JP4979167B2 - プラズマエッチング方法 - Google Patents

プラズマエッチング方法 Download PDF

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Publication number
JP4979167B2
JP4979167B2 JP2001505049A JP2001505049A JP4979167B2 JP 4979167 B2 JP4979167 B2 JP 4979167B2 JP 2001505049 A JP2001505049 A JP 2001505049A JP 2001505049 A JP2001505049 A JP 2001505049A JP 4979167 B2 JP4979167 B2 JP 4979167B2
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JP
Japan
Prior art keywords
etching
gas
plasma
substrate
etching method
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Expired - Lifetime
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JP2001505049A
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English (en)
Japanese (ja)
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JP2003502860A (ja
Inventor
アナンド スリニヴァサン
カール−フレデリック カールストルム
グナール ランドグレン
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Surface Technology Systems Ltd
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Surface Technology Systems Ltd
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Publication date
Priority claimed from SE9902344A external-priority patent/SE9902344D0/xx
Application filed by Surface Technology Systems Ltd filed Critical Surface Technology Systems Ltd
Publication of JP2003502860A publication Critical patent/JP2003502860A/ja
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Publication of JP4979167B2 publication Critical patent/JP4979167B2/ja
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    • H10P50/246—
    • H10P50/242—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30612—Etching of AIIIBV compounds
    • H01L21/30621—Vapour phase etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP2001505049A 1999-06-21 2000-06-21 プラズマエッチング方法 Expired - Lifetime JP4979167B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
SE9902344A SE9902344D0 (sv) 1999-06-21 1999-06-21 Dry etching process of III-V-semiconductor
SE9902344-2 1999-06-21
SE9903213A SE9903213D0 (sv) 1999-06-21 1999-09-10 Dry etching process of compound semiconductor materials
SE9903213-8 1999-09-10
PCT/GB2000/002255 WO2000079578A1 (en) 1999-06-21 2000-06-21 Improvements relating to plasma etching

Publications (2)

Publication Number Publication Date
JP2003502860A JP2003502860A (ja) 2003-01-21
JP4979167B2 true JP4979167B2 (ja) 2012-07-18

Family

ID=26663600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001505049A Expired - Lifetime JP4979167B2 (ja) 1999-06-21 2000-06-21 プラズマエッチング方法

Country Status (8)

Country Link
US (1) US6933242B1 (enExample)
EP (1) EP1188180B1 (enExample)
JP (1) JP4979167B2 (enExample)
KR (1) KR100731849B1 (enExample)
AT (1) ATE448566T1 (enExample)
DE (1) DE60043300D1 (enExample)
SE (1) SE9903213D0 (enExample)
WO (1) WO2000079578A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820570B2 (en) 2001-08-15 2004-11-23 Nobel Biocare Services Ag Atomic layer deposition reactor
KR100759808B1 (ko) 2005-12-08 2007-09-20 한국전자통신연구원 Ｉｉｉ－ｖ 족 반도체 다층구조의 식각 방법 및 이를이용한 수직공진형 표면방출 레이저 제조 방법
US20080239428A1 (en) * 2007-04-02 2008-10-02 Inphase Technologies, Inc. Non-ft plane angular filters
JP5723377B2 (ja) * 2009-11-09 2015-05-27 スリーエム イノベイティブ プロパティズ カンパニー 半導体のためのエッチングプロセス
KR102306979B1 (ko) 2014-04-01 2021-09-30 에베 그룹 에. 탈너 게엠베하 기질의 표면 처리를 위한 방법 및 장치
JP2017022368A (ja) * 2015-06-05 2017-01-26 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ ＧａＮ及びその他のＩＩＩ−Ｖ材料の原子層エッチング
US10096487B2 (en) 2015-08-19 2018-10-09 Lam Research Corporation Atomic layer etching of tungsten and other metals
US9991128B2 (en) 2016-02-05 2018-06-05 Lam Research Corporation Atomic layer etching in continuous plasma
US10566212B2 (en) 2016-12-19 2020-02-18 Lam Research Corporation Designer atomic layer etching
KR102733594B1 (ko) * 2019-12-18 2024-11-25 주식회사 원익아이피에스 기판 처리 방법
TW202247248A (zh) 2021-02-03 2022-12-01 美商蘭姆研究公司 原子層蝕刻中的蝕刻選擇性控制

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201820A (ja) * 1993-12-28 1995-08-04 Fujitsu Ltd 水銀カドミウムテルル基板のエッチング方法
JPH10303181A (ja) * 1997-04-28 1998-11-13 Mitsui Chem Inc 乾式プロセスガス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527425A (en) * 1995-07-21 1996-06-18 At&T Corp. Method of making in-containing III/V semiconductor devices
JPH1116896A (ja) * 1997-06-27 1999-01-22 Fujitsu Ltd 化合物半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07201820A (ja) * 1993-12-28 1995-08-04 Fujitsu Ltd 水銀カドミウムテルル基板のエッチング方法
JPH10303181A (ja) * 1997-04-28 1998-11-13 Mitsui Chem Inc 乾式プロセスガス

Also Published As

Publication number Publication date
EP1188180B1 (en) 2009-11-11
KR20020041333A (ko) 2002-06-01
ATE448566T1 (de) 2009-11-15
SE9903213D0 (sv) 1999-09-10
KR100731849B1 (ko) 2007-06-25
EP1188180A1 (en) 2002-03-20
DE60043300D1 (enExample) 2009-12-24
JP2003502860A (ja) 2003-01-21
US6933242B1 (en) 2005-08-23
WO2000079578A1 (en) 2000-12-28

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