JP4985171B2 - ロードポート装置の取付装置 - Google Patents
ロードポート装置の取付装置 Download PDFInfo
- Publication number
- JP4985171B2 JP4985171B2 JP2007187848A JP2007187848A JP4985171B2 JP 4985171 B2 JP4985171 B2 JP 4985171B2 JP 2007187848 A JP2007187848 A JP 2007187848A JP 2007187848 A JP2007187848 A JP 2007187848A JP 4985171 B2 JP4985171 B2 JP 4985171B2
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- load port
- port device
- support
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 claims description 34
- 238000005096 rolling process Methods 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 14
- 238000009434 installation Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000012546 transfer Methods 0.000 description 5
- 238000004904 shortening Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 240000001973 Ficus microcarpa Species 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2200/00—Constructional details of connections not covered for in other groups of this subclass
- F16B2200/10—Details of socket shapes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Description
B :台車体
E :半導体製造装置(製造装置)
L :ロードポート装置
10,10’,10”:位置決め凸部
11:支持球体
20:位置決め支持体
21:固定板
22:支持板
23,23”:位置決め凹部
23a:支持球体転動案内面
23b:位置決め孔部
23c:突条係止部
31 :装着盤
41 :フレーム
42 :キャスタ
43 :支持ボルト
50 :壁体
51 :取付面
Claims (3)
- 半導体製造装置との間でウェハの出し入れを行うために、当該ウェハを収容したウェハキャリアを載置するロードポート装置を、前記半導体製造装置の壁体の外側の取付面に位置決めして取り付けるための取付装置であって、
前記ロードポート装置の下端部に取付けられた台車体の奥側に左右一対の位置決め凸部が下方に向けて突設され、
前記位置決め凸部は、支持球体で構成されて、当該支持球体は、当該支持球体を支持する支持体の下面から半球よりも小さな一部のみが突出した状態で、当該支持体に全方向に対して回転可能に支持され、
前記壁体の取付面の下端部には、支持板が手前側に突出して固定され、当該支持板の上面には、前記一対の位置決め凸部を嵌合させるための一対の位置決め凹部が形成され、
前記位置決め凹部は、前記支持球体が転動可能な中空逆円錐台状の支持球体転動案内面と、当該支持球体転動案内面の中心部に形成された位置決め孔部とから成り、
ロードポート装置の取付け時において、前記一対の支持球体は、前記一対の支持球体転動案内面を転動して、一対の位置決め孔部に落し込まれることにより、当該ロードポート装置は、半導体製造装置の壁体に対して位置決めされる構成であることを特徴とするロードポート装置の取付装置。 - 上面に一対の位置決め凹部が形成された前記支持板は、前記壁体に標準ピッチで形成されたねじ孔に一対のボルトを介して固定される固定板に対して一体に取り付けられていることを特徴とする請求項1に記載のロードポート装置の取付装置。
- 前記台車体の手前側及び奥側には、それぞれ左右一対のキャスタ、及び高さ調整可能な左右一対の支持ボルトが取り付けられた構成であることを特徴とする請求項1又は2に記載のロードポート装置の取付装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007187848A JP4985171B2 (ja) | 2007-07-19 | 2007-07-19 | ロードポート装置の取付装置 |
KR1020107000917A KR101474584B1 (ko) | 2007-07-19 | 2008-07-18 | 로드 포트 장치의 설치 장치 |
TW097127263A TWI438856B (zh) | 2007-07-19 | 2008-07-18 | Assembly device for wafer loading device |
PCT/JP2008/063051 WO2009011428A1 (ja) | 2007-07-19 | 2008-07-18 | ロードポート装置の取付装置 |
US12/689,648 US8444125B2 (en) | 2007-07-19 | 2010-01-19 | Attaching apparatus for load port apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007187848A JP4985171B2 (ja) | 2007-07-19 | 2007-07-19 | ロードポート装置の取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009026913A JP2009026913A (ja) | 2009-02-05 |
JP4985171B2 true JP4985171B2 (ja) | 2012-07-25 |
Family
ID=40259754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007187848A Expired - Fee Related JP4985171B2 (ja) | 2007-07-19 | 2007-07-19 | ロードポート装置の取付装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8444125B2 (ja) |
JP (1) | JP4985171B2 (ja) |
KR (1) | KR101474584B1 (ja) |
TW (1) | TWI438856B (ja) |
WO (1) | WO2009011428A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5338335B2 (ja) * | 2008-08-13 | 2013-11-13 | 東京エレクトロン株式会社 | 搬送容器の開閉装置及びプローブ装置 |
JP5168329B2 (ja) * | 2010-08-31 | 2013-03-21 | Tdk株式会社 | ロードポート装置 |
US20130168335A1 (en) * | 2012-01-04 | 2013-07-04 | Peerless Industries, Inc. | Moveable fixture for exhibiting display devices or the like |
JP6226190B2 (ja) * | 2014-02-20 | 2017-11-08 | Tdk株式会社 | パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置 |
JP6160548B2 (ja) * | 2014-04-16 | 2017-07-12 | トヨタ自動車株式会社 | 半導体製造装置用の設置構造 |
JP6451453B2 (ja) * | 2015-03-31 | 2019-01-16 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
JP6554872B2 (ja) * | 2015-03-31 | 2019-08-07 | Tdk株式会社 | ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法 |
CN109256353B (zh) * | 2017-07-12 | 2021-10-22 | 家登精密工业股份有限公司 | 定位底座 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6138721A (en) | 1997-09-03 | 2000-10-31 | Asyst Technologies, Inc. | Tilt and go load port interface alignment system |
US6883770B1 (en) * | 1999-05-18 | 2005-04-26 | Tdk Corporation | Load port mounting mechanism |
JP2000332079A (ja) * | 1999-05-18 | 2000-11-30 | Tdk Corp | 半導体製造装置用ロードポート、ロードポート取り付け機構及びロードポート取り付け方法 |
JP4049949B2 (ja) * | 1999-07-14 | 2008-02-20 | 東京エレクトロン株式会社 | 着脱式ロードポート装置 |
JP4021126B2 (ja) | 2000-06-02 | 2007-12-12 | 東京エレクトロン株式会社 | 台車を備えたロードポート装置 |
TW461014B (en) * | 2000-10-11 | 2001-10-21 | Ind Tech Res Inst | A positioning method and device for wafer loading devices |
US6607341B1 (en) * | 2002-03-05 | 2003-08-19 | Robert A. Wade | Cabinet installation apparatus and associated methods |
US20040258505A1 (en) * | 2003-06-04 | 2004-12-23 | Wu Kung Chris | Processing equipment modular font-end |
DE102008002756A1 (de) * | 2008-01-24 | 2009-08-06 | Vistec Semiconductor Systems Gmbh | Vorrichtung zum Vermessen oder Inspizieren von Substraten der Halbleiterindustrie |
-
2007
- 2007-07-19 JP JP2007187848A patent/JP4985171B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-18 TW TW097127263A patent/TWI438856B/zh not_active IP Right Cessation
- 2008-07-18 KR KR1020107000917A patent/KR101474584B1/ko not_active IP Right Cessation
- 2008-07-18 WO PCT/JP2008/063051 patent/WO2009011428A1/ja active Application Filing
-
2010
- 2010-01-19 US US12/689,648 patent/US8444125B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009026913A (ja) | 2009-02-05 |
KR20100047224A (ko) | 2010-05-07 |
TWI438856B (zh) | 2014-05-21 |
US8444125B2 (en) | 2013-05-21 |
TW200910508A (en) | 2009-03-01 |
KR101474584B1 (ko) | 2014-12-18 |
WO2009011428A1 (ja) | 2009-01-22 |
US20100143027A1 (en) | 2010-06-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4985171B2 (ja) | ロードポート装置の取付装置 | |
US6138721A (en) | Tilt and go load port interface alignment system | |
US7845284B2 (en) | Overhead traveling vehicle having safety member | |
JPH04250648A (ja) | ウェハ−保持装置 | |
US20160185467A1 (en) | Apparatus for automatically mounting and dismounting aircraft fuselage | |
US20020044859A1 (en) | FOUP loading apparatus for FOUP opener | |
JP4094193B2 (ja) | 可搬式装置搬送用のキャスタ装置 | |
JP5682595B2 (ja) | ロードポート装置の取付け方法及び当該方法に用いられる運搬架台 | |
KR100337277B1 (ko) | 로드 포트 장착 기구 | |
KR102326021B1 (ko) | 도어 이송 장치 | |
JP2004165458A (ja) | 容器開閉装置 | |
KR101312501B1 (ko) | 리프트 핀 모듈 및 이것을 포함하는 평판표시소자 제조장치 | |
US6857841B2 (en) | Vehicle for transporting a semiconductor device carrier to a semiconductor processing tool | |
KR101687297B1 (ko) | 반송대차 얼라인 장치 | |
US6745908B2 (en) | Shelf module adapted to store substrate carriers | |
JP4049949B2 (ja) | 着脱式ロードポート装置 | |
KR20090110658A (ko) | 평판디스플레이용 픽업장치의 소스피시비피커 | |
CN217686517U (zh) | 晶圆装载机及立式炉 | |
JP2020527659A (ja) | 製造設備の構成要素ラックシステムを有する踏み台 | |
JP6295024B2 (ja) | ミニマル製造装置と生産ラインと生産ラインの組み替え方法 | |
CN220253179U (zh) | 一种湿法设备与晶圆处理系统 | |
JP2012064829A (ja) | カセットアダプタ、及びカセットカバー | |
CN220348163U (zh) | 副车架定位工装 | |
KR101784858B1 (ko) | 로드포트모듈 제조공정방법 및 로드포트모듈 제조공정설비 | |
US11776832B2 (en) | Transfer system, transfer device, and transfer method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100623 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120127 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120403 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120416 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150511 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |