CN104999176A - Method for machining cutting edge - Google Patents
Method for machining cutting edge Download PDFInfo
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- CN104999176A CN104999176A CN201410401572.0A CN201410401572A CN104999176A CN 104999176 A CN104999176 A CN 104999176A CN 201410401572 A CN201410401572 A CN 201410401572A CN 104999176 A CN104999176 A CN 104999176A
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Abstract
The invention relates to a method for machining a cutting edge. Lasers are applied to a cutting part at least one time, and the pulse width range of the lasers ranges from 81 ns to 650 ns. By means of the method for machining the cutting edge, the degree of finish of the cutting edge of a tool bit made of hard materials (like PCD) is obviously improved; and the machining time of a single tool is greatly shortened, the production efficiency is improved, and the machining cost of the single tool is reduced.
Description
Technical field
The present invention relates to a kind of processing method with the position of cutting function, particularly relate to a kind of processing method of cutting edge, the position or material (containing hard material) with cutting function are processed to make to the method for cutting edge.
Background technology
Industry manufactures and manufacture field, in the process manufactured a product, usually needs to polish to raw material, the mode of grinding or cutting carries out moulding processing.When material has higher hardness, common processing method is not only difficult to realize, on man-hour also and uneconomical.
In microscopic dimensions, the blade obtained by means such as grinding or discharge lines cuttings, it presents containing the sawtooth wire of hierarchy structure more than 3 μm.This makes on the one hand the easy work in-process of blade occur avalanche, cracked and reduce cutter life, can leave microcosmic on the other hand concavo-convex thus leave machining spur, affect processing effect on workpiece to be machined surface.
In order to improve cutting edge quality, generally can be carried out the fine grinding of front and rear knife face by the emery wheel that granularity is thinner or carry out discharge lines cutting fine finishining with more inefficient machined parameters, the former can only process simple shape, and the latter will extend the process time of cutter greatly.
Laser is just widely used in numerous areas from eighties of last century, is mainly divided into: cutting, welding, mark and heat treatment (laser and optoelectronics progress [J], 2002,39 (1), 53-6).Laser cutting is the light beam that a kind of minimum diameters of line focus can be less than the high-energy-density of 0.1mm, and the power density at focus place is greater than 10
7w/cm
2~ 10
8w/cm
2.When laser is radiated at cut material surface, luminous energy is transformed into heat energy, makes the temperature of facular area be elevated to rapidly fusing point or the boiling point of material, and is melted rapidly or vaporize.The mobile route of laser is set, focus point and material is constantly interacted, and then realizes the cutting of material.In the process, also carry out helping with assist gas and cut, blow away slag and cooling.In addition, laser power, laser beam pattern, polarization and cutting speed determine the quality (laser and optoelectronics progress [J], 2002,39 (1), 53-6) of cutting.
Because laser has the advantages that material to be carried out to contactless cutting processing, it has been widely used in the division processing field (CN1386606A of material, CN1768998A and CN101804551A), especially hard material (superhard material) manufacture field, as: the cutter for processing with hard material (superhard material) surface.
In order to improve wearability and the corrosion resistance of cutter, usually hard (superhard) material is imposed at bit interface by modes such as sintering, welding, paster or coating, as: diamond, quartz, monocrystalline diamond and zirconium dioxide etc. (CN102581587A and CN101380751A).The cutter head being covered with hard (superhard) material still needs processing further to produce the cutting edge being adapted to cut, but the application of hard (superhard) material makes to process cutting edge with conventional polishing process, and the difficulty making the cutting edge in this type of cutter head later stage (as: anterior angle or relief angle) process suddenly increases.
Discharge lines cutting method is used to solve this technical problem.First the method makes a call to a through hole on the cutter head of hard (superhard) material, then in hole, inserts electric lead, and its two ends and external power supply manufacture cutting edge by the mode of chemical galvano-cautery after connecting.The defect of the method is, the linearity at cutting edge edge is lower, and fineness is also poor, causes the needs that cannot realize object fine finishining and cut.
Chinese invention patent application 200810138477.0 discloses a kind of processing method of cutting edge of diamond compound tool, the steps include: a) to be ground to required shape and size by after tool matrix heat treatment; B) diamond blade welding position relief grinding and blade kissing and tool matrix after knife face, tool matrix should subtract 0.05 ~ 0.2mm than diamond blade compact dimensions, to add man-hour carrying out cutting edge to cutter, is not worked into tool matrix; C) exactly diamond blade is welded on tool matrix relevant position; D) by diamond blade with being laser-cut into required form, evenly reserve the surplus of 0.15mm; E) copper rod material is become electrode by the size and dimension finish turning of diamond blade cutting edge, be installed on numerical control electric spark; F) by cutter positioning on the position that lathe is correct, guarantee with electricity point-device coincide; G) make electrode rotary close to cutter, until form suitable discharging gap; H) choosing the power parameters such as the rough machined electric current of electric spark, pulse width according to cutting edge surplus, making electrode remove unnecessary diamond close to producing galvanic action during diamond blade; I) redress electrode, select the power parameters such as accurately machined electric current, pulse width, make electrode produce galvanic corrosion close to diamond blade and play finishing function, to obtain high-precision size, shape and cutting edge.It uses laser by diamond blade excision forming, but still with galvanic action processing cutting edge, does not make the aspects such as the linearity of cutting edge and fineness be significantly improved.
Chinese invention patent application 200810201484.0 discloses a kind of diamond composite crystal combination lockable four-side knife and manufacture method, after diadust and sintering cemented carbide combined making diamond composite polycrystalline with HTHP, with discharge lines cutting or laser, diamond composite polycrystalline is cut into tetrahedron, then carry out fine grinding and form.But this technology does not only record the concrete grammar of laser cutting, the technological means of its laser cutting is also not for processing cutting edge.
Chinese utility model patent ZL20092021791.6 discloses a kind of laser double-surface synchronous processing system, comprises laser instrument, interposition moving stage and workpiece to be machined.Workpiece to be machined both sides are two bundle laser, act on two sides of workpiece to be machined respectively.The laser beam of workpiece to be machined both sides on the same line or intersect at inside workpiece.By laser double-surface synchronous processing, the thickness of its Thickness Ratio single-sided process once can processed can increase by more than 1 times, achieves various superhard material as cutting such as the Double-side Synchronous of PDC, PCBN and composite sheet, pottery etc.This technology can not be applicable to the processing of cutting edge roundness in good condition.
Chinese invention patent application 20118005259.7 discloses manufacture method and the manufacturing installation of a kind of cutting tool and this cutting tool, by making laser beam flying cutter material, described cutter material being cut into predetermined shape to manufacture cutting tool, closing bundle by making two linearly polarized laser bundles thus the laser beam that the polarization direction of these two linearly polarized laser bundles is formed each other in right angle cuts cutter material.The manufacturing installation of this cutting tool, comprise for generation of by two linearly polarized laser bundles form the device that laser beam closes bundle, and laser beam is closed bundle guide to the optical system of cutter material, the polarization direction of two linearly polarized laser bundles is each other in right angle.
Continuous laser is first acted on hard material by existing correlation technique, and the major part of hard material forms a cutting edge cut surface, then uses scanning laser action in a hard material surface crossing with cutting edge cut surface, makes cutting edge.Be suitable for accurately machined perfect cutting edge to obtain, after this technology also needs that continuous laser is repeatedly acted on hard material usually, then make cutting edge to scan laser, the man-hour of single products is expended huge, and output is lower.
Summary of the invention
One object of the present invention is the processing method providing a kind of cutting edge, the position with cutting function is processed to the method for the cutting edge made, to improve cutting edge sharpness and the continuity of cutting tool, to reduce the machining spur and roughness that are cut surface.
Another object of the present invention is to provide the method for the cutting edge of a kind of processing containing hard material, and realizing take hard material as the rapid processing of cutting edge, accelerates the speed that cutter makes, improves output.
Another object of the present invention is to provide a kind of cutting edge made with the hard material of the Material cladding of multiple hardness to carry out the method for rapid processing, significantly to shorten cutting tool, and especially PCD and the process time containing ultra-hard cutting tools such as diamonds.
The various hard materials that the present invention relates to, as: but be not limited only to carbide alloy, diamond, quartz, cubic boron nitride, diamond, monocrystalline diamond, zirconium dioxide and various jewel, and the composite body that these materials are obtained by mode phase compounds such as sintering, paster and welding.The common hard material for cutter head of Tool Industry is a kind of composite formed by multiple homogenous material, and PCD is one of its representative, similar to CVD and CBN.It is using carbide alloy as fixed bed, for the connection of cutter head and cutter hub with fixing, material (as: the cubic boron nitride that prioritizing selection pattern hardness is greater than 7, and the diamond of the kind such as PCD, CVD and monocrystalline) be overlying on carbide surface as cutting lay, to improve wearability and the corrosion resistance of cutter.
For cutting tool, it cuts with blade usually.With regard to the understanding of skilled person, blade comprises the wiring of being intersected by cutter rake face and rear knife face, i.e. cutting edge.And the quality of cutting edge directly has influence on processing effect and the service life of cutter.The rake face of cutting tool and rear knife face then obtain primarily of the means such as grinding or wire cut EDM, and cutting edge is by its intersection self-assembling formation.The cutting portion that the present invention relates to should be understood to the part playing cutting function, especially blade.
The processing method of various cutting edge provided by the invention, reply cutting portion imposes laser at least 1 time.
The processing method of various cutting edge provided by the invention, the cutting portion be also suitable for the hard material of similar PCD structure is cutter head is processed to produce cutting edge, usually needs to impose laser at least 1 time to hard material.These hard materials, usually using carbide alloy as fixed bed, its connection being used for cutter head and cutter hub as pedestal, with fixing, is convenient to the attachment of cutting lay simultaneously.
Multiple laser instrument, as: but be not limited only to CO
2gas laser, optical fiber, psec, YAG laser, YLC laser instrument, YLP-HP laser instrument and YVO
4solid state lasers etc. all can be applicable to the processing method of various cutting edge provided by the invention, but prioritizing selection YLP-HP optical fiber laser, and obtain cutting edge with the laser action that this sends in cutting portion.
In laser form, prioritizing selection continuous wave laser action of the present invention obtains cutting edge in cutting portion.This type of laser comprises various quasi-continuous lasing and pulse laser, as: but be not limited to picosecond laser and femtosecond laser.Its wave-length coverage had is 1.07 μm ± 5%, preferably 1.06 μm-1.08 μm.
The laser instrument of 1W-500W power is applicable to the processing method of various cutting edge provided by the invention.At this, the power output prioritizing selection 10w-200w of the laser applied, more preferably 10w-100w, as: but be not limited only to 15w ± 4w, 20w ± 4w, 25w ± 4w, 30w ± 4w, 35w ± 4w, 40w ± 4w, 45w ± 4w, 50w ± 4w, 55w ± 4w, 60w ± 4w, 65w ± 4w, 70w ± 4w, 75w ± 4w, 80w ± 4w, 85w ± 4w, 90w ± 4w and 95w ± 4w.
The processing method of various cutting edge provided by the invention, the pulse recurrence rate prioritizing selection 1.6KHz-1000KHz of its laser, more preferably 2KHz-1000KHz.
The processing method of various cutting edge provided by the invention, the pulsewidth prioritizing selection 81ns-650ns of the laser of its application, more preferably 81ns-243ns, as: but be not limited only to 81ns, 85ns, 89ns, 94ns, 98ns, 103ns, 107ns, 112ns, 116ns, 121ns, 125ns, 129ns, 134ns, 138ns, 153ns, 157ns, 162ns, 166ns, 171ns, 175ns, 179ns, 184ns, 188ns, 193ns, 197ns, 202ns, 206ns, 211ns, 215ns, 220ns, 224ns, 229ns, 233ns, 238ns and 243ns.
The processing method of various cutting edge provided by the invention, the pulse energy range prioritizing selection 0.05MJ-10MJ of the laser of its application, more preferably 0.1MJ-2.1MJ, as: but be not limited only to 0.1MJ, 0.2MJ, 0.3MJ, 0.4MJ, 0.5MJ, 0.6MJ, 0.7MJ, 0.8MJ, 0.9MJ, 1.0MJ, 1.1MJ, 1.2MJ, 1.3MJ, 1.4MJ, 1.5MJ, 1.6MJ, 1.7MJ, 1.8MJ, 1.9MJ, 2.0MJ and 2.1MJ.
The embodiment of the processing method of a kind of cutting edge provided by the invention, by laser action in cutting portion to make cutting edge.
The embodiment of the processing method of another kind of cutting edge provided by the invention, carries out grinding or wire cut EDM to material, obtains cutting portion, then imposes laser action at least 1 time in cutting portion place, make cutting edge.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be less than the first machining angle of cutting portion first relief angles, laser is processed cutting portion from major first face, to form one second rear knife face, the second obtained relief angle is made to be less than the first relief angle.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be less than the first machining angle of cutting portion first relief angles, laser is processed cutting portion from major first flank, to form one second rear knife face, the second obtained relief angle is made to be less than the first relief angle.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be greater than the second machining angle of cutting portion first anterior angle angle, laser is processed cutting portion from major first face, to form second rake face, the second obtained anterior angle is made to be greater than the first anterior angle.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be greater than the second machining angle of cutting portion first anterior angle angle, laser is processed cutting portion from major first flank, to form second rake face, the second obtained anterior angle is made to be greater than the first anterior angle.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be greater than the 3rd machining angle of cutting portion first relief angles, laser is processed along major first face or major first flank cutting portion, to form knife face after the 3rd, make obtain the 3rd relief angle and be greater than the first relief angle.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be greater than the 3rd machining angle of cutting portion first relief angles, laser is processed along major first flank cutting portion, to form knife face after the 3rd, make obtain the 3rd relief angle and be greater than the first relief angle, and the direction of major first flank is acted on first along laser, laser is not and to major first face.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be greater than the 3rd machining angle of cutting portion first relief angles, laser is processed along major first face cutting portion, to form knife face after the 3rd, make obtain the 3rd relief angle and be greater than the first relief angle, and the direction of major first face is acted on first along laser, laser is not and to major first flank.
The embodiment of the processing method of another kind of cutting edge provided by the invention, the plane of cutting with the portion of being cut is for datum level, to be less than the 4th machining angle of cutting portion first anterior angle angle, laser is processed along major first face or major first flank cutting portion, to form the 3rd rake face, make obtain the 3rd anterior angle and be less than the first anterior angle.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be less than the 4th machining angle of cutting portion first anterior angle angle, laser is processed cutting portion along major first face, to form the 3rd rake face, makes acquisition the 3rd anterior angle be less than the first anterior angle, and the direction of major first face is acted on first along laser, laser is not and to major first flank.
The embodiment of the processing method of another kind of cutting edge provided by the invention, cutting portion comprises major first face and major first flank, the plane of cutting with the portion of being cut is for datum level, to be less than the 4th machining angle of cutting first anterior angle angle, laser is processed along major first flank cutting portion, to form the 3rd rake face, make obtain the 3rd anterior angle and be less than the first anterior angle, and the direction of major first flank is acted on first along laser, laser is not and to major first face.
The beneficial effect that technical solution of the present invention realizes:
The processing method of cutting edge provided by the invention, at least 1 laser cutting is imposed to cutting portion, can significantly shorten process time to half below, the machining period of single-piece cutter is shortened greatly, improve production efficiency and speed of production, reduce the processing cost of single-piece cutter.
With the cutting edge that method processing provided by the invention obtains, its cutting edge fineness and linearity all obtain and significantly improve, and improve cutting-tool's used life, are suitable for processing unmanageable material (as: hard material).
Especially laser is imposed overdischarge linear cutter or grinding and after obtaining blade, the sharpness of gained cutting edge and continuity (200 times contrast) are all significantly increased or improve.Carry out preliminary working with the cutting edge that fine finishining obtains with the employing conventional method such as grinding or discharge lines cutting to compare, (after universal cutter processing parts 200, piece surface generation residual processing vestige causes cutter to be scrapped to the processing life-span significant prolongation more than one times of the cutting edge that the present invention obtains; Still continue normal process after the tool sharpening part 500 of this method manufacture, finally produce vestige at about 1300 and scrap).
Accompanying drawing explanation
Fig. 1 forms by continuous laser of the present invention the microstructure schematic diagram of cutting seam;
Fig. 2 for the present invention scan laser formed cutting seam microstructure schematic diagram;
Fig. 3 is the schematic diagram of the inventive method processing cutting portion one embodiment;
Fig. 4 is the schematic diagram of another embodiment of the inventive method processing cutting portion;
Fig. 5 is the schematic diagram of another embodiment of the inventive method processing cutting portion;
Fig. 6 is the schematic diagram of another embodiment of the inventive method processing cutting portion;
Fig. 7 is the schematic diagram of another embodiment of the inventive method processing cutting portion;
Fig. 8 is the schematic diagram of another embodiment of the inventive method processing cutting portion;
Fig. 9 is the schematic diagram of another embodiment of the inventive method processing cutting portion;
Figure 10 is the schematic diagram of another embodiment of the inventive method processing cutting portion;
Figure 11 is the microstructure schematic diagram using different parameters to carry out machining acquisition cutting portion one embodiment, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 12 is the microstructure schematic diagram using different parameters to carry out another embodiment of machining acquisition cutting portion, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 13 is the microstructure schematic diagram using different parameters to carry out another embodiment of machining acquisition cutting portion, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 14 is the microstructure schematic diagram using different parameters to carry out another embodiment of machining acquisition cutting portion, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 15 is the microstructure schematic diagram using different parameters to carry out another embodiment of machining acquisition cutting portion, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 16 is the microstructure schematic diagram using different parameters to carry out another embodiment of machining acquisition cutting portion, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 17 is the microstructure schematic diagram using different parameters to carry out another embodiment of machining acquisition cutting portion, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 18 is the microstructure schematic diagram using different parameters to carry out another embodiment of machining acquisition cutting portion, and in figure, " ■ " represents cutting nubbin (not punching completely),
represent burn part (excessively carbonizing), " " represents material body;
Figure 19 is the schematic diagram adopting existing conventional method processing PCD material to obtain cutting portion one embodiment;
Figure 20 is the schematic diagram adopting the inventive method processing PCD material to obtain cutting portion one embodiment.
Detailed description of the invention
Technical scheme of the present invention is described in detail below in conjunction with accompanying drawing.The embodiment of the present invention is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to the technical scheme of invention or equivalent replacement, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in right of the present invention.
The adoptable continuous laser of the present embodiment moves to the other end (or another edge, place) with the form of single trend from one end (or an edge), in this motion process, continuingly act on hard material, and on hard material, form cutting seam S1 (not cut off by hard material) or section (surface formed after being cut off by hard material).Fig. 1 gives the micromorphologic visual field signal of the cutting seam formed in the process, and its entirety is interpreted as presenting straight line (section) form.But in the cutting process of reality, deformation is there is after material is heated, therefore small irregular curve or form of discounting may also be there is at the edge of local, thus become faulty straight line (or being similar to straight line in certain scope), but these small changes, not owing to the trend of laser, also substantial change cannot be played to configuration.These tiny forms in local produced due to edge in cutting process also should be included in the implication of straight line (section) form.
The present embodiment is adoptable scanning laser also, and its movement locus presents Two-dimensional morphology on microcosmic.Fig. 2 gives a kind of visual field signal of Two-dimensional morphology like this, as shown in Figure 2, laser moves to the other end (or another place edge) with the form of single trend from one end (or an edge) on the whole and continuingly acts on while hard material forms cutting seam S2, also moving towards vertical direction moves back and forth with this entirety simultaneously, and formed and somely move towards vertical straight line (section) with entirety.
The processing method of a kind of cutting edge that the present embodiment provides, by laser action in cutting portion to make cutting edge.Cutting portion refers to have cutting function part, and it can also adopt the mode such as grinding or wire cut EDM process material and obtain.Furthermore achieved that cutting edge fineness and linearity all obtain by the mode processing to obtain the second relief angle (anterior angle) or the 3rd relief angle (anterior angle) to cutting portion to significantly improve, improve cutting-tool's used life.
Fig. 3 is the schematic diagram of the inventive method processing cutting portion one embodiment, and as shown in Figure 3, cutting portion 100 comprises major first face 110 and major first flank 120.The plane that the present embodiment cuts with the portion of being cut is for datum level, to be less than the first machining angle of cutting portion 100 first relief angles, laser 200 is processed from major first face 110 pairs of cutting portions, to form one second rear knife face, makes the second obtained relief angle be less than the first relief angle.
Fig. 4 is the schematic diagram of another embodiment of the inventive method processing cutting portion, as shown in Figure 4, cutting portion 100 comprises major first face 110 and major first flank 120, the plane that the present embodiment cuts with the portion of being cut is for datum level, to be less than the first machining angle of cutting portion 100 first relief angles, laser 200 is processed from major first flank 120 pairs of cutting portions 100, to form one second rear knife face, makes the second obtained relief angle be less than the first relief angle.
Fig. 5 is the schematic diagram of another embodiment of the inventive method processing cutting portion, as shown in Figure 5, cutting portion 100 comprises major first face 110 and major first flank 120, the plane that the present embodiment cuts with the portion of being cut is for datum level, to be greater than the second machining angle of cutting portion 100 first anterior angle angle, laser 200 is processed from major first face 110 pairs of cutting portions 100, to form second rake face, makes the second anterior angle obtained be greater than the first anterior angle.
Fig. 6 is the schematic diagram of another embodiment of the inventive method processing cutting portion, as shown in Figure 6, cutting portion 100 comprises major first face 110 and major first flank 120, the plane that the present embodiment cuts with the portion of being cut is for datum level, to be greater than the second machining angle of cutting portion 100 first anterior angle angle, laser 200 is processed from major first flank 120 pairs of cutting portions 100, to form second rake face, makes the second anterior angle obtained be greater than the first anterior angle.
Fig. 7 is the schematic diagram of another embodiment of the inventive method processing cutting portion, as shown in Figure 7, cutting portion 100 comprises major first face 110 and major first flank 120, the plane that the present embodiment cuts with the portion of being cut is for datum level, to be greater than the 3rd machining angle of the first relief angles, laser 200 is processed along major first flank 120 pairs of cutting portions 100, and form processing plane 130 at cutting portion 100, to form the 3rd rear knife face, acquisition the 3rd relief angle is made to be greater than the first relief angle, and the direction 210 (in figure dotted line) of major first flank 120 is acted on first along laser 200, laser 200 is not and to major first face 110.
Fig. 8 is the schematic diagram of another embodiment of the inventive method processing cutting portion, as shown in Figure 8, cutting portion 100 comprises major first face 110 and major first flank 120, the plane that the present embodiment cuts with the portion of being cut is for datum level, to be greater than the 3rd machining angle of the first relief angles, laser 200 is processed along major first face 110 pairs of cutting portions 100, and form processing plane 130 at cutting portion 100, to form the 3rd rear knife face, acquisition the 3rd relief angle is made to be greater than the first relief angle, and the direction 210 (in figure dotted line) of major first face 110 is acted on first along laser 200, laser 200 is not and to major first flank 110.
Fig. 9 is the schematic diagram of another embodiment of the inventive method processing cutting portion, as shown in Figure 9, cutting portion 100 comprises major first face 110 and major first flank 120, the plane that the present embodiment cuts with the portion of being cut is for datum level, to be less than the 4th machining angle of the first anterior angle angle, laser 200 is processed along major first flank 120 pairs of cutting portions 100, and form processing plane 130 at cutting portion 100, to form the 3rd rake face, acquisition the 3rd anterior angle is made to be less than the first anterior angle, and the direction (in figure dotted line) of major first face 110 is acted on first along laser 200, laser 200 is not and to major first flank 120.
Figure 10 is the schematic diagram of another embodiment of the inventive method processing cutting portion, as shown in Figure 10, cutting portion 100 comprises major first face 110 and major first flank 120, the plane that the present embodiment cuts with the portion of being cut is for datum level, to be less than the 4th machining angle of the first anterior angle angle, laser 200 is processed along major first face 110 pairs of cutting portions 100, and form processing plane 130 at cutting portion 100, to form the 3rd rake face, acquisition the 3rd anterior angle is made to be less than the first anterior angle, and the direction 210 (in figure dotted line) of major first flank 120 is acted on first along laser 200, laser 200 is not and to major first face 110.
The present embodiment adopts processing method, as: with by as described in the cutting portion plane of cutting for datum level, to be less than the first machining angle of described cutting portion first relief angles, described laser is processed described cutting portion from described major first face, to form one second rear knife face, the second obtained relief angle is made to be less than the first relief angle, and conduct in-depth research with regard to laser processing parameter (see the table 1) effect to formed cutting edge, gained cutting edge through 250 times amplify forms see Figure 11-Figure 18.
Wherein, alleged " in scope " refers to that the laser parameter that cutting edge processing method of the present invention adopts belongs to following situation:
The wave-length coverage of laser is 1.07 μm ± 5%, as: 1.06 μm-1.08 μm;
The power bracket of laser instrument is 10w-200w;
The pulse recurrence rate scope of laser is 1.6KHz-1000KHz;
The pulse duration scope of laser is 81ns-650ns, especially 81ns-243ns;
The pulse energy range of laser is 0.05MJ-10MJ, especially 0.1MJ-2.1MJ.
Table 1
There is above-mentioned every embodiment, when wavelength, pulsewidth and pulse energy fall in scope, significantly can improve situations such as the smoothness of the cutting edge of processing cutting portion and residual volumes, improve the quality of cutting edge.When the parameters such as wavelength, pulsewidth and pulse energy all fall in scope, processing cutting portion institute obtains best cutting edge, namely without burn, without remnants, body edges place (cutting edge) smoothly, in a linearity.
PCD cutter is one of representative of superhard cutter, for the cutter of the long 100mm of sword, conventional method is processed PCD material and usually first carry out roughing in about 150 minutes (as: discharge lines cutting), then fine finishining (as: grinding) in about 170 minutes, gained cutting edge amplifies the structure after 200 times as shown in figure 19, and it presents containing the sawtooth wire of hierarchy structure at about 3 μm.
Same, PCD material first carries out roughing in about 150 minutes (as: discharge lines cutting) usually, and then impose about 60 minutes laser, gained cutting edge amplifies the structure after 200 times as shown in figure 20, its cutting edge presented is more level and smooth and continuous, and sharpness and continuity significantly improve.
(ADC+ZrO when conventional method being processed composite with aluminium alloy of cutting edge processing metal pottery that PCD material obtains
2), after about 250, cutting edge is damaged, and finished surface is crude, cannot continue to use.Same, by cutting edge processing metal pottery (ADC+ZrO obtained for method processing PCD material provided by the invention
2), after more than 600, cutting edge has no obvious breakage, still can continue to use.
Claims (16)
1. a processing method for cutting edge, is characterized in that imposing laser at least 1 time to cutting portion, and the pulsewidth of described laser is 81ns-650ns.
2. a processing method for cutting edge, is characterized in that first carrying out grinding or wire cut EDM to material, obtains cutting portion, then imposes laser action at least 1 time in cutting portion place, make cutting edge; The pulsewidth of described laser is 81ns-650ns.
3. the processing method of cutting edge according to claim 1 and 2, it is characterized in that described cutting portion comprises major first face and major first flank, the method that described laser imposes cutting portion is selected from
Method one, with the plane of being cut by described cutting portion for datum level, to be less than the first machining angle of described cutting portion first relief angles, described laser is processed described cutting portion from described major first face, to form one second rear knife face, the second obtained relief angle is made to be less than the first relief angle; Or
Method two, with the plane of being cut by described cutting portion for datum level, to be less than the first machining angle of described cutting portion first relief angles, described laser is processed described cutting portion from described major first flank, to form one second rear knife face, the second obtained relief angle is made to be less than the first relief angle; Or
Method three, with the plane of being cut by described cutting portion for datum level, to be greater than the second machining angle of described cutting portion first anterior angle angle, described laser is processed described cutting portion from described major first face, to form second rake face, the second obtained anterior angle is made to be greater than the first anterior angle; Or
Method four, with the plane of being cut by described cutting portion for datum level, to be greater than the second machining angle of described cutting portion first anterior angle angle, described laser is processed described cutting portion from described major first flank, to form second rake face, the second anterior angle obtained is made to be greater than the first anterior angle; Or
Method five, with the plane of being cut by described cutting portion for datum level, to be greater than the 3rd machining angle of described cutting portion first relief angles, described laser is processed along described major first face or described major first flank described cutting portion, to form the 3rd rear knife face, acquisition the 3rd relief angle is made to be greater than the first relief angle; Or
Method six, with the plane of being cut by described cutting portion for datum level, to be greater than the 3rd machining angle of described cutting portion first relief angles, described laser is processed along described major first flank described cutting portion, to form the 3rd rear knife face, make acquisition the 3rd relief angle be greater than the first relief angle, and act on the direction of described major first flank first along described laser, described laser is not and to described major first face; Or
Method seven, with the plane of being cut by described cutting portion for datum level, to be greater than the 3rd machining angle of described cutting portion first relief angles, described laser is processed along described major first face described cutting portion, to form the 3rd rear knife face, make obtain the 3rd relief angle and be greater than the first relief angle, and act on the direction of described major first face first along described laser, described laser is not and to described major first flank; Or
Method eight, with the plane of being cut by described cutting portion for datum level, to be less than the 4th machining angle of described cutting portion first anterior angle angle, described laser is processed along described major first face or described major first flank described cutting portion, to form the 3rd rake face, acquisition the 3rd anterior angle is made to be less than the first anterior angle; Or
Method nine, with the plane of being cut by described cutting portion for datum level, to be less than the 4th machining angle of described cutting portion first anterior angle angle, described laser is processed along described major first face described cutting portion, to form the 3rd rake face, make acquisition the 3rd anterior angle be less than the first anterior angle, and act on the direction of described major first face first along described laser, described laser is not and to described major first flank; Or
Method ten, with the plane of being cut by described cutting portion for datum level, to be less than the 4th machining angle of described cutting portion first anterior angle angle, described laser is processed along described major first flank described cutting portion, to form the 3rd rake face, make acquisition the 3rd anterior angle be less than the first anterior angle, and act on the direction of described major first flank first along described laser, described laser is not and to described major first face.
4. the processing method of cutting edge according to claim 1 and 2, is characterized in that the pulsewidth of described laser is 81ns-243ns.
5. the processing method of cutting edge according to claim 1 and 2, is characterized in that the pulsewidth of described laser is selected from 81ns, 85ns, 89ns, 94ns, 98ns, 103ns, 107ns, 112ns, 116ns, 121ns, 125ns, 129ns, 134ns, 138ns, 153ns, 157ns, 162ns, 166ns, 171ns, 175ns, 179ns, 184ns, 188ns, 193ns, 197ns, 202ns, 206ns, 211ns, 215ns, 220ns, 224ns, 229ns, 233ns, 238ns or 243ns.
6. the processing method of cutting edge according to claim 1 and 2, is characterized in that the pulse energy of described laser is 0.05MJ-10MJ.
7. the processing method of cutting edge according to claim 1 and 2, is characterized in that the pulse energy of described laser is 0.1MJ-2.1MJ.
8. the processing method of cutting edge according to claim 1 and 2, is characterized in that the pulse energy of described laser is selected from 0.1MJ, 0.2MJ, 0.3MJ, 0.4MJ, 0.5MJ, 0.6MJ, 0.7MJ, 0.8MJ, 0.9MJ, 1.0MJ, 1.1MJ, 1.2MJ, 1.3MJ, 1.4MJ, 1.5MJ, 1.6MJ, 1.7MJ, 1.8MJ, 1.9MJ, 2.0MJ or 2.1MJ.
9. the processing method of cutting edge according to claim 1 and 2, is characterized in that the power output of described laser is 10w-200w.
10. the processing method of cutting edge according to claim 1 and 2, is characterized in that the power output of described laser is 10w-100w.
The processing method of 11. cutting edges according to claim 1 and 2, is characterized in that the power output of described laser is selected from 15w ± 4w, 20w ± 4w, 25w ± 4w, 30w ± 4w, 35w ± 4w, 40w ± 4w, 45w ± 4w, 50w ± 4w, 55w ± 4w, 60w ± 4w, 65w ± 4w, 70w ± 4w, 75w ± 4w, 80w ± 4w, 85w ± 4w, 90w ± 4w and 95w ± 4w.
The processing method of 12. cutting edges according to claim 1 and 2, is characterized in that the wave-length coverage 1.07 μm ± 5% of described laser.
The processing method of 13. cutting edges according to claim 1 and 2, is characterized in that the wave-length coverage of described laser is selected from 1.06 μm-1.08 μm.
The processing method of 14. cutting edges according to claim 1 and 2, is characterized in that the pulse recurrence rate of described laser is 1.6KHz-1000KHz.
The processing method of 15. cutting edges according to claim 1 and 2, is characterized in that the pulse recurrence rate of described laser is 2KHz-1000KHz.
The processing method of 16. cutting edges according to claim 1 and 2, is characterized in that described cutting portion is blade.
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