CN104364208A - Glass-substrate-cutting method and glass-substrate production method - Google Patents
Glass-substrate-cutting method and glass-substrate production method Download PDFInfo
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- CN104364208A CN104364208A CN201380030915.0A CN201380030915A CN104364208A CN 104364208 A CN104364208 A CN 104364208A CN 201380030915 A CN201380030915 A CN 201380030915A CN 104364208 A CN104364208 A CN 104364208A
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- glass substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
Abstract
The provided glass-substrate-cutting method for cutting a glass substrate by irradiation with a laser beam is characterized by: heating a laser-beam irradiation region, where one surface of the glass substrate is irradiated with the laser beam, at or above the temperature at which the laser-beam irradiation section is vaporized from the one surface of the glass substrate to the other surface thereof; and moving the laser-beam irradiation region relative to the glass substrate and along a planned cutting line of the glass substrate. Further provided is a glass-substrate production method.
Description
Technical field
The present invention relates to the cutting method of glass substrate and the manufacture method of glass substrate.
Background technology
As the cutting method of glass substrate, to using the cutting method of laser to be studied.
Such as, in patent documentation 1, propose a kind of cutting method of glass substrate, wherein, after the notch recesses being formed predetermined depth by irradiating laser, utilize pressurized gas etc. to carry out pressure cooling immediately.
In addition, in patent documentation 2, propose a kind of cutting method of glass substrate, wherein, laser is scanned glass substrate is irradiated, make the glass melting of the illuminated portion of laser, and utilize assist gas to be blown away by the glass of melting.
But, if utilize the cutting method of the glass substrate proposed in patent documentation 1, then can comprise the part corresponding with the notch recesses formed by irradiating laser and carry out forcing the part of the bottom being formed at notch recesses when cooling afterwards in its cut surface, both surface property are different.
When there is surface property distinct portions like this that caused by cutting method in cut surface, in order to make goods, needing to grind cut surface, forming the uniform cut surface of surface property.Therefore, spended time is needed to carry out the grinding step of cut surface.
In addition, need after irradiating laser immediately to glass substrate winding-up pressurized gas (assist gas), therefore the position of glass substrate is easily subjected to displacement, and cutting accuracy reduces sometimes.
If utilize the cutting method of glass substrate proposed in patent documentation 2, then the position that there is glass substrate be subjected to displacement because of the pressure of assist gas, problem that precision when cutting reduces sometimes.In addition, according to the energy density of laser, the heat distortion amount of the glass of local increases and glass substrate is cracked sometimes.In addition, the glass of melting that removes by assist gas can adhere to, be set in cut surface or its periphery, therefore in order to be removed, need spended time to carry out grinding step.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2004-059328 publication
Patent documentation 2: Japanese Laid-Open Patent Publication 60-251138 publication
Summary of the invention
Invent problem to be solved
In view of the problem of above-mentioned prior art, the object of the present invention is to provide with above-mentioned to glass substrate jet assist gas existing glass substrate cutting method compared with, the cutting method of the glass substrate of cutting processing can be carried out to glass substrate with good precision.
For the means of dealing with problems
In order to solve above-mentioned problem, the invention provides a kind of cutting method of glass substrate, it is by the cutting method of irradiating laser to the glass substrate that glass substrate cuts, it is characterized in that, by a surface irradiation to described glass substrate, the irradiation area of the laser of described laser is heated to more than the temperature of the laser irradiating part generating gasification on surface to another surface made from described glass substrate, and the irradiation area of described laser moved along the predetermined cuts line of described glass substrate relative to described glass substrate.
Invention effect
According to the cutting method of glass substrate of the present invention, compared with the cutting method of the glass substrate of existing use assist gas, cutting processing can be carried out with good precision to glass substrate.
Accompanying drawing explanation
Fig. 1 is the explanatory view of the cutting method of the glass substrate of embodiments of the present invention.
Fig. 2 is the explanatory view of the heating process in the cutting method of the glass substrate of embodiments of the present invention.
Fig. 3 is the explanatory view of the refrigerating work procedure in the cutting method of the glass substrate of embodiments of the present invention.
Fig. 4 is the explanatory view of the relation of the transfer rate of glass substrate of experimental example 1 of the present invention and the evaluation of the energy density of laser and cut surface.
Fig. 5 is the explanatory view of the relation of the transfer rate of glass substrate of experimental example 2 of the present invention and the evaluation of the energy density of laser and cut surface.
Fig. 6 is the explanatory view of the relation of the transfer rate of glass substrate of experimental example 3 of the present invention and the evaluation of the energy density of laser and cut surface.
Fig. 7 is the explanatory view of the relation of the transfer rate of glass substrate of experimental example 4 of the present invention and the evaluation of the energy density of laser and cut surface.
Embodiment
Below, the specific embodiment of the present invention is described with reference to accompanying drawing, but the present invention is not limited to following embodiment, can without departing from the scope of the invention in addition various distortion and the displacement of following embodiment.
In present embodiment, the cutting method of glass substrate of the present invention is described.
The cutting method of glass substrate of the present invention is that it has following formation by the cutting method of irradiating laser to the glass substrate that glass substrate cuts.
The feature of the cutting method of glass substrate of the present invention is,
The irradiation area of the laser of laser is heated to more than the temperature of the laser irradiating part generating gasification on surface to another surface made from described glass substrate by a surface irradiation to glass substrate.
Further, the irradiation area of described laser is made to move along the predetermined cuts line of described glass substrate relative to described glass substrate.
Utilize Fig. 1 ~ Fig. 3 to illustrate.
Fig. 1 schematically shows the formation obtained utilizing the situation of glass substrate cutting method glass-cutting substrate of the present invention to observe above the glass substrate of the side (face side) of irradiating laser.
Glass substrate 11, along the direction conveying shown in arrow A in Fig. 1, makes the part (irradiation area of laser) of having irradiated the laser 12 vibrated by not shown laser oscillation apparatus can move along the predetermined cuts line 13 on glass substrate.
In Fig. 1, irradiating the part (irradiation area of laser) of laser 12, being heated (heating process) from the laser irradiating part on surface to another surface of glass substrate.And, the region 14 having irradiated laser is left from the irradiation area of laser by the conveying of glass substrate 11, the periphery cooled (refrigerating work procedure) of the laser irradiating part (after irradiating laser, glass there occurs the part of gasification) 15 after laser radiation.
It should be noted that, have employed in Fig. 1 by conveying glass substrate 11 and make the formation that the part (irradiation area of laser) of having irradiated laser 12 on glass substrate 11 is subjected to displacement, as long as but along predetermined cuts line irradiating laser 12, which can be not limited to.Such as, also can by fixing by glass substrate 11 and adjust the optical system in the light path of the laser between laser oscillation apparatus and glass substrate, to operate and the position that makes to have irradiated the part (irradiation area of laser) of laser 12 is subjected to displacement.Can also according to carry glass substrate 11 and the mode making the position of the part of having irradiated laser 12 also be subjected to displacement is formed.
In addition, for convenience of explanation, there is shown the predetermined cuts line 13 of glass substrate, but glass substrate does not arrange this line.In addition, predetermined cuts line is not defined as straight line, can be set as the arbitrary lines such as curve according to the shape of the glass substrate after required cutting.
The composition can applying the glass substrate of the cutting method of glass substrate of the present invention is not particularly limited, and can be applied to various glass substrate.Such as, alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high silica glass can be enumerated, other take silicon-dioxide as the oxide based glass etc. of main component.
In addition, the thickness of glass substrate is also not particularly limited.
But, when above-mentioned glass substrate irradiating laser is heated, in the irradiation area of laser, by from a face side of glass substrate to the laser irradiating part on another surface, be namely heated to make glass generating gasification in its whole thickness of slab direction temperature more than.Therefore, the thickness of slab of glass substrate is preferably selected according to the output rating etc. of laser oscillation apparatus.Such as, the thickness of slab of glass substrate be preferably below 3.0mm, be more preferably below 1.0mm, more preferably below 0.5mm, be particularly preferably below 0.2mm.About the lower value of glass substrate, as long as be not particularly limited for the value being greater than zero (0).
In addition, the shape of the glass substrate shown in Fig. 1 is rectangle, but the shape of glass substrate is also not particularly limited.Such as, can for the ribbon glass substrate utilizing the glass substrate building mortion of float glass process or glass tube down-drawing etc. to be shaped.
Then, the heating process of carrying out in the irradiation area (glass substrate having irradiated the part of laser) of laser is described.Fig. 2 schematically show the irradiation area of the laser comprised in Fig. 1, the sectional view at B-B ' line place.
In the cutting method of glass substrate of the present invention, by as mentioned above to glass substrate irradiating laser 12, in the irradiation area of laser, carry out heating process.
In the irradiation area of the laser of glass substrate, be heated to more than the temperature of glass generating gasification from the laser irradiating part 21 on a surface to another surface of glass substrate of glass substrate.Herein, a surface of glass substrate refers to the face of the side of laser incidence, and another surface refers to its opposite face.Therefore, at laser irradiating part 21, glass generating gasification, forms communicating pores with the short period of time along the direction of illumination (thickness direction of glass substrate) of laser.
Further, at the periphery 22 of laser irradiating part 21, also heated by the heat transfer from laser irradiating part.
Like this, in heating process or following closely, i.e. when laser radiation (during glass gasification) or after following laser radiation closely, can when not making glass gasify with the short period of time at laser irradiating part to when above-mentioned laser irradiating part winding-up assist gas (not using assist gas).Therefore, it is possible to process with good precision when the position skew etc. not producing glass substrate, the crackle of glass substrate can be suppressed to produce.
Illuminate condition as the laser in heating process does not limit, as long as according to can the mode being heated to more than the gasification temperature of glass to the laser irradiating part of another face side from a surface of glass substrate (swashing the surface of light inlet side) side be carried out selecting in the laser-irradiated domain of glass substrate.
Specifically, such as, according to the transfer rate of the thickness of the glass substrate as material to be cut, glass composition, glass substrate (irradiation area of laser is relative to the translational speed of glass substrate) etc., according to the mode that can heat laser irradiating part as mentioned above to select the energy density etc. of laser.Such as can by carrying out trial test to calculate in advance.
Particularly the irradiation area of laser is being set to v (m/ hour) relative to the translational speed of glass substrate, the energy density of above-mentioned laser is being set to E (W/mm
2), when the thickness of slab of glass substrate being set to t (mm), preferably adjust the energy density of irradiated laser according to the mode meeting following relation:
E≥50×t×v。
By carrying out the cutting of the glass substrate comprising heating process under the state meeting afore mentioned rules, in the irradiation area of laser, the laser irradiating part on a surface to another surface of glass substrate from glass substrate can be positively heated to more than the temperature of glass generating gasification.
The spot diameter (beam diameter of the laser on a surface of glass substrate) of the laser exposed on glass substrate is not also limited, can select according to required working accuracy etc.
In addition, the kind of used laser is not particularly limited, as long as the glass substrate of the part of this irradiation can be heated by laser glass substrate being irradiated to vibration.Specifically, such as CO can be used
2laser, excimer laser, copper evaporation laser, YAG (YttriumAluminum Garnet, yttrium aluminum garnet) laser etc.
In heating process, by as mentioned above to glass substrate irradiating laser, the glass of laser irradiating part is gasified.Therefore, the glass ingredient (gas) of gasification can be produced at laser irradiating part and periphery thereof.If this composition is separated out, is attached on the surface of the optical system such as lens, mirror of the laser oscillation apparatus be configured in the light path of laser, then can exist and cannot irradiate the situation of the laser of abundant energy to glass substrate or cannot, to the situation etc. of desired position irradiating laser, bring impact likely to the working accuracy etc. of glass substrate.Therefore, preferably by glass substrate irradiating laser, the glass ingredient of gasification is removed.That is, preferably in heating process, the glass ingredient of the above-mentioned laser irradiating part of gasification is removed.About will the means of glass ingredient removing of gasification, be not particularly limited, device, the device etc. that utilizes gas to be blown away by the glass ingredient of gasification that the glass ingredient of gasification is aspirated can be used.About its configuration, also be carry out selecting according to used means, as long as according to not hindering heating process and the mode that be removed can being configured before the glass ingredient of gasification be attached on the lens be configured in the light path of laser, mirror etc.Such as, in fig. 2, consider to be configured in as shown in 23 near the part of having irradiated laser.
In addition, when using the device utilizing gas to be blown away by the glass ingredient of gasification, the kind of the gas used is not particularly limited, but owing to being used by the periphery of the part of LASER HEATING at glass substrate, therefore preferably uses non-combustible gas.Specifically, the such as rare gas element such as nitrogen, argon gas, air etc. can be used.In addition, in this situation, in order to prevent the displacement of the position of glass substrate, the mode preferably not contacting glass substrate according to gas supplies.
Then, refrigerating work procedure is described.
Refrigerating work procedure is following operation: after irradiating laser, the irradiation area of glass substrate and/or laser is moved, thus, the laser irradiating part (having irradiated the part of laser) after laser radiation is away from the irradiation area of laser, and the periphery of laser irradiating part is cooled.
In refrigerating work procedure, as shown in Figure 2, the periphery 22 of laser irradiating part (irradiated laser in heating process and gasify part) 21 is cooled.During cooling, separating out on glass baseplate surface (surface of glass substrate and/or another surface) with the form of the precipitate 31 of approximate wire as shown in Figure 3 sometimes at least partially of this periphery 22.Infer that this is because the thermal conductivity of glass is low, thus after heating process, in refrigerating work procedure, produce thermograde in this periphery 22, therefore, make being excluded at least partially and separating out on glass substrate of periphery 22 due to the stress produced in this periphery 22.It should be noted that, in figure, precipitate 31 separates out the upper surface (surface) to glass substrate, but also separates out sometimes to lower surface (another surface) side.Like this, the cut surface obtained from irradiating laser at least partially of the periphery 22 of laser irradiating part is excluded, and therefore finally can obtain uniform cut surface.
In order to produce above-mentioned precipitate thus obtain uniform cut surface in refrigerating work procedure, preferably cool with the periphery of suitable speed of cooling to laser irradiating part.This speed of cooling can be changed by the translational speed of the irradiation area of laser relative to glass substrate.Therefore, preferably preliminary experiment etc. is carried out, according to producing the mode of above-mentioned precipitate to select the translational speed of irradiation area relative to glass substrate of laser in refrigerating work procedure.
The precipitate 31 produced in refrigerating work procedure also hinders cooling sometimes, therefore, preferably generation is removed at the precipitate of the periphery of laser irradiating part.As the means of this precipitate of removing, be not particularly limited, such as can by utilizing gas to blow away, aspirating removing, utilizing the methods such as brush or baffle plate etc. remove to remove simply.
In addition, when utilizing gas to be blown away by precipitate, waiting to not apply vibration to glass substrate the cutting accuracy consequently affecting glass substrate, preferably using the gas of low pressure.
Refrigerating work procedure is the operation cooled the periphery 22 of the laser irradiating part after laser radiation as mentioned above, does not limit its cooling temperature.Such as, preferably after the heating of laser irradiating part, the periphery of laser irradiating part is cooled to below second-order transition temperature.
Now, when utilizing the temperature of periphery atmosphere to cool after heating process, peripheral temperature is preferably at least below second-order transition temperature, is preferably less than 100 DEG C, is particularly preferably less than 40 DEG C.It should be noted that, said peripheral temperature is at least the temperature of the periphery of the part of having carried out refrigerating work procedure herein, preferably comprises the temperature of the periphery of the glass substrate entirety of cutting.
Above, the cutting method of glass substrate of the present invention is illustrated, in the cutting method of this glass substrate, assist gas is not jetted on glass substrate, therefore, it is possible to suppress the displacement of the position of glass substrate, cutting processing can be carried out with good precision to glass substrate.In addition, glass substrate can be suppressed to crack when cutting, the uniform cut surface of surface property can be formed.
The cutting method of hereto illustrated glass substrate is applied in the manufacturing process of glass substrate, the manufacture method of the glass substrate of the cutting method employing this glass substrate can be obtained.
In the manufacture method of this glass substrate, cutting processing can be carried out to glass substrate with good precision, can glass substrate be suppressed to crack when cutting, uniform cut surface can be formed, therefore, it is possible to the fabrication yield obtaining glass substrate improves, the milling time of cut surface in grinding step shortens or omits the effect of grinding step.
Embodiment
Below, enumerate specific embodiment to be described, but the present invention is not limited to these embodiments.
[experimental example 1]
In this experimental example, the change energy density of laser, the irradiation area of laser carry out glass-cutting substrate relative to the translational speed of glass substrate, evaluate the cut surface of the glass substrate after cutting.
When the cutting of glass substrate, by the formation shown in Fig. 1, for the glass substrate (Asahi Glass Co., Ltd manufacture, trade(brand)name: AN100) of alkali-free borosilicate glass comprising vertical 100mm, horizontal 100mm, thickness of slab 0.1mm, while with predetermined transfer rate conveying glass substrate, along predetermined cuts line with spot diameter for about 0.3mm and the mode reaching predetermined energy density irradiate and use CO
2the laser of laser apparatus.When cutting, the peripheral temperature (envrionment temperature) of glass substrate is room temperature (25 DEG C).
For the glass substrate after cutting, the average evaluation that cannot cut off is C; Though will be able to cut off do not observe precipitate in the part of irradiating laser, be uneven by the result of visual confirmation cut surface, or the average evaluation creating crackle in glass substrate is B.Can breaking glass substrate and be A by the visual average evaluation can confirming as uniform cut surface.Show the result in table 1 and Fig. 4.Fig. 4 is a figure part for the result of table 1 mapping obtained.
Table 1
In the figure shown in Fig. 4, straight line X is following straight line: the translational speed (in this case the transfer rate of glass substrate) of the irradiation area of laser relative to glass substrate is being set to v (m/ hour), the energy density of above-mentioned laser is set to E (W/mm
2), when the thickness of slab of glass substrate being set to t (mm), E=50 × t × v.
Further, straight line Y show to create in refrigerating work procedure precipitate, the irradiation area of laser relative to the minimum value of the translational speed (in this case the transfer rate of glass substrate) of glass substrate, be 144 (m/ hour) in this situation.
Evaluate in the scope being distributed in and being surrounded by straight line X and straight line Y according to Fig. 4, A, obtain C when energy density is less than straight line X and evaluate, obtain B when transfer rate is slower than straight line Y and evaluate.
Think that its reason is, first, with regard to each laser irradiation area relative to glass substrate translational speed (transfer rate of glass substrate) with regard to, when irradiation energy density is the laser of more than straight line X, can by the irradiation area of laser, be positively heated to more than the temperature of glass generating gasification from the laser irradiating part on surface to another surface of glass substrate.
In addition, thinking that its reason is also, is the transfer rate of more than straight line Y by making transfer rate, the periphery of the laser irradiating part after laser radiation fully can be cooled, can get rid of from cut surface part with the form of precipitate, therefore, it is possible to form the uniform cut surface of surface property.
Namely, think: in the glass substrate obtaining C evaluation, sufficient laser energy cannot be given relative to the translational speed (transfer rate of glass substrate) of glass substrate with the irradiation area of laser, in the irradiation area of laser, the part till another surface of glass substrate cannot be heated to more than the temperature of glass generating gasification (cannot heat up fully in the scope in the whole thickness of slab direction of glass substrate).Therefore, glass substrate cannot cut off by supposition.
In addition, in the glass substrate obtaining B evaluation, the laser of sufficient energy density can be irradiated relative to the translational speed (transfer rate of glass substrate) of glass substrate with the irradiation area of laser, therefore, it is possible to carry out the cutting of glass substrate.
But, infer that the reason obtaining B evaluation is, the irradiation area of laser is insufficient relative to the translational speed (transfer rate of glass substrate) of glass substrate, the speed of cooling of the periphery of the laser irradiating part after laser radiation slows down, this periphery is not excluded with the form of precipitate and left behind, and cut surface does not become even.Or infer: when the temperature of the periphery of the laser irradiating part after making laser radiation by conveying glass substrate cools, do not reach desired speed of cooling, therefore, create crackle at cut surface and periphery thereof.
On the other hand, think: the glass substrate that A evaluates suitably can have selected the energy density of laser relative to the translational speed (transfer rate of glass substrate) of glass substrate according to the irradiation area of laser.Therefore think, in the irradiation area of laser, be heated to more than the temperature of glass generating gasification from a surface of glass substrate to another surface.In addition think, because the transfer rate of glass substrate is suitable, therefore, the periphery of the laser irradiating part after laser radiation cools with suitable speed of cooling, the periphery of the laser irradiating part after this laser radiation is excluded with the form of precipitate, thus obtains uniform cut surface.
[experimental example 2]
In this experimental example, be except 0.2mm except making the thickness of slab carrying out the glass substrate cut, change the energy density of laser in the same manner as experimental example 1, the irradiation area of laser carrys out glass-cutting substrate relative to the translational speed of glass substrate, and the cut surface of the glass substrate after cutting is evaluated.
Show the result in table 2, Fig. 5.Fig. 5 is the figure mapping of the result of table 2 obtained.
Table 2
In the figure shown in Fig. 5, straight line X is also the straight line of above-mentioned E=50 × t × v (t=0.2mm).
In addition, straight line Y show to create in refrigerating work procedure precipitate, the irradiation area of laser relative to the minimum value of the translational speed (in this case the transfer rate of glass substrate) of glass substrate, be 144 (m/ hour) in this situation.
Thus, can confirm that A evaluates to be distributed in by the scope of straight line X and straight line Y encirclement.
[experimental example 3]
In this experimental example, be except 0.3mm except making the thickness of slab carrying out the glass substrate cut, change the energy density of laser in the same manner as experimental example 1, the irradiation area of laser carrys out glass-cutting substrate relative to the translational speed of glass substrate, and the cut surface of the glass substrate after cutting is evaluated.
Show the result in table 3, Fig. 6.Fig. 6 is the figure mapping of the result of table 3 obtained.
Table 3
In the figure shown in Fig. 6, straight line X is also the straight line of above-mentioned E=50 × t × v (t=0.3mm).
In addition, straight line Y show to create in refrigerating work procedure precipitate, the irradiation area of laser relative to the minimum value of the translational speed (in this case the transfer rate of glass substrate) of glass substrate, be 144 (m/ hour) in this situation.
In this experimental example, do not change the transfer rate of glass substrate and the energy density changing irradiated laser to carry out the cutting of glass substrate.Thus, when making energy density be greater than straight line X in the energy density increasing laser, in the irradiation area of laser, laser irradiating part can be heated to more than the temperature of glass generating gasification from of a glass substrate surface to another surface, can confirm that obtaining A evaluates.
[experimental example 4]
In this experimental example, be except 0.6mm except making the thickness of slab carrying out the glass substrate cut, change the energy density of laser in the same manner as experimental example 1, the irradiation area of laser carrys out glass-cutting substrate relative to the translational speed of glass substrate, and the cut surface of the glass substrate after cutting is evaluated.
Show the result in table 4, Fig. 7.Fig. 7 is the figure mapping of the result of table 4 obtained.
Table 4
In the figure shown in Fig. 7, straight line X is also the straight line of above-mentioned E=50 × t × v (t=0.6mm).
In addition, straight line Y show to create in refrigerating work procedure precipitate, the irradiation area of laser relative to the minimum value of the translational speed (in this case the transfer rate of glass substrate) of glass substrate, be 144 (m/ hour) in this situation.
In this experimental example, the energy density of the laser irradiated is lower than straight line X.Therefore think, sufficient laser energy cannot be given relative to the translational speed (transfer rate of glass substrate) of glass substrate with the irradiation area of laser, in the irradiation area of laser, the part till another surface of glass substrate cannot be heated to more than the temperature of glass substrate generating gasification.Therefore, thinking cannot breaking glass substrate, thus obtains C and evaluate.
Industrial applicability
The present invention may be used for the cutting method of various glass substrate and the manufacture method etc. of various glass substrate.
Based on the Japanese Patent Application 2013-004667 that the application submitted to Japan Office by June 28th, 2012 Japanese Patent Application 2012-145991 and 2013 submits to Japan Office 15, on January, require the right of priority that these are applied for, and with the form of reference, these full contents applied for are comprised in the present invention.
Label declaration
11 glass substrates
12 laser
21 laser irradiating parts
The periphery of 22 laser irradiating parts
31 precipitates
Claims (7)
1. a cutting method for glass substrate, is cut glass substrate by irradiating laser, and the feature of the cutting method of described glass substrate is,
The irradiation area of the laser of described laser is heated to more than the temperature of the laser irradiating part generating gasification on surface to another surface made from described glass substrate by a surface irradiation to described glass substrate,
The irradiation area of described laser is moved along the predetermined cuts line of described glass substrate relative to described glass substrate.
2. the cutting method of glass substrate as claimed in claim 1, wherein, the periphery of described laser irradiating part is cooled to below second-order transition temperature after the heating of described laser irradiating part.
3. the cutting method of glass substrate as claimed in claim 1 or 2, wherein, is being set to v (m/ hour) by described laser-irradiated domain relative to the translational speed of glass substrate, the energy density of described laser is being set to E (W/mm
2), when the thickness of slab of glass substrate being set to t (mm), meet following relation:
E≥50×t×v。
4. the cutting method of the glass substrate according to any one of claims 1 to 3, wherein, by the removing of the glass ingredient of the described laser irradiating part after gasification.
5. the cutting method of the glass substrate according to any one of Claims 1 to 4, wherein, removes generation at the precipitate of the periphery of described laser irradiating part.
6. the cutting method of the glass substrate according to any one of Claims 1 to 5, wherein, the thickness of slab of described glass substrate is below 3.0mm.
7. a manufacture method for glass substrate, it uses the cutting method of the glass substrate according to any one of claim 1 ~ 6.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012145991 | 2012-06-28 | ||
| JP2012-145991 | 2012-06-28 | ||
| JP2013-004667 | 2013-01-15 | ||
| JP2013004667 | 2013-01-15 | ||
| PCT/JP2013/065194 WO2014002685A1 (en) | 2012-06-28 | 2013-05-31 | Glass-substrate-cutting method and glass-substrate production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104364208A true CN104364208A (en) | 2015-02-18 |
| CN104364208B CN104364208B (en) | 2017-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380030915.0A Expired - Fee Related CN104364208B (en) | 2012-06-28 | 2013-05-31 | The cutting method of glass substrate and the manufacture method of glass substrate |
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| Country | Link |
|---|---|
| JP (1) | JP6206406B2 (en) |
| KR (1) | KR20150035577A (en) |
| CN (1) | CN104364208B (en) |
| TW (1) | TWI603801B (en) |
| WO (1) | WO2014002685A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110573465A (en) * | 2017-07-31 | 2019-12-13 | 日本电气硝子株式会社 | Method for producing glass film |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6579040B2 (en) * | 2016-05-31 | 2019-09-25 | 日本電気硝子株式会社 | Manufacturing method of glass roll |
| JP2018024536A (en) * | 2016-08-08 | 2018-02-15 | 日本電気硝子株式会社 | Method for cutting belt-like glass film |
| KR102410719B1 (en) | 2017-02-07 | 2022-06-20 | 니폰 덴키 가라스 가부시키가이샤 | Method for manufacturing glass film |
| WO2024042887A1 (en) * | 2022-08-25 | 2024-02-29 | 日本電気硝子株式会社 | Glass sheet production method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57209838A (en) * | 1981-04-01 | 1982-12-23 | Kurieiteibu Gurasuwaakusu Inte | Laser glass cutting method and product made thereby |
| WO2006070825A1 (en) * | 2004-12-28 | 2006-07-06 | Mitsuboshi Diamond Industrial Co., Ltd. | Method for cutting brittle material substrate and substrate cutting system |
| JP2008247038A (en) * | 2008-05-24 | 2008-10-16 | Lemi Ltd | Method for fully cutting brittle material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000263277A (en) * | 1999-03-16 | 2000-09-26 | Hitachi Cable Ltd | Method and device for working of non-metal material |
-
2013
- 2013-05-31 JP JP2014522495A patent/JP6206406B2/en not_active Expired - Fee Related
- 2013-05-31 KR KR20147034251A patent/KR20150035577A/en not_active Application Discontinuation
- 2013-05-31 WO PCT/JP2013/065194 patent/WO2014002685A1/en active Application Filing
- 2013-05-31 CN CN201380030915.0A patent/CN104364208B/en not_active Expired - Fee Related
- 2013-06-07 TW TW102120419A patent/TWI603801B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57209838A (en) * | 1981-04-01 | 1982-12-23 | Kurieiteibu Gurasuwaakusu Inte | Laser glass cutting method and product made thereby |
| WO2006070825A1 (en) * | 2004-12-28 | 2006-07-06 | Mitsuboshi Diamond Industrial Co., Ltd. | Method for cutting brittle material substrate and substrate cutting system |
| JP2008247038A (en) * | 2008-05-24 | 2008-10-16 | Lemi Ltd | Method for fully cutting brittle material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110573465A (en) * | 2017-07-31 | 2019-12-13 | 日本电气硝子株式会社 | Method for producing glass film |
| CN110573465B (en) * | 2017-07-31 | 2022-04-12 | 日本电气硝子株式会社 | Method for producing glass film |
| CN114573224A (en) * | 2017-07-31 | 2022-06-03 | 日本电气硝子株式会社 | Method for producing glass film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104364208B (en) | 2017-12-12 |
| JPWO2014002685A1 (en) | 2016-05-30 |
| JP6206406B2 (en) | 2017-10-04 |
| KR20150035577A (en) | 2015-04-06 |
| TW201404516A (en) | 2014-02-01 |
| TWI603801B (en) | 2017-11-01 |
| WO2014002685A1 (en) | 2014-01-03 |
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