JP4910319B2 - インターフェース回路を内蔵した集積回路装置及び電子機器 - Google Patents

インターフェース回路を内蔵した集積回路装置及び電子機器 Download PDF

Info

Publication number
JP4910319B2
JP4910319B2 JP2005197930A JP2005197930A JP4910319B2 JP 4910319 B2 JP4910319 B2 JP 4910319B2 JP 2005197930 A JP2005197930 A JP 2005197930A JP 2005197930 A JP2005197930 A JP 2005197930A JP 4910319 B2 JP4910319 B2 JP 4910319B2
Authority
JP
Japan
Prior art keywords
input
power supply
differential signal
pad
input pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005197930A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007019185A (ja
JP2007019185A5 (enExample
Inventor
史和 小松
安成 降矢
公徳 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2005197930A priority Critical patent/JP4910319B2/ja
Priority to US11/426,119 priority patent/US7432732B2/en
Publication of JP2007019185A publication Critical patent/JP2007019185A/ja
Publication of JP2007019185A5 publication Critical patent/JP2007019185A5/ja
Application granted granted Critical
Publication of JP4910319B2 publication Critical patent/JP4910319B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6638—Differential pair signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01037—Rubidium [Rb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01066—Dysprosium [Dy]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1905—Shape
    • H01L2924/19051—Impedance matching structure [e.g. balun]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2005197930A 2005-07-06 2005-07-06 インターフェース回路を内蔵した集積回路装置及び電子機器 Expired - Lifetime JP4910319B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005197930A JP4910319B2 (ja) 2005-07-06 2005-07-06 インターフェース回路を内蔵した集積回路装置及び電子機器
US11/426,119 US7432732B2 (en) 2005-07-06 2006-06-23 Integrated circuit device including interface circuit and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005197930A JP4910319B2 (ja) 2005-07-06 2005-07-06 インターフェース回路を内蔵した集積回路装置及び電子機器

Publications (3)

Publication Number Publication Date
JP2007019185A JP2007019185A (ja) 2007-01-25
JP2007019185A5 JP2007019185A5 (enExample) 2008-08-14
JP4910319B2 true JP4910319B2 (ja) 2012-04-04

Family

ID=37617753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005197930A Expired - Lifetime JP4910319B2 (ja) 2005-07-06 2005-07-06 インターフェース回路を内蔵した集積回路装置及び電子機器

Country Status (2)

Country Link
US (1) US7432732B2 (enExample)
JP (1) JP4910319B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4434288B2 (ja) * 2008-03-19 2010-03-17 セイコーエプソン株式会社 集積回路装置、電気光学装置及び電子機器
US7741871B2 (en) * 2008-03-19 2010-06-22 Seiko Epson Corporation Integrated circuit device, electro-optical device, and electronic instrument
JP4434289B2 (ja) * 2008-03-19 2010-03-17 セイコーエプソン株式会社 集積回路装置、電気光学装置及び電子機器
JP5151604B2 (ja) * 2008-03-26 2013-02-27 セイコーエプソン株式会社 集積回路装置、電気光学装置及び電子機器
JP4544326B2 (ja) * 2008-03-26 2010-09-15 セイコーエプソン株式会社 集積回路装置、電気光学装置及び電子機器
KR101728550B1 (ko) * 2010-11-26 2017-04-19 엘지이노텍 주식회사 전자기간섭 노이즈 저감회로
JP6194372B2 (ja) * 2014-01-22 2017-09-06 アルプス電気株式会社 センサモジュール、並びに、これに用いるセンサチップ及び処理回路チップ
TWI724059B (zh) * 2016-07-08 2021-04-11 日商半導體能源研究所股份有限公司 顯示裝置、顯示模組及電子機器
US11482155B2 (en) 2018-07-20 2022-10-25 Semiconductor Energy Laboratory Co., Ltd. Receiving circuit

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04118946A (ja) * 1990-09-10 1992-04-20 Toshiba Corp 半導体集積回路装置
US6002268A (en) * 1993-01-08 1999-12-14 Dynachip Corporation FPGA with conductors segmented by active repeaters
US6625795B1 (en) * 1998-06-29 2003-09-23 Xilinx, Inc. Method and apparatus for placement of input-output design objects into a programmable gate array
JP4034915B2 (ja) * 1999-09-22 2008-01-16 株式会社ルネサステクノロジ 半導体チップおよび液晶表示装置
JP2001144091A (ja) 1999-11-11 2001-05-25 Sanyo Electric Co Ltd 半導体集積回路
JP3858572B2 (ja) 2000-08-03 2006-12-13 セイコーエプソン株式会社 電気光学装置

Also Published As

Publication number Publication date
JP2007019185A (ja) 2007-01-25
US7432732B2 (en) 2008-10-07
US20070008005A1 (en) 2007-01-11

Similar Documents

Publication Publication Date Title
US7609125B2 (en) System, device and method for reducing cross-talk in differential signal conductor pairs
US10470296B2 (en) Printed circuit board, printed wiring board, and differential transmission circuit
JPH0341757A (ja) 厚膜薄膜積層基板およびそれを用いた電子回路装置
US7277298B2 (en) Multi-terminal device and printed wiring board
JP4910319B2 (ja) インターフェース回路を内蔵した集積回路装置及び電子機器
CN114174963B (zh) 联接至天线的电极结构和包括该电极结构的显示装置
JP2019106537A (ja) 半導体パッケージ及びこれを含む半導体モジュール
CN113261097A (zh) 一种芯片封装装置、终端设备
JP4561504B2 (ja) 終端抵抗を備えたインターフェース回路並びにそれを内蔵した集積回路装置及び電子機器
JP4604887B2 (ja) バンプを有する集積回路装置及び電子機器
CN101472388A (zh) 线路板的布局结构
KR102538705B1 (ko) 반도체 패키지
JP5051836B2 (ja) 半導体装置およびその設計方法
JP2008182062A (ja) 半導体装置
US7557646B2 (en) Semiconductor device with non-intersecting power and ground wiring patterns
CN102761314B (zh) 单晶片功率分配器及其制造方法以及单晶片功率合成器
US7375978B2 (en) Method and apparatus for trace shielding and routing on a substrate
JP5460616B2 (ja) 半導体パッケージ
CN115032836B (zh) 显示基板和显示装置
TWI421986B (zh) A semiconductor device and an electronic device using the same
CN103635016A (zh) 电路布图方法以及印刷电路板
CN112416176B (zh) 触控装置
JP3954415B2 (ja) 配線用補助パッケージ
CN101488483A (zh) 半导体芯片封装结构
JP2007129122A (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080625

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080625

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20080625

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20080626

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110908

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110927

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111128

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111220

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120102

R150 Certificate of patent or registration of utility model

Ref document number: 4910319

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150127

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term