JP4993826B2 - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法 Download PDFInfo
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- JP4993826B2 JP4993826B2 JP2001245924A JP2001245924A JP4993826B2 JP 4993826 B2 JP4993826 B2 JP 4993826B2 JP 2001245924 A JP2001245924 A JP 2001245924A JP 2001245924 A JP2001245924 A JP 2001245924A JP 4993826 B2 JP4993826 B2 JP 4993826B2
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- film
- tft
- insulating film
- heat treatment
- hydrogen
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- 229910052739 hydrogen Inorganic materials 0.000 claims description 51
- 239000001257 hydrogen Substances 0.000 claims description 51
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
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- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
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- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
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- 238000000151 deposition Methods 0.000 description 1
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- 238000005401 electroluminescence Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
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- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 150000002825 nitriles Chemical class 0.000 description 1
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- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
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- 239000003870 refractory metal Substances 0.000 description 1
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
- Dram (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001245924A JP4993826B2 (ja) | 2000-08-14 | 2001-08-14 | 半導体装置の作製方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-246099 | 2000-08-14 | ||
JP2000246099 | 2000-08-14 | ||
JP2000246099 | 2000-08-14 | ||
JP2001245924A JP4993826B2 (ja) | 2000-08-14 | 2001-08-14 | 半導体装置の作製方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011259980A Division JP5143272B2 (ja) | 2000-08-14 | 2011-11-29 | El表示装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002151524A JP2002151524A (ja) | 2002-05-24 |
JP2002151524A5 JP2002151524A5 (enrdf_load_stackoverflow) | 2008-07-31 |
JP4993826B2 true JP4993826B2 (ja) | 2012-08-08 |
Family
ID=26597957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001245924A Expired - Fee Related JP4993826B2 (ja) | 2000-08-14 | 2001-08-14 | 半導体装置の作製方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4993826B2 (enrdf_load_stackoverflow) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004138958A (ja) | 2002-10-21 | 2004-05-13 | Semiconductor Energy Lab Co Ltd | 表示装置 |
US20060072047A1 (en) * | 2002-12-06 | 2006-04-06 | Kanetaka Sekiguchi | Liquid crystal display |
US20070164280A1 (en) * | 2003-08-28 | 2007-07-19 | Shinji Maekawa | Thin film transistor, manufacturing method for thin film transistor and manufacturing method for display device |
CN100568457C (zh) | 2003-10-02 | 2009-12-09 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
US20050170643A1 (en) | 2004-01-29 | 2005-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Forming method of contact hole, and manufacturing method of semiconductor device, liquid crystal display device and EL display device |
US7416977B2 (en) | 2004-04-28 | 2008-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing display device, liquid crystal television, and EL television |
JP5525224B2 (ja) | 2008-09-30 | 2014-06-18 | 株式会社半導体エネルギー研究所 | 表示装置 |
US8530897B2 (en) * | 2008-12-11 | 2013-09-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device including an inverter circuit having a microcrystalline layer |
JP5533070B2 (ja) * | 2010-03-16 | 2014-06-25 | カシオ計算機株式会社 | 薄膜トランジスタ、発光装置及び薄膜トランジスタの製造方法 |
WO2012090799A1 (en) * | 2010-12-28 | 2012-07-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2012209543A (ja) * | 2011-03-11 | 2012-10-25 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP6496666B2 (ja) | 2013-12-03 | 2019-04-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US9577110B2 (en) * | 2013-12-27 | 2017-02-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including an oxide semiconductor and the display device including the semiconductor device |
KR102354008B1 (ko) * | 2014-05-29 | 2022-01-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 반도체 장치의 제작 방법 및 전자 기기 |
CN113658921B (zh) * | 2021-08-13 | 2023-10-17 | 长鑫存储技术有限公司 | 半导体结构的制造方法和半导体结构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3515132B2 (ja) * | 1991-06-20 | 2004-04-05 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
JPH0845867A (ja) * | 1994-05-27 | 1996-02-16 | Sanyo Electric Co Ltd | 半導体装置の製造方法および表示装置 |
JPH08228005A (ja) * | 1995-02-20 | 1996-09-03 | Seiko Epson Corp | 半導体装置、薄膜トランジスタ、相補型薄膜トランジスタ、液晶表示装置及びそれらの製造方法 |
JPH08316486A (ja) * | 1995-05-17 | 1996-11-29 | Sanyo Electric Co Ltd | 薄膜半導体素子 |
JP2000068518A (ja) * | 1998-08-26 | 2000-03-03 | Sony Corp | 薄膜トランジスタの製造方法 |
-
2001
- 2001-08-14 JP JP2001245924A patent/JP4993826B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2002151524A (ja) | 2002-05-24 |
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