JP4961223B2 - プラズマ処理装置の圧力制御方法 - Google Patents

プラズマ処理装置の圧力制御方法 Download PDF

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Publication number
JP4961223B2
JP4961223B2 JP2007021692A JP2007021692A JP4961223B2 JP 4961223 B2 JP4961223 B2 JP 4961223B2 JP 2007021692 A JP2007021692 A JP 2007021692A JP 2007021692 A JP2007021692 A JP 2007021692A JP 4961223 B2 JP4961223 B2 JP 4961223B2
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Japan
Prior art keywords
pressure
control method
gas
value
control
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JP2007021692A
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English (en)
Japanese (ja)
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JP2008187139A5 (https=
JP2008187139A (ja
Inventor
直行 小藤
博 秋山
征洋 長谷
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2007021692A priority Critical patent/JP4961223B2/ja
Priority to US11/767,547 priority patent/US7680563B2/en
Publication of JP2008187139A publication Critical patent/JP2008187139A/ja
Publication of JP2008187139A5 publication Critical patent/JP2008187139A5/ja
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G05D16/2006—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2066—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source
    • G05D16/2073—Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source with a plurality of pressure sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0396—Involving pressure control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/2496—Self-proportioning or correlating systems
    • Y10T137/2559—Self-controlled branched flow systems
    • Y10T137/2564—Plural inflows
    • Y10T137/2572—One inflow supplements another
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7761—Electrically actuated valve
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7762—Fluid pressure type
    • Y10T137/7764—Choked or throttled pressure type
    • Y10T137/7768—Pilot controls supply to pressure chamber

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Feedback Control In General (AREA)
JP2007021692A 2007-01-31 2007-01-31 プラズマ処理装置の圧力制御方法 Active JP4961223B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007021692A JP4961223B2 (ja) 2007-01-31 2007-01-31 プラズマ処理装置の圧力制御方法
US11/767,547 US7680563B2 (en) 2007-01-31 2007-06-25 Pressure control device for low pressure processing chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007021692A JP4961223B2 (ja) 2007-01-31 2007-01-31 プラズマ処理装置の圧力制御方法

Publications (3)

Publication Number Publication Date
JP2008187139A JP2008187139A (ja) 2008-08-14
JP2008187139A5 JP2008187139A5 (https=) 2009-08-13
JP4961223B2 true JP4961223B2 (ja) 2012-06-27

Family

ID=39668890

Family Applications (1)

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JP2007021692A Active JP4961223B2 (ja) 2007-01-31 2007-01-31 プラズマ処理装置の圧力制御方法

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US (1) US7680563B2 (https=)
JP (1) JP4961223B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4815538B2 (ja) * 2010-01-15 2011-11-16 シーケーディ株式会社 真空制御システムおよび真空制御方法
TWM423354U (en) * 2011-08-10 2012-02-21 Ableprint Technology Co Ltd Gas concentrations control device of pressure container
JP6274717B2 (ja) * 2012-07-12 2018-02-07 特定非営利活動法人ナノフォトニクス工学推進機構 近接場光を用いたエッチング方法
JP6173851B2 (ja) * 2013-09-20 2017-08-02 株式会社日立ハイテクノロジーズ 分析方法およびプラズマエッチング装置
JP5854335B2 (ja) * 2013-11-20 2016-02-09 プログレッシオ合同会社 処理チャンバの圧力制御方法及び処理チャンバの圧力制御装置
WO2017066252A1 (en) * 2015-10-13 2017-04-20 Hyperloop Technologies, Inc. Adjustable variable atmospheric condition testing apparatus and method
JP6749268B2 (ja) * 2017-03-07 2020-09-02 東京エレクトロン株式会社 基板処理装置
JP6841201B2 (ja) * 2017-10-06 2021-03-10 株式会社島津製作所 ガス推定装置および真空排気装置
JP7061489B2 (ja) * 2018-03-20 2022-04-28 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、基板処理装置および減圧乾燥方法
DE102019133010A1 (de) * 2019-12-04 2021-06-10 Zf Cv Systems Global Gmbh Ausfallsicherheitsventileinheit für eine Parkbremsfunktion sowie Parkbremsventilanordnung
JP7750775B2 (ja) * 2022-03-02 2025-10-07 株式会社Ｓｃｒｅｅｎホールディングス 制御支援装置および制御支援方法
KR102864350B1 (ko) * 2022-05-18 2025-09-24 주식회사 히타치하이테크 플라스마 처리 장치 및 가스의 배기 방법
JP7458664B1 (ja) 2022-09-28 2024-04-01 兼松エンジニアリング株式会社 減圧型マイクロ波乾燥装置及び減圧型マイクロ波乾燥方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278615A (ja) * 1985-10-02 1987-04-10 Hitachi Ltd 圧力調整制御方法
JPH06236857A (ja) * 1993-02-09 1994-08-23 Hitachi Ltd 半導体製造装置の圧力制御方法
US6142163A (en) * 1996-03-29 2000-11-07 Lam Research Corporation Method and apparatus for pressure control in vacuum processors
JPH1011152A (ja) 1996-06-26 1998-01-16 Dainippon Screen Mfg Co Ltd 減圧処理装置の真空排気装置
JP3751012B2 (ja) * 1997-08-12 2006-03-01 東京エレクトロン株式会社 半導体プラズマ装置における圧力系の制御方法及びその装置
JP2000284832A (ja) * 1999-03-31 2000-10-13 Komatsu Ltd 温度制御装置及び同装置のバルブ制御部
JP4346741B2 (ja) * 1999-08-05 2009-10-21 キヤノンアネルバ株式会社 発熱体ｃｖｄ装置及び付着膜の除去方法
JP2001202138A (ja) * 2000-01-20 2001-07-27 Matsushita Electric Ind Co Ltd 反応室の制御方法と反応室の制御装置
US6896764B2 (en) * 2001-11-28 2005-05-24 Tokyo Electron Limited Vacuum processing apparatus and control method thereof
US7013834B2 (en) * 2002-04-19 2006-03-21 Nordson Corporation Plasma treatment system
JP4718141B2 (ja) * 2004-08-06 2011-07-06 東京エレクトロン株式会社 薄膜形成方法及び薄膜形成装置

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Publication number Publication date
US20080183340A1 (en) 2008-07-31
US7680563B2 (en) 2010-03-16
JP2008187139A (ja) 2008-08-14

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