beam effect, multiple vertical uniform hot spots from 1 first surface of plate grade material to second surface cause multiple equal
The appearance of the fine fisssure point 41 of even vertical distribution；
The pulse width range of laser beam is 10 femtosecond~100 picosecond, and single-point energy scope is 0.1 μ J~20 after laser beam focus
μ J, can be according to the different corresponding selections of thickness h of plate grade material 1 to be processed；
For example, for h=0.05mm, then the pulse width of laser beam is 10~30 femtoseconds, 0.1~0.3 μ J of single-point energy scope；
For h=0.5mm, then the pulse width of laser beam is 1~5 picosecond, 1~3 μ J of single-point energy scope；For h=2mm, then laser
The pulse width of beam is 50~100 picoseconds, 10~20 μ J of single-point energy scope；
Step S4, cutting route relatively moves laser beam 3 on demand with plate grade material 1；It needs to cut what laser beam passed through
Route forms multiple vertical cutting columns 4；
Movable laser device 2 or plate grade material 1 so that relative displacement occurs for the two, and the route of relative displacement, which follows, to be needed to cut
Route；
It, more preferably, can be with the planarization detection device of arranging plate grade material, with detection plate grade in above-mentioned steps implementation process
The planarization data of material laser beam incidence surface；By the planarization detection device of plate grade material and the control device of laser 2
Connection, laser move laser focus point according to the planarization data of reception；Multiple fine fisssure points 41 can be caused to be formed vertical
Cut the up rightness of column 4 more preferably；
Step S5, by wet etching along cutting route is needed to separate plate grade material 1.
The mixing of phosphoric acid, acetic acid, hydrofluoric acid, sulfuric acid, nitric acid or hydrochloric acid or above-mentioned acid can be used in the corrosive liquid of wet etching
Object.
An elliptical aperture is cut for the example of Fig. 1 and Fig. 2, it is necessary on plate grade material 1, which passes through
Smaller pulse width and extremely low single-point energy form the uniform vertical cutting column of micro-damage, to obtain the material of low-light spot
Processing method may finally realize the subvertical cutting orifice angle more than 80 °, and avoid common chipping, chip, carry
High product yield, quality and cutting efficiency.
It should be noted last that more than specific embodiment is merely illustrative of the technical solution of the present invention and unrestricted,
Although the present invention is described in detail with reference to example, it will be understood by those of ordinary skill in the art that, it can be to the present invention
Technical solution be modified or replaced equivalently, without departing from the spirit and scope of technical solution of the present invention, should all cover
Among scope of the presently claimed invention.
Claims (10)
1. a kind of plate grade material abnormity processing method, which is characterized in that comprise the following steps：
Step S1 generates laser beam (3) using laser (2)；
Step S2, laser beam (3) are incident to the second table after focusing from the first surface of plate grade material (1) to be cut
Face；
Step S3, laser beam foucing, perpendicular to incidence surface direction, are formed and formed by multiple fine fisssure points (41) in plate grade material
Vertical cutting column (4)；
Step S4, cutting route relatively moves laser beam (3) on demand with plate grade material (1)；In the needs that laser beam passes through
Cutting route forms multiple vertical cutting columns (4)；
Step S5, by wet etching along need cutting route by plate grade material (1) separate.
2. plate grade material abnormity processing method as described in claim 1, which is characterized in that
The multiple fine fisssure point (41) in vertical cutting column (4) is uniformly hung down along plate grade material (1) first surface to second surface
Straight distribution.
3. plate grade material abnormity processing method as described in claim 1, which is characterized in that
The plate grade material (1) is transparent or semitransparent material.
4. plate grade material abnormity processing method as described in claim 1, which is characterized in that
The wavelength of laser beam (3) is 355 nanometers~1064 nanometers.
5. plate grade material abnormity processing method as described in claim 1, which is characterized in that
In step S2, laser beam (3) line focus is formed vertically one by one after plate grade material (1) from first surface to second surface
Even hot spot, the diameter range of the vertical uniform hot spot is 0.5 micron~15 microns.
6. plate grade material abnormity processing method as described in claim 1, which is characterized in that
The pulse width range of laser beam is 10 femtosecond~100 picosecond.
7. plate grade material abnormity processing method as described in claim 1, which is characterized in that
Single-point energy scope is the μ J of 0.1 μ J~20 after laser beam focus.
8. plate grade material abnormity processing method as described in claim 1, which is characterized in that
The plate grade material includes non-quartz glass, quartz glass, lithium tantalate, lithium niobate or the three-five of light transmission material.
9. plate grade material abnormity processing method as described in claim 1, which is characterized in that
Planarization detection device is set with the planarization data of detection plate grade material laser beam incidence surface；By the flat of plate grade material
Whole property detection device is connected with the control device of laser (2), and laser moves laser according to the planarization data of reception and focuses on
Point.
10. plate grade material abnormity processing method as described in claim 1, which is characterized in that
The thickness range of plate grade material (1) is 0.05 millimeter~2 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711330381.XA CN108067751A (en) | 2017-12-13 | 2017-12-13 | Plate grade material abnormity processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711330381.XA CN108067751A (en) | 2017-12-13 | 2017-12-13 | Plate grade material abnormity processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108067751A true CN108067751A (en) | 2018-05-25 |
Family
ID=62158255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711330381.XA Pending CN108067751A (en) | 2017-12-13 | 2017-12-13 | Plate grade material abnormity processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108067751A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112427812A (en) * | 2020-09-22 | 2021-03-02 | 厦门云天半导体科技有限公司 | Method for realizing separation of ultrathin workpieces through spacing ultrafine laser through holes |
| CN113695167A (en) * | 2021-09-16 | 2021-11-26 | 深圳市摆渡微电子有限公司 | Striker for dispensing and manufacturing method thereof |
| CN117548861A (en) * | 2024-01-10 | 2024-02-13 | 深圳市大族数控科技股份有限公司 | Method and system for processing slotted hole in light-transmitting material |
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| CN104959736A (en) * | 2015-07-23 | 2015-10-07 | 深圳英诺激光科技有限公司 | Apparatus and method for processing micropore through filamentous laser |
| CN106029286A (en) * | 2013-12-17 | 2016-10-12 | 康宁股份有限公司 | Method for rapid laser drilling of holes in glass and products made therefrom |
| CN106946466A (en) * | 2016-09-05 | 2017-07-14 | 江苏大学 | Strengthened glass processes the method and device in hole |
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| CN101244523A (en) * | 2008-02-27 | 2008-08-20 | 浙江工业大学 | Laser process testing method and special instrument |
| JP2012521889A (en) * | 2009-03-27 | 2012-09-20 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | Improved method for processing brittle materials |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112427812A (en) * | 2020-09-22 | 2021-03-02 | 厦门云天半导体科技有限公司 | Method for realizing separation of ultrathin workpieces through spacing ultrafine laser through holes |
| CN113695167A (en) * | 2021-09-16 | 2021-11-26 | 深圳市摆渡微电子有限公司 | Striker for dispensing and manufacturing method thereof |
| CN117548861A (en) * | 2024-01-10 | 2024-02-13 | 深圳市大族数控科技股份有限公司 | Method and system for processing slotted hole in light-transmitting material |
| CN117548861B (en) * | 2024-01-10 | 2024-06-11 | 深圳市大族数控科技股份有限公司 | Method and system for processing slotted hole in light-transmitting material |
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Effective date of registration: 20200610 Address after: Room 987, Room 1303, 99 South Second Road, Songyu, Xiamen China (Fujian) Free Trade Experimental Zone, 361000 Applicant after: Xiamen Yun Tian Semiconductor Technology Co.,Ltd. Address before: Xishan Jing Hong Lu 214116 Jiangsu city of Wuxi province No. 58 East Industrial Park No. 45 Applicant before: WUXI GMAX MICROELECTRONICS Co.,Ltd. |
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Application publication date: 20180525 |