JP4887346B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4887346B2
JP4887346B2 JP2008297134A JP2008297134A JP4887346B2 JP 4887346 B2 JP4887346 B2 JP 4887346B2 JP 2008297134 A JP2008297134 A JP 2008297134A JP 2008297134 A JP2008297134 A JP 2008297134A JP 4887346 B2 JP4887346 B2 JP 4887346B2
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JP
Japan
Prior art keywords
island
semiconductor device
back surface
semiconductor chip
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008297134A
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English (en)
Japanese (ja)
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JP2009049435A (ja
JP2009049435A5 (https=
Inventor
治雄 兵藤
孝行 谷
隆生 渋谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
On Semiconductor Trading Ltd
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On Semiconductor Trading Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by On Semiconductor Trading Ltd filed Critical On Semiconductor Trading Ltd
Priority to JP2008297134A priority Critical patent/JP4887346B2/ja
Publication of JP2009049435A publication Critical patent/JP2009049435A/ja
Publication of JP2009049435A5 publication Critical patent/JP2009049435A5/ja
Application granted granted Critical
Publication of JP4887346B2 publication Critical patent/JP4887346B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2008297134A 2008-11-20 2008-11-20 半導体装置 Expired - Fee Related JP4887346B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008297134A JP4887346B2 (ja) 2008-11-20 2008-11-20 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008297134A JP4887346B2 (ja) 2008-11-20 2008-11-20 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006243624A Division JP4383436B2 (ja) 2006-09-08 2006-09-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2009049435A JP2009049435A (ja) 2009-03-05
JP2009049435A5 JP2009049435A5 (https=) 2010-04-30
JP4887346B2 true JP4887346B2 (ja) 2012-02-29

Family

ID=40501297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008297134A Expired - Fee Related JP4887346B2 (ja) 2008-11-20 2008-11-20 半導体装置

Country Status (1)

Country Link
JP (1) JP4887346B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6752639B2 (ja) 2016-05-02 2020-09-09 ローム株式会社 半導体装置の製造方法
US10388616B2 (en) 2016-05-02 2019-08-20 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150868A (ja) * 1985-12-25 1987-07-04 Hitachi Micro Comput Eng Ltd 半導体装置用リ−ドフレ−ムとそれを使用する樹脂封止方法
JP3304705B2 (ja) * 1995-09-19 2002-07-22 セイコーエプソン株式会社 チップキャリアの製造方法
JP3209696B2 (ja) * 1996-03-07 2001-09-17 松下電器産業株式会社 電子部品の製造方法
JP3877402B2 (ja) * 1997-11-28 2007-02-07 三洋電機株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2009049435A (ja) 2009-03-05

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