JP4961761B2 - 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 - Google Patents

半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 Download PDF

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Publication number
JP4961761B2
JP4961761B2 JP2006029277A JP2006029277A JP4961761B2 JP 4961761 B2 JP4961761 B2 JP 4961761B2 JP 2006029277 A JP2006029277 A JP 2006029277A JP 2006029277 A JP2006029277 A JP 2006029277A JP 4961761 B2 JP4961761 B2 JP 4961761B2
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Japan
Prior art keywords
semiconductor device
adhesive composition
adhesive
heating
semiconductor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2006029277A
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English (en)
Japanese (ja)
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JP2006249415A5 (enExample
JP2006249415A (ja
Inventor
洋子 大澤
浩史 土谷
幸綱 小西
泰司 澤村
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP2006029277A priority Critical patent/JP4961761B2/ja
Publication of JP2006249415A publication Critical patent/JP2006249415A/ja
Publication of JP2006249415A5 publication Critical patent/JP2006249415A5/ja
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Publication of JP4961761B2 publication Critical patent/JP4961761B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2006029277A 2005-02-09 2006-02-07 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 Expired - Fee Related JP4961761B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006029277A JP4961761B2 (ja) 2005-02-09 2006-02-07 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005032897 2005-02-09
JP2005032897 2005-02-09
JP2006029277A JP4961761B2 (ja) 2005-02-09 2006-02-07 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置

Publications (3)

Publication Number Publication Date
JP2006249415A JP2006249415A (ja) 2006-09-21
JP2006249415A5 JP2006249415A5 (enExample) 2008-11-20
JP4961761B2 true JP4961761B2 (ja) 2012-06-27

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JP2006029277A Expired - Fee Related JP4961761B2 (ja) 2005-02-09 2006-02-07 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置

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JP (1) JP4961761B2 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5137538B2 (ja) * 2007-11-28 2013-02-06 リンテック株式会社 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP2009203338A (ja) * 2008-02-27 2009-09-10 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
JP5521364B2 (ja) * 2008-03-18 2014-06-11 日立化成株式会社 接着シート
JP5549182B2 (ja) * 2008-10-28 2014-07-16 日立化成株式会社 接着シート及びこれを用いた半導体装置の製造方法
JP5160380B2 (ja) * 2008-11-12 2013-03-13 新日鉄住金化学株式会社 フィルム状接着剤、それを用いた半導体パッケージ及びその製造方法
JP5168736B2 (ja) * 2009-02-06 2013-03-27 信越化学工業株式会社 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム
JP5023179B2 (ja) * 2010-03-31 2012-09-12 リンテック株式会社 チップ用樹脂膜形成用シートおよび半導体チップの製造方法
JP2012153819A (ja) * 2011-01-27 2012-08-16 Lintec Corp 接着剤組成物および接着シート
JP5742478B2 (ja) * 2011-05-31 2015-07-01 日立化成株式会社 接着シート
JP5828706B2 (ja) * 2011-08-03 2015-12-09 日東電工株式会社 ダイシング・ダイボンドフィルム
JP6148430B2 (ja) * 2011-07-26 2017-06-14 日東電工株式会社 接着シート及びその用途
JP2013187376A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
JP2013187375A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
JP6123243B2 (ja) * 2012-11-12 2017-05-10 味の素株式会社 絶縁樹脂材料
JP6314569B2 (ja) * 2013-03-22 2018-04-25 東レ株式会社 電子機器用接着剤組成物および電子機器用接着剤シート
JP6122726B2 (ja) * 2013-07-29 2017-04-26 日東シンコー株式会社 シール材
JP2015129226A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置
JP5751651B2 (ja) * 2014-05-22 2015-07-22 リンテック株式会社 接着シートおよび半導体装置の製造方法
JP6319495B2 (ja) * 2017-04-05 2018-05-09 味の素株式会社 絶縁樹脂材料
JP6695922B2 (ja) * 2018-04-05 2020-05-20 味の素株式会社 絶縁樹脂材料
JP6860038B2 (ja) * 2019-06-10 2021-04-14 味の素株式会社 絶縁樹脂材料
JP7346372B2 (ja) 2020-09-08 2023-09-19 株式会社東芝 半導体装置
CN114975290A (zh) * 2022-04-27 2022-08-30 东莞森迈兰电子科技有限公司 一种碳化硅功率模块的耐高温封装结构及其封装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61151286A (ja) * 1984-12-24 1986-07-09 Canon Inc 液晶セル封止用接着剤
JPH0959573A (ja) * 1995-08-22 1997-03-04 Toray Ind Inc Ｔａｂ用接着剤付きテープおよび半導体装置
JPH09255933A (ja) * 1996-03-21 1997-09-30 Nitto Denko Corp シート状接着材料およびその硬化物
JP3554249B2 (ja) * 2000-03-27 2004-08-18 京セラ株式会社 接着材およびこれを用いた電子部品
JP4729778B2 (ja) * 2000-09-13 2011-07-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2006342333A (ja) * 2005-04-13 2006-12-21 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板

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