JP4993826B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
- Publication number
- JP4993826B2 JP4993826B2 JP2001245924A JP2001245924A JP4993826B2 JP 4993826 B2 JP4993826 B2 JP 4993826B2 JP 2001245924 A JP2001245924 A JP 2001245924A JP 2001245924 A JP2001245924 A JP 2001245924A JP 4993826 B2 JP4993826 B2 JP 4993826B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- tft
- insulating film
- heat treatment
- hydrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Dram (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001245924A JP4993826B2 (ja) | 2000-08-14 | 2001-08-14 | 半導体装置の作製方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000246099 | 2000-08-14 | ||
| JP2000246099 | 2000-08-14 | ||
| JP2000-246099 | 2000-08-14 | ||
| JP2001245924A JP4993826B2 (ja) | 2000-08-14 | 2001-08-14 | 半導体装置の作製方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011259980A Division JP5143272B2 (ja) | 2000-08-14 | 2011-11-29 | El表示装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002151524A JP2002151524A (ja) | 2002-05-24 |
| JP2002151524A5 JP2002151524A5 (enExample) | 2008-07-31 |
| JP4993826B2 true JP4993826B2 (ja) | 2012-08-08 |
Family
ID=26597957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001245924A Expired - Fee Related JP4993826B2 (ja) | 2000-08-14 | 2001-08-14 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4993826B2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004138958A (ja) | 2002-10-21 | 2004-05-13 | Semiconductor Energy Lab Co Ltd | 表示装置 |
| US20060072047A1 (en) * | 2002-12-06 | 2006-04-06 | Kanetaka Sekiguchi | Liquid crystal display |
| WO2005022262A1 (en) * | 2003-08-28 | 2005-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor, manufacturing method for thin film transistor and manufacturing method for display device |
| CN100568457C (zh) | 2003-10-02 | 2009-12-09 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
| US20050170643A1 (en) | 2004-01-29 | 2005-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Forming method of contact hole, and manufacturing method of semiconductor device, liquid crystal display device and EL display device |
| US7416977B2 (en) | 2004-04-28 | 2008-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device, liquid crystal television, and EL television |
| US8284142B2 (en) * | 2008-09-30 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US8530897B2 (en) * | 2008-12-11 | 2013-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device including an inverter circuit having a microcrystalline layer |
| KR20230154098A (ko) * | 2009-10-08 | 2023-11-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| JP5533070B2 (ja) * | 2010-03-16 | 2014-06-25 | カシオ計算機株式会社 | 薄膜トランジスタ、発光装置及び薄膜トランジスタの製造方法 |
| WO2012090799A1 (en) * | 2010-12-28 | 2012-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP2012209543A (ja) * | 2011-03-11 | 2012-10-25 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP6496666B2 (ja) | 2013-12-03 | 2019-04-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US9577110B2 (en) * | 2013-12-27 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including an oxide semiconductor and the display device including the semiconductor device |
| JP6615490B2 (ja) * | 2014-05-29 | 2019-12-04 | 株式会社半導体エネルギー研究所 | 半導体装置及び電子機器 |
| CN113658921B (zh) * | 2021-08-13 | 2023-10-17 | 长鑫存储技术有限公司 | 半导体结构的制造方法和半导体结构 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3515132B2 (ja) * | 1991-06-20 | 2004-04-05 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| JPH0845867A (ja) * | 1994-05-27 | 1996-02-16 | Sanyo Electric Co Ltd | 半導体装置の製造方法および表示装置 |
| JPH08228005A (ja) * | 1995-02-20 | 1996-09-03 | Seiko Epson Corp | 半導体装置、薄膜トランジスタ、相補型薄膜トランジスタ、液晶表示装置及びそれらの製造方法 |
| JPH08316486A (ja) * | 1995-05-17 | 1996-11-29 | Sanyo Electric Co Ltd | 薄膜半導体素子 |
| JP2000068518A (ja) * | 1998-08-26 | 2000-03-03 | Sony Corp | 薄膜トランジスタの製造方法 |
-
2001
- 2001-08-14 JP JP2001245924A patent/JP4993826B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002151524A (ja) | 2002-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7068538B2 (ja) | 表示装置、電子機器 | |
| JP4954366B2 (ja) | 半導体装置の作製方法 | |
| US9097953B2 (en) | Semiconductor device, and method of forming the same | |
| JP5376709B2 (ja) | 半導体装置及びその作製方法 | |
| US6953951B2 (en) | Semiconductor device, and manufacturing method thereof | |
| JP4678933B2 (ja) | 半導体装置の作製方法 | |
| KR101427615B1 (ko) | 반도체 장치, 표시 모듈, 및 전자 장치 | |
| KR20000076954A (ko) | 전기광학 디바이스 및 이를 제조하는 방법 | |
| JP4907003B2 (ja) | アクティブマトリクス型表示装置およびそれを用いた電気器具 | |
| JP4836339B2 (ja) | 半導体表示装置及びその作製方法 | |
| JP4896314B2 (ja) | 表示装置 | |
| JP2002151524A (ja) | 半導体装置およびその作製方法 | |
| JP6291015B2 (ja) | 半導体装置 | |
| JP3961310B2 (ja) | 半導体装置の作製方法 | |
| JP5143272B2 (ja) | El表示装置の作製方法 | |
| JP5046439B2 (ja) | 半導体装置の作製方法 | |
| JP4986347B2 (ja) | 半導体装置の作製方法 | |
| JP2006126855A (ja) | 表示装置 | |
| JP4080168B2 (ja) | 半導体装置の作製方法 | |
| JP4954365B2 (ja) | 半導体装置の作製方法 | |
| JP2012109579A (ja) | 半導体装置及びその作製方法 | |
| JP4641598B2 (ja) | 半導体装置の作製方法 | |
| JP4780830B2 (ja) | 電気光学装置およびその作製方法 | |
| JP4127467B2 (ja) | 半導体装置の作製方法 | |
| JP4302357B2 (ja) | 半導体装置の作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080612 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080612 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111007 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111101 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111129 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120501 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120508 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150518 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150518 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |