JP4972640B2 - 電子部品の熱管理のためのシステムおよび方法 - Google Patents
電子部品の熱管理のためのシステムおよび方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title description 13
- 238000012546 transfer Methods 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 25
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 18
- 239000002041 carbon nanotube Substances 0.000 claims description 15
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 15
- 238000009792 diffusion process Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 239000002071 nanotube Substances 0.000 description 19
- 239000000835 fiber Substances 0.000 description 11
- 239000002657 fibrous material Substances 0.000 description 11
- 239000004519 grease Substances 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002134 carbon nanofiber Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005293 physical law Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
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Description
Claims (29)
- 熱管理のための熱伝導媒体であって、
熱源とヒートシンクとの間に配置されるディスクと、
上記熱源に近接して配置される、上記ディスクの第1凹部表面と、
上記ヒートシンクに近接して配置される、上記ディスクの反対側の第2凹部表面と、
上記第1凹部表面および上記第2凹部表面から延びる無数の熱伝導性棒状体と、を備え、上記第1凹部表面の棒状体が、上記熱源に対して複数の接触ポイントを形成し、かつ上記第2凹部表面の棒状体が、上記ヒートシンクに対して複数の接触ポイントを形成する熱伝導媒体。 - 上記ディスクが、熱伝導性を有する材料からなることを特徴とする請求項1記載の熱伝導媒体。
- 上記ディスクが、熱拡散性を備える材料からなることを特徴とする請求項1記載の熱伝導媒体。
- 上記ディスクが、銅、アルミニウム、及びベリリウムからなる群から選択された少なくとも一つからなることを特徴とする請求項1記載の熱伝導媒体。
- 上記第1凹部表面と上記第2凹部表面のそれぞれが、上記ディスクの外周に配置されたリムにより画定されることを特徴とする請求項1記載の熱伝導媒体。
- 上記リムが、上記ヒートシンクと上記熱源との間のスペーサとして機能することを特徴とする請求項5記載の熱伝導媒体。
- 上記リムが、上記ヒートシンクおよび上記熱源により無数の棒状体に対して加えられる圧力をある一定量に制限するよう機能することを特徴とする請求項5記載の熱伝導媒体。
- 上記第1凹部表面と上記第2凹部表面のそれぞれの深さが、それらから延びる無数の棒状体の長さより適度に小さいことを特徴とする請求項1記載の熱伝導媒体。
- 上記第1凹部表面と上記第2凹部表面のそれぞれが、100μm〜500μmの深さを有することを特徴とする請求項1記載の熱伝導媒体。
- 上記第1凹部表面と上記第2凹部表面とが、サイズにおいて同一であることを特徴とする請求項1記載の熱伝導媒体。
- 上記第1凹部表面と上記第2凹部表面とが、サイズにおいて相違することを特徴とする請求項1記載の熱伝導媒体。
- 上記第1凹部表面が、熱を小さな熱源からこれと比較してより大きなヒートシンクへ伝達するため、上記第2凹部表面よりサイズにおいて小さいことを特徴とする請求項11記載の熱伝導媒体。
- 上記無数の棒状体が、該棒状体が延びるそれぞれの凹部表面に対して垂直に配列されていることを特徴とする請求項1記載の熱伝導媒体。
- 上記無数の棒状体が、それぞれの凹部表面から10μm〜100μm延びていることを特徴とする請求項1記載の熱伝導媒体。
- 上記無数の棒状体により与えられる接触ポイントの数が、平方センチメートル当たり108のオーダー以下の範囲にあることを特徴とする請求項1記載の熱伝導媒体。
- 上記の第1凹部表面および第2凹部表面から延びる無数の棒状体が、数において同一であることを特徴とする請求項1記載の熱伝導媒体。
- 上記の第1凹部表面および第2凹部表面から延びる無数の棒状体が、数において相違することを特徴とする請求項1記載の熱伝導媒体。
- 上記の第1凹部表面から延びる棒状体は、熱を小さな熱源からこれと比較してより大きなヒートシンクへ拡散させるため、上記の第2凹部表面から延びる棒状体より数において少ないことを特徴とする請求項1記載の熱伝導媒体。
- 上記棒状体は、カーボンナノチューブからなることを特徴とする請求項1記載の熱伝導媒体。
- 熱管理のための熱伝導媒体であって、
熱源に近接して配置される第1サイドとヒートシンクに近接して配置される反対側の第2サイドとを備えるディスクと、
上記ディスクの上記それぞれのサイドの外周に配置されるリムと、
上記ディスクの第1サイドにおいて、上記リムにより画定される第1凹部表面と、
上記ディスクの第2サイドにおいて、上記リムにより画定される第2凹部表面と、
上記第1凹部表面および上記第2凹部表面から延びる無数の熱伝導性棒状体と、を備え、上記第1凹部表面の棒状体が、上記熱源に対して複数の接触ポイントを形成し、かつ上記第2凹部表面の棒状体が、上記ヒートシンクに対して複数の接触ポイントを形成する熱伝導媒体。 - 上記ディスクが、熱伝導性を有する材料からなることを特徴とする請求項20記載の熱伝導媒体。
- 上記ディスクが、熱拡散性を備える材料からなることを特徴とする請求項20記載の熱伝導媒体。
- 上記リムが、上記ヒートシンクおよび上記熱源により無数の棒状体に対して加えられる圧力をある一定量に制限するよう機能することを特徴とする請求項20記載の熱伝導媒体。
- 上記第1凹部表面と上記第2凹部表面は、それぞれのリムにより画定されるサイズと同様のサイズを有することを特徴とする請求項20記載の熱伝導媒体。
- 異なるサイズのリムによりそれぞれ画定された上記第1凹部表面と上記第2凹部表面とが、サイズにおいて相違することを特徴とする請求項20記載の熱伝導媒体。
- 上記熱伝導媒体が、上記熱源と上記ヒートシンクとの間の熱拡散係数の差を調整するように、上記無数の棒状体がそれぞれの表面において上記リムから僅かに突出していることを特徴とする請求項20記載の熱伝導媒体。
- 上記無数の棒状体により、上記熱源と上記ヒートシンクとの間において粗い界面が適用され、界面の粗研磨が最小限に抑えられることを特徴とする請求項20記載の熱伝導媒体。
- 上記の第1凹部表面および第2凹部表面から延びる無数の棒状体が、数において同一であることを特徴とする請求項20記載の熱伝導媒体。
- 上記の第1凹部表面および第2凹部表面から延びる無数の棒状体が、数において相違することを特徴とする請求項20記載の熱伝導媒体。
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- 2006-04-28 EP EP09165823A patent/EP2112249A1/en not_active Withdrawn
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- 2006-04-28 US US11/413,512 patent/US7898079B2/en active Active
- 2006-04-28 EP EP06751776A patent/EP1885907A4/en not_active Withdrawn
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US20060269670A1 (en) | 2006-11-30 |
JP2008543051A (ja) | 2008-11-27 |
US20110214850A1 (en) | 2011-09-08 |
EP1885907A4 (en) | 2008-12-10 |
AU2006249601B2 (en) | 2011-08-11 |
WO2006127208A3 (en) | 2008-01-31 |
CA2609712C (en) | 2015-04-07 |
EP1885907A2 (en) | 2008-02-13 |
US7898079B2 (en) | 2011-03-01 |
AU2006249601A1 (en) | 2006-11-30 |
CA2609712A1 (en) | 2006-11-30 |
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