JP4888715B2 - 圧力センサ用の感圧素子、及びその製造方法 - Google Patents
圧力センサ用の感圧素子、及びその製造方法 Download PDFInfo
- Publication number
- JP4888715B2 JP4888715B2 JP2007078383A JP2007078383A JP4888715B2 JP 4888715 B2 JP4888715 B2 JP 4888715B2 JP 2007078383 A JP2007078383 A JP 2007078383A JP 2007078383 A JP2007078383 A JP 2007078383A JP 4888715 B2 JP4888715 B2 JP 4888715B2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- pressure
- pedestal
- sensitive element
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 88
- 230000002093 peripheral effect Effects 0.000 claims description 50
- 238000005304 joining Methods 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 11
- 235000012431 wafers Nutrition 0.000 description 49
- 239000013078 crystal Substances 0.000 description 22
- 239000010453 quartz Substances 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- 230000035945 sensitivity Effects 0.000 description 12
- 238000005452 bending Methods 0.000 description 10
- 238000006073 displacement reaction Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 235000014676 Phragmites communis Nutrition 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007078383A JP4888715B2 (ja) | 2007-03-26 | 2007-03-26 | 圧力センサ用の感圧素子、及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007078383A JP4888715B2 (ja) | 2007-03-26 | 2007-03-26 | 圧力センサ用の感圧素子、及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008241287A JP2008241287A (ja) | 2008-10-09 |
| JP2008241287A5 JP2008241287A5 (enExample) | 2010-05-06 |
| JP4888715B2 true JP4888715B2 (ja) | 2012-02-29 |
Family
ID=39912844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007078383A Expired - Fee Related JP4888715B2 (ja) | 2007-03-26 | 2007-03-26 | 圧力センサ用の感圧素子、及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4888715B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5305028B2 (ja) * | 2008-10-16 | 2013-10-02 | セイコーエプソン株式会社 | 圧力センサー |
| JP4998860B2 (ja) | 2009-02-26 | 2012-08-15 | セイコーエプソン株式会社 | 圧力センサー素子、圧力センサー |
| JP2010230401A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 圧力センサー |
| JP2010281573A (ja) * | 2009-06-02 | 2010-12-16 | Seiko Epson Corp | 圧力センサー |
| JP2011013062A (ja) * | 2009-07-01 | 2011-01-20 | Seiko Epson Corp | 圧力センサー |
| JP2011220722A (ja) * | 2010-04-05 | 2011-11-04 | Seiko Epson Corp | 圧力センサー |
-
2007
- 2007-03-26 JP JP2007078383A patent/JP4888715B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008241287A (ja) | 2008-10-09 |
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