JP6274717B2 - 近接場光を用いたエッチング方法 - Google Patents
近接場光を用いたエッチング方法 Download PDFInfo
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- JP6274717B2 JP6274717B2 JP2012156812A JP2012156812A JP6274717B2 JP 6274717 B2 JP6274717 B2 JP 6274717B2 JP 2012156812 A JP2012156812 A JP 2012156812A JP 2012156812 A JP2012156812 A JP 2012156812A JP 6274717 B2 JP6274717 B2 JP 6274717B2
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- 238000000034 method Methods 0.000 title claims description 51
- 238000005530 etching Methods 0.000 title description 19
- 239000000758 substrate Substances 0.000 claims description 60
- 239000010409 thin film Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 8
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 239000007789 gas Substances 0.000 description 49
- 238000006243 chemical reaction Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 5
- 229910002601 GaN Inorganic materials 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000001902 propagating effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000010494 dissociation reaction Methods 0.000 description 3
- 230000005593 dissociations Effects 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000006303 photolysis reaction Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- -1 BCl 3 Substances 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004776 molecular orbital Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- QYSGYZVSCZSLHT-UHFFFAOYSA-N octafluoropropane Chemical compound FC(F)(F)C(F)(F)C(F)(F)F QYSGYZVSCZSLHT-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229960004065 perflutren Drugs 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
2 基板
3 薄膜
4 ナノオーダーの構造部分
10 基板積層体
11 チャンバ
12 基板
13 ステージ
14 光源
15 反射ミラー
16 照明光学系
17 ガス供給部
18 開口窓
19 排気口
21 凸部
Claims (2)
- GaNからなる基板と、前記基板の表面に積層された前記基板と異なるSiO2よりなる薄膜と、を有する基板積層体の表面において、前記薄膜の一部が残存したナノオーダーの凸部を前記凸部の素材に基づき選択的に除去する表面平坦化方法であって、
チャンバ内に前記基板積層体を載置する載置工程と、
前記チャンバ内に、活性種となった場合に前記凸部の素材に基づき前記凸部と選択的に反応する反応性ガスを導入する導入工程と、
前記凸部に近接場光を発生しうる波長の光を、前記基板積層体に照射する照射工程と、
前記光の照射により前記凸部の局所領域に発生した近接場光に基づく非共鳴過程を経て、前記反応性ガスを解離させて前記活性種を生成させる活性種生成工程と、
生成された前記活性種と前記凸部とを化学反応させて反応生成物を生成させることにより、前記凸部のみを前記凸部の素材に基づき選択的に除去する除去工程と、
を有することを特徴とする表面平坦化方法。 - 前記反応性ガスがハロゲン系ガスよりなる請求項1の表面平坦化方法。
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JP6274717B2 true JP6274717B2 (ja) | 2018-02-07 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6291285B2 (ja) * | 2014-02-26 | 2018-03-14 | 特定非営利活動法人ナノフォトニクス工学推進機構 | 表面平坦化方法及び表面平坦化システム |
JP2021125541A (ja) * | 2020-02-04 | 2021-08-30 | キオクシア株式会社 | 処理装置および処理方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5789474A (en) * | 1980-11-21 | 1982-06-03 | Hitachi Ltd | Detection of final point of etching and apparatus therefor |
JP2656869B2 (ja) * | 1991-12-24 | 1997-09-24 | 沖電気工業株式会社 | ドライエッチングにおける終点検出方法 |
JP3201159B2 (ja) * | 1994-08-29 | 2001-08-20 | 松下電器産業株式会社 | 薄膜トランジスタの製造方法 |
JP2601229B2 (ja) * | 1994-12-22 | 1997-04-16 | 日本電気株式会社 | 半導体光素子構造およびそのエッチング方法 |
JP2001215352A (ja) * | 2000-02-04 | 2001-08-10 | Hitachi Cable Ltd | 三次元コア導波路を有する石英系ガラス導波路の製造方法 |
US7062130B2 (en) * | 2003-05-01 | 2006-06-13 | Arthur Telkamp | Low-loss optical waveguide crossovers using an out-of-plane waveguide |
TW200802544A (en) * | 2006-04-25 | 2008-01-01 | Osram Opto Semiconductors Gmbh | Composite substrate and method for making the same |
JP2008117922A (ja) * | 2006-11-02 | 2008-05-22 | Yamaguchi Univ | 半導体発光素子及びその製造方法 |
JP4961223B2 (ja) * | 2007-01-31 | 2012-06-27 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置の圧力制御方法 |
JP4305554B2 (ja) * | 2007-02-28 | 2009-07-29 | ソニー株式会社 | 半導体レーザの製造方法 |
JP5044354B2 (ja) * | 2007-10-10 | 2012-10-10 | 国立大学法人 東京大学 | 表面平坦化方法 |
JP5139092B2 (ja) * | 2008-01-11 | 2013-02-06 | シグマ光機株式会社 | 表面平坦化方法 |
JP2009206333A (ja) * | 2008-02-28 | 2009-09-10 | Nuflare Technology Inc | 半導体製造装置および半導体製造方法 |
JP4700710B2 (ja) * | 2008-05-21 | 2011-06-15 | シグマ光機株式会社 | 光学素子の表面平滑化方法 |
JP2011070107A (ja) * | 2009-09-28 | 2011-04-07 | Nec Corp | 積層光回路の製造方法 |
JP2011107384A (ja) * | 2009-11-17 | 2011-06-02 | Nec Corp | 光結合デバイスの製造方法 |
JP2011203604A (ja) * | 2010-03-26 | 2011-10-13 | Oki Electric Industry Co Ltd | 光学素子とその製造方法 |
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