JP5010875B2 - 洗浄装置及び洗浄方法 - Google Patents

洗浄装置及び洗浄方法 Download PDF

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Publication number
JP5010875B2
JP5010875B2 JP2006231293A JP2006231293A JP5010875B2 JP 5010875 B2 JP5010875 B2 JP 5010875B2 JP 2006231293 A JP2006231293 A JP 2006231293A JP 2006231293 A JP2006231293 A JP 2006231293A JP 5010875 B2 JP5010875 B2 JP 5010875B2
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JP
Japan
Prior art keywords
gas
cleaning
suction
pipe
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006231293A
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English (en)
Japanese (ja)
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JP2008053661A (ja
Inventor
剛 守屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2006231293A priority Critical patent/JP5010875B2/ja
Priority to US11/844,748 priority patent/US7913351B2/en
Priority to KR1020070085983A priority patent/KR100910070B1/ko
Priority to TW096131678A priority patent/TWI451915B/zh
Priority to CN200710147767.7A priority patent/CN101134203B/zh
Publication of JP2008053661A publication Critical patent/JP2008053661A/ja
Application granted granted Critical
Publication of JP5010875B2 publication Critical patent/JP5010875B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
JP2006231293A 2006-08-28 2006-08-28 洗浄装置及び洗浄方法 Expired - Fee Related JP5010875B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006231293A JP5010875B2 (ja) 2006-08-28 2006-08-28 洗浄装置及び洗浄方法
US11/844,748 US7913351B2 (en) 2006-08-28 2007-08-24 Cleaning apparatus and cleaning method
KR1020070085983A KR100910070B1 (ko) 2006-08-28 2007-08-27 세정 장치 및 세정 방법
TW096131678A TWI451915B (zh) 2006-08-28 2007-08-27 Cleaning device
CN200710147767.7A CN101134203B (zh) 2006-08-28 2007-08-28 洗涤装置和洗涤方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006231293A JP5010875B2 (ja) 2006-08-28 2006-08-28 洗浄装置及び洗浄方法

Publications (2)

Publication Number Publication Date
JP2008053661A JP2008053661A (ja) 2008-03-06
JP5010875B2 true JP5010875B2 (ja) 2012-08-29

Family

ID=39158646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006231293A Expired - Fee Related JP5010875B2 (ja) 2006-08-28 2006-08-28 洗浄装置及び洗浄方法

Country Status (4)

Country Link
JP (1) JP5010875B2 (ko)
KR (1) KR100910070B1 (ko)
CN (1) CN101134203B (ko)
TW (1) TWI451915B (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5118573B2 (ja) * 2008-02-20 2013-01-16 日立アロカメディカル株式会社 対象物処理装置
KR101229775B1 (ko) 2008-12-26 2013-02-06 엘지디스플레이 주식회사 기판 세정장치
KR101097509B1 (ko) * 2009-07-17 2011-12-22 주식회사 엠엠티 기판 세정장치
JP5538959B2 (ja) * 2010-03-09 2014-07-02 東京エレクトロン株式会社 基板の洗浄方法及び半導体製造装置
CN104091776B (zh) * 2014-07-25 2017-12-08 上海华力微电子有限公司 一种消除连接孔刻蚀副产物凝结缺陷的晶圆净化设备
KR20160065226A (ko) 2014-11-07 2016-06-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6624485B2 (ja) * 2015-03-16 2019-12-25 大日本印刷株式会社 異物除去装置
EP3383290B1 (en) * 2015-12-02 2021-04-14 Apyx Medical Corporation Mixing cold plasma beam jets with atmosphere
CN106011788B (zh) * 2016-06-28 2018-09-07 昆山国显光电有限公司 一种杂质清除设备
US10918433B2 (en) 2016-09-27 2021-02-16 Apyx Medical Corporation Devices, systems and methods for enhancing physiological effectiveness of medical cold plasma discharges
JP6700150B2 (ja) * 2016-10-03 2020-05-27 東京エレクトロン株式会社 パーティクル捕集装置、パーティクル捕集方法、およびパーティクル捕集システム
JP7038618B2 (ja) * 2018-07-12 2022-03-18 東京エレクトロン株式会社 クリーニング方法及び基板処理装置
JP2020136569A (ja) * 2019-02-22 2020-08-31 東京エレクトロン株式会社 検査装置及びクリーニング方法
CN112404006A (zh) * 2020-11-17 2021-02-26 武汉力华嘉会科技发展有限公司 一种洗消装置
JP7376733B2 (ja) * 2020-12-25 2023-11-08 東京エレクトロン株式会社 メンテナンス装置、真空処理システム及びメンテナンス方法
JPWO2022250014A1 (ko) * 2021-05-26 2022-12-01
CN114408772A (zh) * 2022-02-16 2022-04-29 丁志祥 一种起重机用起重臂
CN116592002B (zh) * 2023-07-17 2023-10-03 四川省鼓风机制造有限责任公司 一种鼓风机吸入除尘机构及方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3818913A (en) * 1972-08-30 1974-06-25 M Wallach Surgical apparatus for removal of tissue
JPS6122570U (ja) * 1984-07-12 1986-02-10 章三 小澤 噴射を利用した身体汚物吸引装置
JPS62188322A (ja) * 1986-02-14 1987-08-17 Hitachi Micro Comput Eng Ltd 洗浄装置
JPH0560088A (ja) * 1991-08-30 1993-03-09 Mitsubishi Heavy Ind Ltd 二重通路同時送風装置
JPH0557257A (ja) * 1991-09-03 1993-03-09 Nec Ibaraki Ltd 部品清掃装置
JPH1043699A (ja) * 1996-08-02 1998-02-17 Shinko:Kk クリーナ
JP3315611B2 (ja) * 1996-12-02 2002-08-19 三菱電機株式会社 洗浄用２流体ジェットノズル及び洗浄装置ならびに半導体装置
JP3919132B2 (ja) * 1997-04-22 2007-05-23 シシド静電気株式会社 塵埃吸引式除塵装置
JPH11319741A (ja) * 1998-05-12 1999-11-24 Huegle Electronics Kk 除塵方法及び除塵装置
JP2000117211A (ja) * 1998-10-14 2000-04-25 Hitachi Electronics Service Co Ltd 清掃装置
JP2003266030A (ja) * 2002-03-15 2003-09-24 Seiko Epson Corp 被処理物の洗浄方法および装置並びにデバイスの製造方法およびデバイス
JP2003303799A (ja) * 2002-04-10 2003-10-24 Sony Corp 表面洗浄装置および表面洗浄方法
JP3607268B2 (ja) * 2002-08-02 2005-01-05 株式会社パイオニア風力機 清掃装置
US7080897B2 (en) * 2003-10-31 2006-07-25 Hewlett-Packard Development Company, L.P. System for delivering material onto a substrate
JP2005302319A (ja) * 2004-04-06 2005-10-27 Seiko Epson Corp プラズマ処理装置およびプラズマ処理方法
JP2006026549A (ja) * 2004-07-16 2006-02-02 Zebiosu:Kk 洗浄方法及びそれを実施するための洗浄装置
JP3841807B2 (ja) * 2004-10-13 2006-11-08 株式会社タクマ ノズルおよびろ過式集塵装置
JP2006144768A (ja) * 2004-10-21 2006-06-08 Yusaku Hirose ファンユニット及び該ファンユニットの施工方法
KR100603434B1 (ko) * 2004-12-30 2006-07-20 (주)프로닉스 플라즈마 세정장치
TWI252129B (en) * 2005-08-03 2006-04-01 Chih-Cheng Wu A method of removing indoor air pollutants

Also Published As

Publication number Publication date
JP2008053661A (ja) 2008-03-06
TWI451915B (zh) 2014-09-11
KR20080019560A (ko) 2008-03-04
TW200815118A (en) 2008-04-01
KR100910070B1 (ko) 2009-07-30
CN101134203A (zh) 2008-03-05
CN101134203B (zh) 2015-05-27

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