CN102642086A - Device and method for cutting ceramics by use of infrared lasers - Google Patents
Device and method for cutting ceramics by use of infrared lasers Download PDFInfo
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- CN102642086A CN102642086A CN2011100416507A CN201110041650A CN102642086A CN 102642086 A CN102642086 A CN 102642086A CN 2011100416507 A CN2011100416507 A CN 2011100416507A CN 201110041650 A CN201110041650 A CN 201110041650A CN 102642086 A CN102642086 A CN 102642086A
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Abstract
The invention discloses a device and method for cutting ceramics by use of infrared lasers. X-axis, Y-axis and Z-axis moving platforms are arranged on a platform; a laser device is arranged at the front end; a laser cutting head is arranged on the laser device and located in the working range of ceramic cutting; the working wavelength of the infrared lasers is 800-1,200nm; and a high-pressure inert gas flow such as nitrogen is added when in cutting so as to realize the effects of cooling, improving the cutting ability, removing cuttings and preventing interference of the cuttings.
Description
Technical field
The present invention system relates to a kind of device and method of infrared laser Cutting Ceramics, refers in particular to reach fly-cutting, time saving and energy saving high precision and avoid destroying the technology of requirement especially.
Background technology
The ceramic post sintering product processed is the indispensable science and technology of accurate industry of 21st century, also is the industrial goods of following normality; Because it has high-melting-point, high rigidity, insulating properties is good and characteristics such as corrosion resistance is good, can under harsh high temperature corrosion environment, use or be applied in the purposes of electric insulation, so be used on the accurate articles for use such as aerospace industry, LED substrate, liner, PC plate, medical apparatus, pipe box, bearing at present; In its machine-shaping operation, essential program, the mode of at present ceramic component being cut through cutting; Especially aluminium nitride ceramics, hardness is high, with diamond cutter or diamond cutter processing; Because of its cutting that belongs to contact, can produce bigger stress, can make ceramic substrate have fragmentation or, dominance and recessive crackle; Make yield rate reduce, raw-material waste is serious.
Summary of the invention
This practicality invention " device and method of infrared laser Cutting Ceramics ", but be the arbitrary shape cutting is provided, can keeps the complete of machining object, avoid the loss of facility, improve working (machining) efficiency, the advantage person who reduces cost.The present invention's " device and method of infrared laser Cutting Ceramics "; Basically be provided with the mobile platform of X, Y, Z axle in board, front end is provided with the laser instrument of laser cutting head, and laser cutting head system is positioned on the working range of Cutting Ceramics; The wavelength of this laser is between between 800nm～1200nm; And in cutting simultaneously, in addition as the high pressure noble gas fluid of nitrogen operate, make to have cooling, improve cutting power, remove smear metal and prevent the interference of smear metal.
The present invention's " device and method of infrared laser Cutting Ceramics "; Basically be provided with the mobile platform of X, Y, Z axle in board; Front end is provided with laser instrument, is provided with laser cutting head in laser instrument, and this laser cutting head system position is axial the moving of Z on laser instrument; And laser cutting head can externally send living infrared laser and jet flow gas, can carry out the cleaver to working substance.
The present invention's " device and method of infrared laser Cutting Ceramics " makes laser shine on the material through after focusing on, and luminous energy is converted into heat energy, makes to be cut material temperature and to raise rapidly, makes it fusing or vaporization then.Meanwhile, the air-flow coaxial with light beam sprays from nozzle, and the fusing or the material of having vaporized are blown away by the bottom of otch.Along with laser and the relative motion that is cut material, thereby on cutting material, form the purpose that joint-cutting reaches cutting.
Description of drawings
First figure: work board schematic perspective view of the present invention.
Second figure: the design schematic perspective view of another kind of work board of the present invention.
The 3rd figure: the present invention's laser head structure is implemented illustration.
The 4th figure: the sketch map of cut of the present invention.
11 ... Board 12 ... Y-axis shift moving platform 13 ... Work top
14 ... Anchor clamps 15 ... Laser instrument 16 ... Laser cutting head
17 ... X mobile platform 18 ... Z axle mobile platform 13A ... Static platform
21 ... Upper pedestal 22 ... Laser room 23 ... Optical frames
31 ... Lower base 32 ... Working space 33 ... Transparent mirror
34 ... Sealing ring 35 ... Extension 36 ... Perforation
41 ... Fixed cell 42 ... Shower nozzle 43 ... Cone-shaped
51 ... Potter crop 19 ... Fixed station
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is further elaborated.
The present invention's device please be joined shown in first figure, lies in board 11 and is provided with y-axis shift moving platform 12; Reach the X axle mobile platform 17 that is at right angles set with y-axis shift moving platform 12; Be positioned at y-axis shift moving platform 12 other ends in board 11 and be provided with laser instrument 15, as shown in the figure, the embodiment of this laser instrument 15 is cantilevered design; Be provided with laser cutting head 16 in laser instrument 15 the place aheads; Be provided with a work top 13 in platform 12, and this table top 13 be provided with can about action with adjustment apart from the anchor clamps 14 of clamping working substance, mat y-axis shift moving platform 12 and X mobile platform 17 can be controlled the mobile confession laser cutting head that the potter crop that is positioned on the table top 13 is X and Y axle and process.
And laser instrument 15 the place aheads are positioned at the scope top that work top 13 moves, and be provided with only to be the axially movable laser cutting head 16 of Z, and laser cutting head 16 can externally send living infrared laser and jet flow gas, can carry out the cleaver to working substance.
And laser cutting head 16 can send infrared laser and jet flow gas to the working substance perpendicular cuts; By this; The position of control X and Y shaft platform 17,11 and mobile; Adjustable full employment table top 13 is accepted laser cutting head 16 according to the cutting route that sets, and along infrared laser and the jet flow gas that laser cutting head 16 is sent, just can obtain to cut precision height, requirement that error is few.And laser cutting head 16 be can be according to working substance highly do the axial adjustment person of Z.
In addition, please join shown in second figure, also can make pottery pass through clamps on static platform 13A, static platform 13A is provided with the anchor clamps 14 that can fix pottery.Laser cutting head 16 is located at Z axle mobile platform 18 and can moves up and down, and 18 of Z axle mobile platforms are in X mobile platform 17, but move left and right; And the y-axis shift moving platform 12 of position on both sides established at X axle mobile platform 17 two ends; And can move forward and backward, then the position is on the set fixed station 19 in board 11 two ends for y-axis shift moving platform 12, and 19 of two fixed stations are a working space; This working space just can provide laser cutting head 16 vertical movable at Z axle mobile platform 18, and the usage space of static platform 13A.Therefore laser cutting head 16 can move in X, Y plane; Also can move simultaneously in Z-direction; The focus of the laser after will focusing on through moving of Z axle like this is as for the surface of pottery; Move on, Y plane by predefined path through motion controller control laser cutting head then, realization is to the cutting of pottery like this.
And the present invention's laser cutting head 16 structures can join the embodiment shown in the 3rd figure to realize that it is provided with upper pedestal 21 and lower base 31; Upper pedestal 21 is to be linked to laser generator, is formed with a Laser room 22 in it, and Laser room 22 is provided with optical frames 23 can be with the required lasing light emitter of infrared light focusing becoming cutting; Establish working space 32 in lower base 32; And be provided with downward extension 35, be provided with shower nozzle 42 in extension 35 lower port with a fixed cell 41, these shower nozzle 42 inner tapered shapes 43; Being provided with a transparent mirror 33 in lower base 31 working spaces 32, is to be unlikely in order to guarantee gas only to be gone out by shower nozzle 42 to get into Laser room 22 and the normal operation that also can keep laser.
Its cutting mode, the sketch map shown in the 4th figure just is when potter crop 51 gets into the laser head working ranges; Receive the cutting of infrared laser and the jet flow of gas simultaneously, not only can make cutting accuracy improve, reduce its error by this, adding of gas held; Can cool off processing temperature; Reduce hot shadow zone and the situation of avoiding condenser lens to be polluted, also prolonged the service life of facility, improve its economic worth and cost greatly.Inert gas such as the of paramount importance effect of nitrogen simultaneously is that it is the key factor of cut pottery, if do not add nitrogen then cut infeasible or efficient extremely low.
In sum, the present invention has the value on the industry, meets patent requirement; Only, the above person is merely the present invention's preferred embodiment, is not in order to limit the scope of the present invention's enforcement; So done equivalence or variation person easily when haveing the knack of this skill; As increase some habits instrument or the change that cooperates other structure to do; But change and modification in spirit that does not break away from the present invention and the following equalization of being done of scope, all should be covered by in the present invention's the claim, close first Chen Ming.
Claims (7)
1. one kind " device and method of infrared laser Cutting Ceramics "; Basically be provided with the mobile platform of X, Y, Z axle in board, front end is provided with laser instrument, is provided with laser cutting head in laser instrument; And laser cutting head system is positioned on the working range of Cutting Ceramics; The wavelength of this infrared laser in cutting simultaneously, carries out jet flow with the noble gas like nitrogen to the potter crop between between 800nm～1200nm.
2. according to claim 1 said it " device and method of infrared laser Cutting Ceramics ", it is characterized in that this noble gas is the nitrogen person.
3. according to claim 1 said it " device and method of infrared laser Cutting Ceramics ", it is characterized in that this noble gas is the argon gas person.
4. according to claim 1 said it " device and method of infrared laser Cutting Ceramics ", it is characterized in that, and laser cutting head can externally send living infrared laser and jet flow gas, can carry out the cleaver working substance.
5. according to claim 1 said it " device and method of infrared laser Cutting Ceramics "; It is characterized in that board is provided with the y-axis shift moving platform, reach the X axle mobile platform that is at right angles set with the y-axis shift moving platform; Be positioned at other end of y-axis shift moving platform in board and be provided with cantilever; Laser instrument is installed on the cantilever, is provided with a work top in platform, and this table top be provided with can about action with adjustment apart from the anchor clamps of clamping potter crop.
6. according to claim 1 said it " device and method of infrared laser Cutting Ceramics "; It is characterized in that; Laser cutting head is located at Z axle mobile platform top; And Z axle mobile platform position is in the X mobile platform, and the position is established at the y-axis shift moving platform in X mobile platform two ends, the y-axis shift moving platform then the position on the set fixed station in board two ends.
7. according to claim 1 said it " device and method of infrared laser Cutting Ceramics ", it is characterized in that pottery comprises aluminium oxide, zirconia, aluminium nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100416507A CN102642086A (en) | 2011-02-21 | 2011-02-21 | Device and method for cutting ceramics by use of infrared lasers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100416507A CN102642086A (en) | 2011-02-21 | 2011-02-21 | Device and method for cutting ceramics by use of infrared lasers |
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| Publication Number | Publication Date |
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| CN102642086A true CN102642086A (en) | 2012-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011100416507A Pending CN102642086A (en) | 2011-02-21 | 2011-02-21 | Device and method for cutting ceramics by use of infrared lasers |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106624358A (en) * | 2017-01-20 | 2017-05-10 | 广州松兴电气股份有限公司 | Laser welding head protective gas device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1541800A (en) * | 2003-04-30 | 2004-11-03 | 蔡良贤 | Trembling laser cutting device and method thereof |
| US20090255911A1 (en) * | 2008-04-10 | 2009-10-15 | Applied Materials, Inc. | Laser scribing platform and hybrid writing strategy |
| CN201350546Y (en) * | 2009-02-17 | 2009-11-25 | 武汉奥华光电器件有限公司 | Laser machine with mobile suspension arm |
| CN101774083A (en) * | 2010-02-08 | 2010-07-14 | 重庆斯沃德光电设备设计制造有限公司 | Multifunctional laser digital-control processing system |
| CN202114403U (en) * | 2011-02-21 | 2012-01-18 | 深圳市木森科技有限公司 | Device using infrared laser to cut ceramic |
-
2011
- 2011-02-21 CN CN2011100416507A patent/CN102642086A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1541800A (en) * | 2003-04-30 | 2004-11-03 | 蔡良贤 | Trembling laser cutting device and method thereof |
| US20090255911A1 (en) * | 2008-04-10 | 2009-10-15 | Applied Materials, Inc. | Laser scribing platform and hybrid writing strategy |
| CN201350546Y (en) * | 2009-02-17 | 2009-11-25 | 武汉奥华光电器件有限公司 | Laser machine with mobile suspension arm |
| CN101774083A (en) * | 2010-02-08 | 2010-07-14 | 重庆斯沃德光电设备设计制造有限公司 | Multifunctional laser digital-control processing system |
| CN202114403U (en) * | 2011-02-21 | 2012-01-18 | 深圳市木森科技有限公司 | Device using infrared laser to cut ceramic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106624358A (en) * | 2017-01-20 | 2017-05-10 | 广州松兴电气股份有限公司 | Laser welding head protective gas device |
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Application publication date: 20120822 |