JP4936677B2 - スマートセンサーおよびスマートセンサーの製造方法 - Google Patents
スマートセンサーおよびスマートセンサーの製造方法 Download PDFInfo
- Publication number
- JP4936677B2 JP4936677B2 JP2005106025A JP2005106025A JP4936677B2 JP 4936677 B2 JP4936677 B2 JP 4936677B2 JP 2005106025 A JP2005106025 A JP 2005106025A JP 2005106025 A JP2005106025 A JP 2005106025A JP 4936677 B2 JP4936677 B2 JP 4936677B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- smart sensor
- sensitive layer
- layer
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/128—Microapparatus
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0500393.4 | 2005-01-10 | ||
| GBGB0500393.4A GB0500393D0 (en) | 2005-01-10 | 2005-01-10 | Microheaters |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006194853A JP2006194853A (ja) | 2006-07-27 |
| JP2006194853A5 JP2006194853A5 (enExample) | 2011-06-30 |
| JP4936677B2 true JP4936677B2 (ja) | 2012-05-23 |
Family
ID=34203825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005106025A Expired - Lifetime JP4936677B2 (ja) | 2005-01-10 | 2005-04-01 | スマートセンサーおよびスマートセンサーの製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7495300B2 (enExample) |
| JP (1) | JP4936677B2 (enExample) |
| GB (2) | GB0500393D0 (enExample) |
Families Citing this family (79)
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|---|---|---|---|---|
| DE102004022178B4 (de) * | 2004-05-05 | 2008-03-20 | Atmel Germany Gmbh | Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn |
| GB0517869D0 (en) * | 2005-09-02 | 2005-10-12 | Univ Warwick | Gas-sensing semiconductor devices |
| KR100799577B1 (ko) * | 2006-08-31 | 2008-01-30 | 한국전자통신연구원 | 가스 및 생화학물질 감지용 센서 제조 방법과 그 센서를포함하는 집적회로 및 그 제조 방법 |
| JP4814771B2 (ja) * | 2006-12-01 | 2011-11-16 | 本田技研工業株式会社 | ガスセンサ |
| KR100818287B1 (ko) * | 2007-01-10 | 2008-03-31 | 삼성전자주식회사 | 폴리 실리콘의 형성방법, 이 폴리 실리콘을 구비하는 박막트랜지스터 및 그 제조방법 |
| US7989319B2 (en) * | 2007-08-07 | 2011-08-02 | Semiconductor Components Industries, Llc | Semiconductor die singulation method |
| US8859396B2 (en) | 2007-08-07 | 2014-10-14 | Semiconductor Components Industries, Llc | Semiconductor die singulation method |
| GB0720905D0 (en) * | 2007-10-25 | 2007-12-05 | Cambridge Entpr Ltd | Shear stress sensors |
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| EP2141491A1 (de) * | 2008-07-02 | 2010-01-06 | Micronas GmbH | Gassensor |
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| US8859303B2 (en) | 2010-01-21 | 2014-10-14 | Cambridge Cmos Sensors Ltd. | IR emitter and NDIR sensor |
| JP5447159B2 (ja) * | 2010-04-30 | 2014-03-19 | Tdk株式会社 | ガスセンサ |
| US8354729B2 (en) | 2010-12-27 | 2013-01-15 | Industrial Technology Research Institute | Gas sensor and manufacturing method thereof |
| EP2500094A1 (en) * | 2011-03-14 | 2012-09-19 | Nxp B.V. | Atmospheric sensor, NFC device, package and manufacturing method |
| US9448198B2 (en) * | 2011-07-05 | 2016-09-20 | Stmicroelectronics Pte Ltd. | Microsensor with integrated temperature control |
| EP2554980B1 (en) * | 2011-08-03 | 2014-06-25 | Nxp B.V. | Integrated circuit with sensor and method of manufacturing such an integrated circuit |
| TWI497057B (zh) | 2012-03-28 | 2015-08-21 | Ind Tech Res Inst | 光學式氣體檢測器 |
| EP2645091B1 (en) * | 2012-03-30 | 2018-10-17 | ams international AG | Integrated circuit comprising a gas sensor |
| CN104285500B (zh) * | 2012-05-08 | 2017-11-28 | Ams传感器英国有限公司 | 红外线发射器与ndir传感器 |
| CN102730621B (zh) * | 2012-06-15 | 2015-05-27 | 西安交通大学 | 一种加热丝嵌入式硅基微热板及加工方法 |
| EP2706567A1 (en) * | 2012-09-11 | 2014-03-12 | Nxp B.V. | Integrated circuit including an environmental sensor |
| US8802568B2 (en) | 2012-09-27 | 2014-08-12 | Sensirion Ag | Method for manufacturing chemical sensor with multiple sensor cells |
| US11371951B2 (en) | 2012-09-27 | 2022-06-28 | Sensirion Ag | Gas sensor comprising a set of one or more sensor cells |
| US9484260B2 (en) | 2012-11-07 | 2016-11-01 | Semiconductor Components Industries, Llc | Heated carrier substrate semiconductor die singulation method |
| US9136173B2 (en) | 2012-11-07 | 2015-09-15 | Semiconductor Components Industries, Llc | Singulation method for semiconductor die having a layer of material along one major surface |
| EP2731129A1 (en) * | 2012-11-07 | 2014-05-14 | ams AG | Molded semiconductor sensor device and method of producing the same at a wafer-level |
| EP2741322B1 (en) * | 2012-12-10 | 2016-04-27 | ams AG | Semiconductor device with integrated hot plate and recessed substrate and method of production |
| EP2762866B1 (en) * | 2013-01-31 | 2017-08-09 | Sensirion AG | CMOS gas sensor and method for manufacturing the same |
| EP2778667A1 (en) * | 2013-03-13 | 2014-09-17 | Sensirion AG | Multi-temperature CMOS gas sensor |
| US9354197B2 (en) * | 2013-04-25 | 2016-05-31 | Wisenstech Ltd. | Micromachined oxygen sensor and method of making the same |
| KR102091390B1 (ko) * | 2013-08-14 | 2020-03-20 | 로베르트 보쉬 게엠베하 | 입자 센서 및 입자 센서의 제조 방법 |
| GB2523788B (en) * | 2014-03-05 | 2020-04-22 | Ams Sensors Uk Ltd | Method of fabrication of CMOS-based Semiconductor Devices comprising CMOS-incompatible metals |
| US9418894B2 (en) | 2014-03-21 | 2016-08-16 | Semiconductor Components Industries, Llc | Electronic die singulation method |
| KR20150116209A (ko) * | 2014-04-07 | 2015-10-15 | 주식회사 이노칩테크놀로지 | 센서 소자 |
| KR101649586B1 (ko) * | 2014-04-07 | 2016-08-19 | 주식회사 모다이노칩 | 센서 |
| US9453807B2 (en) * | 2014-04-08 | 2016-09-27 | Ams International Ag | Thermal conductivity gas sensor with amplification material |
| EP2765410B1 (en) * | 2014-06-06 | 2023-02-22 | Sensirion AG | Gas sensor package |
| EP2975386B1 (en) | 2014-07-14 | 2020-09-02 | Sensirion AG | Heater structure for a sensor device |
| US9385041B2 (en) | 2014-08-26 | 2016-07-05 | Semiconductor Components Industries, Llc | Method for insulating singulated electronic die |
| DE102014226810A1 (de) * | 2014-12-22 | 2016-06-23 | Robert Bosch Gmbh | Sensor zur Messung der Kohlenstoffdioxidkonzentration in einem Gasgemisch und Verfahren zu seiner Herstellung |
| EP3037810B1 (fr) * | 2014-12-23 | 2017-10-25 | EM Microelectronic-Marin SA | Capteur d'humidite ameliore |
| EP3096345B1 (en) * | 2015-05-22 | 2018-07-11 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Infrared emitter |
| US10041898B2 (en) * | 2015-12-01 | 2018-08-07 | International Business Machines Corporation | 3D micro and nanoheater design for ultra-low power gas sensors |
| US10578572B2 (en) | 2016-01-19 | 2020-03-03 | Invensense, Inc. | CMOS integrated microheater for a gas sensor device |
| EP3196639B1 (en) * | 2016-01-21 | 2020-04-08 | Sensirion AG | Gas sensor with bridge structure |
| DE102016203239B4 (de) * | 2016-02-29 | 2025-02-27 | Robert Bosch Gmbh | MEMS-Sensor mit einer Heizeinrichtung an einer Membran und entsprechendes Herstellungsverfahren |
| US10288575B2 (en) * | 2016-05-31 | 2019-05-14 | Ams Sensors Uk Limited | Environment sensor system |
| US10366923B2 (en) | 2016-06-02 | 2019-07-30 | Semiconductor Components Industries, Llc | Method of separating electronic devices having a back layer and apparatus |
| KR101788528B1 (ko) | 2016-06-29 | 2017-11-15 | 대구대학교 산학협력단 | 전도성 고분자를 갖는 동일평면 도파관의 rf 가스감지회로의 전기적인 특성 분석방법 |
| TWI601686B (zh) * | 2016-08-03 | 2017-10-11 | 國立交通大學 | Method for manufacturing semiconductor gas sensing device and semiconductor gas sensing device |
| TWI603080B (zh) * | 2016-08-05 | 2017-10-21 | Micro gas sensor and its manufacturing method | |
| CA3034248A1 (en) | 2016-08-18 | 2018-02-22 | Carrier Corporation | Isolated sensor and method of isolating a sensor |
| TWI684565B (zh) * | 2016-08-26 | 2020-02-11 | 聯華電子股份有限公司 | 半導體感測器及其製造方法 |
| US10383967B2 (en) | 2016-11-30 | 2019-08-20 | Invensense, Inc. | Substance sensing with tracers |
| US10393718B2 (en) * | 2016-12-29 | 2019-08-27 | Industrial Technology Research Institute | Micro-electromechanical apparatus for thermal energy control |
| US10598621B2 (en) * | 2017-04-11 | 2020-03-24 | Invensense, Inc. | Gas sensing device with chemical and thermal conductivity sensing |
| CN107064222B (zh) * | 2017-05-04 | 2024-04-19 | 潍坊歌尔微电子有限公司 | 气体传感器及其加工方法 |
| US10373869B2 (en) | 2017-05-24 | 2019-08-06 | Semiconductor Components Industries, Llc | Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus |
| TWI626627B (zh) * | 2017-08-31 | 2018-06-11 | 研能科技股份有限公司 | 致動傳感模組 |
| CN109580724A (zh) * | 2017-09-29 | 2019-04-05 | 萧育仁 | 微型气体传感器及其制造方法 |
| US10656129B2 (en) * | 2017-12-11 | 2020-05-19 | National Applied Research Laboratories | Miniature gas sensor |
| JP6922108B1 (ja) * | 2018-06-28 | 2021-08-18 | 長江存儲科技有限責任公司Yangtze Memory Technologies Co.,Ltd. | 3次元(3d)メモリデバイスおよびその形成方法 |
| US10770573B2 (en) | 2018-09-20 | 2020-09-08 | Tower Semiconductor Ltd. | Apparatus, system and method of an electrostatically formed nanowire (EFN) |
| US20200096396A1 (en) | 2018-09-26 | 2020-03-26 | Ams Sensors Uk Limited | Gas Sensors |
| US20200150069A1 (en) * | 2018-11-12 | 2020-05-14 | Ams Sensors Uk Limited | Gas sensor |
| US11674916B2 (en) | 2018-11-12 | 2023-06-13 | Sciosense B.V. | Gas sensor |
| CN109270123A (zh) * | 2018-11-15 | 2019-01-25 | 东北农业大学 | 一种检测丙酮气体的传感器及制备方法 |
| US10818551B2 (en) | 2019-01-09 | 2020-10-27 | Semiconductor Components Industries, Llc | Plasma die singulation systems and related methods |
| CN113924477B (zh) * | 2019-04-24 | 2025-08-08 | 加利福尼亚大学董事会 | 对湿度和温度可忽略响应的气体传感器 |
| DE102019120848A1 (de) * | 2019-08-01 | 2021-02-04 | Vaillant Gmbh | Beladungsmessverfahren und Vorrichtung |
| US11300534B2 (en) | 2019-09-06 | 2022-04-12 | General Electric Company | Monolithic gas-sensing chip assembly and method |
| CN113514502A (zh) * | 2020-04-10 | 2021-10-19 | 中国石油化工股份有限公司 | 多维度多参量气体传感器及其制备方法、气体检测方法 |
| JP7496755B2 (ja) * | 2020-10-15 | 2024-06-07 | ローム株式会社 | センサ及びその製造方法 |
| JP7578218B2 (ja) * | 2021-03-11 | 2024-11-06 | Mmiセミコンダクター株式会社 | 熱式センサチップ |
| CN115165813A (zh) * | 2022-06-15 | 2022-10-11 | 湖北深紫科技有限公司 | 一种单片集成的光激发气敏传感器及其制备方法 |
| CN117342517B (zh) * | 2023-10-11 | 2025-04-22 | 莱斯能特(苏州)科技有限公司 | 一种mems热膜式流量传感器芯片及其制备方法 |
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| US4413502A (en) * | 1981-04-27 | 1983-11-08 | Nippon Soken, Inc. | Gas detecting sensor |
| JPH0434351A (ja) * | 1990-05-31 | 1992-02-05 | Toshiba Corp | 感応素子の製造方法 |
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| JP2582343B2 (ja) * | 1993-12-04 | 1997-02-19 | エルジー電子株式会社 | 低消費電力型薄膜ガスセンサ及びその製造方法 |
| FI112005B (fi) * | 1995-11-24 | 2003-10-15 | Valtion Teknillinen | Sähköisesti moduloitavissa oleva terminen säteilylähde |
| EP0795625A1 (en) * | 1996-03-11 | 1997-09-17 | Tokyo Gas Co., Ltd. | Thin film deposition method and gas sensor made by the method |
| JPH09257736A (ja) * | 1996-03-25 | 1997-10-03 | Tokai Univ | ガスセンサおよびガス検出装置 |
| EP0882978A1 (en) * | 1997-06-04 | 1998-12-09 | STMicroelectronics S.r.l. | Integrated semi-conductor device comprising a chemoresistive gas microsensor and manufacturing process thereof |
| JP2000019141A (ja) * | 1998-07-03 | 2000-01-21 | Tokyo Gas Co Ltd | 半導体ガスセンサ |
| JP2000235012A (ja) * | 1999-02-17 | 2000-08-29 | Hitachi Ltd | 炭酸ガスセンサ |
| JP2000258376A (ja) * | 1999-03-10 | 2000-09-22 | Kubota Corp | マイクロヒータ及びマイクロヒータの作製方法 |
| JP2001013098A (ja) * | 1999-06-30 | 2001-01-19 | Shimadzu Corp | ガス測定方法 |
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| JP4103027B2 (ja) * | 2000-10-04 | 2008-06-18 | 富士電機機器制御株式会社 | 薄膜ガスセンサ |
| WO2002080620A1 (en) * | 2001-03-28 | 2002-10-10 | Ecole Polytechnique Federale De Lausanne (Epfl) | High temperature micro-hotplate |
| US20020142478A1 (en) * | 2001-03-28 | 2002-10-03 | Hiroyuki Wado | Gas sensor and method of fabricating a gas sensor |
| JP2003021547A (ja) * | 2001-07-09 | 2003-01-24 | Denso Corp | 薄膜式センサならびにフローセンサおよびその製造方法 |
| JP4325133B2 (ja) * | 2001-08-27 | 2009-09-02 | 株式会社デンソー | ガスセンサおよびその製造方法 |
| JP2003294672A (ja) * | 2002-03-29 | 2003-10-15 | Fuji Electric Co Ltd | 薄膜ガスサンサおよびガス漏れ警報器 |
| DE10221084A1 (de) * | 2002-05-11 | 2003-11-20 | Bosch Gmbh Robert | Sensoranordnung zum Messen einer Gaskonzentration |
| JP2004226310A (ja) * | 2003-01-24 | 2004-08-12 | Kyocera Corp | 酸素センサ |
| KR100529233B1 (ko) * | 2003-09-06 | 2006-02-24 | 한국전자통신연구원 | 센서 및 그 제조 방법 |
| US7104113B2 (en) * | 2003-11-21 | 2006-09-12 | General Electric Company | Miniaturized multi-gas and vapor sensor devices and associated methods of fabrication |
-
2005
- 2005-01-10 GB GBGB0500393.4A patent/GB0500393D0/en not_active Ceased
- 2005-03-15 GB GB0505192A patent/GB2422017B/en not_active Expired - Lifetime
- 2005-03-30 US US11/092,654 patent/US7495300B2/en not_active Expired - Lifetime
- 2005-04-01 JP JP2005106025A patent/JP4936677B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US7495300B2 (en) | 2009-02-24 |
| GB0505192D0 (en) | 2005-04-20 |
| GB2422017A (en) | 2006-07-12 |
| US20060154401A1 (en) | 2006-07-13 |
| GB2422017B (en) | 2010-04-14 |
| GB0500393D0 (en) | 2005-02-16 |
| JP2006194853A (ja) | 2006-07-27 |
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