JP4950500B2 - プリント配線基板の接合構造 - Google Patents

プリント配線基板の接合構造 Download PDF

Info

Publication number
JP4950500B2
JP4950500B2 JP2006028679A JP2006028679A JP4950500B2 JP 4950500 B2 JP4950500 B2 JP 4950500B2 JP 2006028679 A JP2006028679 A JP 2006028679A JP 2006028679 A JP2006028679 A JP 2006028679A JP 4950500 B2 JP4950500 B2 JP 4950500B2
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
exposed
conductive patterns
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006028679A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007208200A5 (enExample
JP2007208200A (ja
Inventor
幸司 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006028679A priority Critical patent/JP4950500B2/ja
Priority to US11/671,729 priority patent/US7445456B2/en
Publication of JP2007208200A publication Critical patent/JP2007208200A/ja
Publication of JP2007208200A5 publication Critical patent/JP2007208200A5/ja
Application granted granted Critical
Publication of JP4950500B2 publication Critical patent/JP4950500B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2006028679A 2006-02-06 2006-02-06 プリント配線基板の接合構造 Expired - Fee Related JP4950500B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006028679A JP4950500B2 (ja) 2006-02-06 2006-02-06 プリント配線基板の接合構造
US11/671,729 US7445456B2 (en) 2006-02-06 2007-02-06 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006028679A JP4950500B2 (ja) 2006-02-06 2006-02-06 プリント配線基板の接合構造

Publications (3)

Publication Number Publication Date
JP2007208200A JP2007208200A (ja) 2007-08-16
JP2007208200A5 JP2007208200A5 (enExample) 2009-03-12
JP4950500B2 true JP4950500B2 (ja) 2012-06-13

Family

ID=38334617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006028679A Expired - Fee Related JP4950500B2 (ja) 2006-02-06 2006-02-06 プリント配線基板の接合構造

Country Status (2)

Country Link
US (1) US7445456B2 (enExample)
JP (1) JP4950500B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8766099B2 (en) * 2009-09-29 2014-07-01 Apple Inc. Component mounting structures for electronic devices
US8476538B2 (en) * 2010-03-08 2013-07-02 Formfactor, Inc. Wiring substrate with customization layers
JP2012156257A (ja) 2011-01-25 2012-08-16 Fujitsu Ltd 回路基板及び電子装置
US20120325524A1 (en) * 2011-06-23 2012-12-27 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
KR101414056B1 (ko) * 2011-12-29 2014-07-04 (주)멜파스 배선 기판 및 배선 기판 제조 방법
JP2014132299A (ja) * 2013-01-07 2014-07-17 Japan Display Inc 表示装置
CN105163507A (zh) * 2015-08-11 2015-12-16 深圳崇达多层线路板有限公司 一种提升碳油良率的方法
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
CN112867237B (zh) * 2021-02-23 2025-10-14 京东方科技集团股份有限公司 一种印刷线路板及其制备方法、显示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60194377U (ja) * 1984-06-01 1985-12-24 株式会社フジクラ フレキシブル印刷回路板
JPS61224494A (ja) * 1985-03-29 1986-10-06 キヤノン株式会社 プリント基板の接合方法
JPH03230595A (ja) * 1990-02-05 1991-10-14 Nitto Denko Corp フレキシブルプリント基板
JP3376218B2 (ja) * 1996-08-30 2003-02-10 キヤノン株式会社 回路基板接続装置
JPH10173335A (ja) * 1996-12-16 1998-06-26 Sony Corp フレキシブル基板およびその接続方法
US5924873A (en) * 1997-05-15 1999-07-20 Chrysler Corporation Flexible circuit board interconnect with strain relief
US6089920A (en) * 1998-05-04 2000-07-18 Micron Technology, Inc. Modular die sockets with flexible interconnects for packaging bare semiconductor die
US6887095B2 (en) * 2002-12-30 2005-05-03 Intel Corporation Electromagnetic coupler registration and mating
TW559378U (en) * 2003-01-29 2003-10-21 Hon Hai Prec Ind Co Ltd Electrical connector
US7187555B2 (en) * 2003-06-10 2007-03-06 Hewlett-Packard Development Company, L.P. Card guide for expansion circuit card
US7236358B2 (en) * 2003-06-11 2007-06-26 Hewlett-Packard Development Company, L.P. Computer system
KR100616101B1 (ko) * 2003-08-06 2006-08-25 이화트론 주식회사 슬롯 형태의 메인보드를 갖춘 디지털 비디오 레코더
JP4318585B2 (ja) * 2004-04-22 2009-08-26 日東電工株式会社 配線回路基板

Also Published As

Publication number Publication date
JP2007208200A (ja) 2007-08-16
US20070184675A1 (en) 2007-08-09
US7445456B2 (en) 2008-11-04

Similar Documents

Publication Publication Date Title
US7445456B2 (en) Printed circuit board
JPH0593069U (ja) プリント回路基板
JP6741456B2 (ja) 多層回路基板
JP3012814B2 (ja) フレキシブルプリント基板
JP2000165034A (ja) フレキシブルプリント配線板及びその接続方法
JPH06104547A (ja) フレキシブル基板
JPH0918108A (ja) フレキシブルプリント基板の接続構造
CN115426788B (zh) 印制电路板及其制作方法
JP3799783B2 (ja) フレキシブル配線体の接合体
JP2002359447A (ja) フラットケーブルとプリント基板の接続構造
JP2006108436A (ja) プリント配線板の接続構造
JPH0342692Y2 (enExample)
JP2007012483A (ja) 雄型コネクタ
JP2007281012A (ja) フレキシブル基板及び該フレキシブル基板が実装された実装機器
JP2000165035A (ja) フレキシブルプリント配線板とリジットプリント配線板及びこれらの接続方法
JPH1064652A (ja) フレキシブルプリント配線板とフレキシブルフラットケーブルとの接続方法
JP2004335682A (ja) プリント配線基板の接合構造
JP4899804B2 (ja) フレキシブルプリント配線基板
JP2020177733A (ja) 圧着端子及び圧着端子を介して接続する接続方法
JPH05167242A (ja) フレキシブル回路基板の接合方法
JP2005136339A (ja) 基板接合方法およびその接合構造
JP2006253217A (ja) フレキシブル基板の接続構造、ピックアップ、電子機器およびフレキシブル基板の接続方法
JP2008041848A (ja) 半田付け構造
JPH0426010A (ja) フラットケーブル
JP2010073801A (ja) プリント配線基板の接続方法およびプリント配線ユニット

Legal Events

Date Code Title Description
RD05 Notification of revocation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7425

Effective date: 20070626

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090128

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090128

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110610

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110621

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110822

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120306

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120309

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150316

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150316

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees