TWI406828B - Method for processing brittle material substrates - Google Patents
Method for processing brittle material substrates Download PDFInfo
- Publication number
- TWI406828B TWI406828B TW097125517A TW97125517A TWI406828B TW I406828 B TWI406828 B TW I406828B TW 097125517 A TW097125517 A TW 097125517A TW 97125517 A TW97125517 A TW 97125517A TW I406828 B TWI406828 B TW I406828B
- Authority
- TW
- Taiwan
- Prior art keywords
- cooling
- substrate
- beam spot
- point
- temperature
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 152
- 239000000463 material Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000001816 cooling Methods 0.000 claims abstract description 178
- 238000009826 distribution Methods 0.000 claims description 37
- 239000003507 refrigerant Substances 0.000 claims description 33
- 230000008646 thermal stress Effects 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005336 cracking Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000008016 vaporization Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 16
- 208000037656 Respiratory Sounds Diseases 0.000 abstract 4
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 35
- 230000035882 stress Effects 0.000 description 28
- 238000010586 diagram Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000003672 processing method Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 238000002309 gasification Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007252093A JP5011048B2 (ja) | 2007-09-27 | 2007-09-27 | 脆性材料基板の加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200914385A TW200914385A (en) | 2009-04-01 |
| TWI406828B true TWI406828B (zh) | 2013-09-01 |
Family
ID=40515743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097125517A TWI406828B (zh) | 2007-09-27 | 2008-07-07 | Method for processing brittle material substrates |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5011048B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101135436B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN101396771B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI406828B (cg-RX-API-DMAC7.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011079690A (ja) * | 2009-10-06 | 2011-04-21 | Leo:Kk | 回折格子を用いた厚板ガラスのレーザ熱応力割断 |
| JP5281544B2 (ja) * | 2009-10-30 | 2013-09-04 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
| JP5558129B2 (ja) * | 2010-02-05 | 2014-07-23 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
| JP5558128B2 (ja) * | 2010-02-05 | 2014-07-23 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
| JP2011165766A (ja) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
| CN102343507A (zh) * | 2010-07-30 | 2012-02-08 | 信义汽车玻璃(深圳)有限公司 | 汽车玻璃附件安装定位方法 |
| TWI400137B (zh) * | 2010-12-17 | 2013-07-01 | Ind Tech Res Inst | 移除玻璃板材邊緣缺陷之裝置及其方法 |
| CN102643017B (zh) * | 2011-03-14 | 2014-09-10 | 京东方科技集团股份有限公司 | 非接触式裂片方法、设备及切割和裂片的方法、设备 |
| DE102012210527A1 (de) * | 2012-06-21 | 2013-12-24 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Diode und Diode |
| EP2918558B1 (en) * | 2012-11-09 | 2018-02-21 | Nippon Electric Glass Co., Ltd. | Initial crack formation method |
| KR20150084758A (ko) * | 2012-11-13 | 2015-07-22 | 니폰 덴키 가라스 가부시키가이샤 | 판 유리의 제조 방법 및 제조 장치 |
| CN104071974B (zh) * | 2014-06-20 | 2016-04-13 | 武汉先河激光技术有限公司 | 一种用于玻璃切割的激光设备及切割方法 |
| JP2016166120A (ja) * | 2015-03-06 | 2016-09-15 | 三星ダイヤモンド工業株式会社 | 積層基板の加工方法及びレーザ光による積層基板の加工装置 |
| CN113828941B (zh) * | 2021-10-15 | 2022-05-13 | 华中科技大学 | 一种基于复合材料微米级高速识别的加工方法及装置 |
| CN118649750B (zh) * | 2024-07-02 | 2026-06-19 | 江苏鑫华半导体科技股份有限公司 | 一种硅料破碎方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200602279A (en) * | 2004-02-02 | 2006-01-16 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus and scribing method employing scribing apparatus |
| TW200604118A (en) * | 2004-04-27 | 2006-02-01 | Mitsuboshi Diamond Ind Co Ltd | Method for forming vertical crack on brittle board and vertical crack forming apparatus |
| TWI248920B (en) * | 2003-03-21 | 2006-02-11 | Rorze Systems Corp | Apparatus for cutting glass plate |
| TW200613228A (en) * | 2004-06-21 | 2006-05-01 | Applied Photonics Inc | Device, system and method for cutting, cleaving or separating a substrate material |
| TWI277612B (en) * | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100300418B1 (ko) * | 1999-01-18 | 2001-09-22 | 김순택 | 비금속 재료의 절단방법 및 그 장치 |
| DE19952331C1 (de) * | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
| JP4390937B2 (ja) * | 1999-11-25 | 2009-12-24 | 三星ダイヤモンド工業株式会社 | ガラス板分割方法及び装置 |
| WO2003008352A1 (fr) * | 2001-07-18 | 2003-01-30 | Mitsuboshi Diamond Industrial Co., Ltd. | Dispositif et procede destines au traçage d'un substrat en materiau fragile |
| JP2004536759A (ja) * | 2001-07-25 | 2004-12-09 | ヴラディミア シュテファノヴィッチ コンドラテンコ | もろい非金属材料を切る方法 |
| JP2005536428A (ja) * | 2002-08-21 | 2005-12-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 脆性基板の切断方法 |
| KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
| US20080061043A1 (en) * | 2004-10-01 | 2008-03-13 | Masahiro Fujii | Scribing Method for Brittle Material and Scribing Apparatus |
| CN100475419C (zh) | 2004-10-25 | 2009-04-08 | 三星钻石工业股份有限公司 | 裂痕形成方法及裂痕形成装置 |
| JP2007055000A (ja) * | 2005-08-23 | 2007-03-08 | Japan Steel Works Ltd:The | 非金属材料製の被加工物の切断方法及びその装置 |
| JP2007090860A (ja) * | 2005-09-01 | 2007-04-12 | Shibaura Mechatronics Corp | 脆性材料の割断加工システム及びその方法 |
-
2007
- 2007-09-27 JP JP2007252093A patent/JP5011048B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-07 TW TW097125517A patent/TWI406828B/zh not_active IP Right Cessation
- 2008-07-24 KR KR1020080072120A patent/KR101135436B1/ko not_active Expired - Fee Related
- 2008-09-19 CN CN2008101491908A patent/CN101396771B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI277612B (en) * | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| TWI248920B (en) * | 2003-03-21 | 2006-02-11 | Rorze Systems Corp | Apparatus for cutting glass plate |
| TW200602279A (en) * | 2004-02-02 | 2006-01-16 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus and scribing method employing scribing apparatus |
| TW200604118A (en) * | 2004-04-27 | 2006-02-01 | Mitsuboshi Diamond Ind Co Ltd | Method for forming vertical crack on brittle board and vertical crack forming apparatus |
| TW200613228A (en) * | 2004-06-21 | 2006-05-01 | Applied Photonics Inc | Device, system and method for cutting, cleaving or separating a substrate material |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200914385A (en) | 2009-04-01 |
| KR101135436B1 (ko) | 2012-04-13 |
| KR20090032949A (ko) | 2009-04-01 |
| JP2009083119A (ja) | 2009-04-23 |
| JP5011048B2 (ja) | 2012-08-29 |
| CN101396771B (zh) | 2013-05-08 |
| CN101396771A (zh) | 2009-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |