JP4967066B2 - アモルファスシリコン膜の成膜方法および成膜装置 - Google Patents

アモルファスシリコン膜の成膜方法および成膜装置 Download PDF

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Publication number
JP4967066B2
JP4967066B2 JP2011044014A JP2011044014A JP4967066B2 JP 4967066 B2 JP4967066 B2 JP 4967066B2 JP 2011044014 A JP2011044014 A JP 2011044014A JP 2011044014 A JP2011044014 A JP 2011044014A JP 4967066 B2 JP4967066 B2 JP 4967066B2
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amorphous silicon
silicon film
forming
film
based gas
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Japanese (ja)
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JP2011249764A5 (https=
JP2011249764A (ja
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一秀 長谷部
博紀 村上
明修 柿本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011044014A priority Critical patent/JP4967066B2/ja
Priority to TW100114311A priority patent/TWI420574B/zh
Priority to TW102134148A priority patent/TWI562202B/zh
Priority to KR1020110039227A priority patent/KR101282908B1/ko
Priority to US13/094,043 priority patent/US9006021B2/en
Priority to CN201410478548.7A priority patent/CN104278252B/zh
Priority to CN201410479712.6A priority patent/CN104264125B/zh
Priority to CN201110107275.1A priority patent/CN102234786B/zh
Priority to CN201410478007.4A priority patent/CN104264124B/zh
Publication of JP2011249764A publication Critical patent/JP2011249764A/ja
Publication of JP2011249764A5 publication Critical patent/JP2011249764A5/ja
Application granted granted Critical
Publication of JP4967066B2 publication Critical patent/JP4967066B2/ja
Priority to KR1020120145412A priority patent/KR101529171B1/ko
Priority to KR1020140072194A priority patent/KR101534638B1/ko
Priority to KR1020140072192A priority patent/KR101534634B1/ko
Priority to KR1020140072193A priority patent/KR101534637B1/ko
Priority to KR1020140072197A priority patent/KR101615968B1/ko
Priority to US14/656,914 priority patent/US9123782B2/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H10P14/3452—Microstructure
    • H10P14/3454—Amorphous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/042—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers
    • H10W20/045—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers for deposition from the gaseous phase, e.g. for chemical vapour deposition [CVD]

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  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
JP2011044014A 2010-04-27 2011-03-01 アモルファスシリコン膜の成膜方法および成膜装置 Active JP4967066B2 (ja)

Priority Applications (15)

Application Number Priority Date Filing Date Title
JP2011044014A JP4967066B2 (ja) 2010-04-27 2011-03-01 アモルファスシリコン膜の成膜方法および成膜装置
TW100114311A TWI420574B (zh) 2010-04-27 2011-04-25 非晶矽膜形成方法及非晶矽膜形成裝置
TW102134148A TWI562202B (en) 2010-04-27 2011-04-25 Amorphous silicon film formation method and amorphous silicon film formation apparatus
KR1020110039227A KR101282908B1 (ko) 2010-04-27 2011-04-26 어모퍼스 실리콘막의 성막 방법 및 성막 장치
US13/094,043 US9006021B2 (en) 2010-04-27 2011-04-26 Amorphous silicon film formation method and amorphous silicon film formation apparatus
CN201110107275.1A CN102234786B (zh) 2010-04-27 2011-04-27 非晶体硅膜的成膜方法和成膜装置
CN201410478007.4A CN104264124B (zh) 2010-04-27 2011-04-27 成膜装置
CN201410479712.6A CN104264125B (zh) 2010-04-27 2011-04-27 成膜装置
CN201410478548.7A CN104278252B (zh) 2010-04-27 2011-04-27 非晶体硅膜的成膜方法和成膜装置
KR1020120145412A KR101529171B1 (ko) 2010-04-27 2012-12-13 어모퍼스 실리콘막의 성막 방법 및 성막 장치
KR1020140072197A KR101615968B1 (ko) 2010-04-27 2014-06-13 어모퍼스 실리콘막의 성막 방법 및 성막 장치
KR1020140072193A KR101534637B1 (ko) 2010-04-27 2014-06-13 어모퍼스 실리콘막의 성막 방법 및 성막 장치
KR1020140072192A KR101534634B1 (ko) 2010-04-27 2014-06-13 어모퍼스 실리콘막의 성막 방법 및 성막 장치
KR1020140072194A KR101534638B1 (ko) 2010-04-27 2014-06-13 어모퍼스 실리콘막의 성막 방법 및 성막 장치
US14/656,914 US9123782B2 (en) 2010-04-27 2015-03-13 Amorphous silicon film formation method and amorphous silicon film formation apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010102405 2010-04-27
JP2010102405 2010-04-27
JP2011044014A JP4967066B2 (ja) 2010-04-27 2011-03-01 アモルファスシリコン膜の成膜方法および成膜装置

Related Child Applications (5)

Application Number Title Priority Date Filing Date
JP2012084170A Division JP5330562B2 (ja) 2010-04-27 2012-04-02 成膜装置
JP2012084168A Division JP5373142B2 (ja) 2010-04-27 2012-04-02 アモルファスシリコン膜の成膜方法および成膜装置
JP2012084171A Division JP5373143B2 (ja) 2010-04-27 2012-04-02 半導体装置の製造方法並びにコンタクトホール及び／又はラインの埋め込み方法
JP2012084172A Division JP5330563B2 (ja) 2010-04-27 2012-04-02 成膜装置
JP2012084169A Division JP5337269B2 (ja) 2010-04-27 2012-04-02 アモルファスシリコン膜の成膜方法および成膜装置

Publications (3)

Publication Number Publication Date
JP2011249764A JP2011249764A (ja) 2011-12-08
JP2011249764A5 JP2011249764A5 (https=) 2012-01-26
JP4967066B2 true JP4967066B2 (ja) 2012-07-04

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ID=44816157

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JP2011044014A Active JP4967066B2 (ja) 2010-04-27 2011-03-01 アモルファスシリコン膜の成膜方法および成膜装置

Country Status (5)

Country Link
US (2) US9006021B2 (https=)
JP (1) JP4967066B2 (https=)
KR (6) KR101282908B1 (https=)
CN (4) CN104264125B (https=)
TW (2) TWI562202B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109537A (ja) * 2010-10-29 2012-06-07 Tokyo Electron Ltd 成膜装置
JP2012147017A (ja) * 2010-04-27 2012-08-02 Tokyo Electron Ltd 成膜装置

Families Citing this family (49)

* Cited by examiner, † Cited by third party
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WO2012047945A2 (en) 2010-10-05 2012-04-12 Silcotek Corp. Wear resistant coating, article, and method
JP4967066B2 (ja) * 2010-04-27 2012-07-04 東京エレクトロン株式会社 アモルファスシリコン膜の成膜方法および成膜装置
JP5490753B2 (ja) * 2010-07-29 2014-05-14 東京エレクトロン株式会社 トレンチの埋め込み方法および成膜システム
JP5689398B2 (ja) * 2010-12-21 2015-03-25 東京エレクトロン株式会社 窒化シリコン膜の成膜方法及び成膜装置
JP5675331B2 (ja) * 2010-12-27 2015-02-25 東京エレクトロン株式会社 トレンチの埋め込み方法
JP5977002B2 (ja) * 2011-08-25 2016-08-24 東京エレクトロン株式会社 トレンチの埋め込み方法および半導体集積回路装置の製造方法
JP5793398B2 (ja) * 2011-10-28 2015-10-14 東京エレクトロン株式会社 シード層の形成方法及びシリコン含有薄膜の成膜方法
US9353442B2 (en) 2011-10-28 2016-05-31 Tokyo Electron Limited Apparatus for forming silicon-containing thin film
JP5829196B2 (ja) * 2011-10-28 2015-12-09 東京エレクトロン株式会社 シリコン酸化物膜の成膜方法
JP5780981B2 (ja) * 2012-03-02 2015-09-16 東京エレクトロン株式会社 ゲルマニウム薄膜の成膜方法
JP5792101B2 (ja) * 2012-03-15 2015-10-07 東京エレクトロン株式会社 積層半導体膜の成膜方法
KR101862547B1 (ko) 2012-04-13 2018-05-31 삼성전자주식회사 폴리실리콘막 형성 방법 및 반도체 장치의 제조 방법
JP6022273B2 (ja) * 2012-09-14 2016-11-09 株式会社日立国際電気 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム
JP6022272B2 (ja) 2012-09-14 2016-11-09 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
JP5876398B2 (ja) * 2012-10-18 2016-03-02 東京エレクトロン株式会社 成膜方法及び成膜装置
JP6068130B2 (ja) 2012-12-25 2017-01-25 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
JP5925673B2 (ja) 2012-12-27 2016-05-25 東京エレクトロン株式会社 シリコン膜の成膜方法および成膜装置
JP5947710B2 (ja) * 2012-12-27 2016-07-06 東京エレクトロン株式会社 シード層の形成方法、シリコン膜の成膜方法および成膜装置
JP6125279B2 (ja) 2013-03-05 2017-05-10 株式会社日立国際電気 半導体装置の製造方法、基板処理装置およびプログラム
JP6082712B2 (ja) 2013-07-31 2017-02-15 東京エレクトロン株式会社 シリコン膜の成膜方法および薄膜の成膜方法
JP6092040B2 (ja) * 2013-08-02 2017-03-08 東京エレクトロン株式会社 シリコン膜の形成方法およびその形成装置
KR101489306B1 (ko) * 2013-10-21 2015-02-11 주식회사 유진테크 어모퍼스 실리콘막의 증착 방법 및 증착 장치
JP6348707B2 (ja) * 2013-12-11 2018-06-27 東京エレクトロン株式会社 アモルファスシリコンの結晶化方法、結晶化シリコン膜の成膜方法、半導体装置の製造方法および成膜装置
KR101507381B1 (ko) 2014-02-26 2015-03-30 주식회사 유진테크 폴리실리콘 막의 성막 방법
KR20150108664A (ko) * 2014-03-18 2015-09-30 주식회사 유진테크 머티리얼즈 전구체 화합물 및 이를 이용한 박막 증착 방법, 어모퍼스 실리콘막의 증착방법
JP2015192063A (ja) * 2014-03-28 2015-11-02 東京エレクトロン株式会社 アモルファスシリコン膜形成装置の洗浄方法、アモルファスシリコン膜の形成方法およびアモルファスシリコン膜形成装置
US20150303060A1 (en) * 2014-04-16 2015-10-22 Samsung Electronics Co., Ltd. Silicon precursor, method of forming a layer using the same, and method of fabricating semiconductor device using the same
SG10201506694QA (en) * 2014-09-03 2016-04-28 Silcotek Corp Chemical vapor deposition process and coated article
US9915001B2 (en) 2014-09-03 2018-03-13 Silcotek Corp. Chemical vapor deposition process and coated article
KR102334110B1 (ko) * 2014-10-24 2021-12-02 삼성전자주식회사 반도체 소자 형성방법
KR101706747B1 (ko) * 2015-05-08 2017-02-15 주식회사 유진테크 비정질 박막의 형성방법
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