WO2009011428A1 - ロードポート装置の取付装置 - Google Patents

ロードポート装置の取付装置 Download PDF

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Publication number
WO2009011428A1
WO2009011428A1 PCT/JP2008/063051 JP2008063051W WO2009011428A1 WO 2009011428 A1 WO2009011428 A1 WO 2009011428A1 JP 2008063051 W JP2008063051 W JP 2008063051W WO 2009011428 A1 WO2009011428 A1 WO 2009011428A1
Authority
WO
WIPO (PCT)
Prior art keywords
load port
attaching
end portion
port apparatus
aligning
Prior art date
Application number
PCT/JP2008/063051
Other languages
English (en)
French (fr)
Inventor
Mitsuo Natsume
Original Assignee
Sinfonia Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co., Ltd. filed Critical Sinfonia Technology Co., Ltd.
Publication of WO2009011428A1 publication Critical patent/WO2009011428A1/ja
Priority to US12/689,648 priority Critical patent/US8444125B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B2200/00—Constructional details of connections not covered for in other groups of this subclass
    • F16B2200/10—Details of socket shapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　本願は、半導体製造装置との間でウェハの出し入れを行うために、当該ウェハを収容したウェハキャリアを載置するように構成されるロードポート装置を、前記半導体製造装置の取付面に取り付けるための取付装置に関する。台車体は、前記ロードポート装置の下端部に取付られる。一対の位置決め凸部は、前記ロードポート装置の前記下端部に、下方に向けて突出するように取り付けられる。支持板は、前記壁体の前記取付面の下端部に手前側に突出するように固定される。一対の位置決め凹部は、前記位置決め凸部が嵌合するように、前記支持板の上面に形成される。
PCT/JP2008/063051 2007-07-19 2008-07-18 ロードポート装置の取付装置 WO2009011428A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/689,648 US8444125B2 (en) 2007-07-19 2010-01-19 Attaching apparatus for load port apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007187848A JP4985171B2 (ja) 2007-07-19 2007-07-19 ロードポート装置の取付装置
JP2007-187848 2007-07-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/689,648 Continuation US8444125B2 (en) 2007-07-19 2010-01-19 Attaching apparatus for load port apparatus

Publications (1)

Publication Number Publication Date
WO2009011428A1 true WO2009011428A1 (ja) 2009-01-22

Family

ID=40259754

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063051 WO2009011428A1 (ja) 2007-07-19 2008-07-18 ロードポート装置の取付装置

Country Status (5)

Country Link
US (1) US8444125B2 (ja)
JP (1) JP4985171B2 (ja)
KR (1) KR101474584B1 (ja)
TW (1) TWI438856B (ja)
WO (1) WO2009011428A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067940A (ja) * 2008-08-13 2010-03-25 Tokyo Electron Ltd Ｆｏｕｐ開閉装置及びプローブ装置
JP2012054271A (ja) * 2010-08-31 2012-03-15 Tdk Corp ロードポート装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130168335A1 (en) * 2012-01-04 2013-07-04 Peerless Industries, Inc. Moveable fixture for exhibiting display devices or the like
JP6226190B2 (ja) * 2014-02-20 2017-11-08 Tdk株式会社 パージシステム、及び該パージシステムに供せられるポッド及びロードポート装置
JP6160548B2 (ja) * 2014-04-16 2017-07-12 トヨタ自動車株式会社 半導体製造装置用の設置構造
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
CN109256353B (zh) * 2017-07-12 2021-10-22 家登精密工业股份有限公司 定位底座

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332079A (ja) * 1999-05-18 2000-11-30 Tdk Corp 半導体製造装置用ロードポート、ロードポート取り付け機構及びロードポート取り付け方法
JP2001526458A (ja) * 1997-09-03 2001-12-18 アシスト テクノロジーズ インコーポレイテッド ティルトアンドゴー方式のロードポート・インタフェース整列システム
JP2002134582A (ja) * 2000-10-11 2002-05-10 Ind Technol Res Inst ウェハーロードポートの位置決め装置と方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6883770B1 (en) * 1999-05-18 2005-04-26 Tdk Corporation Load port mounting mechanism
JP4049949B2 (ja) * 1999-07-14 2008-02-20 東京エレクトロン株式会社 着脱式ロードポート装置
JP4021126B2 (ja) 2000-06-02 2007-12-12 東京エレクトロン株式会社 台車を備えたロードポート装置
US6607341B1 (en) * 2002-03-05 2003-08-19 Robert A. Wade Cabinet installation apparatus and associated methods
US20040258505A1 (en) * 2003-06-04 2004-12-23 Wu Kung Chris Processing equipment modular font-end
DE102008002756A1 (de) * 2008-01-24 2009-08-06 Vistec Semiconductor Systems Gmbh Vorrichtung zum Vermessen oder Inspizieren von Substraten der Halbleiterindustrie

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001526458A (ja) * 1997-09-03 2001-12-18 アシスト テクノロジーズ インコーポレイテッド ティルトアンドゴー方式のロードポート・インタフェース整列システム
JP2000332079A (ja) * 1999-05-18 2000-11-30 Tdk Corp 半導体製造装置用ロードポート、ロードポート取り付け機構及びロードポート取り付け方法
JP2002134582A (ja) * 2000-10-11 2002-05-10 Ind Technol Res Inst ウェハーロードポートの位置決め装置と方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067940A (ja) * 2008-08-13 2010-03-25 Tokyo Electron Ltd Ｆｏｕｐ開閉装置及びプローブ装置
JP2012054271A (ja) * 2010-08-31 2012-03-15 Tdk Corp ロードポート装置

Also Published As

Publication number Publication date
TW200910508A (en) 2009-03-01
JP2009026913A (ja) 2009-02-05
KR101474584B1 (ko) 2014-12-18
JP4985171B2 (ja) 2012-07-25
US8444125B2 (en) 2013-05-21
KR20100047224A (ko) 2010-05-07
TWI438856B (zh) 2014-05-21
US20100143027A1 (en) 2010-06-10

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