JP4969377B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4969377B2
JP4969377B2 JP2007234920A JP2007234920A JP4969377B2 JP 4969377 B2 JP4969377 B2 JP 4969377B2 JP 2007234920 A JP2007234920 A JP 2007234920A JP 2007234920 A JP2007234920 A JP 2007234920A JP 4969377 B2 JP4969377 B2 JP 4969377B2
Authority
JP
Japan
Prior art keywords
semiconductor device
layer
metal layer
region
film substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007234920A
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English (en)
Japanese (ja)
Other versions
JP2009070866A5 (https=
JP2009070866A (ja
Inventor
武史 須永
太郎 西岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2007234920A priority Critical patent/JP4969377B2/ja
Publication of JP2009070866A publication Critical patent/JP2009070866A/ja
Publication of JP2009070866A5 publication Critical patent/JP2009070866A5/ja
Application granted granted Critical
Publication of JP4969377B2 publication Critical patent/JP4969377B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
JP2007234920A 2007-09-11 2007-09-11 半導体装置 Expired - Fee Related JP4969377B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007234920A JP4969377B2 (ja) 2007-09-11 2007-09-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007234920A JP4969377B2 (ja) 2007-09-11 2007-09-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2009070866A JP2009070866A (ja) 2009-04-02
JP2009070866A5 JP2009070866A5 (https=) 2010-10-14
JP4969377B2 true JP4969377B2 (ja) 2012-07-04

Family

ID=40606845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007234920A Expired - Fee Related JP4969377B2 (ja) 2007-09-11 2007-09-11 半導体装置

Country Status (1)

Country Link
JP (1) JP4969377B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012008817A (ja) * 2010-06-25 2012-01-12 Toshiba Corp 半導体メモリカード
JP2022059798A (ja) * 2020-10-02 2022-04-14 ローム株式会社 サーマルプリントヘッド及びサーマルプリンタ
WO2023139813A1 (ja) * 2022-01-19 2023-07-27 ヌヴォトンテクノロジージャパン株式会社 半導体装置及びレーザマーキング方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63263748A (ja) * 1987-04-22 1988-10-31 Hitachi Ltd 半導体装置及びその製造方法
JPH0334439A (ja) * 1989-06-30 1991-02-14 Hitachi Ltd 半導体装置の製造方法
JP3410480B2 (ja) * 1991-06-04 2003-05-26 共同印刷株式会社 カード及びその刻印方法
JPH0817951A (ja) * 1994-06-27 1996-01-19 Nec Corp 半導体装置
JP2000332376A (ja) * 1999-05-25 2000-11-30 Mitsubishi Electric Corp 半導体装置のマーキング方法
JP2003168082A (ja) * 2001-11-30 2003-06-13 Toppan Forms Co Ltd Ｒｆ−ｉｄの検査方法および検査システムおよび検査対象のｒｆ−ｉｄフォーム

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Publication number Publication date
JP2009070866A (ja) 2009-04-02

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