JP4895795B2 - 多層配線基板の製造方法 - Google Patents

多層配線基板の製造方法 Download PDF

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JP4895795B2
JP4895795B2 JP2006342472A JP2006342472A JP4895795B2 JP 4895795 B2 JP4895795 B2 JP 4895795B2 JP 2006342472 A JP2006342472 A JP 2006342472A JP 2006342472 A JP2006342472 A JP 2006342472A JP 4895795 B2 JP4895795 B2 JP 4895795B2
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layer
resin
insulating layer
wiring
forming
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JP2008153580A5 (cg-RX-API-DMAC7.html
JP2008153580A (ja
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雄一郎 清水
弘次 武井
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2006342472A 2006-12-20 2006-12-20 多層配線基板の製造方法 Active JP4895795B2 (ja)

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JP2006342472A JP4895795B2 (ja) 2006-12-20 2006-12-20 多層配線基板の製造方法

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JP2006342472A JP4895795B2 (ja) 2006-12-20 2006-12-20 多層配線基板の製造方法

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JP2008153580A JP2008153580A (ja) 2008-07-03
JP2008153580A5 JP2008153580A5 (cg-RX-API-DMAC7.html) 2009-10-22
JP4895795B2 true JP4895795B2 (ja) 2012-03-14

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5322531B2 (ja) * 2008-05-27 2013-10-23 新光電気工業株式会社 配線基板の製造方法
JP5298740B2 (ja) * 2008-09-30 2013-09-25 富士通株式会社 多層回路基板の製造方法
KR101934460B1 (ko) * 2011-09-30 2019-01-02 제온 코포레이션 절연성 접착 필름, 적층체, 경화물 및 복합체
JP6057641B2 (ja) 2012-09-20 2017-01-11 新光電気工業株式会社 配線基板及びその製造方法
JP2015138921A (ja) * 2014-01-24 2015-07-30 日本ゼオン株式会社 電子材料用基板
JP2015138922A (ja) * 2014-01-24 2015-07-30 日本ゼオン株式会社 電子材料用基板及び電子材料用基板の製造方法
JP2016051756A (ja) * 2014-08-29 2016-04-11 日本ゼオン株式会社 多層プリント配線板およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4291469B2 (ja) * 1999-09-29 2009-07-08 イビデン株式会社 多層プリント配線板およびその製造方法
JP2001284821A (ja) * 2000-03-30 2001-10-12 Nippon Zeon Co Ltd 多層回路基板
JPWO2004086833A1 (ja) * 2003-03-27 2006-06-29 日本ゼオン株式会社 プリント配線板、その製造方法及び支持体付き硬化性樹脂成形体
JP2006278922A (ja) * 2005-03-30 2006-10-12 Nippon Zeon Co Ltd 多層回路基板の製造方法

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