JP4951609B2 - 回路付サスペンション基板 - Google Patents
回路付サスペンション基板 Download PDFInfo
- Publication number
- JP4951609B2 JP4951609B2 JP2008289048A JP2008289048A JP4951609B2 JP 4951609 B2 JP4951609 B2 JP 4951609B2 JP 2008289048 A JP2008289048 A JP 2008289048A JP 2008289048 A JP2008289048 A JP 2008289048A JP 4951609 B2 JP4951609 B2 JP 4951609B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- auxiliary
- suspension board
- terminal
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4833—Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4866—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives the arm comprising an optical waveguide, e.g. for thermally-assisted recording
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B2005/0002—Special dispositions or recording techniques
- G11B2005/0005—Arrangements, methods or circuits
- G11B2005/0021—Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10537—Attached components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Description
7 導体パターン
13 第1導体パターン
16 ヘッド側端子
17 外部側端子
19 第2導体パターン
20 基板本体部
22 素子側端子
23 供給側端子
25 挿入開口部
26 挿入部
29 挿通開口部
30 補助部
31 光導波路
35 外部回路基板
38 磁気ヘッド
39 スライダ
40 発光素子
50 出射開口部
Claims (6)
- 導体パターンを備える回路付サスペンション基板であって、
基板本体部と、
前記基板本体部から連続して形成され、前記基板本体部に対して前記基板本体部の裏面と対向するように、折り返された補助部とを備え、
回路付サスペンション基板において、前記基板本体部と前記補助部との対向方向の前記基板本体部側に配置され、前記導体パターンと電気的に接続される磁気ヘッドを搭載するスライダと、
回路付サスペンション基板において、前記基板本体部と前記補助部との対向方向の前記補助部側に配置され、前記導体パターンと電気的に接続される発光素子とをさらに備え、
前記導体パターンは、
外部回路に電気的に接続される第1端子と、前記磁気ヘッドに電気的に接続される第2端子とを備える第1導体パターンと、
外部回路に電気的に接続される第3端子と、前記発光素子に電気的に接続される第4端子とを備える第2導体パターンと
を備え、
前記第1導体パターンにおいて、前記第1端子および前記第2端子は、ともに前記基板本体部に配置されており、
前記第2導体パターンにおいて、前記第3端子は前記基板本体部に配置され、前記第4端子は前記補助部に配置されていることを特徴とする、回路付サスペンション基板。 - 前記スライダと前記発光素子とは、厚み方向において対向配置されていることを特徴とする、請求項1に記載の回路付サスペンション基板。
- 前記スライダは、光導波路を備え、
前記発光素子は、前記光導波路と厚み方向において対向するように、前記スライダの裏面に配置されており、
前記基板本体部および前記補助部には、前記発光素子が挿通されるように、それらの厚み方向を貫通する第1開口部が形成されていることを特徴とする、請求項1または2に記載の回路付サスペンション基板。 - 前記スライダは、光導波路を備え、
前記発光素子から出射される光が通過して前記光導波路に入射されるように、前記基板本体部および前記補助部には、それらの厚み方向を貫通する第2開口部が形成されていることを特徴とする、請求項1または2に記載の回路付サスペンション基板。 - 前記基板本体部には、厚み方向を貫通する第3開口部が形成されており、
前記補助部は、前記第3開口部に挿入される挿入部を備えていることを特徴とする、請求項1〜4のいずれかに記載の回路付サスペンション基板。 - 前記基板本体部と前記補助部とは、溶接により接合されていることを特徴とする、請求項1〜5のいずれかに記載の回路付サスペンション基板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008289048A JP4951609B2 (ja) | 2008-11-11 | 2008-11-11 | 回路付サスペンション基板 |
CN200910205599.1A CN101740040B (zh) | 2008-11-11 | 2009-10-30 | 带电路的悬挂基板 |
US12/591,102 US8194353B2 (en) | 2008-11-11 | 2009-11-09 | Suspension board with circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008289048A JP4951609B2 (ja) | 2008-11-11 | 2008-11-11 | 回路付サスペンション基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010118097A JP2010118097A (ja) | 2010-05-27 |
JP4951609B2 true JP4951609B2 (ja) | 2012-06-13 |
Family
ID=42165001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008289048A Expired - Fee Related JP4951609B2 (ja) | 2008-11-11 | 2008-11-11 | 回路付サスペンション基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8194353B2 (ja) |
JP (1) | JP4951609B2 (ja) |
CN (1) | CN101740040B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008172012A (ja) * | 2007-01-11 | 2008-07-24 | Nitto Denko Corp | 回路付サスペンション基板 |
JP5002574B2 (ja) * | 2008-11-11 | 2012-08-15 | 日東電工株式会社 | 回路付サスペンション基板およびその製造方法 |
JP5204679B2 (ja) * | 2009-01-23 | 2013-06-05 | 日東電工株式会社 | 回路付サスペンション基板 |
US8861142B2 (en) * | 2010-10-13 | 2014-10-14 | Nitto Denko Corporation | Suspension board with circuit and producing method thereof |
JP5801085B2 (ja) | 2011-03-31 | 2015-10-28 | 日東電工株式会社 | 回路付サスペンション基板 |
JP5311237B2 (ja) * | 2011-04-11 | 2013-10-09 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、ハードディスクドライブおよびサスペンション用基板の製造方法 |
JP5770837B2 (ja) * | 2011-04-25 | 2015-08-26 | 株式会社日立製作所 | ヘッドジンバルアセンブリ、ヘッドアセンブリ及び磁気ディスク装置 |
JP6245917B2 (ja) * | 2013-10-04 | 2017-12-13 | キヤノン株式会社 | 回路基板、及び電子機器 |
JP6044688B2 (ja) * | 2015-09-07 | 2016-12-14 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンションおよびハードディスクドライブ |
JP6802688B2 (ja) * | 2016-11-02 | 2020-12-16 | 日東電工株式会社 | 配線回路基板 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0778436A (ja) | 1993-09-09 | 1995-03-20 | Sony Corp | ヘッド浮上装置 |
US5723033A (en) * | 1995-09-06 | 1998-03-03 | Akashic Memories Corporation | Discrete track media produced by underlayer laser ablation |
JP3201968B2 (ja) | 1997-02-28 | 2001-08-27 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Fpcケーブルおよびキャリッジユニットならびにディスク装置 |
JPH10293915A (ja) | 1997-04-21 | 1998-11-04 | Nippon Mektron Ltd | 磁気ヘッド用可撓性回路基板 |
JP2000348451A (ja) * | 1999-06-03 | 2000-12-15 | Tdk Corp | 磁気ヘッド装置及び該装置の製造方法 |
US6110330A (en) * | 1999-06-28 | 2000-08-29 | Trace Storage Technology Corp | Process for bonding lubricant to magnetic disk |
JP2001023138A (ja) | 1999-07-02 | 2001-01-26 | Fujitsu Ltd | ヘッドアセンブリ及びこれを備えたディスク装置 |
EP1345226A1 (en) | 2000-12-20 | 2003-09-17 | Fujitsu Limited | Suspension and disk device |
JP2002216327A (ja) * | 2001-01-22 | 2002-08-02 | Hitachi Ltd | ヘッド用サスペンションおよびicチップの実装方法 |
JP2003045004A (ja) * | 2001-07-27 | 2003-02-14 | Fuji Xerox Co Ltd | 光アシスト磁気ヘッド及び光アシスト磁気ディスク装置 |
JP2003173643A (ja) | 2001-12-07 | 2003-06-20 | Nhk Spring Co Ltd | ディスクドライブ用サスペンション |
JP4104957B2 (ja) | 2002-11-07 | 2008-06-18 | 日本発条株式会社 | サスペンション用部品の接合処理装置 |
JP2005071465A (ja) | 2003-08-25 | 2005-03-17 | Nhk Spring Co Ltd | 板材溶接構造及びヘッドサスペンション |
JP4074265B2 (ja) * | 2004-04-28 | 2008-04-09 | 株式会社東芝 | ヘッドサスペンションアッセンブリおよびこれを備えたディスク装置 |
JP4377775B2 (ja) | 2004-08-20 | 2009-12-02 | 日本発條株式会社 | ディスクドライブ用サスペンション |
JP4635607B2 (ja) | 2004-12-28 | 2011-02-23 | Tdk株式会社 | 熱アシスト磁気記録ヘッド及び熱アシスト磁気記録装置 |
JP2007157209A (ja) | 2005-12-01 | 2007-06-21 | Hitachi Global Storage Technologies Netherlands Bv | 磁気記録装置 |
JP2007207349A (ja) | 2006-02-02 | 2007-08-16 | Tdk Corp | 近接場光発生部を備えた薄膜磁気ヘッド |
US7773342B2 (en) | 2006-01-30 | 2010-08-10 | Tdk Corporation | Thin-film magnetic head having near-field-light-generating portion with trapezoidal end |
JP4236673B2 (ja) | 2006-04-12 | 2009-03-11 | 株式会社日立製作所 | 近接場光発生器及び近接場光記録再生装置 |
JP4335886B2 (ja) * | 2006-04-20 | 2009-09-30 | 日本発條株式会社 | ディスクドライブ用サスペンション |
CN101114463A (zh) | 2006-07-25 | 2008-01-30 | 新科实业有限公司 | 微致动器、带有微致动器的磁头万向节组件及其制造方法 |
JP4049196B2 (ja) | 2006-10-02 | 2008-02-20 | 富士ゼロックス株式会社 | 光アシスト磁気ヘッド及び光アシスト磁気ディスク装置 |
JP2008130106A (ja) | 2006-11-16 | 2008-06-05 | Hitachi Ltd | 熱アシスト磁気記録ヘッド支持機構 |
JP4162697B2 (ja) | 2006-11-21 | 2008-10-08 | 日東電工株式会社 | 回路付サスペンション基板およびその製造方法 |
EP1926089B1 (en) | 2006-11-21 | 2010-01-13 | Nitto Denko Corporation | Suspension board with circuit and producing method thereof |
JP5204679B2 (ja) * | 2009-01-23 | 2013-06-05 | 日東電工株式会社 | 回路付サスペンション基板 |
-
2008
- 2008-11-11 JP JP2008289048A patent/JP4951609B2/ja not_active Expired - Fee Related
-
2009
- 2009-10-30 CN CN200910205599.1A patent/CN101740040B/zh not_active Expired - Fee Related
- 2009-11-09 US US12/591,102 patent/US8194353B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101740040A (zh) | 2010-06-16 |
JP2010118097A (ja) | 2010-05-27 |
CN101740040B (zh) | 2014-02-19 |
US20100118445A1 (en) | 2010-05-13 |
US8194353B2 (en) | 2012-06-05 |
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