JP2008153580A5 - - Google Patents
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- Publication number
- JP2008153580A5 JP2008153580A5 JP2006342472A JP2006342472A JP2008153580A5 JP 2008153580 A5 JP2008153580 A5 JP 2008153580A5 JP 2006342472 A JP2006342472 A JP 2006342472A JP 2006342472 A JP2006342472 A JP 2006342472A JP 2008153580 A5 JP2008153580 A5 JP 2008153580A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resin
- insulating
- forming
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 74
- 229920005989 resin Polymers 0.000 claims 23
- 239000011347 resin Substances 0.000 claims 23
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 125000002723 alicyclic group Chemical group 0.000 claims 5
- 229920000098 polyolefin Polymers 0.000 claims 5
- 239000012790 adhesive layer Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000007800 oxidant agent Substances 0.000 claims 3
- 230000001590 oxidative effect Effects 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006342472A JP4895795B2 (ja) | 2006-12-20 | 2006-12-20 | 多層配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006342472A JP4895795B2 (ja) | 2006-12-20 | 2006-12-20 | 多層配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008153580A JP2008153580A (ja) | 2008-07-03 |
| JP2008153580A5 true JP2008153580A5 (cg-RX-API-DMAC7.html) | 2009-10-22 |
| JP4895795B2 JP4895795B2 (ja) | 2012-03-14 |
Family
ID=39655401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006342472A Active JP4895795B2 (ja) | 2006-12-20 | 2006-12-20 | 多層配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4895795B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5322531B2 (ja) * | 2008-05-27 | 2013-10-23 | 新光電気工業株式会社 | 配線基板の製造方法 |
| JP5298740B2 (ja) * | 2008-09-30 | 2013-09-25 | 富士通株式会社 | 多層回路基板の製造方法 |
| KR101934460B1 (ko) * | 2011-09-30 | 2019-01-02 | 제온 코포레이션 | 절연성 접착 필름, 적층체, 경화물 및 복합체 |
| JP6057641B2 (ja) | 2012-09-20 | 2017-01-11 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP2015138921A (ja) * | 2014-01-24 | 2015-07-30 | 日本ゼオン株式会社 | 電子材料用基板 |
| JP2015138922A (ja) * | 2014-01-24 | 2015-07-30 | 日本ゼオン株式会社 | 電子材料用基板及び電子材料用基板の製造方法 |
| JP2016051756A (ja) * | 2014-08-29 | 2016-04-11 | 日本ゼオン株式会社 | 多層プリント配線板およびその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4291469B2 (ja) * | 1999-09-29 | 2009-07-08 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
| JP2001284821A (ja) * | 2000-03-30 | 2001-10-12 | Nippon Zeon Co Ltd | 多層回路基板 |
| JPWO2004086833A1 (ja) * | 2003-03-27 | 2006-06-29 | 日本ゼオン株式会社 | プリント配線板、その製造方法及び支持体付き硬化性樹脂成形体 |
| JP2006278922A (ja) * | 2005-03-30 | 2006-10-12 | Nippon Zeon Co Ltd | 多層回路基板の製造方法 |
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2006
- 2006-12-20 JP JP2006342472A patent/JP4895795B2/ja active Active