JP4974873B2 - 静電チャック及び基板温調固定装置 - Google Patents

静電チャック及び基板温調固定装置 Download PDF

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Publication number
JP4974873B2
JP4974873B2 JP2007333867A JP2007333867A JP4974873B2 JP 4974873 B2 JP4974873 B2 JP 4974873B2 JP 2007333867 A JP2007333867 A JP 2007333867A JP 2007333867 A JP2007333867 A JP 2007333867A JP 4974873 B2 JP4974873 B2 JP 4974873B2
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JP
Japan
Prior art keywords
substrate
electrostatic chuck
fixing device
substrate temperature
outer edge
Prior art date
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JP2007333867A
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English (en)
Japanese (ja)
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JP2009158664A (ja
JP2009158664A5 (enExample
Inventor
智昭 児山
晃樹 玉川
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2007333867A priority Critical patent/JP4974873B2/ja
Priority to US12/333,491 priority patent/US8199454B2/en
Priority to KR1020080133155A priority patent/KR101458990B1/ko
Priority to CNA2008101765999A priority patent/CN101471278A/zh
Publication of JP2009158664A publication Critical patent/JP2009158664A/ja
Publication of JP2009158664A5 publication Critical patent/JP2009158664A5/ja
Application granted granted Critical
Publication of JP4974873B2 publication Critical patent/JP4974873B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2007333867A 2007-12-26 2007-12-26 静電チャック及び基板温調固定装置 Active JP4974873B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007333867A JP4974873B2 (ja) 2007-12-26 2007-12-26 静電チャック及び基板温調固定装置
US12/333,491 US8199454B2 (en) 2007-12-26 2008-12-12 Electrostatic chuck and substrate temperature adjusting-fixing device
KR1020080133155A KR101458990B1 (ko) 2007-12-26 2008-12-24 정전척 및 기판 온도조절-고정장치
CNA2008101765999A CN101471278A (zh) 2007-12-26 2008-12-25 静电夹盘和基板温度调节固定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007333867A JP4974873B2 (ja) 2007-12-26 2007-12-26 静電チャック及び基板温調固定装置

Publications (3)

Publication Number Publication Date
JP2009158664A JP2009158664A (ja) 2009-07-16
JP2009158664A5 JP2009158664A5 (enExample) 2010-11-25
JP4974873B2 true JP4974873B2 (ja) 2012-07-11

Family

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Family Applications (1)

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JP2007333867A Active JP4974873B2 (ja) 2007-12-26 2007-12-26 静電チャック及び基板温調固定装置

Country Status (4)

Country Link
US (1) US8199454B2 (enExample)
JP (1) JP4974873B2 (enExample)
KR (1) KR101458990B1 (enExample)
CN (1) CN101471278A (enExample)

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JP7209515B2 (ja) * 2018-11-27 2023-01-20 東京エレクトロン株式会社 基板保持機構および成膜装置
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Also Published As

Publication number Publication date
KR20090071439A (ko) 2009-07-01
CN101471278A (zh) 2009-07-01
JP2009158664A (ja) 2009-07-16
US8199454B2 (en) 2012-06-12
KR101458990B1 (ko) 2014-11-07
US20090168291A1 (en) 2009-07-02

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