JP4964780B2 - ワイヤボンド相互接続、半導体パッケージ、および、ワイヤボンド相互接続の形成方法 - Google Patents

ワイヤボンド相互接続、半導体パッケージ、および、ワイヤボンド相互接続の形成方法 Download PDF

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JP4964780B2
JP4964780B2 JP2007541391A JP2007541391A JP4964780B2 JP 4964780 B2 JP4964780 B2 JP 4964780B2 JP 2007541391 A JP2007541391 A JP 2007541391A JP 2007541391 A JP2007541391 A JP 2007541391A JP 4964780 B2 JP4964780 B2 JP 4964780B2
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bond
substrate
wire
die
finger
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Expired - Lifetime
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Japanese (ja)
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JP2008520111A5 (https=
JP2008520111A (ja
Inventor
リー，フン−テーク
キム，ジョン−クック
キム，チュルシック
ジャン，キ−ヨン
ペンゼ，ラジェンドラ，ディー．
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Stats Chippac Inc
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Stats Chippac Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W99/00—Subject matter not provided for in other groups of this subclass

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  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2007541391A 2004-11-12 2005-11-14 ワイヤボンド相互接続、半導体パッケージ、および、ワイヤボンド相互接続の形成方法 Expired - Lifetime JP4964780B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62765004P 2004-11-12 2004-11-12
US60/627,650 2004-11-12
PCT/US2005/041116 WO2006053277A2 (en) 2004-11-12 2005-11-14 Wire bond interconnection

Publications (3)

Publication Number Publication Date
JP2008520111A JP2008520111A (ja) 2008-06-12
JP2008520111A5 JP2008520111A5 (https=) 2008-12-25
JP4964780B2 true JP4964780B2 (ja) 2012-07-04

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JP2007541391A Expired - Lifetime JP4964780B2 (ja) 2004-11-12 2005-11-14 ワイヤボンド相互接続、半導体パッケージ、および、ワイヤボンド相互接続の形成方法

Country Status (5)

Country Link
US (4) US7453156B2 (https=)
JP (1) JP4964780B2 (https=)
KR (1) KR101227228B1 (https=)
TW (1) TWI368974B (https=)
WO (1) WO2006053277A2 (https=)

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US8519517B2 (en) * 2004-11-13 2013-08-27 Stats Chippac Ltd. Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
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US7863099B2 (en) * 2007-06-27 2011-01-04 Stats Chippac Ltd. Integrated circuit package system with overhanging connection stack
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US7973394B2 (en) * 2009-06-10 2011-07-05 Blondwich Limited Enhanced integrated circuit package
KR102293198B1 (ko) * 2009-09-16 2021-08-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
US8304921B2 (en) * 2009-11-13 2012-11-06 Stats Chippac Ltd. Integrated circuit packaging system with interconnect and method of manufacture thereof
US8039384B2 (en) 2010-03-09 2011-10-18 Stats Chippac, Ltd. Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
US8409978B2 (en) 2010-06-24 2013-04-02 Stats Chippac, Ltd. Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
US8609525B2 (en) * 2011-03-21 2013-12-17 Stats Chippac Ltd. Integrated circuit packaging system with interconnects and method of manufacture thereof
JP5990897B2 (ja) 2011-11-25 2016-09-14 ソニー株式会社 電力制御装置、送電装置、および電力制御システム
US8643159B2 (en) 2012-04-09 2014-02-04 Freescale Semiconductor, Inc. Lead frame with grooved lead finger
JP2013229368A (ja) * 2012-04-24 2013-11-07 Denso Corp 電子装置およびその製造方法
JP5894502B2 (ja) * 2012-06-04 2016-03-30 ローム株式会社 ワイヤボンディング構造および半導体装置
US9837188B2 (en) * 2012-07-06 2017-12-05 Nxp B.V. Differential return loss supporting high speed bus interfaces
CN104603943B (zh) * 2012-09-24 2017-07-04 瑞萨电子株式会社 半导体器件的制造方法以及半导体器件
US8680660B1 (en) 2013-03-12 2014-03-25 Freescale Semiconductor, Inc. Brace for bond wire
US20140312474A1 (en) * 2013-04-19 2014-10-23 Texas Instruments Incorporated Semiconductor package with wire bonding
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
JP6279339B2 (ja) * 2014-02-07 2018-02-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9881870B2 (en) * 2015-12-30 2018-01-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and manufacturing method thereof
US10600756B1 (en) 2017-02-15 2020-03-24 United States Of America, As Represented By The Secretary Of The Navy Wire bonding technique for integrated circuit board connections
CN114222737B (zh) 2019-05-31 2024-07-26 詹森药业有限公司 NF-κB诱导激酶的小分子抑制剂
KR20230173269A (ko) 2022-06-16 2023-12-27 삼성전자주식회사 반도체 패키지
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US8129263B2 (en) 2012-03-06
US20100225008A1 (en) 2010-09-09
US7453156B2 (en) 2008-11-18
WO2006053277A3 (en) 2007-06-21
US20110266700A1 (en) 2011-11-03
TW200623373A (en) 2006-07-01
TWI368974B (en) 2012-07-21
KR20070084060A (ko) 2007-08-24
US7986047B2 (en) 2011-07-26
US20080135997A1 (en) 2008-06-12
WO2006053277A2 (en) 2006-05-18
US7745322B2 (en) 2010-06-29
JP2008520111A (ja) 2008-06-12
US20060113665A1 (en) 2006-06-01

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