TWI603801B - Method of cutting glass substrate and method of manufacturing glass substrate - Google Patents

Description

Method for cutting glass substrate and method for manufacturing glass substrate

The present invention relates to a method of cutting a glass substrate and a method of manufacturing a glass substrate.

As a method of cutting a glass substrate, a method of cutting using laser light has been studied.

For example, Patent Document 1 discloses a method of cutting a glass substrate by performing a forced cooling using a compressed gas or the like immediately after forming a slit recess having a specific depth by irradiating laser light.

Further, Patent Document 2 discloses a method of cutting a glass substrate by scanning and irradiating a laser beam with a laser beam, melting the glass with respect to the portion irradiated with the laser light, and blowing the molten glass with an assist gas.

However, according to the cutting method of the glass substrate disclosed in Patent Document 1, the cut surface includes a portion corresponding to the notch recess formed by irradiating the laser light, and is formed in the slit when forced cooling is performed thereafter. The part of the lower part of the recess has different surface characteristics.

In the case where the surface characteristics differed by the cutting method in the cut surface as described above, in order to form a product, it is necessary to polish the cut surface to form a cut surface having uniform surface characteristics. Therefore, it takes time for the grinding step of the cut surface.

Further, since it is necessary to blow the compressed gas (assist gas) to the glass substrate immediately after the irradiation of the laser light, the position of the glass substrate is likely to be displaced and the cutting accuracy is lowered.

According to the method for cutting a glass substrate disclosed in Patent Document 2, there is a problem in that the position of the glass substrate is displaced by the pressure of the assist gas, and the accuracy at the time of cutting is lowered. Further, there is a case where the amount of thermal deformation of the local glass is increased due to the energy density of the laser light, and cracking occurs in the glass substrate. Further, since the molten glass removed by the assist gas adheres and solidifies to the cut surface and its periphery, it takes time to remove the molten glass in the polishing step.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-059328

Patent Document 2: Japanese Patent Laid-Open Publication No. SHO 60-251138

An object of the present invention is to provide a glass substrate capable of accurately cutting a glass substrate as compared with a method of cutting a glass substrate to which the auxiliary gas is blown to the glass substrate in view of the above-described problems of the prior art. Break method.

In order to solve the above problems, the present invention provides a method for cutting a glass substrate, which is characterized in that it is irradiated with laser light to cut a glass substrate, and the laser light is irradiated onto one surface of the glass substrate. In the irradiation region, heating is performed at a temperature higher than a temperature at which the laser beam irradiated from one surface of the glass substrate to the other surface is vaporized, and the irradiation region of the laser light is along the line to cut of the glass substrate. The glass substrate moves relatively.

According to the method for cutting a glass substrate of the present invention, the glass substrate can be cut accurately with respect to the method of cutting a glass substrate using the auxiliary gas.

11‧‧‧ glass substrate

12‧‧‧Laser light

13‧‧‧ cut the booking line

14‧‧‧A zone that has been exposed to laser light

15‧‧‧Laser light irradiation after laser irradiation

21‧‧‧Laser Light Irradiation Department

22‧‧‧The peripheral part of the laser irradiation unit

23‧‧‧Removal of components of vaporized glass components

31‧‧‧Precipitation

A‧‧‧ arrow

Fig. 1 is an explanatory view showing a method of cutting a glass substrate according to an embodiment of the present invention.

Fig. 2 is an explanatory view showing a heating step in a method of cutting a glass substrate according to an embodiment of the present invention.

Fig. 3 is an explanatory view showing a cooling step in a method of cutting a glass substrate according to an embodiment of the present invention.

Fig. 4 is an explanatory view showing the relationship between the transport speed of the glass substrate of Experimental Example 1 and the energy density of the laser light and the evaluation of the cut surface.

Fig. 5 is an explanatory view showing the relationship between the transport speed of the glass substrate of Experimental Example 2 of the present invention and the energy density of the laser light and the evaluation of the cut surface.

Fig. 6 is an explanatory view showing the relationship between the transport speed of the glass substrate of Experimental Example 3 of the present invention and the energy density of the laser light and the evaluation of the cut surface.

Fig. 7 is an explanatory view showing the relationship between the transport speed of the glass substrate of Experimental Example 4 of the present invention and the energy density of the laser light and the evaluation of the cut surface.

In the following, the embodiments of the present invention are described with reference to the drawings, but the present invention is not limited to the embodiments described below, and various modifications and substitutions may be made to the embodiments described below without departing from the scope of the invention.

In the present embodiment, a method of cutting a glass substrate of the present invention will be described.

The method for cutting a glass substrate of the present invention is a method of irradiating laser light to cut a glass substrate, and has the following configuration.

In a region where the laser beam is irradiated with laser light on one surface of the glass substrate, it is heated to a temperature higher than a temperature at which the laser beam irradiated from one surface of the glass substrate to the other surface is vaporized.

Further, the method for cutting a glass substrate according to the present invention is characterized in that the irradiation region of the laser light is relatively moved with respect to the glass substrate along a line to cut of the glass substrate.

The details will be described using FIG. 1 to FIG. 3 .

FIG. 1 schematically shows a configuration in which the glass substrate is cut by the cutting method of the glass substrate of the present invention from the upper surface of the glass substrate on the side (one surface side) of the irradiated laser light.

The glass substrate 11 is conveyed in the direction indicated by the arrow A in Fig. 1, so that the portion (the irradiation region of the laser light) irradiated by the laser light 12 emitted from the laser oscillation device (not shown) can be along the glass substrate. The cut line 13 is moved.

In Fig. 1, in the portion (the irradiation region of the laser light) irradiated by the laser light 12, the laser light irradiation portion from one surface to the other surface of the glass substrate is heated (heating step). Then, the region 14 to which the laser light has been irradiated is moved away from the irradiation region of the laser light by the glass substrate 11, and the peripheral portion of the laser light irradiation portion (the portion that irradiates the laser light to vaporize the glass) after the laser light is irradiated is irradiated. It is cooled (cooling step).

In addition, in FIG. 1, the glass substrate 11 is conveyed, and the part irradiated with the laser beam 11 on the glass substrate 11 (the irradiation area of the laser light) is shifted, but as long as it can be cut along It is only necessary to illuminate the laser beam 12 by the predetermined line, and is not limited to this form. For example, by irradiating the glass substrate 11 and adjusting and operating the optical system on the optical path of the laser light between the laser oscillating device and the glass substrate, the portion irradiated by the laser light 12 (laser light) The position of the illumination area is shifted. It is also possible to transport the glass substrate 11 and also to shift the position of the portion irradiated by the laser light 12.

Further, for convenience of explanation, the line to cut 13 for the glass substrate is shown in the drawing, but the line is not provided on the glass substrate. Further, the line to be cut is not limited to a straight line, and may be an arbitrary line such as a curve depending on the shape of the glass substrate to be cut after the required cutting.

The composition of the glass substrate to which the glass substrate cutting method of the present invention can be applied is not particularly limited, and can be applied to various glass substrates. Examples thereof include alkali-free borosilicate glass, borosilicate glass, soda lime glass, sorghum glass, and other oxide-based glass containing cerium oxide as a main component.

Further, the thickness of the glass substrate is also not particularly limited.

However, when the glass substrate is irradiated with laser light and heated, the laser light irradiation portion from one surface side to the other surface of the glass substrate, that is, the entire thickness direction of the glass substrate is heated in the irradiation region of the laser light. Above the temperature at which the glass is vaporized. Therefore, it is preferable to select the thickness of the glass substrate in accordance with the output of the laser oscillation device or the like. For example, the thickness of the glass substrate is preferably 3.0 mm or less, more preferably 1.0 mm or less, still more preferably 0.5 mm or less, and particularly preferably 0.2 mm or less. The lower limit of the glass substrate is not particularly limited as long as it is greater than zero (0).

Further, the shape of the glass substrate shown in FIG. 1 is a rectangle, but the shape of the glass substrate is not particularly limited. For example, it may be a strip-shaped glass substrate formed by a glass substrate forming apparatus such as a float method or a down-draw method.

Next, a heating step performed in the irradiation region of the laser light (the portion irradiated with the laser light to the glass substrate) will be described. Fig. 2 is a schematic view showing a cross-sectional view taken at line BB' of the irradiation region of the laser light of Fig. 1.

In the method of cutting a glass substrate of the present invention, the glass substrate is irradiated with the laser light 12 in the above manner, and the heating step is performed in the irradiation region of the laser light.

The laser light irradiation portion 21 from one surface of the glass substrate to the other surface of the glass substrate is heated to a temperature higher than the vaporization temperature of the glass in the irradiation region of the laser light of the glass substrate. Here, the surface of one of the glass substrates refers to the surface on the incident side of the laser light, and the other surface refers to the opposite surface. Therefore, in the laser beam irradiation unit 21, the glass is vaporized, and a through hole is formed in the irradiation direction of the laser light (the thickness direction of the glass substrate) in a short time.

Further, the peripheral portion 22 of the laser beam irradiation unit 21 is also heated by heat transfer from the laser beam irradiation unit.

In this manner, after the heating step and immediately after the irradiation, that is, when the laser beam is irradiated (when the glass is vaporized) and immediately after the laser beam is irradiated, the auxiliary gas (the auxiliary gas is not used) can be blown to the laser light irradiation unit in a short time. The glass is vaporized by the laser light irradiation portion. Therefore, it is possible to perform processing with high precision without causing a positional shift of the glass substrate or the like, and it is possible to suppress the glass base. The crack in the board is produced.

The irradiation conditions of the laser light in the heating step are not limited, and may be applied to the surface of one of the glass substrates (the surface on the incident side of the laser light) to the other surface side in the laser light irradiation region of the glass substrate. The light irradiation unit may be heated to a temperature higher than or equal to the vaporization temperature of the glass.

Specifically, the laser beam irradiation unit can be used depending on, for example, the thickness of the glass substrate as the object to be cut, the glass composition, the transport speed of the glass substrate (the relative movement speed of the irradiation region of the laser light with respect to the glass substrate), and the like. The energy density of the laser light or the like may be selected by heating as described above. For example, it can be calculated by performing a preliminary test in advance.

In particular, the relative movement speed of the irradiation region of the laser light with respect to the glass substrate is set to v (m/hour), the energy density of the laser light is set to E (W/mm ² ), and the thickness of the glass substrate is set. In the case of t (mm), it is preferable to adjust the energy density of the irradiated laser light so as to satisfy the relationship of E ≧ 50 × t × v.

By performing the cutting of the glass substrate including the heating step while satisfying the predetermined condition, it is possible to surely irradiate the laser light from one surface of the glass substrate to the other surface of the glass substrate in the irradiation region of the laser light. The part is heated to a temperature above the vaporization of the glass.

The spot diameter of the laser light irradiated onto the glass substrate (the beam diameter of the laser light on one surface of the glass substrate) is not limited, and can be selected according to the required processing precision or the like.

Further, the type of the laser to be used is not particularly limited, and the glass substrate may be heated by irradiating the glass substrate with the emitted laser light. Specifically, for example, a CO ₂ laser, a pseudo-molecular laser, a copper vapor deposition laser, a YAG (Yttrium Aluminum Garnet) laser, or the like can be used.

In the heating step, the glass substrate is irradiated with the laser light in the above manner, and the glass is vaporized for the laser light irradiation portion. Therefore, a vaporized glass component (gas) is generated in the laser light irradiation portion and its periphery. If the component is on a laser disposed on the light path of the laser beam When the surface of an optical system such as a lens or a mirror of an oscillating device is deposited or adhered, there is a case where laser light cannot be irradiated with sufficient energy to the glass substrate, or a laser beam cannot be irradiated to a desired position, and the glass is provided. The processing accuracy of the substrate and the like are affected. Therefore, it is preferable to remove the vaporized glass component by irradiating the glass substrate with laser light. That is, in the heating step, it is preferable to remove the glass component of the vaporized irradiation portion of the above-described laser light. The member for removing the vaporized glass component is not particularly limited, and a mechanism for sucking the vaporized glass component or a mechanism for blowing the vaporized glass component with a gas may be used. The arrangement may be selected according to the member to be used, as long as the heating step is not hindered, and the vaporized glass component can be removed before being attached to a lens, a mirror, or the like disposed on the optical path of the laser light. The configuration can be. For example, in FIG. 2, as indicated by 23, it is conceivable to arrange in the vicinity of the portion irradiated by the laser light.

Further, in the case of using a mechanism for blowing a vaporized glass component by a gas, the type of the gas to be used is not particularly limited, but since it is used in the periphery of a portion of the glass substrate heated by the laser light, It is preferred to use a non-combustible gas. Specifically, an inert gas such as nitrogen or argon, or air or the like can be used. Further, in this case, in order to prevent displacement of the position of the glass substrate, it is preferable to supply the gas so as not to collide with the glass substrate.

Next, the cooling step will be described.

The cooling step is such that after irradiating the laser light, the laser light irradiating portion (the portion irradiated with the laser light) after the laser light is irradiated is moved away from the laser light by moving the irradiation region of the glass substrate and/or the laser light. The region is irradiated to cool the peripheral portion of the laser beam irradiation portion.

In the cooling step, as shown in FIG. 2, the peripheral portion 22 of the laser light irradiation portion (the portion which is vaporized by irradiating the laser light in the heating step) 21 is cooled. At the time of cooling, as shown in FIG. 3, at least a part of the peripheral portion 22 is deposited as a substantially linear precipitate 31 on the surface of the glass substrate (one surface and/or the other surface of the glass substrate). Inferred that it is due to glass Since the thermal conductivity of the glass is low, a temperature gradient is generated in the peripheral portion 22 in the cooling step after the heating step, so that the peripheral portion 22 is placed on the glass substrate by the stress generated in the peripheral portion 22. At least part of it is excluded and precipitated. Further, in the figure, the precipitate 31 is deposited on the upper surface (one surface) of the glass substrate, but there is also a case where it is deposited on the lower surface (the other surface) side. In this manner, since at least a part of the peripheral portion 22 of the laser light irradiation portion is excluded from the cut surface obtained by irradiating the laser light, a uniform cut surface can be finally obtained.

In the cooling step, in order to obtain a uniform cut surface in order to generate the precipitate, it is preferable to cool the peripheral portion of the laser light irradiation portion at an appropriate cooling rate. The cooling rate may vary depending on the relative moving speed of the irradiated area of the laser light with respect to the glass substrate. Therefore, it is preferable to select the relative moving speed of the irradiation region of the laser light with respect to the glass substrate so as to perform the preliminary test or the like and generate the precipitate in the cooling step.

Since the precipitate 31 generated in the cooling step is also inhibited from cooling, it is preferable to remove the precipitate generated in the peripheral portion of the laser beam irradiation portion. The means for removing the precipitate is not particularly limited, and can be easily removed by, for example, gas blowing, suction removal, removal by a brush or a separator, or the like.

In the case where the precipitate is blown off by the gas, it is preferable to use a gas having a low pressure in order to prevent the glass substrate from vibrating or the like, thereby affecting the cutting accuracy of the glass substrate.

The cooling step is performed by cooling the peripheral portion 22 of the laser beam irradiation portion after the laser light is irradiated as described above, and the cooling temperature is not limited. For example, it is preferable that the peripheral portion of the laser beam irradiation portion is cooled to a temperature below the glass transition temperature after heating of the laser beam irradiation portion.

In this case, when cooling is performed by the temperature of the surrounding atmosphere after the heating step, the peripheral temperature is preferably at least the glass transition temperature, preferably 100 ° C or lower, and particularly preferably 40 ° C or lower. Here, the term "peripheral temperature" as used herein means a temperature around the portion where at least the cooling step is performed, and preferably includes a temperature around the entire glass substrate to be cut.

The method for cutting the glass substrate of the present invention has been described above. In the method for cutting the glass substrate, since the auxiliary gas is not blown to the glass substrate, the displacement of the position of the glass substrate can be suppressed, and the glass substrate can be accurately adjusted. The glass substrate is cut. Moreover, the occurrence of cracks in the glass substrate can be suppressed at the time of cutting, and a cut surface having uniform surface characteristics can be obtained.

The method of cutting a glass substrate described above is applied to a manufacturing step of a glass substrate, and can be a method of producing a glass substrate using the method for cutting the glass substrate.

In the method for producing a glass substrate, since the glass substrate can be cut accurately, and cracking in the glass substrate during cutting can be suppressed, a uniform cut surface can be obtained, and thus it is possible to obtain a uniform cut surface. The effect of improving the manufacturing yield of the glass substrate, shortening the polishing time of the cut surface in the polishing step, or omitting the polishing step.

Example

The specific examples are described below, but the present invention is not limited to the examples.

[Experimental Example 1]

In the present experimental example, the energy density of the laser light and the relative moving speed of the irradiation region of the laser light with respect to the glass substrate were changed to cut the glass substrate, and the cut surface of the cut glass substrate was evaluated.

When the glass substrate is cut, a glass substrate containing an alkali-free borosilicate glass having a length of 100 mm, a width of 100 mm, and a thickness of 0.1 mm (manufactured by Asahi Glass Co., Ltd., trade name: AN100) is used as shown in Fig. 1 . While the glass substrate is conveyed at a specific conveyance speed, the laser beam using the CO ₂ laser is irradiated with a spot diameter of about 0.3 mm along a line to cut, and the specific energy density is achieved. The ambient temperature (ambient temperature) of the glass substrate at the time of cutting was room temperature (25 ° C).

In the glass substrate after the cutting, the cut surface was evaluated as C, and the cut surface was not observed in the portion irradiated with the laser, and the cut surface was visually confirmed. It was found that B was not uniform or cracked on the glass substrate. A person who can cut the glass substrate and can visually confirm that it is a uniform cut surface is evaluated as A. The results are shown in Table 1 and Figure 4. Figure 4 is a graphical representation of one of the results of Table 1.

In the graph shown in FIG. 4, the straight line X is obtained by setting the relative moving speed of the irradiation region of the laser light to the glass substrate (here, the transport speed of the glass substrate) to v (m/hour), and the laser light is used. When the energy density is E (W/mm ² ) and the thickness of the glass substrate is t (mm), a straight line of E = 50 × t × v is obtained.

Further, the straight line Y indicates the minimum value of the relative moving speed of the irradiation region of the laser light having the precipitate in the cooling step with respect to the glass substrate (here, the transport speed of the glass substrate), which is 144 (m/hr). ).

According to FIG. 4, an A evaluation is distributed in a range surrounded by the straight line X and the straight line Y, and C is evaluated when the energy density is smaller than the straight line X, and B is evaluated when the transport speed is slower than the straight line Y.

The reason is considered to be that, first, the relative movement speed of the irradiation region of each of the laser beams with respect to the glass substrate (the transport speed of the glass substrate) is irradiated with a straight line X or more. In the case of laser light of energy density, the laser light irradiation portion from one surface of the glass substrate to the other surface in the irradiation region of the laser light can be surely heated to a temperature higher than the vaporization temperature of the glass.

In addition, it is considered that the peripheral portion of the laser beam irradiation portion after the laser beam irradiation is sufficiently cooled by the conveyance speed of the line Y or more, and is excluded from the cut surface portion in the form of precipitates. Therefore, it is possible to produce a cut surface having uniform surface characteristics.

In other words, in the glass substrate to be evaluated by C, it is considered that the relative movement speed of the irradiation region of the laser light with respect to the glass substrate (the transport speed of the glass substrate) cannot provide sufficient energy of the laser light, and for the irradiation region of the laser beam, It is not possible to heat up to the temperature at which the glass is vaporized to the other surface of the glass substrate (the temperature cannot be sufficiently increased in the entire thickness direction of the glass substrate). Therefore, it is estimated that the glass substrate cannot be cut.

In addition, the glass substrate to be evaluated by B can be irradiated with laser light having a sufficient energy density with respect to the relative moving speed of the irradiation region of the laser light to the glass substrate (the transport speed of the glass substrate), so that the glass substrate can be cut. Broken.

However, it is estimated that the relative moving speed of the irradiation region of the laser light with respect to the glass substrate (the transport speed of the glass substrate) is insufficient, and the cooling rate of the peripheral portion of the laser beam irradiated portion after the laser light irradiation is slow, and the peripheral portion is not precipitated. The matter is removed and remains, so that the cut surface becomes uneven. Alternatively, it is estimated that when the temperature of the peripheral portion of the laser beam irradiation portion after the laser beam irradiation is cooled by the conveyance of the glass substrate, cracking occurs in the cut surface and the periphery thereof because the cooling rate is not desired.

On the other hand, it is considered that the glass substrate of the A evaluation can appropriately select the energy density of the laser light in accordance with the relative moving speed of the irradiation region of the laser light with respect to the glass substrate (the transport speed of the glass substrate). Therefore, it is considered that the irradiation region of the laser light is heated from the surface of one of the glass substrates to the other surface to a temperature higher than the temperature at which the glass is vaporized. Further, since the conveyance speed of the glass substrate is appropriate, the peripheral portion of the laser beam irradiation portion after the laser beam irradiation is cooled at an appropriate cooling rate, and the peripheral portion of the laser beam irradiation portion after the laser beam irradiation is used as The precipitates are excluded so that a uniform cut surface can be obtained.

[Experimental Example 2]

In the present experimental example, the energy density of the laser light and the irradiation area of the laser light were changed with respect to the glass substrate in the same manner as in Experimental Example 1 except that the thickness of the glass substrate to be cut was set to 0.2 mm. The glass substrate was cut at a relative moving speed, and the cut surface of the cut glass substrate was evaluated.

The results are shown in Table 2 and Figure 5. Figure 5 is a graph showing the results of Table 2.

In the graph shown in Fig. 5, the straight line X is also a straight line which becomes the above E = 50 × t × v (t = 0.2 mm).

Further, the straight line Y indicates the minimum value of the relative moving speed of the irradiation region of the laser light having the precipitate in the cooling step with respect to the glass substrate (here, the transport speed of the glass substrate), and in this case, it is 144 (m/hr). ).

From this, it was confirmed that the A evaluation was distributed within the range surrounded by the straight line X and the straight line Y.

[Experimental Example 3]

In the present experimental example, the energy density of the laser light and the irradiation area of the laser light were changed with respect to the glass substrate in the same manner as in Experimental Example 1 except that the thickness of the glass substrate to be cut was set to 0.3 mm. The glass substrate was cut at a relative moving speed, and the cut surface of the cut glass substrate was evaluated.

The results are shown in Table 3 and Figure 6. Figure 6 is a graph showing the results of Table 3.

[table 3]

In the graph shown in Fig. 6, the straight line X is also a straight line which becomes the above E = 50 × t × v (t = 0.3 mm).

Further, the straight line Y indicates the minimum value of the relative moving speed of the irradiation region of the laser light having the precipitate in the cooling step with respect to the glass substrate (here, the transport speed of the glass substrate), and in this case, it is 144 (m/hr). ).

In this experimental example, the glass substrate was cut without changing the transport speed of the glass substrate and changing the energy density of the irradiated laser light. Accordingly, when the energy density of the laser light is increased to be greater than the energy density of the straight line X, the laser light irradiation portion can be heated to the glass gasification from one surface of the glass substrate to the other surface for the irradiation region of the laser light. Above the temperature, it was confirmed that it was an A evaluation.

[Experimental Example 4]

In the present experimental example, the energy density of the laser light and the irradiation area of the laser light were changed with respect to the glass substrate in the same manner as in Experimental Example 1 except that the thickness of the glass substrate to be cut was set to 0.6 mm. The glass substrate was cut at a relative moving speed, and the cut surface of the cut glass substrate was evaluated.

The results are shown in Table 4 and Figure 7. Figure 7 is a graph showing the results of Table 4.

In the graph shown in Fig. 7, the straight line X is also a straight line which becomes the above E = 50 × t × v (t = 0.6 mm).

Further, the straight line Y indicates the minimum value of the relative moving speed of the irradiation region of the laser light having the precipitate in the cooling step with respect to the glass substrate (here, the transport speed of the glass substrate), and in this case, it is 144 (m/hr). ).

In this experimental example, the energy density of the irradiated laser light is lower than the straight line X. Therefore, it is considered that the relative movement speed of the irradiation region of the laser light with respect to the glass substrate (the transport speed of the glass substrate) cannot provide sufficient energy of the laser light, and the irradiation region of the laser light cannot be used until the other of the glass substrate. The surface is heated to a temperature above the vaporization temperature of the glass substrate. Therefore, it is considered that the glass substrate cannot be cut and the C evaluation is performed.

[Industrial availability]

The present invention can be utilized in various methods for cutting glass substrates, various methods for producing glass substrates, and the like.

This application is based on the Japanese Patent Application No. 2012-145991 filed on June 28, 2012, and the Japanese Patent Application No. 2013- 004, PCT filed on Jan. 15, 2013. The priority of the application is incorporated herein by reference.

11‧‧‧ glass substrate

12‧‧‧Laser light

13‧‧‧ cut the booking line

14‧‧‧A zone that has been exposed to laser light

15‧‧‧Laser light irradiation after laser irradiation

A‧‧‧ arrow

Claims (8)

A method for cutting a glass substrate, wherein the glass substrate is irradiated with laser light, and the glass substrate is irradiated to the surface of the glass substrate by irradiation with the laser light of the laser light, and heated to the glass a temperature at which the surface of the substrate is vaporized by the portion irradiated to the other portion of the substrate; the temperature of the periphery of the glass substrate is 100° C. or less; and the irradiation region of the laser light is along the line to cut of the glass substrate. The glass substrate moves relatively. The method of cutting a glass substrate according to claim 1, wherein the peripheral portion of the laser light irradiation portion is cooled by the laser light irradiation portion and then cooled to a temperature lower than a glass transition temperature. A method of cutting a glass substrate according to claim 1 or 2, wherein the glass component of the vaporized irradiation portion of the laser light is removed. The method of cutting a glass substrate according to claim 1 or 2, wherein the precipitate generated in a peripheral portion of the laser light irradiation portion is removed. The method for cutting a glass substrate according to claim 1 or 2, wherein the glass substrate has a thickness of 3.0 mm or less. A method of cutting a glass substrate according to claim 1 or 2, wherein the linear precipitate is deposited on a peripheral portion of the laser light irradiation portion. The method for cutting a glass substrate according to claim 1 or 2, wherein the relative velocity of the irradiation region of the laser light with respect to the glass substrate is such that the precipitate is precipitated from a peripheral portion of the laser beam irradiated portion after the laser beam is irradiated. Provisions. A method of producing a glass substrate using the method of cutting a glass substrate according to claim 1 or 2.