JP4975523B2 - 部品内蔵基板 - Google Patents

部品内蔵基板 Download PDF

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Publication number
JP4975523B2
JP4975523B2 JP2007140141A JP2007140141A JP4975523B2 JP 4975523 B2 JP4975523 B2 JP 4975523B2 JP 2007140141 A JP2007140141 A JP 2007140141A JP 2007140141 A JP2007140141 A JP 2007140141A JP 4975523 B2 JP4975523 B2 JP 4975523B2
Authority
JP
Japan
Prior art keywords
substrate
electronic component
imaging device
component
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007140141A
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English (en)
Japanese (ja)
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JP2008294331A (ja
JP2008294331A5 (enExample
Inventor
直 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007140141A priority Critical patent/JP4975523B2/ja
Publication of JP2008294331A publication Critical patent/JP2008294331A/ja
Publication of JP2008294331A5 publication Critical patent/JP2008294331A5/ja
Application granted granted Critical
Publication of JP4975523B2 publication Critical patent/JP4975523B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2007140141A 2007-05-28 2007-05-28 部品内蔵基板 Active JP4975523B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007140141A JP4975523B2 (ja) 2007-05-28 2007-05-28 部品内蔵基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007140141A JP4975523B2 (ja) 2007-05-28 2007-05-28 部品内蔵基板

Publications (3)

Publication Number Publication Date
JP2008294331A JP2008294331A (ja) 2008-12-04
JP2008294331A5 JP2008294331A5 (enExample) 2010-04-15
JP4975523B2 true JP4975523B2 (ja) 2012-07-11

Family

ID=40168723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007140141A Active JP4975523B2 (ja) 2007-05-28 2007-05-28 部品内蔵基板

Country Status (1)

Country Link
JP (1) JP4975523B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5619372B2 (ja) * 2009-04-16 2014-11-05 大日本印刷株式会社 撮像素子モジュール
KR101051540B1 (ko) * 2009-09-23 2011-07-22 삼성전기주식회사 인쇄회로기판
JP2014170893A (ja) * 2013-03-05 2014-09-18 Taiyo Yuden Co Ltd カメラモジュール
JP6314070B2 (ja) * 2014-10-07 2018-04-18 新光電気工業株式会社 指紋認識用半導体装置、指紋認識用半導体装置の製造方法及び半導体装置
JP2018534782A (ja) * 2015-11-27 2018-11-22 チャイナ ウェーハ レベル シーエスピー カンパニー リミテッド イメージセンシングチップパッケージ構造および方法
JP6990029B2 (ja) * 2017-03-09 2022-01-12 株式会社アムコー・テクノロジー・ジャパン 電子機器および電子機器の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007472A (ja) * 1999-06-17 2001-01-12 Sony Corp 電子回路装置およびその製造方法
JP2004079779A (ja) * 2002-08-19 2004-03-11 Seiko Precision Inc 固体撮像装置
JP4475875B2 (ja) * 2003-02-26 2010-06-09 イビデン株式会社 プリント配線板
WO2006035528A1 (ja) * 2004-09-29 2006-04-06 Murata Manufacturing Co., Ltd. スタックモジュール及びその製造方法

Also Published As

Publication number Publication date
JP2008294331A (ja) 2008-12-04

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