CN104999176B - The processing method of cutting edge - Google Patents
The processing method of cutting edge Download PDFInfo
- Publication number
- CN104999176B CN104999176B CN201410401572.0A CN201410401572A CN104999176B CN 104999176 B CN104999176 B CN 104999176B CN 201410401572 A CN201410401572 A CN 201410401572A CN 104999176 B CN104999176 B CN 104999176B
- Authority
- CN
- China
- Prior art keywords
- laser
- cutting
- cutting edge
- processing method
- cutting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
A kind of processing method of cutting edge imposes cutting portion laser at least 1 time, and the pulse duration range of laser used is 81ns-650ns.The processing method of quick cutting edge provided by the invention, not only make to be significantly improved with the cutting edge finish that hard material (such as: PCD) is cutter head, the machining period for also substantially reducing single-piece cutter, improves production efficiency, reduces the processing cost of single-piece cutter.
Description
Technical field
The present invention relates to a kind of processing method at position with cutting function more particularly to a kind of processing sides of cutting edge
Method, to cutting function position or material (containing hard material) processed the method to make cutting edge.
Background technique
Industry manufacture and manufacture field, during manufacturing product, it usually needs polished raw material, be ground or
The mode of cutting carries out moulding processing.When material hardness with higher, common processing method is not only difficult to realize, in work
When on it is also and uneconomical.
In microscopic dimensions, the blade obtained by means such as the wire cuttings that is ground or discharges is presented containing width and depth 3
μm or more sawtooth it is linear.On the one hand this makes the easy work in-process of blade avalanche, fragmentation occur and reduce cutter life, another
Aspect can leave microcosmic concave-convex to leave machining spur on workpiece to be machined surface, influence processing effect.
In order to improve cutting edge quality, the fine grinding of front and rear knife face can be carried out or by the thinner grinding wheel of granularity generally with lower
Efficiency machined parameters carry out electric discharge wire cutting finishing, the former can only the processing is simple shape, the latter will greatly prolong cutter plus
Between working hour.
Laser is just widely used in numerous areas from eighties of last century, is broadly divided into: at cutting, welding, label and heat
Reason (laser and optoelectronics are in progress [J], 2002,39 (1), 53-6).Laser cutting is that a kind of minimum diameters of line focus can be small
It is greater than 10 in the power density of the light beam of the high-energy density of 0.1mm, focal point7W/cm2~108W/cm2.When laser irradiation exists
By cutting material surface, luminous energy is transformed into thermal energy, so that the temperature of facular area quickly rises to the fusing point or boiling point of material, and by
Melt rapidly or vaporizes.The movement routine of laser is set, so that focus point constantly interacts with material, Jin Ershi
The cutting of existing material.In the process, it also cuts to assist gas help, blow away slag and cooling.In addition, laser power, swash
Beam mode, polarization and cutting speed determine quality (laser and optoelectronics progress [J], 2002,39 (1), the 53- of cutting
6)。
Since laser has the characteristics that carry out contactless cutting processing to material, the segmentation of material has been widely used in it
Manufacture field (CN1386606A, CN1768998A and CN101804551A), especially hard material (superhard material) processing neck
Domain, such as: for processing the cutter with hard material (superhard material) surface.
In order to improve the wearability and corrosion resistance of cutter, usually pass through sintering, welding, patch or coating in bit interface
Etc. modes impose hard (superhard) material, such as: diamond, quartz, monocrystalline diamond and zirconium dioxide (CN102581587A and
CN101380751A).It is covered with the cutter head of hard (superhard) material there is still a need for further processings to generate the cutting edge for being adapted to cutting,
But the application of hard (superhard) material is so that can not process cutting edge with conventional polishing process, so that such cutter head later period
Cutting edge (such as: anterior angle or relief angle) processing difficulty suddenly increase.
Electric discharge wire cutting method is made to solve the technical problem.This method is first on the cutter head of hard (superhard) material
A through-hole is made a call to, is then built into electric lead in hole, after both ends and external power supply are connected, the system by way of chemical galvano-cautery
Make cutting edge.The defect of this method is that the straightness at cutting edge edge is lower, and finish is also poor, causes to cannot achieve object essence
Process the needs of cutting.
Chinese invention patent application 200810138477.0 discloses a kind of processing method of cutting edge of diamond compound tool,
It the steps include: to be ground to required shape and size after a) being heat-treated tool matrix；B) in diamond blade welding position
Relief grinding and blade kissing and tool matrix flank, tool matrix should subtract 0.05~0.2mm than diamond blade compact dimensions,
Not to be worked into tool matrix when carrying out cutting edge processing to cutter；C) diamond blade is accurately welded on cutter base
On body corresponding position；D) diamond blade is uniformly reserved into the surplus of 0.15mm with required shape is laser-cut into；E) by copper rod
Material, at electrode, is installed on numerical control electric spark by the size and shape smart car of diamond blade cutting edge；F) by cutter positioning in machine
Bed correctly on position, guarantees correctly to coincide with electrode；G) make electrode rotary close to cutter, until forming suitable electric discharge
Gap；H) power parameters such as the rough machined electric current of electric spark, pulse width are chosen according to cutting edge surplus, makes electrode close to Buddha's warrior attendant
Galvanic action is generated when stone blade removes extra diamond；I) electrode is redressed, electric current, the pulse of finishing are selected
The power parameters such as width make electrode generate galvanic corrosion close to diamond blade and play finishing function, to obtain high-precision size, shape
Shape and cutting edge.It uses laser by diamond blade excision forming, but still processes cutting edge with galvanic action, does not make the straight of cutting edge
Dimension and finish etc. are significantly improved.
Chinese invention patent application 200810201484.0 discloses a kind of diamond composite crystal combination lockable four-side knife and system
Method is made, diadust and sintering cemented carbide is combined together with high temperature and pressure after diamond composite polycrystalline is made, is used
Diamond composite polycrystalline is cut into tetrahedron by electric discharge wire cutting or laser, then refine.But the technology is not remembered not only
The specific method of laser cutting is carried, the technological means of laser cutting is also not intended to processing cutting edge.
Chinese utility model patent ZL20092021791.6 discloses a kind of laser double-surface synchronous processing system, including swashs
Light device, intermediate displacement platform and workpiece to be machined.Workpiece to be machined two sides are two beam laser, are respectively acting on the two of workpiece to be machined
A side.The laser beam of workpiece to be machined two sides is on the same line or intersection is in inside workpiece.Add by the way that laser double-surface is synchronous
Work, the thickness that can once process can increase by 1 times or more than the thickness of single-sided process, realize to various superhard materials
Such as: the Double-side Synchronous cutting of PDC, PCBN and its composite sheet, ceramics.The technology can not be fully suitable for cutting edge roundness
Processing.
Chinese invention patent application 20118005259.7 discloses a kind of cutting tool and the manufacturer of the cutting tool
Method and manufacturing device, by making laser beam flying cutter material, by the cutter material be cut into predetermined shape with
Manufacture cutting tool, by make two linearly polarized laser beams close beams to two linearly polarized laser beams polarization direction each other in
Right angle and the laser beam formed cuts cutter material.The manufacturing device of the cutting tool, including for generate by
The formed laser beam of two linearly polarized laser beams closes the device of beam, and laser beam conjunction beam is guided to the light of cutter material
The polarization direction of system, two linearly polarized laser beams is at right angles to each other.
Continuous laser is first acted on hard material by existing the relevant technologies, and one is formed in the major part of hard material
Then cutting edge cut surface acts on the hard material surface intersected with cutting edge cut surface using scanning laser, cutting edge is made.
In order to obtain the perfect cutting edge for being suitable for finishing, which usually also needs continuous laser repeatedly acting on hard material
Afterwards, then with scanning laser cutting edge is made, the working hour consuming of single products is huge, and yield is lower.
Summary of the invention
It is an object of the present invention to provide a kind of processing methods of cutting edge, add to the position with cutting function
Work is in the method for the cutting edge made, to improve the cutting edge sharpness and continuity of cutting tool, is cut adding for surface to reduce
Work tool marks and roughness.
It is another object of the present invention to provide a kind of methods for processing the cutting edge containing hard material, realize with hard
Material is the rapid processing of cutting edge, accelerates the speed of cutter making, improves yield.
It is yet a further object of the present invention to provide a kind of with the production of hard material made of the Material cladding of a variety of hardness
The cutting edge method that carries out rapid processing, significantly to shorten cutting tool, especially PCD and containing the superhard bite such as diamond
The process time of tool.
Various hard materials of the present invention, such as: but it is not limited only to hard alloy, diamond, quartz, cubic crystal nitridation
Boron, diamond, monocrystalline diamond, zirconium dioxide and various jewels and these materials are mutually answered by sintering, patch with modes such as welding
Close obtained composite body.The hard material that Tool Industry is commonly used in cutter head is a kind of to be answered by what a variety of homogenous materials were formed
Condensation material, PCD be its represent one of, it is similar such as: CVD and CBN.It is used for cutter head and knife using hard alloy as fixing layer
The connection and fixation of body, material of the preferential selection mode hardness greater than 7 is (such as: cubic boron nitride and PCD, CVD and monocrystalline
Etc. types diamond) be overlying on carbide surface as cutting lay, to improve the wearability and corrosion resistance of cutter.
For cutting tool, usually cut with blade.With regard to the understanding of skilled person, blade includes by cutter
Wiring, i.e. cutting edge made of rake face and flank intersection.And the quality of cutting edge directly influences the processing effect of cutter and makes
Use the service life.The rake face and flank of cutting tool are then mainly obtained by means such as grinding or wire cut EDMs, sword
Mouth is by its intersection self-assembling formation.Cutting portion of the present invention should be understood as playing the part of cutting function, especially blade.
The processing method of various cutting edges provided by the invention, reply cutting portion impose laser at least 1 time.
The processing method of various cutting edges provided by the invention is also adapted to be cutter head to the hard material of similar PCD structure
Cutting portion processed to generate cutting edge, it usually needs hard material is imposed laser at least 1 time.These hard materials lead to
Often using hard alloy as fixing layer, it is used for the connection and fixation of cutter head and cutter hub, while as pedestal convenient for cutting lay
Attachment.
A variety of lasers, such as: but it is not limited only to CO2Gas laser, optical fiber, picosecond, YAG laser, YLC laser,
YLP-HP laser and YVO4The processing method that solid state laser etc. can be suitably used for various cutting edges provided by the invention, but it is excellent
YLP-HP optical fiber laser is first selected, and cutting edge is made in cutting portion with the laser action that this is issued.
In laser form, the present invention preferentially selects continuous wave laser action that cutting edge is made in cutting portion.Such laser includes
Various quasi-continuous lasings and pulse laser, such as: but it is not limited to picosecond laser and femtosecond laser.Its wave-length coverage having is 1.07
μm ± 5%, preferably 1.06 μm -1.08 μm.
The processing method that the laser of 1W-500W power is applicable to various cutting edges provided by the invention.Here, being applied
The output power of laser preferentially select 10w-200w, more preferable 10w-100w, such as: but be not limited only to 15w ± 4w, 20w ± 4w,
25w±4w、30w±4w、35w±4w、40w±4w、45w±4w、50w±4w、55w±4w、60w±4w、65w±4w、70w±
4w, 75w ± 4w, 80w ± 4w, 85w ± 4w, 90w ± 4w and 95w ± 4w.
The processing method of various cutting edges provided by the invention, the pulse recurrence rate of laser preferentially select 1.6KHz-
1000KHz, more preferable 2KHz-1000KHz.
The pulsewidth of the processing method of various cutting edges provided by the invention, the laser of application preferentially selects 81ns-650ns,
More preferable 81ns-243ns, such as: but be not limited only to 81ns, 85ns, 89ns, 94ns, 98ns, 103ns, 107ns, 112ns,
116ns、121ns、125ns、129ns、134ns、138ns、153ns、157ns、162ns、166ns、171ns、175ns、
179ns、184ns、188ns、193ns、197ns、202ns、206ns、211ns、215ns、220ns、224ns、229ns、
233ns, 238ns and 243ns.
The pulse energy range of the processing method of various cutting edges provided by the invention, the laser of application preferentially selects
0.05MJ-10MJ, more preferable 0.1MJ-2.1MJ, such as: but be not limited only to 0.1MJ, 0.2MJ, 0.3MJ, 0.4MJ, 0.5MJ,
0.6MJ、0.7MJ、0.8MJ、0.9MJ、1.0MJ、1.1MJ、1.2MJ、1.3MJ、1.4MJ、1.5MJ、1.6MJ、1.7MJ、
1.8MJ, 1.9MJ, 2.0MJ and 2.1MJ.
The embodiment of the processing method of a kind of cutting edge provided by the invention, by laser action in cutting portion sword is made
Mouthful.
The embodiment of the processing method of another kind cutting edge provided by the invention, carries out grinding or discharge lines to material
Cutting processing obtains cutting portion, then imposes at cutting portion laser action at least 1 time, cutting edge is made.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be less than the first machining angle of the first relief angles of cutting portion using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion from major first face, to form second flank, is less than the second relief angle obtained
First relief angle.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be less than the first machining angle of the first relief angles of cutting portion using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion from major first flank, to form second flank, is less than the second relief angle obtained
First relief angle.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be greater than the second machining angle of the first anterior angle of cutting portion angle using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion from major first face, to form second rake face, is greater than the second anterior angle obtained
First anterior angle.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be greater than the second machining angle of the first anterior angle of cutting portion angle using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion from major first flank, to form second rake face, is greater than the second anterior angle obtained
First anterior angle.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be greater than the third machining angle of the first relief angles of cutting portion using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion along major first face or major first flank, to form third flank, makes to obtain
Three relief angles are greater than the first relief angle.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be greater than the third machining angle of the first relief angles of cutting portion using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion along major first flank, to form third flank, obtained third relief angle is made to be greater than first
Relief angle, and act on along laser the direction of major first flank for the first time, laser is not and to major first face.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be greater than the third machining angle of the first relief angles of cutting portion using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion along major first face, to form third flank, obtained third relief angle is made to be greater than first
Relief angle, and act on along laser the direction of major first face for the first time, laser is not and to major first flank.
The embodiment of the processing method of another kind cutting edge provided by the invention, on the basis of the plane of the portion's of being cut cutting
Face, to be less than the 4th machining angle of the first anterior angle of cutting portion angle, by laser along major first face or major first flank
Cutting portion is processed, to form third rake face, makes obtained third anterior angle less than the first anterior angle.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, will to be less than the 4th machining angle of the first anterior angle of cutting portion angle using the plane of the portion's of being cut cutting as benchmark face
Laser processes cutting portion along major first face, to form third rake face, so that obtaining third anterior angle less than first
Anterior angle, and act on along laser the direction of major first face for the first time, laser is not and to major first flank.
The embodiment of the processing method of another kind cutting edge provided by the invention, cutting portion includes major first face and first
Flank, to be less than the 4th machining angle of the first anterior angle angle of cutting, will swash using the plane of the portion's of being cut cutting as benchmark face
Light processes cutting portion along major first flank, to form third rake face, make obtained third anterior angle less than first before
Angle, and act on along laser the direction of major first flank for the first time, laser is not and to major first face.
Technical solution of the present invention realize the utility model has the advantages that
The processing method of cutting edge provided by the invention imposes at least 1 time laser cutting to cutting portion, can significantly shorten processing
Time improves production efficiency and speed of production so that the machining period of single-piece cutter is greatly shortened to less than half, drop
The low processing cost of single-piece cutter.
With the cutting edge that method provided by the invention processing obtains, cutting edge finish and straightness are significantly improved,
Cutting-tool's used life is improved, is suitable for processing unmanageable material (such as: hard material).
Especially laser is imposed after having been subjected to wire cut EDM or grinding and obtaining blade, gained cutting edge
Sharpness is significantly increased or improves with continuity (200 times of comparisons).It is conventional with use grinding or electric discharge wire cutting etc.
Method carry out preliminary working and finishing acquisition cutting edge compares, the processing service life for the cutting edge that the present invention obtains significantly extend one times with
It is upper that (piece surface, which generates residual processing trace, after universal cutter processes part 200 causes cutter to be scrapped；The knife of this method manufacture
Normal process is continued to after tool processing part 500, is finally scrapped in 1300 or so generation traces).
Detailed description of the invention
Fig. 1 forms the microstructure schematic diagram of cutting seam for continuous laser of the present invention；
Fig. 2 forms the microstructure schematic diagram of cutting seam for scanning laser of the present invention；
Fig. 3 is the schematic diagram that the method for the present invention processes one embodiment of cutting portion；
Fig. 4 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion；
Fig. 5 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion；
Fig. 6 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion；
Fig. 7 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion；
Fig. 8 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion；
Fig. 9 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion；
Figure 10 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion；
Figure 11 by processed using different parameters one embodiment of acquisition cutting portion microstructure schematic diagram, in figure
" ■ " indicates cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material sheet
Body；
Figure 12 by processed using different parameters another embodiment of acquisition cutting portion microstructure schematic diagram, figure
In " ■ " indicate cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material
Ontology；
Figure 13 by processed using different parameters another embodiment of acquisition cutting portion microstructure schematic diagram, figure
In " ■ " indicate cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material
Ontology；
Figure 14 by processed using different parameters another embodiment of acquisition cutting portion microstructure schematic diagram, figure
In " ■ " indicate cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material
Ontology；
Figure 15 by processed using different parameters another embodiment of acquisition cutting portion microstructure schematic diagram, figure
In " ■ " indicate cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material
Ontology；
Figure 16 by processed using different parameters another embodiment of acquisition cutting portion microstructure schematic diagram, figure
In " ■ " indicate cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material
Ontology；
Figure 17 by processed using different parameters another embodiment of acquisition cutting portion microstructure schematic diagram, figure
In " ■ " indicate cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material
Ontology；
Figure 18 by processed using different parameters another embodiment of acquisition cutting portion microstructure schematic diagram, figure
In " ■ " indicate cutting nubbin (not punching completely),Indicate burn part (excessively charing), " " indicates material
Ontology；
Figure 19 is the schematic diagram that one embodiment of cutting portion is obtained using existing conventional method processing PCD material；
Figure 20 is to process the schematic diagram that PCD material obtains one embodiment of cutting portion using the method for the present invention.
Specific embodiment
Below in conjunction with attached drawing, the technical schemes of the invention are described in detail.The embodiment of the present invention is only to illustrate skill of the invention
Art scheme rather than limit, although being described the invention in detail referring to preferred embodiment, those skilled in the art
It should be appreciated that can be with modification or equivalent replacement of the invented technical scheme, without departing from the essence of technical solution of the present invention
Mind and range, should all cover within the scope of the claims of the present invention.
The adoptable continuous laser of the present embodiment is moved in the form of single trend from one end (or edge from one) another
It holds at (or another place edge), hard material is continuingly acted in this motion process, and form cutting seam S1 on hard material
(not cutting off hard material) or section (surface formed after cutting off hard material).Fig. 1 gives to be formed in the process
Cutting seam micromorphology the visual field signal, entirety be interpreted as present straight line (section) form.But it is cut through actual
Cheng Zhong, deformation occurs after material is heated, therefore small irregular curve or form of discounting may also occurs at the edge of part,
To become faulty straight line (or being similar to straight line in a certain range), but these small variations, not return
Because in the trend of laser, can not also play substantive change to configuration.These are due to edge generation in cutting process
The tiny form in part should also be included in the meaning of straight line (section) form.
The also adoptable scanning laser of the present embodiment, motion profile is in microcosmic upper presentation Two-dimensional morphology.Fig. 2 gives one
The visual field signal of the suchlike Two-dimensional morphology of kind, as shown in Fig. 2, laser is on the whole in the form of single trend from one end
(or edge at one) move to the other end (or another place edge) continuingly act on hard material formed cutting seam S2 while, also
It is moving towards to move back and forth simultaneously on vertical direction with the entirety, and is being formed and several move towards vertical straight line with whole
(section).
The processing method of a kind of cutting edge provided in this embodiment, by laser action in cutting portion cutting edge is made.Cutting portion
Refer to cutting function part, material can also be processed using modes such as grinding or wire cut EDMs
And it obtains.It is further real in a manner of obtaining the second relief angle (anterior angle) or third relief angle (anterior angle) being processed to cutting portion
Show cutting edge finish and straightness is significantly improved, improves cutting-tool's used life.
Fig. 3 is the schematic diagram that the method for the present invention processes one embodiment of cutting portion, as shown in figure 3, cutting portion 100 includes first
Rake face 110 and major first flank 120.The plane that the present embodiment is cut using the portion of being cut is benchmark face, to be less than cutting portion 100
First machining angle of the first relief angles is processed laser 200, to cutting portion from major first face 110 to form one
A second flank makes the second relief angle obtained less than the first relief angle.
Fig. 4 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion, as shown in figure 4, cutting portion 100 includes the
One rake face 110 and major first flank 120, the plane that the present embodiment is cut using the portion of being cut is benchmark face, to be less than cutting portion
First machining angle of 100 first relief angles processes laser 200 from major first flank 120 to cutting portion 100, with
Second flank is formed, makes the second relief angle obtained less than the first relief angle.
Fig. 5 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion, as shown in figure 5, cutting portion 100 includes the
One rake face 110 and major first flank 120, the plane that the present embodiment is cut using the portion of being cut is benchmark face, to be greater than cutting portion
Second machining angle of 100 first anterior angle angles processes laser 200 from major first face 110 to cutting portion 100, with
Second rake face is formed, so that the second anterior angle obtained is greater than the first anterior angle.
Fig. 6 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion, as shown in fig. 6, cutting portion 100 includes the
One rake face 110 and major first flank 120, the plane that the present embodiment is cut using the portion of being cut is benchmark face, to be greater than cutting portion
Second machining angle of 100 first anterior angle angles processes laser 200 from major first flank 120 to cutting portion 100, with
Second rake face is formed, so that the second anterior angle obtained is greater than the first anterior angle.
Fig. 7 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion, as shown in fig. 7, cutting portion 100 includes the
One rake face 110 and major first flank 120, the plane that the present embodiment is cut using the portion of being cut is benchmark face, after being greater than first
The third machining angle of angle angle processes laser 200 along major first flank 120 to cutting portion 100, and in cutting portion
100 form processing plane 130, to form third flank, so that obtaining third relief angle is greater than the first relief angle, and along laser
200 act on the direction 210 (dotted line in figure) of major first flank 120 for the first time, and laser 200 is not and to major first face 110.
Fig. 8 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion, as shown in figure 8, cutting portion 100 includes the
One rake face 110 and major first flank 120, the plane that the present embodiment is cut using the portion of being cut is benchmark face, after being greater than first
The third machining angle of angle angle processes laser 200 along major first face 110 to cutting portion 100, and in cutting portion
100 form processing plane 130, to form third flank, so that obtaining third relief angle is greater than the first relief angle, and along laser
200 act on the direction 210 (dotted line in figure) of major first face 110 for the first time, and laser 200 is not and to major first flank 110.
Fig. 9 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion, as shown in figure 9, cutting portion 100 includes the
One rake face 110 and major first flank 120, the plane that the present embodiment is cut using the portion of being cut is benchmark face, before less than first
4th machining angle of angle angle processes laser 200 along major first flank 120 to cutting portion 100, and in cutting portion
100 form processing plane 130, to form third rake face, so that obtaining third anterior angle less than the first anterior angle, and along laser
200 act on the direction (dotted line in figure) of major first face 110 for the first time, and laser 200 is not and to major first flank 120.
Figure 10 is the schematic diagram that the method for the present invention processes another embodiment of cutting portion, and as shown in Figure 10, cutting portion 100 includes
Major first face 110 and major first flank 120, the plane that the present embodiment is cut using the portion of being cut is benchmark face, less than first
Laser 200 is processed cutting portion 100 along major first face 110, and is being cut by the 4th machining angle of anterior angle angle
Portion 100 forms processing plane 130, to form third rake face, so that obtaining third anterior angle less than the first anterior angle, and along laser
200 act on the direction 210 (dotted line in figure) of major first flank 120 for the first time, and laser 200 is not and to major first face 110.
The present embodiment uses processing method, such as: using the plane cut by the cutting portion as benchmark face, to be less than described cut
The first machining angle for cutting the first relief angles of portion, by the laser from the major first face to the cutting portion into
Row processing, to form second flank, makes the second relief angle obtained less than the first relief angle, and with regard to laser processing parameter
(referring to table 1) has made intensive studies the effect of formed cutting edge, and the form that gained cutting edge amplifies through 250 times is referring to Figure 11-
Figure 18.
Wherein, the so-called laser parameter for referring to that cutting edge processing method of the present invention uses " in range " belongs to following situation:
The wave-length coverage of laser is 1.07 μm ± 5%, such as: 1.06 μm -1.08 μm；
The power bracket of laser is 10w-200w；
The pulse recurrence rate range of laser is 1.6KHz-1000KHz；
The pulse duration range of laser is 81ns-650ns, especially 81ns-243ns；
The pulse energy range of laser is 0.05MJ-10MJ, especially 0.1MJ-2.1MJ.
Table 1
There is above-mentioned every embodiment, it, can be to the sword of processing cutting portion when wavelength, pulsewidth and pulse energy are fallen into range
The situations such as the smoothness of mouth and residual volume can be significantly improved, and improve the quality of cutting edge.The ginseng such as wavelength, pulsewidth and pulse energy
Number processes optimal cutting edge obtained by cutting portion when each falling in range, i.e., without burn, no remnants, at body edges (cutting edge)
Smoothly, linear in one.
PCD cutter is one of representative of superhard cutter, and by taking the cutter of the long 100mm of sword as an example, conventional method is processed PCD material
Matter usually first carries out roughing in about 150 minutes (such as: electric discharge wire cutting), then finishing (such as: grinding) in about 170 minutes,
Structure after gained cutting edge amplifies 200 times is as shown in figure 19, presents linear in 3 μm or so of sawtooth containing width and depth.
Likewise, PCD material usually first carries out roughing in about 150 minutes (such as: electric discharge wire cutting), about 60 points are then imposed
Clock laser, gained cutting edge amplify 200 times after structure it is as shown in figure 20, present cutting edge more smoothly and continuously, sharpness
It is significantly improved with continuity.
By (the ADC+ when composite material of cutting edge processing cermet made from conventional method processing PCD material and aluminium alloy
ZrO2), cutting edge is damaged after about 250, and finished surface is crude, can not continue to use.Likewise, by side provided by the invention
Method processes cutting edge made from PCD material and processes cermet (ADC+ZrO2), more than 600 after cutting edge have no obvious broken
Damage, may continue to using.
Claims (12)
1. a kind of processing method of cutting edge, it is characterised in that imposed laser at least 1 time to cutting portion, the pulsewidth of the laser is
81ns-650ns；
The pulse energy of the laser is 0.05MJ-10MJ；
1.07 μm ± 5% of the wave-length coverage of the laser；
The cutting portion system first carries out grinding or wire cut EDM to material and obtains, including major first face and
Major first flank, the method that the laser imposes cutting portion are selected from
Method seven, using the plane cut by the cutting portion as benchmark face, to be greater than first relief angles of cutting portion
Third machining angle processes the laser along the major first face to the cutting portion, to form
Three flanks make obtained third relief angle be greater than the first relief angle, and act on the major first face for the first time along the laser
Direction, the laser is not and to the major first flank；Or
Method eight, using the plane cut by the cutting portion as benchmark face, to be less than the first anterior angle of cutting portion angle
4th machining angle, by the laser along the major first face or the major first flank to the cutting
Portion is processed, to form third rake face, so that obtaining third anterior angle less than the first anterior angle.
2. the processing method of cutting edge according to claim 1, it is characterised in that the pulsewidth of the laser is 81ns-243ns.
3. the processing method of cutting edge according to claim 1, it is characterised in that the pulsewidth of the laser selected from 81ns,
85ns、89ns、94ns、98ns、103ns、107ns、112ns、116ns、121ns、125ns、129ns、134ns、138ns、
153ns、157ns、162ns、166ns、171ns、175ns、179ns、184ns、188ns、193ns、197ns、202ns、
206ns, 211ns, 215ns, 220ns, 224ns, 229ns, 233ns, 238ns or 243ns.
4. the processing method of cutting edge according to claim 1, it is characterised in that the pulse energy of the laser is 0.1MJ-
2.1MJ。
5. the processing method of cutting edge according to claim 1, it is characterised in that the pulse energy of the laser is selected from
0.1MJ、0.2MJ、0.3MJ、0.4MJ、0.5MJ、0.6MJ、0.7MJ、0.8MJ、0.9MJ、1.0MJ、1.1MJ、1.2MJ、
1.3MJ, 1.4MJ, 1.5MJ, 1.6MJ, 1.7MJ, 1.8MJ, 1.9MJ, 2.0MJ or 2.1MJ.
6. the processing method of cutting edge according to claim 1, it is characterised in that the output power of the laser is 10w-
200w。
7. the processing method of cutting edge according to claim 1, it is characterised in that the output power of the laser is 10w-
100w。
8. the processing method of cutting edge according to claim 1, it is characterised in that the output power of the laser is selected from 15w
±4w、20w±4w、25w±4w、30w±4w、35w±4w、40w±4w、45w±4w、50w±4w、55w±4w、60w±4w、
65w ± 4w, 70w ± 4w, 75w ± 4w, 80w ± 4w, 85w ± 4w, 90w ± 4w and 95w ± 4w.
9. the processing method of cutting edge according to claim 1, it is characterised in that the wave-length coverage of the laser is selected from
1.06μm-1.08μm。
10. the processing method of cutting edge according to claim 1, it is characterised in that the pulse recurrence rate of the laser is
1.6KHz-1000KHz。
11. the processing method of cutting edge according to claim 1, it is characterised in that the pulse recurrence rate of the laser is
2KHz-1000KHz。
12. the processing method of cutting edge according to claim 1, it is characterised in that the cutting portion is blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410401572.0A CN104999176B (en) | 2014-08-15 | 2014-08-15 | The processing method of cutting edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410401572.0A CN104999176B (en) | 2014-08-15 | 2014-08-15 | The processing method of cutting edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104999176A CN104999176A (en) | 2015-10-28 |
| CN104999176B true CN104999176B (en) | 2019-06-25 |
Family
ID=54372176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410401572.0A Active CN104999176B (en) | 2014-08-15 | 2014-08-15 | The processing method of cutting edge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104999176B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312341B (en) * | 2016-11-11 | 2017-12-08 | 北京工业大学 | Frock clamp, device and method for cutting edge roundness processing |
| WO2018179666A1 (en) * | 2017-03-28 | 2018-10-04 | 住友電工ハードメタル株式会社 | Method for manufacturing cutting tool |
| CN107876975A (en) * | 2017-12-18 | 2018-04-06 | 深圳光韵达激光应用技术有限公司 | A kind of composite sheet dual-headed laser cutting slicing apparatus and partition machining method |
| CN108311795B (en) * | 2018-01-19 | 2020-05-29 | 天津科技大学 | Carbon dioxide laser processing method and processing device for PCBN |
| CN110315216B (en) * | 2018-03-29 | 2021-07-30 | 上海名古屋精密工具股份有限公司 | Method for laser machining a workpiece and use thereof for producing a tool |
| CN109676258B (en) * | 2019-01-21 | 2020-07-14 | 南京航空航天大学 | CVD diamond micro milling cutter preparation method based on laser and precision cutter grinding |
| CN110000467A (en) * | 2019-04-04 | 2019-07-12 | 华南师范大学 | Laser machine PCD diamond cutter Sharpening device and method |
| CN111822865A (en) * | 2019-04-15 | 2020-10-27 | 汇专科技集团股份有限公司 | Laser processing method of integral PCD cutter |
| CN110732776B (en) * | 2019-09-20 | 2021-05-25 | 江苏大学 | Laser edge trimming device and method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008246658A (en) * | 2007-03-30 | 2008-10-16 | Nippon Paper Industries Co Ltd | Cutting knife |
| CN101327564A (en) * | 2008-07-30 | 2008-12-24 | 威海威硬工具有限公司 | Method for processing cutting edge of diamond compound tool |
| CN102294507A (en) * | 2010-06-28 | 2011-12-28 | 三菱综合材料株式会社 | End mill and manufacturing method of same |
| JP2012011489A (en) * | 2010-06-30 | 2012-01-19 | Union Tool Co | Drilling tool |
| CN202239685U (en) * | 2011-09-30 | 2012-05-30 | 株洲钻石切削刀具股份有限公司 | Hole chamfering tool with variable relief angle widths |
| CN102574243A (en) * | 2009-10-23 | 2012-07-11 | 钴碳化钨硬质合金公司 | Three-dimensional surface shaping of rotary cutting tool edges with lasers |
| CN103189160A (en) * | 2010-11-01 | 2013-07-03 | 住友电气工业株式会社 | Cutting tool, production method for same, and production device |
| CN103624330A (en) * | 2013-11-15 | 2014-03-12 | 成都发动机（集团）有限公司 | Small-diameter internal reamer |
| CN203636047U (en) * | 2014-03-24 | 2014-06-11 | 上海精韧激光科技有限公司 | Milling cutter |
-
2014
- 2014-08-15 CN CN201410401572.0A patent/CN104999176B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008246658A (en) * | 2007-03-30 | 2008-10-16 | Nippon Paper Industries Co Ltd | Cutting knife |
| CN101327564A (en) * | 2008-07-30 | 2008-12-24 | 威海威硬工具有限公司 | Method for processing cutting edge of diamond compound tool |
| CN102574243A (en) * | 2009-10-23 | 2012-07-11 | 钴碳化钨硬质合金公司 | Three-dimensional surface shaping of rotary cutting tool edges with lasers |
| CN102294507A (en) * | 2010-06-28 | 2011-12-28 | 三菱综合材料株式会社 | End mill and manufacturing method of same |
| JP2012011489A (en) * | 2010-06-30 | 2012-01-19 | Union Tool Co | Drilling tool |
| CN103189160A (en) * | 2010-11-01 | 2013-07-03 | 住友电气工业株式会社 | Cutting tool, production method for same, and production device |
| CN202239685U (en) * | 2011-09-30 | 2012-05-30 | 株洲钻石切削刀具股份有限公司 | Hole chamfering tool with variable relief angle widths |
| CN103624330A (en) * | 2013-11-15 | 2014-03-12 | 成都发动机（集团）有限公司 | Small-diameter internal reamer |
| CN203636047U (en) * | 2014-03-24 | 2014-06-11 | 上海精韧激光科技有限公司 | Milling cutter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104999176A (en) | 2015-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104999176B (en) | The processing method of cutting edge | |
| CN107127459B (en) | A kind of laser accurate processing method of diamond cutter | |
| CN103921356B (en) | A kind of precision machined method of hard brittle material end face | |
| CN105269284B (en) | A kind of efficient process of preparing of ultraprecise of concave shaped complex outline PCD cutters | |
| CN108213735A (en) | It is a kind of without graphitization complex outline PCD molding cutter cutting edge laser processings | |
| CN201632768U (en) | Laser tool blade milling machine | |
| CN108081137A (en) | A kind of emery wheel double excitation trimming device and method with gas-liquid parallel connection tubular type | |
| CN106984913A (en) | A kind of full laser preparation method of diamond cutter | |
| CN103042468B (en) | Method for roughly trimming diamond grinding wheel | |
| CN101327564A (en) | Method for processing cutting edge of diamond compound tool | |
| CN106312341B (en) | Frock clamp, device and method for cutting edge roundness processing | |
| WO2021190530A1 (en) | Processing method for tool having complex cutting edge using combined laser | |
| CN113414889B (en) | Method and device for compounding laser-assisted diamond cutting and laser polishing in situ | |
| CN102950387A (en) | Laser heating auxiliary arc striking micro-explosion processing method and device for engineering ceramic material | |
| CN109514103A (en) | A kind of system of processing and processing method of glass cover-plate | |
| CN110480188A (en) | A kind of processing method of nano twin crystal micro cutter of diamond rapid shaping | |
| Hao et al. | Fabrication of large aspect ratio PCD micro-milling tool with pulsed lasers and grinding | |
| WO2021190529A1 (en) | Pcd cutter for realizing machining by means of milling instead of grinding, and preparation method therefor and use thereof | |
| CN105478925A (en) | Improved technology for machining thread ring gages | |
| CN113770670B (en) | PCD end mill and processing method thereof | |
| CN105081782B (en) | The processing method of hard material | |
| CN112935559A (en) | Method for manufacturing molding grinding wheel based on ultrashort pulse water-guided laser | |
| CN109877551B (en) | PCD step chamfering tool machining process | |
| CN205141072U (en) | Electric capacity type ni -mh power battery pole piece continuous production unit | |
| CN110315216B (en) | Method for laser machining a workpiece and use thereof for producing a tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |